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Chapter 1 Solutions 2
Chapter 2 Solutions 6
Chapter 3 Solutions 13
Chapter 4 Solutions 33
Chapter 5 Solutions 44
Chapter 6 Solutions 50
Appendix A Solutions 63
Appendix B Solutions 83
Appendix C Solutions 92
Chapter 1 Solutions
0.30 × 3.89 –4
1.1 a. Yield = ⎛ 1 + ---------------------------⎞ = 0.36
⎝ 4.0 ⎠
2
π × ( 30 ⁄ 2 ) π × 30
b. Dies per wafer = ----------------------------- – ------------------------------- = 283 – 42.1 = 240
2.5 sqrt ( 2 × 2.5 )
0.30 × 2.5 – 4
Yield = ⎛ 1 + --------------------------⎞ = 0.50
⎝ 4.0 ⎠
Profit = 240 × 0.50 × $25 = $3000
c. The Woods chip
d. Woods chips: 50,000/416 = 120.2 wafers needed
Markon chips: 25,000/240 = 104.2 wafers needed
Therefore, the most lucrative split is 120 Woods wafers, 30 Markon wafers.
0.75 × 1.99 ⁄ 2 –4
1.3 a. Defect – Free single core = ⎛ 1 + ----------------------------------⎞ = 0.28
⎝ 4.0 ⎠
14 KW
b. --------------------------------------------------------------------- = 166
( 66 W + 2.3 W + 2 × 7.9 W )
c. 200 W × 11 = 2200 W
2200/(76.2) = 28 racks
Only 1 cooling door is required.
1.6 a. The IBM x346 could take less space, which would save money in real estate.
The racks might be better laid out. It could also be much cheaper. In addition,
if we were running applications that did not match the characteristics of these
benchmarks, the IBM x346 might be faster. Finally, there are no reliability
numbers shown. Although we do not know that the IBM x346 is better in any
of these areas, we do not know it is worse, either.
1.7 a. (1 – 8) + .8/2 = .2 + .4 = .6
2
Power new ( V × 0.60 ) × ( F × 0.60 ) 3
b. -------------------------- = ----------------------------------------------------------
2
- = 0.6 = 0.216
Power old V ×F
.75
c. 1 = -------------------------------- ; x = 50%
(1 – x) + x ⁄ 2
2
Power new ( V × 0.75 ) × ( F × 0.60 ) 2
- = 0.75 × 0.6 = 0.338
d. -------------------------- = ----------------------------------------------------------
2
Power old V ×F
Exercises
1.8 a. (1.35)10 = approximately 20
b. 3200 × (1.4)12 = approximately 181,420
c. 3200 × (1.01)12 = approximately 3605
d. Power density, which is the power consumed over the increasingly small area,
has created too much heat for heat sinks to dissipate. This has limited the
activity of the transistors on the chip. Instead of increasing the clock rate,
manufacturers are placing multiple cores on the chip.
Chapter 1 Solutions ■ 5
12
10
Net speedup
6
0
0 10 20 30 40 50 60 70 80 90 100
Percent vectorization