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TelCom Semiconductor
TelCom Semiconductor
Company Profile
THE COMPANY
TelCom Semiconductor, Inc. designs and manufactures analog and mixed
signal integrated circuits in five principal product families: thermal management,
mixed signal, power management, system management and interface. TelCom
produces more than 600 devices for a wide variety of applications in the communi-
cations, computing and instrumentation markets.
Thermal Management
With its wide variety of temperature sensing products, TelCom Semiconductor
TelCom Semiconductor
Thermal Management Products is a leader in Thermal Management analog circuits. TelCom’s range of thermal
management devices help monitor and warn of fault conditions and solve thermal
management problems. TelCom’s family of temperature sensors and brushless DC
fan controllers serve a broad spectrum of applications. Logic output temperature
sensors are autonomous, programmable temperature devices that output a logic state
Can't change when measured temperature is too high or too low. Voltage output sensors
Take
The supply a linearized output voltage directly proportional to measured temperature.
Heat?
These devices are useful in thermometer circuits, temperature compensation appli-
cations, and as general purpose replacements to older thermistor technology. Serial
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I/O sensors are designed for easy interface to the system processor. Both multidrop
and single zone sensors are available. TelCom’s new brushless DC fan managers
provide temperature-proportional fan speed control and fan fault detection. These
devices extend fan service life, lower average fan supply current, reduce noise, and
protect the system from fan and over-temperature related failures. All of TelCom’s
thermal management products are well-suited for use in portable computers and
handheld electronic telecommunications equipment such as cellular phones, power
supplies, and fan control equipment.
Mixed-Signal
TelCom’s mixed-signal products are focused on signal conversion and low level
TelCom Semiconductor
power amplification. This product line includes over 190 different finished parts and
TC5xx Family A/D Converters
is comprised of six primary product types: voltage references, A/D converters,
display A/D converters, voltage-to-frequency (V/F) and frequency-to-voltage (F/V)
converters, and chopper stabilized op amps. Our precision analog front end contain
all the analog circuitry necessary to implement a dual slope integrating A/D
converter. They connect to the host processor (or TC520A serial adapter) with only
3 wires, and they feature programmable resolution and conversion speed and a low
installed cost versus other integrating converters. All TelCom analog front ends
directly handle both differential and bipolar input voltages. The precision serial
A/D converters have 17 bit resolution, superior noise rejection, and user-program-
mable resolution/conversion speed. Like the precision analog front ends, they
directly handle both differential and bipolar input voltages. We carry both single
channel, integrating A/D converters and single channel, dual slope A/D’s with no
need for an external processor. TelCom’s new family of linear building blocks
combine several low power analog functions into low-profile packages for smaller,
more efficient analog circuit solutions.
Power Management
TelCom’s power management products help to regulate, control and detect
electrical conduction through many different semiconductor circuit levels and board
components. New product development efforts in this area are mainly targeted to
detach and regulate voltages in battery and line powered computer, industrial and
telecommunications equipment. TelCom’s DC-to-DC charge pump converters are
ideal for use in any low current, voltage inversion or doubling applications. Our
BiCMOS and CMOS PWM’s are lower power replacements for industry standard
converters. TelCom’s CMOS LDO family supersedes a wide variety of popular
TelCom Semiconductor bipolar regulators, delivering superior performance at lower supply current levels.
Processor Supervisors TelCom offers many sizes of MOSFET drivers. This allows for the best match
between the switching performance of the driver/MOSFET to the application.
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System Management
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sors safeguard processor sanity and provide other critical system monitoring
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functions such as battery backup control for CMOS SRAM and RTC’s.
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TelCom’s interface products fall into two categories: data communications and
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display drivers. TelCom will be introducing several new products in these categories
in the coming years.
COMPANY HISTORY
19
58Teledyne TelCom Semiconductor was founded in June 1993 as the result of a management
Crystalonics buy-out of Teledyne Components, a division of Teledyne Industries. TelCom’s
history actually goes back to 1960 as a company called Amelco Semiconductor Co.
60
19
Teledyne Inc. In 1970, Amelco was acquired by Teledyne and ran as a division of Teledyne
Industries, Inc. from 1970 to 1993. Therefore, TelCom can be credited with the
longest, continuous history of any semiconductor manufacturer in Silicon Valley.
60 Amelco
19
Semiconductor Phil Drayer, TelCom Semiconductor’s current President and CEO, joined Teledyne
Components in 1990 and is credited with having initiated a corporate quality
7 7
196 Continental 196 Teledyne improvement culture, rebuilding the company’s sales, support, and marketing,
Devices Philbrick
modernizing the wafer fabrication facility, and overseeing the introduction of 80
new products in 24 months.
70
Teledyne
19
Semiconductor TelCom Semiconductor, Inc. officially began operations in December of 1993.
Annual sales totaled $25 million in the first year of operations and, in July of 1995,
85 Topaz
19 TelCom went public (NASDAQ: TLCM).
Semiconductor
19
90
Teledyne LINEAGE OF TELCOM SEMICONDUCTOR
Components
1993 - TelCom Semiconductor, Inc. established
93
1990 - Teledyne Components formed from Teledyne Semiconductor, Teledyne
19
Philbrick, Teledyne Crystalonics, and Topaz Semiconductor
1970 - Amelco Semiconductor Co. and Continental Devices merge to form
Teledyne Semiconductor
1960 - Amelco Semiconductor Co. formed
Consumer Electronics
Building Controls
Communications
Security Systems
Instrumentation
Power Systems
Product Line
Automotive
Peripherals
Computers
Electronics
Datacom
Displays
Telecom
Display A/D ▼ ▼ ▼
System A/D ▼ ▼ ▼
Voltage Reference ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼
Op Amps ▼ ▼
Switching Regulators ▼ ▼ ▼ ▼ ▼ ▼
Voltage Detectors ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼
Linear Regulators ▼ ▼ ▼ ▼ ▼
Temperature Sensors ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼
Data Communications ▼ ▼ ▼ ▼ ▼ ▼ ▼
Display Driver ▼ ▼ ▼ ▼ ▼
PWM's ▼ ▼ ▼
System Supervisors ▼ ▼ ▼ ▼ ▼ ▼
EMPLOYEES AND FACILITIES
TelCom Semiconductor, Inc. employs approximately 320 people worldwide.
TelCom’s wafers are manufactured at company headquarters in Mountain View,
California. This 50,000 square foot manufacturing facility contains a 9,000 square
foot clean room using CMOS and Bipolar technology. In December 1995, TelCom
entered into an agreement with IC WORKS, a private California semiconductor
wafer manufacturer. This guarantees TelCom access to manufacturing capacity
utilizing submicron process technology, which provides TelCom with leading edge
process technology at a fraction of the cost of a dedicated facility. The facility in
Hong Kong employs approximately 140 people and provides an additional 35,000
square feet to conduct final testing and shipment distribution to customers world-
wide.
COMPANY BACKGROUND
Headquarters TelCom Semiconductor, Inc.
1300 Terra Bella Avenue, Mountain View, CA 94043-1836
Tel: (650) 968-9241, Toll Free: (800) 444-5568, Fax: (650) 967-1590
Web: http://www.telcom-semi.com, E-mail: liter@c2smtp.telcom-semi.com
Capitalization $144,500,000
Linear
Building
Blocks
Mountain View, CA