Professional Documents
Culture Documents
1991 Haber 156160
1991 Haber 156160
by
Andrew Haber
The auUlor has granted an irrevocable non- L'auteur a accordS une licence irrlwocable et
exclusive licence allowing the National Ubrary non E!~~e permettant a la Bibraotheque
of Canada to reproduoe, loan, distribute or sell nationale du Canada de reproduire, pr6ter,
copies of his/her thesis by any means and in distribuer ou vendre des copies de sa these
any fonn or format, making this thesis available de queiQue maniere et sous quelque forme
to interested persons. que ce soit pour mettre des exemplaires de
cette these a la disposition des personnes
interessees.
The author retains ownership of the copyright l'auteur conserve la proprtete du droit d'auteur
in his/her thesis. Neither the thesis nor qui protege sa these. Ni la these ni des extraits
substantial extracts from it may be printed or substantiels de celle-ci ne doivent ~tre
otherwise reproduced without his/her per- imprimes ou autrement reproduits sans son
mission. autorisation.
ISBN 0-315-67745-7
Canada
ABSTRACT
0
Film embossing is a mechanical process in which a flat film
is transformed into an embossed product. During the process,
thermal and stress fields are applied to the polymer, causing
changes in the microstructure and physical dimensions of the
material. The engineering analysis of the process requires the
study of various aspects relating to the characterization of
the microstructure before and after embossing. A variety of
experimental techniques were employed to characterize the
properties and microstructure of embossed films in relation
to: crystallinity, orientation, mechanical properties and
dimensions of the embossed films. Mathematical models were
also developed to predict the temperature, stress and
deformation in the plastic films during embossing.
i
RESUME
ii
ACKNOWLEDGEMENTS
0
I wish to express my deepest appreciation for the guidance
and encouragement received from my research director,
Professor M.R. Kamal, who stimulated my interest in the field
of polymer science and engineering.
0 iii
TABLE OP CONTENTS
0
ABSTRACT i
RESUME ii
ACKNOWLEDGEMENTS iii
TABLE OP CONTENTS iv
LIST OP PIGORES vii
LIST OP TABLES xi
LIST OP PHOTOGRAPHS xi
N'OMDCLATORE xii
1. INTRODUCTION 1
0 iv
Page
3.3.2. Pre-Embossing Variables 40
3.3.2.1. Preheat Roll Temperature 40
3.3.2.2. Radiation Heater Temperature 45
3.3.2.3. Film Velocity 49
3.3.3. Embossing Variables 52
3.3.3.1. Embossing Roll Pattern 52
3.3.3.2. Rubber Layer Properties 53
3.3.3.3. Metal Roll Properties 55
3.3.3.4. Embossing Pressure 55
3.3.3.5. Embossing Roll Temperature 55
3.3.3.6. Backup Roll Temperature 56
4. EXPERIMENTAL 58
4.1. Flat Film Analysis 58
4.1.1. Previous studies 58
4.1.1.1. Morphology 58
4.1.1.2. Other Studies 68
4.1.2. Experimental 69
4.1.2.1. Sampling Procedure 72
4.1.3. Results 74
4.1.4. Discussion 84
4.2. Embossed Film Analysis 93
4.2.1. Previous studies 93
4.2.2. Experimental 95
4.2.2.1. Sampling Procedure 103
4.2.3. Results 105
4.2.3.1. Temperature Distribution 105
4.2.3.2. Embossed Film Characterization 111
4.2.4. Discussion 123
5. THEORETICAL ANALYSIS 129
5.1. Heat Transfer Analysis 129
5.1.1. Preheat Roll system 131
5.1.1.1. Numerical Solution 133
5.1.1.2. Heat Transfer Coefficient 137
5.1.1.3. Material Properties 138
5.1.1.4. Model Accuracy 138
5.1.1.5. Discussion 139
5.1.2. Free Moving Film 144
5.1.2.1. Numerical Solution 145
5.1.2.2. Discussion 145
5.1.3. Radiation Heater System 146
5.1.3.1. Numerical Solution 149
5.1.3.2. Material Properties 150
5.1.3.3. Shape Factor 150
5.1.3.4. Air Temperature Distribution 151
5.1.3.5. Model Accuracy 154
5.1.3.6. Discussion 156
V
0 5.1.4. Embossing Roll system 160
5.2. Stress Analysis 161
5.2.1. Contact Problem 163
5.2.1.1. Hertz Analysis 164
5.2.1.2. Multi-Layered Roll Analysis 166
5.2.1.3. Material Properties 167
5.2.1.4. Discussion 167
5.2.2. Indentation Problem 172
5.2.2.1. Single Layer Analysis 173
5.2.2.2. Multi-Layered Analysis 175
5.2.2.3. Discussion 176
5.3. Summary 180
6. DISCUSSION 182
6.1. Heat Transfer Analysis 182
6.2. Stress Analysis 191
6.3. Film Embossing Process Description 196
7. CONCLUSIONS, ORIGINAL CONTRIBUTIONS AND FUTURE WORK 199
7.1. General Conclusions 199
7.2. Original Contributions 202
7.3. Recommendations for Future Work 203
REFERENCES 204
APPENDIX A EXPERIMENTAL PROCEDURES A-1
APPENDIX B EXPERIMENTAL DATA B-1
APPENDIX C MORPHOLOGY AND ORIENTATION IN POLYETHYLENE C-1
TUBULAR BLOWN FILMS
APPENDIX D RHEOLOGICAL PROPERTIES OF LDPE-1 D-1
0 vi
LIST OF FIGURES
0 Figure caption
1-1 Tubular Blown Film Process Schematic. 8
1-2 Components of a Polymer Processing System. 15
3-1 Schematic Diagram of the Continuous Tubular
Blown Film Embossing Process. 21
3-2 Schematic Diagram of the Continuous Embossing
station. 23
3-3 Schematic Diagram of the Film Geometry. 26
3-4 Schematic Diagram of the Continuous System
Embossing Pattern. 27
3-5 Schematic Diagram of the Batch Embossing Station. 28
3-6 Schematic Diagram of the Batch System
Embossing Pattern. 30
3-7 Infrared Spectrum of LDPE-1, H=0.05 mm. 33
3-8 Total Reflectance, Transmittance and
Absorptance of LDPE-1, H=0.025 mm. 34
3-9 Thermal Properties of LDPE-1. 36
3-10 Mechanical Properties, Compression, of LDPE-1. 38
3-11 Preheat Roll Surface Temperature Distribution,
Tp=93. 3°C. 42
3-12 Preheat Roll surface Temperature Distribution. 43
3-13 Air Temperature Distribution, Preheat Roll. 44
3-14 Radiation Heater Tube Temperature Distribution. 47
3-15 Air Temperature Distribution, Radiation Heaters. 48
3-16 Air Temperature Distribution, Preheat Roll. 50
3-17 Air Temperature Distribution. 51
4-1 Representation of the a-axis Orientation as
a Function of stress. 64
0 vii
Figure Caption
0 4-2 LDPE-1 Film Blowing Conditions. 75
4-3 X-Ray Diffraction Data. 77
0 ix
Figure Caption
0 C-3 Elongational Viscosity Data of LDPE, HDPE
and LLDPE at 150°C for Various Strain Rates. C-18
C-4 Elongational Viscosity of LOPE at Various
Strain Rates and Temperatures. C-19
C-5 Elongational Viscosity of HDPE at Various
Strain Rates and Temperatures. C-20
D-1 Time Sweep Experiments, w=1 rad/s and ~=10%. D-4
D-2 Strain sweep Experiments, w=1 radfs. D-5
D-3 Frequency Sweep Experiments, ~=10%. D-6
D-4 Shear Viscosity of LDPE-1. D-7
0 X
LIST OF TABLES
0 Table caption Page
1-1 Types of Film Embossing systems. 6
LIST OF PHOTOGRAPHS
Photograph Caption
A-1 Pattern Quality Standards. A-ll
c xi
NOMENCLATURE
0
Symbol Definition Units
A Area m:z.
Punch Radius m
Bi Biot Number
BUR Blowup Ratio
Specific Heat
Cylinder Diameter m
Young's Modulus Material i Pa
Shape Factor
L Length m
MD Machine Direction
n Power Law Index (Equation D-1)
n Sample Size
N Number of Increments
N' Applied Force N/m
NO Thickness Direction
0 xii
Symbol Definition Units
0 p Pressure Pa
q Heat Flux Vector
Ri Radius Roll i m
t Time s
T Temperature oc
TD Transverse Direction
u Displacement m
V Velocity Vector
V Velocity m/s
w Width m
w Weight kg
Xc Crystallinity %
Subscripts:
A Ambient
am Amorphous
er Crystalline
F Film
MIN Minimum
MAX Maximum
0 Initial
p Preheat Roll
0 xiii
Symbol Definition Units
0 R Radiation Heater
s Surface
XYZ Cartesian co-ordinates
rez Cylindrical Co-ordinates
ijk Indices
Greek Symbols
p Density kgfm3
w Frequency s-1
c xiv
1
Chapter 1
0 J:NTRODUCTJ:ON
1. 1. GENERAL J:NTRODUCTJ:ON
c
2
+
Heot T~eoted Film Engraved Roll Embossing: A heat
treated plastic film is passed
between the nip of two embossing
En<>oao; ng Ro lis rolls in contact, of which at least
one carries the embossing pattern
[5-9].
Embossed Product
Support Ro I Is
Vacuum Embossing: A heat treated
plastic film is passed over an
embossing screen. A vacuum is
applied to pull the film into
Emeossl~g Scree~
contact with the screen to impress
the embossing pattern into the film
[8,10,11].
c
7
Nip Rol Is
I
18ubble
Blown Tube
~Rod ius
T Moch; ne 0; rect; on
F i Im Th i ckness
' r - - - - - ! - - - - ! f - - Free :z:e L i ne
Gop
Air Supp I Id
Resin
Properties
Machine
U I t i mete
Design Micr-ostr-ucture
:Pr-oper-ties
Variables
Operating
Conditions
0
16
Chapter 2
0 SCOPE AND OBJECTIVES
Chapter 3
0 PROCESS DESCRIPTION
Flattened
Twbw I a r F i Im
SI it ters
Film
Bubble
Prehect
Rol I
at ion
Rod i
Heaters
Film
Wind-up
Backup
Roll
Embossing
Rol I
!=' reheo t Re I I
Cliometer 0.30 m
Flot Film Length 1 • 07 m
L-f 0 • .22 m
0
Tube Oiometer 1 .59 cm
Length 0.91 m
Embossed
l='roduct.
Emboss i na Ro I I
Ro I I
Soci<U~:J Cl i ome te r 0 . 1 5 m
Cliometer 0.20 m Length 1 .07 m
Length 1 .07 m
Rubber LO!:Jer
Thickness 1 .27 cm
After heating, the film passes into the nip between a water
cooled engraved steel roll, 1.07 m in length and 0.15 m in
diameter, and a rubber coated steel backup roll, 1.07 m in
length and 0.20 m in diameter, to impress a pattern onto the
surface. The rubber layer, 1.27 cm thick, is made of Neoprene
rubber having 45 Shore A hardness. Force, which is controlled
by a pneumatic mechanism, is applied to a ram 8. 9 cm in
diameter. The force controls the movement of the embossing
roll with respect to the stationary backup roll. At the point
of contact between the two rolls, the plastic film is
compressed, sheared and cooled, thereby causing further
changes in the material dimensions and microstructure (i.e.
crystallinity, morphology, and orientation). These changes
ultimately determine the final properties of the embossed
25
X.ND
=:~:::2
Co) Cross Section View
Tr- ~_)_Y_.T-0--I~H---~2·
(b) Top View
V
Y. TO.....-------,..----_..:._~............._.___ Y=W/2
a) Pattern Face
a: 1 13.5 degrees
b: 0.368 mm
c: 0.356 mm
d: 0.252 mm
e: 0.242 mm
f: 66.6 degrees
Prehect. Ro I I
F l c t Film Clicmet.er 0.::30 m
Length 1. 07 m
0.18 m
c:m
I
Rod i et. ion Hect.ers
Tube Oiometer 1 .59 cm
Tube Length 0.91 m
0.44 m
0.72 m
Embossed
Product.
Emboss i ng Ro 1 1
Sockuf=l Ro 1 I Cl i cme t.e r 0 • 1 5 m
Cliomet.er 0.20 m Length 1 .07 m
Length 1 .07 m
Rubber Lo\.::jer
Thickness 1 .27 cm
rubber backup roll and embossing rolls remained the same. The
0 embossing pattern used in the batch embossing system is
presented in Figure 3-6. The diamond shaped pattern is similar
to that used in the continuous embossing system.
a) Pattern Face
a: go degrees
b= 0.216 mm
c: 0.351 mm
d: 0.248 mm
e: 0.216 mm
f: go degrees
0
32
3.3.1.1. Resin Properties
Wavelength. J..IITl
2.5 3 4 6 8 10 12
N 80
[
0
·- 60
m
m
ffi 40
[
0
L
t-
20
0 0.09 .
•f 0.06
-e
I 0.03 ·r
0.00
0.79
~
•
f 0.76
i
Ill
c
~ 0.73
0.70 .
0.15
F----
•f 0.10 ·r
i.
j 0.05
0.00
0.5 1.0 1.5 2.0 2.5
WCMJIMgth. pm
0
15
1.3 .
11
0
0 <P
c~
9
~
IN 10
E 0
u
.......
-0
M
0
f
~
8.
0
Q
a 0
~
~
•
6 L
0
p
~
J: 0 •.3 .
f
"D
c:
0
(.)
0
0
a
•~~ 0
0.2
50 75 100 125 150
Temperatun~, -c
10~----------------------------------~
c
c..
~
:t!
cp
E
::i
c 5
c:
0
:e0 0
0.. 0
e
c..
0 . .
75--
()
c
c..
~
. 50
"
::::J
::::J
"'C
0 0
~
"c:
0'1
::::J
25 0
$?.
(~
0
25 50 75 100
Temperature, •c
The preheat roll was used to raise the temperature of the flat
film from approximately room temperature to 95°C. If the
temperature of a polyethylene film is raised above 100°C 1
processing difficulties may occur because the flat film may
stick to the surface of the preheat roll. In addition, when
operating at temperatures above 100°C, steam or oil based
heaters must be used. The factors which influence the final
temperature of the flat film are the film velocity, film
0
41
thickness, ambient air temperature and preheat roll surface
temperature.
0
42
95
OY/Wp/2=-1
6. Y/Wp/2=0
0
a
DY/Wp/2=1
f
....
:::J
E
Cl)
c..
E 90·
~~ e
D
n
t! [~
Cl)
u
~:::J
en
85+--------------.~------------~:------------~
0 90 180 270
Circumferential Angle, degrees
(~
Tp 93.3°C 0 0
0
a
E
....,::J
80-r-
~
G)
a.
E ~~ Tp 65.5°C 4!~
t!
G)
u 55 -r-
~::J
(/')
Tp 48.8°C
lO 0 [p
~17 V ~11
Tp 37.8°C
30 I
-1 0 1
Axial position Y/Wp/2
BOOE~ 0 0
(.)
0
700
600-
TR 537.8°C
[~ D
500+-------------------~------------------~
-1 0 1
Axial position Y/WR/2
200
TR 537.8°C
175 0 - 0 Z=0.43 m
• - • Z=0.49 m
00 6.-6. Z=0.54 m
~
- 150
.6.-.6. Z=0.60
D-D Z=0.65
m
m
....
::::1
~:
~
8. 125
E
t!
100
75
200
TR B15.6°C
175 0 - 0 Z=0.43 m
"....!
::::1
150
• - • Z=0.49
6-6. Z=0.54
.a.-.a. Z=O.SO
m
m
m
E!G D-D Z=0.65 m
0..
E
~
125
100~-----------------+----------------~
-1 0 1
Axial position Y/WR/2
125
00
~
::::J
.....
~
CD
a.
75
TR 537.8°C
E 0 - 0 Z=Om
.!
• - • Z=0.24 m
ll.-ll. Z=0.34 m
.&.-.&. Z=0.43 m
25
....
125
ll.
~
!:I
e.,
0.
75
TR 815.6°C
0 - 0 Z=Om
E • - • Z=0.24m
t! ll.-ll. Z=0.34 m
.&.-.&. Z=0.43 m
25-===~======~~======~==~
_, 0 ,
Axial position Y/Wp/2
225
815.6°C
OY/'!1/2=-1 g~ £51
DY/W/2=0
175 6Y/W/2=1
0
•
!
.aE 125 ·r- D
.,c.. D
E 0
~ ~
75
25 111 Ji . ..
537.8°C
OY/W/2=-1
ag ~
175·· 0~2=0
6 /2=1
•0
r! D
.....:1 125
.,~
Q.
E
{!!.
75
25 1~~~------~~n----~.~------~------~
0.0 0.2 0.4 0.6 o.a
z.m
0
55
3.3.3.3. Metal Roll Properties
0
The embossing roll and metal core of the backup roll were
constructed of an annealed SAE 4140 carbon low alloy steel
with a minimum Brinnell hardness of 190. some of the important
physical properties for this material are presented in Table
3-1. The data presented in Table 3-1 will be used in all
future references to describe the properties of the metal
rolls.
In this study, municipal water was used to cool the roll. The
temperature of municipal water supply varies seasonally and
geographically. The seasonal variation in the temperature can
range between 10 and 15°C, with winter being the coldest and
summer the hottest. All the embossing experiments were
conducted in the spring. The inlet water temperature on the
embossing roll was on average 14°C, while the outlet
temperature was 32°C.
0
58
Chapter 4
EXPERJ:MEB'l'AL
4.1.1.1. Morphology
over the past 30 years, several studies have been carried out
to investigate and explain the orientation and morphology of
polyethylene films. The type of orientation described in the
early studies can be grouped into the following three
categories:
with the a and c axes rotated randomly about the b-axis. The
direction of crystal growth was found to be in the b-axis
direction. This type of orientation can also be referred to
as the helix model. The orientation model proposed by Keller
[48-51] was based on the examination of unoriented and drawn
heat treated compression molded samples.
The work by Stein and Sutherland [54,55] showed that the 721
cm- 1 infrared absorption band for polyethylene contains a
strong crystalline component with its transition moment
polarized parallel to the b-axis of the crystallites, in
addition to the contribution from the amorphous regions. This
work and that of Keller [48-51], as described previously, led
Holmes and Palmer [52] to reconsider the orientation of the
films analyzed in 1953. It was found that some of these films
exhibited Type II orientation. Through examination of a large
number of commercial polyethylene films with both positive and
negative birefringences, a third orientation model, Type III,
was proposed whereby the a-axis of the unit cell was tilted
at a preferred angle to the machine direction. The value of
this angle varied between 37 and 55 degrees, depending on the
processing conditions. The b-axis remains oriented in the
plane perpendicular to the machine direction. This type of
orientation is intermediate to the Type I and Type II models.
This model also tends to confirm the conclusions made by the
authors in 1953 regarding the amorphous orientation which was
postulated to be parallel to the machine direction even though
the crystal chain axis was perpendicular to the machine
direction. The value of the tilt angle of the a-axis was found
to increase as the blowup ratio increased and as the haul-off
ratio decreased, for a given polymer and extrusion
temperature. Tubular blown films were found to exhibit varying
orientations ranging from positive to negative birefringence.
High Stress
60°
NO
Ver!d High Intermediate
Stress Stress
9o=' 20-50°
MO
TO
The x-ray patterns obtained by Kwack, Han and Vickers [81] are
indicative of a low/intermediate stress crystallization
orientation, following the model proposed by Keller and Machin
[75].
4.1.2. Experimental
4.1.3. Results
0 s
E 0~~
0 0
e: 20
0 0
iena. 0
E 10
fE
0
0
50 0
0
M
~a: g
j 30
qBq,
0 0
0 0
0
10
0
75
~ 0
50 00
0(9) 0
25
E
E 0.04
J
~ o
0 0
§
oo 0
~
CO~~o
0.02 a> 0
0 2 4 6
Blowup Ratio
30 Q)
.Ec
..........
E 20 ·r-
&>c9 0
.
"0
CD 0
CD
c.
fJ)
0
E 10
t.:i:
0 .
I
90·
E
c.
"0
L.
CD
- CDO 0 0
CD
0
c.
fJ)
70
8
3:
~ 0
0
fJ)
c9 0
50 L
0 20 40 60
Draw Ratio. t»
0
360 . MD-NO Plane 0
0
90
000 ~
0
MD-TD Plane
90 0
JSbO 0
60
000(11)
1 0
0 .
360 MD-TD Plane 0
0
90
q;,oo
CSI>'~
0
0 2
.
4 6
Blowup RaUa
10
I
f
e
:I
0 0 0
E 0 0
1i
a
:I -10 0 0 0
-20
MD-ND Plane
eo
0
I· 00 00 0
0
0
MD-TD Plane
15
I
.r 0 0
I 0
0
0
~-
0
000 0
0
-15
360 MD-TD Plane 0
I 270
f
,.
1 180
90
0
c:P fillY rs> 0
--r
0 2 4 6
Blowup RaUo
c ....
I
0
E 3.0
,.,
(.) 1-
0
~
....
0
:p
0
0::
1.5 coo ~
(.) 1-
oo
e
.r:.
0
0
0
0:00
0
.2 0
0 0
,...
0.0 -
....
I
E
(.) 3.0
8.... 0
0
oo cg
1.5'.
J3 0 oo
0 0 0
00 0
0 0 0
0.0 .
....
I
E
(.) 3.0 1-
~
0
:g 0 00
0:: io
·~
"fi
0
1.5
0
§boo
0
~
r 0 0
0.0 .
0 1 2 3 4 5
Blowup Ratio
0.01~----------------------------------.
CD
u
c::
CD
C' 0
-m
c::
"i:
~
0.00
0 0 ~ 0
0
~
0
-0.01 I
c
.t:::.
c
:2 1.0. t-
0
;;
c
0:: CO e 0
b
·u0
0.8· t-
oota, @0 0
~
u
·-c::
0
(/)
0.5
0
.
1
.•
2
_._
3
. I
4 5
Blowup Ratio
1.5
0
~
:E 1.0
ID
:I
0
:;
'8
::::1
0 0
ID 0.5 -~
·;;
c
~
o.o .
0
0
60
0
0 0
0
30
0 . ..
1.0I·
0
0.9I• 0 0
00 0
0.8 0 0 oo
00 ce
oo
0.7
-0.010 -0.005 0.000 0.005 0.010
Birefrlngence
4.1.4. Discussion
Q 15
0
c 0
ic
01 10
0
[i]
0
.B0
E 5
ii!
::;) 0
0
....
0 - n I -'
3.
0 0
2
0
0 0
0 .
0
1.2
•
:::J
:; 1.0
-g 0
:::E
0
0.8
0
0 0
0.6 . . .
0 1 2 3 4 5 6
Blowup Ratio
100
020 °
1::::..60 °
75 1::::..
1::::..
1::::..
m 1::::.. 0
m 1::::..
0 50
(.!)
0 0
25- 00 0
oo
0 I -.
0 1 2 3 4 5
Blowup Ratio
1.5
-a-axis
- - b-axis
1.2
0
'·-£:. 0.9
I
I7J
c
CD
...... 1\ I
c
i\ /
'V'(\
\ I
'-
0.3 \.. /
\/ I
0.0+-----------~---------~---------r-----------~
0 90 180 270 360
Angle, degrees
60
0 0 6. 0 20.
6. 60.
40
q, 6.6.
20 . 0 6.
A~
0 ...L
0 20°
ID
c: 6. 60. 0 6.
0
c.. 0 6.
0
:::::E 60
I
0
z 0 6.
E 00 6. M
::I
E
'X 30
0
:::::E
·x•0
I
0
_,
0 ...L
0 20.
6. 60.
0.005
8c:
D
Ol
0 0 ll.fl.
c:
•t:
0.000 0 6.
'! cP 4
m 0 6.
-0.005 0 6.
0 6.
-0.010 .I
0 25 50 75 100
Gloss
4.2.2. Experimental
0
97
0
98
0
101
c ~Sulk
F i I m Th i ckness
Thickness
l..l 'l...,.
~
1 l..3
L
/
i-1
0
102
The optical properties of the embossed films were measured
c using a HunterLab Gloss Meter at 20° and 60°. The gloss
measurements were all made with the embossed pattern facing
upwards and with the gloss meter source beam parallel to the
machine direction. The direction of the source beam relative
to the embossed film was found not to affect the gloss
readings. The contrast ratio or opacity of the films [118] was
measured using a Hunterlab Colorimeter. The contrast ratio is
defined as the reflectance of the film sample over a black
standard, CIE Y=O, divided by the reflectance of the same
sample over a white standard, CIE Y=84.0.
0
103
Confidence
Property n Interval (%)
Tensile
Modulus 20 4.6
Ultimate 20 8.4
Density 6 3.2
Shrinkage
Lateral 4 1.2
Marker Method 12 0.6
Static 10 6.3
Thickness
Microsope 15 3.0
Density Column 25 5.7
4.2.3. Results
0 o z-o
A Z=0.24 m V
TR 815.6-c
D Z-0.43 m
CJ
~r V Z=0.65 m
17
•
!' 60
!l
E
~
D
• ~
TR 537.s•c
n
0 Z=O
A Z=0.24 m
~ , o Z•0.43 m V
V Z=0.65 m '
CJ
•
l~
~
C)
I~ A
0
D
I~
.
0 Z=O TR off
A Z=0.24 m
D Z•0.43 m
CJ V Z=0.65 m
• 35
i 'il B u
!l
E
~
25
-1
. 1
0 o z-o TR e1s.s•c
~
90
0
4 Z==0.24 m
Cl Z•0.43 m
V Z==0.65 m
113 ,.
i
:J
i.,
a. j~
E 75 •If' 4
~
Cl) 0 ~~
60
0 Z==O TR 537.e•c
4 Z=-0.24 m
[] z-o.43 m
V Z•0.65 m 0
Cl)
~~
65,,~ 4
113 ••
60
o z-o TR off
4 Z=0.24 m
[] Z•0.43 m
V Z==0.65 m 0 4 I'
0
•I'
65'31'
4
~~ I! r~
60 .
-1 0 1
Y/WF/2
100
,.. m
ll. Z=0.24
0 Z•0.43 m
V Z=0.65 m 0
!~
"ee
:J
.....
95 l
ll.
~~
ID
0. c~
E
~ 0
90 ~~
85 .. TR 537.e•c
0 Z=O
ll. Z=0.24 m
0 Z•0.43 m V
V Z=0.65 m
(J 100 11
•
e V
t
~
E 95 . 0
ll.
i~
IJ
j
c~
90
4~
..
0
o z-o TR off
ll. Z==0.24 m
0 Z•0.43 m
V Z==0.65 m
"
e
95
.
t
~
E 9011.
4
g
8
~~
85
-1 1
Intercept Slope
off 91.15 0.15 0.08
537. 8°C 91.06 11.34 0.98
815. 6°C 91.28 21.86 1.00
Ftlm Bulk
0 • Tp 21.1°C A
0.12
••
A A Tp 93.3°C A
E 0.09 ·I-
E
..
G'J
G'J
CD
c
.::tt.
0.06 ·I-
A
•
·-.c
1-
(J
•
0.03 A A
e 0 0
0.00 • .
I
.
_j
0 Tp 21.1°C A
25·1- A Tp 93.3°C
¥e
A
oi 20·
C'
0
.::tt.
c 0
·c 15·
.c
en
~ 10
.....CD
.9
5·!-
A 0
~
0 In . .
_j
. I
6
Tp 93.3°C
E 0 TR off [p
E 0 TR 537.8°C
6. TR 787 .8°C
0
:lE 4-r- Q~
CD
tn 0
0
~
c: 0 0
"L:
.c 6.
Cl)
0 2 0
+i
0
.......
Cl)
0"• lot-
t--
Tp 21.1°C
T I .
.~
0 TR off
E 0 TR 537.8°C
E 4
6. TR 787.8ac
ll
0
:lE
VTR871.1°C tp
Cl)
tn
c
~ ~
c:
"L:
.c
Cl)
2 0 0
6. V
·-..............uc g
en
6.
o::::: I .I
360
o Tp 21.1•c
-- -
1:1 Tp 93.3•c
I 270
!
0
I)
"0
-aa
!D. 180
en.,
·xa 0 e 0
I 90 1:1
a
0 .
o Tp 21.1•c
-
I
E
u
1.8
0
1:1 Tp 93.3•c
~
,.....
1.5 ·I- 0
0 A
:g
a::
-~ 1.2 f- A
.s::.
~ A
. _.
0 R
0.9
o Tp 21.1•c
0.45 f- 1:1 Tp 93.3•c
lilt A
j 0 & 0
i
0
0.40
A A
0.35 . .
0 150 300 450 600 750 900
Radiation Heater Temperature Setting, OC
360
0 Tp 21.1°C -
.L::!t..
-
A
-
A
6. Tp 93.3°C
rn
Q)
~ 270 ·t-
0'
Q)
"'C
"'C
..
0
~
180·
a.
en
rn
·;c o~o
0
I 90· 6.
0
0~-----+------~----~----~------T-----~
0 5 10 15 20 25 30
Lateral Shrinkage, ~
400
MD TD
0 • Tp 21.1°C
0 A .A Tp 93.3°C
a.
300
:::E
ar
::::1
•
::::1
"0
0
:::E 200
•
0
•
G)
·mc: A ....
A 0
~ 100--
0
A!
0
MD TD
.
0 • Tp 21.1°C
A .A Tp 93.3°C
1.00
~ ~
E
.::tt.
~
·u
0.75 ....
A
•
0
..2 ....
>
G)
(.)
"£:
0
0.50·~ A
2i
UJ 0.25
0.00
_. . .
I
0 5 -_...
o Tp 21.1•c
A Tp 93.3°C
4 ·!-
0
!£
a;::, 3 ·!- A
a
E
~ 2 !- D 0
l A
1 0
0
o Tp 21.1•c
5 1- A Tp 93.3°C D D
f
;::,
4 A
1C
~ 3 A 0
E
~c
a. 2.
1 0
0
o Tp 21.1•c
A Tp 93.3°C
50 0
40
R
c:; 30
•0 A
0
CD
20
A 0
10 . A
r!l
0 . .
0 150 300 450 600 750 900
Radiation Heater Temperature Setting. OC
-
121
Effect of Embossing Pressure
0
After undergoing a specific thermal treatment, the plastic
film is passed between the nip of an engraved steel roll and
a rubber covered steel backup roll. A force is applied onto
the embossing roll by the pneumatic system and the rubber
roll, impressing a pattern into the plastic film. The
embossing pressure will affect the bulk thickness of the
embossed film. The lower the embossing pressure for constant
thermal treatment conditions, the lower the bulk thickness
should be, i.e. poorer pattern definition. The film properties
are not affected by the embossing pressure, but as noted
before, they are influenced by the thermal treatment. The
embossing pressure is usually set at the maximum value during
production in order to ensure the best possible pattern
definition.
Flat Film
c a-axis orientation spread
UE61
120°
UE63
45°
maximum 80° 60°
4.2.4. Discussion
(4-1)
,. " .. ...
95 Tp 93.3°C ..... ········
... .... ........
..... . .. . . ..
~
(.)
0
. .... . .. . . ...
E
....
:::J 75 Tp 65°C
- - - -
E
CD
0.
- - - - ----
---
E
~ 55
CD
()
0
't:
:::J
en Tp 21°C
E 35
ti:
15+-----------,_----------~-----------r--~
0 300 600 900
·Radiation Heater Temperature Setting, °C
0.0+-----~·------~'----+-'----~.------r-'----+.----~
30 40 50 60 70 80 90 100
Preheat Roll Temperature Setting, oc
CHAPTER 5
0 THEORETICAL ANALYSIS
pCvDT/Dt=-(V·q)-T(aPjaT)v(V•V)-(T:VV), (5-1)
Z=Vt, (5-2)
(5-3)
At t=O
T(X,Y,O)=f(X,Y) (5-4)
At Y=-W/2
-k8T(X,-W/2,t)/8Y=h(T(X,-W/2,t)-TA(Y,t)) (5-5)
At Y=W/2
-k8T(X,W/2,t)/8Y=h(T(X,W/2,t)-TA(Y,t)) (5-6)
At X=-H/2
T(-H/2,Y,t)=Tp(Y) (5-7)
At X=H/2
-k8T(H/2,Y,t)/8X=h(T(H/2,Y,t)-TA(Y,t)), (5-8)
(5-9)
where a=kl pCv, which denotes the thermal conductivity. The one
dimensional mathematical description of the problem was solved
using the following initial and boundary conditions:
At t=O
T(X,O)=f(X) (5-10)
At X=-HI2
T (-HI2, t) =Tp (5-11)
At X=HI2
-k8T{HI2,t)I8X=h(T(HI2,t)-TA(t)). (5-12)
2
(Ti,J, t+l-Ti,J, t) I l.\ t=a ( (Ti+l,J, t+l-2Ti,j. t+l+Ti-l,j. t+l) I l1X
+ (Ti,j+l, t.+l-2Ti ,j 't+l+Ti,j-1, t+l) I l.\ Y2 , ( 5-13)
Ambient Environment
TA
H/2 n +l
><
n
j i.T-
X
-H/2
z TT-r--------·-··
1 Z ---------- j ----··---·--·-· n ny+-1
-W/2 y W/2
Implicit X direction
(T i,J, t+l/2-Ti,J, d I~ tl2=a ( (T i+l,J, t+l/z-2Ti,J, u112
+Ti-l,j,t+l/2) I ~X + (Ti,j+l,t-2Ti,j,t+Ti,j-l,d I ~Y )
2 2
(5-14a)
Implicit Y direction
(Ti,J,t+l-Ti,j,t+ttz> I t:.tl2=a. ( (Ti+l,J,t+1/2-2Ti,J,t+lt2+
2
Ti-l,j 't+lt2> I ~X + (Ti ,j+1, t+1-2Ti,j 't+1+Ti,j-1, t+1> I~ Y ) •
2
(5-14b)
Implicit X direction
-Ti-l,J, t+l/2+ ( 2>.1 +1) Ti,J, t+112l >.1-T i+l,J, t+l/2=
>.2T i,j-1, tl ).1+ ( 1-2 >.2) Ti,J, tl ).1+ >.2Ti,J+l, tl >.1 (5-15a)
Implicit Y direction
-Ti,J-1, t+l+ ( 2>.2+1) Ti,J, t+lf >.2-Ti,J+l, t+l=>.lTi-l,J, t+l/21 >.2
+ ( 1-2 ).1) Ti,J, t+ltzl >.2+ >.lTi+l,J, t+112l ).2, ( 5-15b)
At t=O
T(i,j,O)=f(i,j) {5-16)
At Y=-WI2, j=l
Ti, l,t+l= {Ti,2,t+l+BiyTA) I { 1+Biy) (5-17)
0
136
At Y=WI2, j=Ny+1
0 Ti,NY+l,t+l= (Ti,NY,t+l+BiyTA) I ( 1+Biy} (5-18)
At X=-HI2, i=1
Tl,j,t=Tp(j) (5-19)
At X=HI2, i=Nx+1
TNX+l,J,t+l=(TNX,j,t+l+BixTA) I (1+Bix), (5-20)
0 (5-21)
137
At t=O
T(i,O)=f(i) (5-22)
At X=-H/2, i=l
T1 ,t.=Tp (5-23)
At X=H/2, i=Nx+l
TNX+l,t.+l= (TNX,t.+l+BixTA) I ( l+Bix) • (5-24)
Equations 5-5, 5-6 and 5-8 define the convective heat transfer
boundary condition between the plastic film and the ambient
air environment in terms of an average heat transfer
coefficient and the temperature difference between the film
surface and ambient environment [36]. This form is misleading,
because it is a definition of an average thermal conductance
rather than a law of heat transfer convection. The convective
heat transfer is actually a complicated function of the
plastic film velocity, the properties of the polymer,
properties of the preheat roll, geometry of the preheat roll,
air velocity, air properties and temperature gradients. For
example, the heat transfer coefficient for free convection
from a horizontal cylinder to air at atmospheric pressure [36]
can be expressed as follows:
(5-25)
0
138
The heat transfer coefficient between the plastic film and
0 preheat roll was assumed equal to infinity, since the plastic
film is moving at the same linear velocity as the preheat roll
and is in perfect contact with the preheat roll surface, see
Equation 5-7. In this study, the value of the heat transfer
coefficient at the plastic film-air interface was specified
as 20.3 Wfm2°C. This value is an average of several values
quoted in the literature [36,38,126], ranging from 13 to 54
W/m2 °C.
5.1.1.5. Discussion
0 40.0
Tp 37.8•c
0 Estimated
[J Actual
37.5
p
!
tM 35.0 u c>
32.5
Il
1 [~
30.0
Tp ss•c
0 Estimated
67.5 [J Actual
lP
1~
65.0 I~
~~
f •P
{!
62.5
60.0 . Tp 93•c
0 Estimated
92.5 [J Actual
I~ 1p
•u
! 0
'
90.0
tJ c~
87.5
85.0
-1 0 1
Y/WF/2
100
0 Estimated
0 Actual [0
T
0
95E ~
1
~
e
....,::l
eCD
c.
E 0
{! 90( ~ (~
85+-------------------+-----------------~
-1 1
100------------------------------------~
f;' 75.
e
.a
~
G)
Q.
E
t! 50·
25+----------4----------~--------~·----------~:~~
0.0 0.5 1.0 1.5 2.0
time, s
At t=O
T(X,O)=f(X) (5-26)
At X=-H/2
-kaT(-H/2,t)/8X=h(T(-H/2,t)-TA(t)) (5-27)
0
145
At X=H/2
0 -k8T(H/2,t)/8X=h(T(H/2,t)-TA(t)). (5-28)
At X=±H/2
T-TA 00
--=I: (5-29a)
2 2
T0 -TA n=1 (Bn +Bi+Bi ) cos (Bn)
Bntan (Bn) =Bi 1 (5-29b)
5.1.2.2. Discussion
At t=O
0 T(X,O)=f(X) (5-30)
At X=-H/2
-k8T(-H/2,t)/8X=h(T(-H/2,t)-TA(t))+
eF (t) -HJ2'1ss (T~-T ( -H/ 2, t))
4
(5-31)
At X=H/2
-k8T(H/2,t)/8X=h(T(H/2,t)-TA(t))+
eF (th 12 asB (T~-T (H/ 2, t) )
4
1 (5-32)
At X=-HI2
-kaT ( -HI2, t) 1ax=h (T ( -HI2, t) -TA (t)) +h_a; 2 (TR-T ( -H12, t)) (5-33)
At X=HI2
-kaT (HI2, t) 1aX=h (T {HI2, t) -TA (t)) +ha; 2 (TR-T (HI2, t)) . (5-34)
(5-35)
(5-36)
where Bi=Bi2 +Bi 1 , Bi 1=hllx/k and Bi 2 =h* Llxlk. Again, the same
solution scheme described in the previous section was used to
solve the set of equations describing the radiation heater
system. The modified heat transfer coefficient, ambient air
temperature and shape factor were updated following each
increment.
(5-39)
0
151
(5-40)
A,
T
b
Batch System
- Front Heater
0.45 - - Back Heater
0.30
0.15
0.00
Continuous System
- Front Heater
- - Back Heater
0.30
...
-e
if
l
~ 0.15
\.
0.00 +-..iii.!i:::==----1------1--___;:...._-1-------1
20 40 60 80 100
Position Z, cm
TR 537.8°C
100 0 Estimated
D Actual
0
a
e-
::I 80
.....
e 0
8.
E
,! D
60 0
0
40 I
TR 815.6°C
0 Estimated 0
D Actual
100·r-
D
~ 0
-!
::I
e
CD
a.
E
0
~ 75 0
D
50 I .
I
40 60 80 100
Initial Temperature, oc
5.1.3.6. Discussion
TR 537.8°C
100·- 0 Estimated
D Actual 8
u
0
f
:::J 80
.....
.,~
0.
0
E
~ 0
60·r-
0
0
40 .
TR 815.6°C
0 Estimated
0 Actual
100
8
~
!
:::J
...... D
e
CD 0
Q.
E
~ 75·
0
D
50
40 60 80 100
Initial Temperature, °C
90~-------------------------------------
Ti 68.8"C
- - Combined Radiation and Convection (e==0.1)
- - Convection Only (e=O)
(J
0 80
e
.a
E
Cl)
a.
E
t! 70 -- -- - ---
60+-----------~----------~~--------~
Ti 91.4"C
- Combined Radiation and Convection (e•0.1)
110 - · Convection Only {r==O)
0
0
!
....= 100
e
CD
a.
- -- - ----
E
~
90
80+-----------~----------~----------~
20 40 60 80
Position Z, cm
BOT-------------------------------------~
Ti ss•c
- Combined Radiation and Convection (e=0.1)
75 - - Convection Only (e=O)
0
•..
f
....:::J
.,c.~
E
t!
70
-- - ---
65
60+-------------~-----------+----------~
ri 91.4•c
- Combined Radiation ond Convection (r-0.1)
110 - · Convection Only (r=O)
"i
!
100
l
E
~
90
80+---------------~----------~-----------~
20 40 60 80
Position z. cm
At t=O
T(X,O)=f(X) (5-41)
161
At X=-H/2
0 T(-H/2,t)=T 1 (5-42)
At X=H/2
T{H/2,t)=T2 , (5-43)
0
166
00
2 2 0 5
P(Z)=w( (l-Z /B ) . +LaNcos( (2N-1) Z7r/2B)). (5-47)
n=1
5.2.1.4. Discussion
1.00
0.75
0
a..
ti:- 0.50
0.25
0.00+---------+---------+---------r--------4
-1.0 -0.5 0.0 0.5 1.0
Z/ 8 Hertz
0.5
0
a..
'.,.,E
+'
0.0
en
-0.5
-1.0+-----~-----4------~----~-----+----~
-3 -2 -1 0 1 2 3
Machine Direction, Z/8
The properties of the rubber layer can vary over time due to
the rolling process and temperature variations in the
radiation heaters. These effects can harden the rubber layer
over time, resulting in an increase in the modulus and a
decrease in the nip dimensions. According to Parish [ 14 7]
these effects probably have the greatest impact on the
accuracy of the estimates made. As mentioned above, in this
study it was not possible to determine the true elastic
modulus of the rubber layer; therefore literature values were
used.
(5-48)
c where ac denotes the cylinder radius, r the radius co-
ordinate, P the pressure and N1 the applied force. At the
edges of the punch (r=ac) the pressure is infinite, resulting
in plastic deformation of the elastic half space.
c
174
where a denotes the normal stress, r the shear stress and
c r,z,e the cylindrical co-ordinates. Equations 5-49a and 5-49b
are solved using the following boundary conditions:
(5-53)
5.2.2.3. Discussion
0
177
The load required to press a paraboloid of revolution into a
semi-infinite elastic layer for complete penetration [162]
was calculated as being 0.09 N. The diameter of the base of
the paraboloid of revolution was specified to be equal to the
width of the base of the embqssment.
0
178
4
- Flat Cylinder
- - Paraboloid of Revolution
a 3
c..
::E
fD
..
fD
e 2
iii
a
E
- -------- -
0
z 1
I \
I \
0
-1.0 -0.5 0.0 0.5 1.0
r/a
5.3. SUMMARY
0
181
0 (d) No friction is assumed.
(e) The interaction between multiple punches is
ignored.·
0
182
CHAPTER 6
0 DISCUSSION
0 TP 9J.J•c
p - V 16.5 cm/a
- • V 24.5 cmZa
i · · · · V 35.0 cm/a
tE
{!J.
125
I
j
25
Tp off
p - V 16.5cm/a
100 - • V 24.5 cmZa
iJ · · ~ · V 35.0 cm/a
"" ""
75
E
ff
Im 50 ....
25
25 325 825 925
Radiation Heater Temperature Setting. •c
0 TP s3.3•c
p - H 0.025 mm
- · H 0.050 mm
i
E
~
125
--- --- -
~ 75
I
i
25
TP e5•c
p - H 0.025 mm
- · H 0.050 mm
~
!I. 125
E
,.. ,..
~
E
,..
e: 75
IE
!
25
Tp off
p - H 0.025 mm
125 - · H 0.050 mm
{
&
E 75 """
e:
"""
I """
! --- """
25
25 325 625 925
Radiation Heater Temperature Setting. •c
175~----------------------------------~
- Tp off
- - Tp 65°C
···· Tp 93.3°C
125 ..
. . .. /
............ ..... ................ ... ......
75
- -- - --
25+-------------+-------------~------------~
25 325 625 925
Radiation Heater Temperature Setting, °C
~m Bulk
• Tp 21.1°C .&
• •
0.12· ll. .& Tp 93.3°C .&
.&
E 0.09-r-
E
o;
~
O'J
CD
c: 0.06-r- •
•
(J
:E
1-
0.03-r- ll. ll.
0 0 Oil. 0
0.00 .
_._
0 Tp 21.1°C ll.
25 ll. Tp 93.3°C
aR
.; ll.
tn 20 I"
a
~
c: 0
·.::: 15-r-
.r.
en
E 10 r-
.:!
.3
5
ll. 0
0 ll.
0
_Q
. I
0 360
o Tp 21.1•c -
-"""'
- -_._
.&
A Tp 93.3•C
Ill
~ 270
r
"Q
,;
!a. 180
U')
.!! 0 oA
X 0
0 90
I A
0
0 .
-'
o Tp 21.1•c
-
I
E
0
1.8 .
0
A Tp 93.3•C
~
.... 1.5 . 0
0 A
i
""
-~
.c 1.2 ·I- A
.2 A
c
0 0
A
0.9 _I
•.
o Tp 21.1•c
0.45 . A Tp 93.3•C
lt A
0
~
i 0 oA
0.40
.
0 0 A A
0.35 . . .
-'
400
MD TO
0 • Tp 21.1°C
a A .a.
Tp 93.3°C
0..
300·
2
lrJ
:I
- •
"3
-a
0 200- ·o • ...
2
..!!
·;;
c
0
A
....
OA
,! 100·~
0
.
• A A
0 MD TD '
I
I .
I
0 • Tp 21.1°C
A A. Tp 93.3°C
1.00·1-
~ ~
E
~
b
·c:;
0.75 •
0
...
A
~
0
eA. .
·c:00
(I)
0.50··
0.25 1-
••
0.00 .
I
.
25 50 75 100 125 150
Estimated Film Surface Temperature. °C
...-
0 5
0 Tp 21.1•c
4.
t:.. Tp 93.3•c
0
~
c;
:I
3 . /::,.
0
E
!
Cl
2 0 Ot:..
a.. /::,.
1 r- 0
0 .
__.
.
...L
5
o
t:..
:rep 93.3•c
21.1•c
0 0 /::,. /::,.
..~
!:I 4.
3 ·r-
/::,.
0 /::,.
E
l 2
1 0
0 . .
o Tp 21.1•c
60 . t:.. Tp 93.J•c
40
0 /::,.
20
Ot:..
0 /::,.
A
0 c-1
0
192
0 2.0.....--------------~0----,
0
0
1.5
0 0 0
oo 0
1.0 oo
oo 0
0 0 0 00 coo 0 0
Oo
0.5+---......_---+----+----1.1------'t-----;
40
0
06'
20 8
0
0 8
0
0+----4----4------+-----+-----1!1----~
•.; 40·
j
c
·c:
,.c
j 20
0
0 ~
25 50 75 100 125 150 175
Estimated F11m Surface Temperature. •c
0.20
0 P 0.2 MPa
8 P 0.1 MPa
~
E 0
0.15
E
.,
oi
e • 0
~
I)
c
CJ 0.10· •0 0
0
0
0
:c
1--
.:Jt. 0 0
"5
m 0.05
0.00 .
_j
•
I
0 P 0.2 MPa
8 P 0.1 MPa
0
0
40·
0
.,.,.
CO
0
0
c:; 0 0
20
• 00
0 • WJ~cD
0
0
0 . . .
25 50 75 100 125 150 175
Estimated Film Surface Temperature, °C
(6-1)
where 1 oct denotes the octahedral stress, 0' 11 0' 2 and 0' 3 the
principal stresses and c~ the critical stress. The critical
stress, which is equal to the yield stress for LDPE-1 when
measured in tension at room temperature, was found to be 8.94
MPa. The critical stress measured in compression was found to
range from 6.8 MPa, when measured at room temperature, to 3.1
MPa, when measured at 75°C.
The plastic film and rubber layer on the backup roll both
undergo different loading cycles. The plastic film undergoes
a single load cycle, while the rubber layer undergoes a
cyclical loading each time it passes through the nip region.
The distribution of the octahedral stress in the nip region,
calculated using the Hertz theory, is presented in Figure 6-
7. Regardless of the force applied to press the two rolls
together, the maximum stress value obtained at the nip
centerline is below the critical yield value for LDPE-1. The
0 octahedral stress distribution in the contact area under a
195
300~-----------------------------------.
- P 0.2 MPa
- - P 0.1 MPa
--
g
0..
.
......
...,..
200
., / - .,.,. ...... ....... ___
- .......
'
~0
/
'
0
\- 100
0+---------~--------~--------~--------~
-1.0 -0.5 0.0 0.5 1.0
Z/8
The force applied to press the embossing roll onto the backup
roll determines the dimensions of the nip region and stress
distribution in the nip region between the embossing and
rubber covered backup rolls. As the plastic film passes
through the nip region, it is simultaneously cooled and
stressed. When the pressure at any point in the nip region
exceeds the yield point of the polymer, plastic deformation
of the material and permanent deformation of the film occur.
If the stress is below the yield point of the plastic film,
elastic recovery will occur and the film will maintain its
original state. If the yield stress is not exceeded everywhere
in the material, then the pattern will contain regions of
permanently deformed and undeformed material. The pattern
definition reflects the balance between the amount of material
that is frozen (deformed) into the embossment shape and the
amount of material that remains undeformed.
0
199
CHAPTER 7
0 CONCLUSIONS, ORIGINAL CONTRIBUTIONS AND FUTURE WORK
of the process was divided into two parts: the contact between
0 two cylinders and the indentation of a punch into an elastic
half space.
c
202
is simultaneously cooled and stressed. When the pressure at
0 any point in the nip region exceeds the yield point of the
polymer, then plastic deformation of the material occurs and
permanent deformation of the film occurs. If the stress is
less than the yield point of the plastic film, elastic
recovery will occur and the film will maintain its original
state. If the yield pressure is exceeded only in parts of the
material, then the pattern will contain regions of permanently
deformed and undeformed material. The pattern definition is
based on the amount of material that is frozen (deformed) into
the embossment shape and the amount of material that remains
undeformed.
38. G. Menges and w.o. Predohl, Poly. Eng. Sci., 15(5) :394
(1975).
73. C.R. Desper and R.S. Stein, J. Appl. Phys., 37(11) :3990
(1966).
81. T.H. Kwack and c.o. Han, J. Appl. Poly. Sci., 35:363
(1988).
82. c.o. Han, T.H. Kwack and M.E. Vickers, J. Appl. Poly.
Sci., 28:3399 (1983).
209
83. c.o. Han, Y.J. Kim, H.K. Chuang and T.H. Kwack, J.
0 28:3435 (1983).
Appl. Poly. Sci.,
84. T.H. Kwack and c.o. Han, J. Appl. Poly. Sci., 28:3419
(1983).
85. C.D. Han and J.Y. Park, J. Appl. Poly. Sci., 19:3257
(1975).
86. C.D. Han and J.Y. Park, J. Appl. Poly. Sci., 19:3277
(1975).
87. C.D. Han and J.Y. Park, J. Appl. Pol. Sci., 19:3291
(1975).
88. H.H. Winter, Pure & Appl. Chem., 55(6) :943 (1983).
89. J. Meissner, Pure & Appl. Chem., 42:552 ( 1975) .
90. W. Minoshima and J .L. White, J. Non-Newt. Fl. Mech.,
19:251 (1986).
91. W. Minoshima and J.L. White, J. Non-Newt. Fl. Mech.,
19:275 (1986).
92. L.A. Utracki and J. Lara, Melt Rheology of PE; Part I
Correlation Between Extensional and Shear Flows, Paper
Presented at the International Workshop on Extensional
Flows, Mulhouse-La Bresse, France (January 1983).
93. L.A. Utracki, A. catani, J. Lara and M.R. Kamal,
Processability and Flow of Polyethylenes 1 Paper
presented at the European meeting on Polymer Processing
and Properties, Capri, Italy (June 1983).
94. R. Farber and J. Dealy, Poly. Eng. Sci., 14 (6): 435
(1974).
95. T. Kanai and J.L. White, Poly. Eng. Sci., 24(15):1185
(1984).
96. C.J. Petrie, Poly. Eng. Sci., 15(10) :708 (1975).
97. R.K. Gupta, A.B. Metzner and K.F. Wissbrun, Poly. Eng.
Sci., 22(3):172 (1982).
0
210
103. N.C. Huck and P.L. Clegg, S.P.E. Trans. 1 1:121 (1961).
0
212
141. H.R. Thomas and V .A. Hoersch, Univ. of Ill. Eng. Exptl.
Station Bulletin, Series No. 212, Urbana (1930).
148. T.C. Soong and C. Li, Intl. J. Mech. Sci., 23:263 (1981).
0
213
156. J.O. Smith and C.K. Liu, J. Appl. Mech., 75:157 (1953).
160. J.W. Harding and I.N. Sneddon, Proc. Gamb. Phil. Soc.,
41:16 (1945).
164. R.S. Dhaliwal and I.S. Rau, Intl. J. Eng. Sci., 8:843
(1970).
167. L. Fox and E. T. Goodwin, Phil. Trans. Roy. Soc., A245: 501
(1953).
0
214
171. ASTM D 1928-80 1 Annual Book of ASTM Standards, 8. 02:169
0 (1990).
172. ASTM E 252-84, Annual Book of ASTM Standards, 8. 03:763
(1990).
173. Large Polarization Microscope "Zetopan-Pol" Instruction
Manual, Reichert, Austria (1972).
Page
0 A.6. MECHANICAL PROPERTIES A-26
0
A-4
0
A-5
A.1.2. Velocity
V=Rndc, {A-1)
0
A-7
The dimensions of the embossing roll pattern were measured by
0 taking photographs of the casting using a Leitz Wetzlar
microscope, Model Dialex 20, equipped with a polaroid camera
at low magnifications, i.e. 4-40x. A copper wire was placed
next to the cast as a reference. The diameter of the copper
wire was measured using a Mitutoyo Combimike micrometer, Model
No. 159-211. the accuracy of this instrument was +0.0025 mm.
The film thickness of the plastic films was measured using the
density gradient technique. This approach is similar to that
described in ASTM E 252-84 [172]. The density of the sample
is determined and the film thickness calculated using the
following equation:
H=w/Ap, (A-2)
The true length of the flat films was measured using a ruler.
0
.
A-ll
0 Rating
0
A-12
3 • The embossed film sample was placed on the
0 rotating stage of the microscope and viewed between
the crossed polarizers.
4. The sample stage was rotated until extinction was
achieved, i.e. maximum darkness.
5. The rotating stage was rotated 45 degrees to a
position of maximum brightness.
6. The microscope image was then photographed using
a polaroid camera.
A.4. MICROSTRUCTURE
0
A-13
Dichroic ratios at 720, 730, 1080, 1303, 1352, 1368 and 1894
cm- 1 were measured using a Perkin Elmer Infrared Grating
Spectrophotometer Model 467 with a Sample Space Wire Grid
Polarizer. The spectrophotometer is capable of scanning from
250 cm- 1 to 4000 cm- 1 • The wire grid polarizer contains a
polarizing element, which is a gold wire grid vapour deposited
on a silver bromide substrate, for use in the 2.5 to 35 ~m
spectral range.
0
A-18
A.4.4. Birefringence
0
A-19
A.4.5. Density
Density g{cm3
0 Float
Float
1
2
.900
.910
Float 3 .916
Float 4 .922
Float 5 .924
(A-3)
(A-4)
The following step by step procedure was used to make all the
measurements:
0
A-27
e=L-L0 /L 0 , (A-5)
0
A-30
8. The test specimen was compressed at a strain rate
0 of 0.5 or 1.0 mm/min. The chart recorder speed was
set at 1 mmjmin. The chart recording showed the load
as the abscissa and the compressive strain as the
ordinate.
q=-k(8T/8X), (A-7)
k = 0.005422 V I H, (A-8)
0 l!.T
A-34
where k denotes the thermal conductivity, V the voltage, I the
0 amperage, H the sample thickness and ~T the average
temperature difference between thermocouples 1-2 and 3-4.
The specific heats for the resins were obtained using the
ratio method [190). The reference material used to calculate
the specific heat was sapphire [191].
A.8.1. Gloss
B.S. FIGURES
0 B.S.1. Effect of Film Velocity
0.15
0 Film
0.12 A Bulk
E A
E
.
CI'J
0.09
CI'J
I)
c
.Jtt.
(,)
0.06
~
0.03 0 0
0 0
0.00 .
I I
30·~ 0
~
ti
C'l
D
.Jtt.
c 25 0
·r:::
.c
(I)
-E
I)
.9
20·· 0
0
15 . .
10.0 12.5 15.0 17.5 20.0
Film Velocity, m/min
0 .
0
-'e u
o.975
0
~
!0 0.950
a:: 0 0
u
·e'fi 0.925 .
0
i5
0.900 --'
0.395 .
0
M
0 0
0
j 0.380
i
0
0.365 .
0.350 .
10.0 12.5 15.0 17.5 20.0
Film Velocity, m/min
90
0
0 MD 0
0 80 8 TD
a..
:::E
ur
::J 70
0
0
::J
"'0
0 8
:::E
..!! 60
·m
c:
~ 50+
40 I
I I
0 MD
0.475 8 TD
~
E
..:w::
~
·c:; 0
0.450
0
~
·:c00 0.425+ 0
en
0.400~------~------~--------~------~~
10.0 12.5 15.0 17.5 20.0
Film Velocity. m/min
5
0 -
.
~
"6
;:,
3 0
CJ 0 0
E
! 2 0
~
1.
5. 0 0 0 0
2.
1
.
0
0
11
.
0
0
0
7
5
10.0 12.5 15.0 17.5 20.0
Film Velocity. m/mln
0.20
•
F11m Bulk
0 e P 0.1 MPa
0.15
A .& P 0.2 MPa ...
E
E
! •
m
m
CD
.
0.10. •...
c:
.X
(J
:r:
1- ~ ~
0.05 f-ti 0
0.00 •
I
I
30 0 P 0.1 MPa
A P 0.2 MPa
~
CD
..
et
c
.X
c: 20
·c:
..c:
en
c
A
~
0
.....cCD 10-f-
_,
0
a . I
~
0 360
0 P 0.1 MPa -- -
.... ....-
A P 0.2 MPa
.,
u
f 270
0'1
u
"0
-oa
f 180
Q.
.,
fl)
·;:
a 90
a
I
a
0 . .
0 P 0.1 MPa
1.6 . A P 0.2 MPa
A.
0
1.3 . 0
A.
1.0 A A.
0
0.7 .
0 P 0.1 MPa
0.450 A P 0.2 MPa
at 0.425 r8
I
.E R
i 0.400! • r
(.) a a
0.375
0.350 -.
0 150 300 450 600 750 900
Radiation Heater Temperature Setting. OC
MD TO
300·1- 0 e P 0.1 MPa
c ll. ..A. P 0.2 MPa
a..
::::E
fl
::::J
•
::::J
200·
~
"C
0
::::E
CD
•
0
"ii
c 100 ~
t! ~
0 .
I
.
I .
MD ID
1.00 0 e P 0.1 MPa
ll. ..A. P 0.2 MPa
~
E
.:tl.
0.75+ • •e
~
·c;
'~
•
..Q
~
0.50 ..
~~
.!:.!
c
0
en 0.25·"-
0.00+------4------4------4,------~----~------~
0 150 300 450 600 750 900
Radiation Heater Temperature Setting, °C
5
0 0 P 0.1 t.4Pa
Lt. P 0.2 t.4Pa
4 Lt.
0
~
0 3 Lt. 0
:::J
a Lt.
E
~0 2 ft 0
a..
1.
0 ·-·
0 P 0.1 t.4Pa
5 Lt. P 0.2 t.4Pa ft ft
f 4. ft
....:::J
.! 3 ft
.....,
E
....
0 2
a..
1.
0 --'-
0 P 0.1 t.4Pa
Lt. P 0.2 t.4Pa
20 0
Lt.
15
§
6
•0 10 . a
CD
5 !l ft
0 I
.
0 150 300 450 600 750 900
Radiation Heater Temperature Setting. •c
Ftlm Bulk
0 • H 0.029 mm . .
0.12·
••
ll. .A H 0.057 mm
E 0.09·
,.
E
c
~
ftJ
CD
0.06·
~~
•
u
·-r= ll.ll.
0.03· ~0
0 oo
0.00 I
I
I
0 H 0.029 mm 0
ll. H 0.057 mm
M 15·1-
.;
0'
j
c
·c: 10-~
.c
(/)
-~
.:!
.9 5·
0
0 ll.
IQ . ll.
0 A . I
0 360 1...-
0 H 0.029 mm --,...
6. H 0.057 mm
ID
D
f 270 -1-
,0
D
-oa
f 180 .
0..
(/)
ID
·;c 0 0 0
a
I 90 . A
a
0 -'
-
I
E
u
1.8
0
A
0 H 0.029 mm
A H 0.057 mm
~
...... 1.5
A
0 A
0
i0:::
.2
e
..c
1.2 1- A
.2
c
0 0
0.9 .
0 H 0.029 mm
0.45 -1- A H 0.057 mm
g
0 g A
0.40 A
0.35 . I .
0 150 300 450 600 750 900
Radiation Heater Temperature Setting. •c
5
0 0 H 0.029 mm
4.
l:!t. H 0.057 mm
0
~
"6
:::J
3. 1:1
a
E
!0 2. 8 8
a.
1 8
_.
0
5 0 H 0.029 mm e e
l:!t. H 0.057 mm
-
!:::J
~
E
4
3 ·l:!t. 8
-.s
0
a.
2.
1 0
0 .
I
.
0 H 0.029 mm
1:1 H 0.057 mm
a
45
0
A
15 . 0
A
0
0 .
0 150 300 450 600 750 900
Radiation Heater Temperature Setting, •c
Fllm Bulk
-
••
• __
0 12
0 e BUR 4:1 (0.029 mm)
6. A BUR 2:1 (0.027 mm)
A
E 0.09 r-
E A
u) •
en
~ 0.06
.:::t.
.2
r=.
0.03 r-~
0.00+-----------~---------------~---------------+-.----------~.---------------~----------~
G)
Cl
-
0
~ 40 ~
·c
..s:::
(f)
E
.! 20 0
..9 8
A
0 ~ . .
I 0 I
0 360
0 BUR 4:1 ~0.029 mm~
LJ. BUR 2:1 0.027 mm
...
A
- ---·
.,.,
270
.,!
gt
"0
..g
0
f 180 .
a.
.,
(/')
LJ. 0
·;c
0 90 0
I
0
0
0 BUR 4:1 ~0.029 mm~
.... 0 LJ. BUR 2:1 0.027 mm
I
E 1.4 ·f.
u
....,
0
,...
0
1.2 0
~
0
·eu
.!: 1.0 ,..
LJ.
..2 OLJ.
c
LJ.
LJ. LJ.
0.8 --'
0
r&
0.41 .lA
A
0
0.38 ~LJ.
0.35 I .
I .
Radiation Heater Temperature Setting. •c
MO TO
300·1- 0 e BUR 4:1 ~0.029 mm~
0
c.. 6 A BUR 2:1 0.027 mm
::E
A
Cl')
•
:;:]
"0
:;:]
200 A
0
::E
CD
·o;
c
0 •
0
100
,!
.
e~~
0 I
I
I
I
I
MD TO'
0 e BUR 4:1 f0.029 mm~
6 A BUR 2:1 0.027 mm
Cl')
........
E
0.75
•H
•
.:IIt.
b
·a 0.50
t~
0 0
~
(J
"iE
0 0.25
en
0.00+------+------~----~:~----~----~----__,
0 150 300 450 600 750 900
Radiation Heater Temperature Setting. °C
.....
0 5 --
0 BUR 4:1 ~0.029 mm~
A BUR 2:1 0.027 mm
4
!£ A
"6 3 0
:s A
a
E
:11D 2. G
A
D.. 0
1
0 -•
3 0
2 A
1 ·I-
0 .
0 BUR 4:1 ~0.029 mm~
A BUR 2:1 0.027 mm
A
30
0
ft
6 20'.
b
CO
R
10
• A
0
A
0 I
APPENDIX C
0 MORPHOLOGY AND ORIENTATION IN
POLYETHYLENE TUBULAR BLOWN FILMS
Paper presented at the Society of Plastics Engineers Annual
Technical Conference (ANTEC), Los-Angeles, May (1987),
published in the SPE Technical Papers, Vol. 33, page 446
(1987) and published in Plastics Engineering,
page 45, October (1988).
INTRODUCTION
1. Melt temperature
2. Draw ratio
3. Blowup ratio
4. Freeze line height
EXPERIMENTAL
BACKGROUND
Rheoloqical Properties:
The x-ray data support the prediction that linear low density
0 polyethylene exhibits low stress orientation, a-axis parallel
to the machine direction. Due to the low stress levels, the
orientation was found to remain constant regardless of the
blowup ratio. Although the a-axis has preferential orientation
in the machine direction, there is still a large spread of a-
axis orientation in all directions, i.e random. The overall
level of orientation in these films is very low, indicating
a very low degree of stress crystallization orientation. This
can be attributed not only to the rheological properties of
the resin, but also to the processing conditions which had to
be adjusted to avoid bubble instability. The cooling air and
film velocities settings were lower in comparison to those
used for the low and high density polyethylene films produced.
High density polyethylene also exhibited low stress level
orientation, while low density polyethylene an intermediate
value. The a-axis for all the low density polyethylene
samples, were inclined at an angle from the TD-ND plane in the
ND direction. For all the samples, symmetry was noted about
the ND-MD plane in the TD-ND plane. Some degree of a-axis
orientation was observed, for all the films, in all
directions. No sample showed pure a-axis orientation. This is
as expected due to the crystallization process occurring over
a temperature range. For all the samples tested, the b-axis
orientation was in the transverse direction. The degree of
spread around the transverse direction was small. The observed
b-axis orientation is consistent with the row structure model.
SOMHARY
Processing
Die Gap Temperature Thickness
Resin (mm) (oC) Blowup Ratio Cmml
~I
"" 0
Sonic Velocity
(km/s)
Resin BUR ~ Birefringence _MQ_ ~ MD/TD
LLOPE 1.9:1 0.912 -o. 75x1o· 3 0.83 1.01 0.82
2.4:1
2.8:1
---
0.917
1.99
0.00
0.82 0.95 0.86
0.84 0.72 1.20
0
I
......
w
"' 0
Tensile Properties
Impact (MPa)
Yield Modulus Yield
Resin BUR ..{,kgl MD _TIL _TIL TO
LLD PE 1. 3:1 2.6 123.0 143.3 10.6 10.9
2.4:1 2.1 113.5 137.3 9.8 10.6
2.8:1 3.0 63.4 86.5 5.2 7.2
0
I
1-'
.c:>-
'=' 0
Dichroic X-Ray
Ratio a-axis }2,-axis
Resin BUR 730 cm- 1 MD _:m_ _:m_ TD
note: The x-ray angles are measured from the horizontal axis and is the
point of maximum intensity along the diffraction ring.
(")
I
1-'
U1
V
0
NIP ROLLS
BLOWN FILM
AIR
COOLING
DIE
EXTRUDER
LOW STRESS
I a.:: - I 1110
woe b-axla
888
'-ox la
eww
Figure c-2: Effect of Stress During Crystallization (')
on Crystalline Orientation. I
.....
-..]
V 0
-f 0
"0
0
4:
~
10 1
LOPE
•• ooo
00
>- •orSJ
I
-
1-
U)
.,
+
+1
+ '
0
0
10' -
-
U)
> ...
i· I IDPE
0
c:u0
;}_ 10 1
+ ~ •• • 0
I I I I
10'"' to• to• 10 1
TIME CS)
.,
+
++I 1
1
.I 0
r
u
-
CJ)
I
I 00 00
>
~ ao•
+
+,;
170 c
+
+ *
.0 Q
I
... ,. .01
.001
~~
z oc:
+*
,
0
+
-0 +o o
~
(!)
+
z to• !If·
+ 190 c
0 +
id +
+
+
I I
10-t so• 10
1
to•
TIME (S)
,....
'P-<t 1
c
,~ +
e, 10 • 150
170 c
>- 0 190 c
-
J-
U)
0 •o•
u
-
Cl)
,. .........
+ 0
•
> a
;;}_
z 10
1
I ., . .,. ... 0
Ill+
-0
l-
<(
........
+0
(!) +
z ao• t-
0
GJ
I
I I I I
10-1 1o• 1
10 10'
n
I
t-.>
0
Figure C-5: Elongational Viscosity of HOPE at Various
Strain Rates and Temperatures.
D-1
Appendix D
RHEOLOGICAL PROPERTIES OF LDPE-1
•n-1
1]= k 'Y I (D-1)
__
n_ k (Pa-sn) R2
0.396 13980.7 0.999
0.413 9403.7 0.999
D-3
The first normal stress difference values were found to
increase with shear rate, but, due to the large variability
in the data, no conclusions could be made.
D-4
A! AA AA AA AA A A
8 A
OG• 180°C
7 ~G· 1so•c
c eG.. 1ao•c
n..
.:f! • G.. 1so•c
ri
::I 6
"S
"tJ
0
::::E
5 •••••••••••••
0 0 0 0 0
0 0 0 0
4
0 10 20 .30 40 50 60 70
time, min
-
~~
9
A
ll. t. A
ll.
A A A
~~
8 ·I- ll. ll.
OG• 180°C ll.
Cl ll.G• 150°C ~~
a..
7 ·I- eG" 180°C
""'ri A G.. 150°C
::J
::J
"Cl
0
::E
6 1-
5 •0 0• • • • • • • •
0 0 0 0 0 0 ~
4 I
0 20 40 60 80
Strain, S
1000.0
OG' 180ac
AG' 1soac
eG" 180°C
100.0 ·r- .&G" 15oac
c
Q..
.:tt.
ri
A
I i ~~
:::2
.,
:;
0
10.0 ·I-
•i
::E
·~ 00
~·
1.0 cp
0.1+-------------~~--------------~----------~
0.1 1.0 10.0 100.0
Angular Frequency. rad/s
1E5~------------------------------------~
0 e
Rheometries Mechanical Spectrometer
ll. A lnstron Capillary Rhearneter
0 ll. 1ao-c .... 1~
1E4 -r-
100·
••
10+---------+~------+------r---------r-----~----~
0.01 0.10 1.00 10.00 100.00 1000.00 1.00E4
Shear Rate. s- 1
,.
'
Figure D-4: Shear Viscosity of LDPE-1.