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Company Profile

1300 Terra Bella Avenue


Mountain View, CA 94043-1836
TelCom Semiconductor, Inc. Company Profile

THE COMPANY
TelCom Semiconductor, Inc. designs and manufactures analog and mixed
signal integrated circuits in five principal product families: thermal management,
mixed signal, power management, system management and interface. TelCom
produces more than 600 devices for a wide variety of applications in the communi-
cations, computing and instrumentation markets.

The company is headquartered in Mountain View, California, where it owns and


operates a dedicated wafer manufacturing facility, producing proprietary products.
Testing is performed at their Hong Kong facility, and products are sold through a
network of worldwide sales offices, registered sales representatives and electronic
component distributors. Our customers are comprised of a diverse group of domestic
and foreign original equipment manufacturers (OEMs) and distributors. The
company’s stock is traded on NASDAQ under the symbol TLCM.

Thermal Management
With its wide variety of temperature sensing products, TelCom Semiconductor
TelCom Semiconductor
Thermal Management Products is a leader in Thermal Management analog circuits. TelCom’s range of thermal
management devices help monitor and warn of fault conditions and solve thermal
management problems. TelCom’s family of temperature sensors and brushless DC
fan controllers serve a broad spectrum of applications. Logic output temperature
sensors are autonomous, programmable temperature devices that output a logic state
Can't change when measured temperature is too high or too low. Voltage output sensors
Take
The supply a linearized output voltage directly proportional to measured temperature.
Heat?
These devices are useful in thermometer circuits, temperature compensation appli-
cations, and as general purpose replacements to older thermistor technology. Serial
1
2
4
5 3
7
8 6
*
9
0
A
#
T
X

I/O sensors are designed for easy interface to the system processor. Both multidrop
and single zone sensors are available. TelCom’s new brushless DC fan managers
provide temperature-proportional fan speed control and fan fault detection. These
devices extend fan service life, lower average fan supply current, reduce noise, and
protect the system from fan and over-temperature related failures. All of TelCom’s
thermal management products are well-suited for use in portable computers and
handheld electronic telecommunications equipment such as cellular phones, power
supplies, and fan control equipment.
Mixed-Signal
TelCom’s mixed-signal products are focused on signal conversion and low level
TelCom Semiconductor
power amplification. This product line includes over 190 different finished parts and
TC5xx Family A/D Converters
is comprised of six primary product types: voltage references, A/D converters,
display A/D converters, voltage-to-frequency (V/F) and frequency-to-voltage (F/V)
converters, and chopper stabilized op amps. Our precision analog front end contain
all the analog circuitry necessary to implement a dual slope integrating A/D
converter. They connect to the host processor (or TC520A serial adapter) with only
3 wires, and they feature programmable resolution and conversion speed and a low
installed cost versus other integrating converters. All TelCom analog front ends
directly handle both differential and bipolar input voltages. The precision serial
A/D converters have 17 bit resolution, superior noise rejection, and user-program-
mable resolution/conversion speed. Like the precision analog front ends, they
directly handle both differential and bipolar input voltages. We carry both single
channel, integrating A/D converters and single channel, dual slope A/D’s with no
need for an external processor. TelCom’s new family of linear building blocks
combine several low power analog functions into low-profile packages for smaller,
more efficient analog circuit solutions.

Power Management
TelCom’s power management products help to regulate, control and detect
electrical conduction through many different semiconductor circuit levels and board
components. New product development efforts in this area are mainly targeted to
detach and regulate voltages in battery and line powered computer, industrial and
telecommunications equipment. TelCom’s DC-to-DC charge pump converters are
ideal for use in any low current, voltage inversion or doubling applications. Our
BiCMOS and CMOS PWM’s are lower power replacements for industry standard
converters. TelCom’s CMOS LDO family supersedes a wide variety of popular
TelCom Semiconductor bipolar regulators, delivering superior performance at lower supply current levels.
Processor Supervisors TelCom offers many sizes of MOSFET drivers. This allows for the best match
between the switching performance of the driver/MOSFET to the application.
N - Y

System Management
O K R

O P
C AC TTE
TR U
L
B A
B

1
EF

Microcontroller and microprocessor based systems rely on processor supervi-


R
V

R
TO
EC V
ET ∆

sory functions to insure stable operation. TelCom’s cost-effective system supervi-


D
C
C

2
V

EF

sors safeguard processor sanity and provide other critical system monitoring
70 I
C E

R
G

V
(T C
)

ER O
M D
TI CH
TT

M AY
T

functions such as battery backup control for CMOS SRAM and RTC’s.
A

A
B

ER
W

TI EL
V

Interface
C D
(T WD
)
70

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TelCom’s interface products fall into two categories: data communications and
R
V

display drivers. TelCom will be introducing several new products in these categories
in the coming years.
COMPANY HISTORY

19
58Teledyne TelCom Semiconductor was founded in June 1993 as the result of a management
Crystalonics buy-out of Teledyne Components, a division of Teledyne Industries. TelCom’s
history actually goes back to 1960 as a company called Amelco Semiconductor Co.
60
19
Teledyne Inc. In 1970, Amelco was acquired by Teledyne and ran as a division of Teledyne
Industries, Inc. from 1970 to 1993. Therefore, TelCom can be credited with the
longest, continuous history of any semiconductor manufacturer in Silicon Valley.
60 Amelco
19
Semiconductor Phil Drayer, TelCom Semiconductor’s current President and CEO, joined Teledyne
Components in 1990 and is credited with having initiated a corporate quality
7 7
196 Continental 196 Teledyne improvement culture, rebuilding the company’s sales, support, and marketing,
Devices Philbrick
modernizing the wafer fabrication facility, and overseeing the introduction of 80
new products in 24 months.
70
Teledyne
19
Semiconductor TelCom Semiconductor, Inc. officially began operations in December of 1993.
Annual sales totaled $25 million in the first year of operations and, in July of 1995,
85 Topaz
19 TelCom went public (NASDAQ: TLCM).
Semiconductor

19
90
Teledyne LINEAGE OF TELCOM SEMICONDUCTOR
Components
1993 - TelCom Semiconductor, Inc. established
93
1990 - Teledyne Components formed from Teledyne Semiconductor, Teledyne
19
Philbrick, Teledyne Crystalonics, and Topaz Semiconductor
1970 - Amelco Semiconductor Co. and Continental Devices merge to form
Teledyne Semiconductor
1960 - Amelco Semiconductor Co. formed

MARKETS AND CUSTOMERS


TelCom’s products are sold worldwide to more than 5,000 customers in three
primary end markets - communications, computing, and instrumentation. Our
products are used in a variety of applications, including industrial and process
control, test and measurement, personal computers, and telecommunications equip-
ment. The company has a global sales staff and a network of independent sales
representatives and distributors worldwide. TelCom has sales offices in Europe,
Hong Kong, and the United States, with technical applications support available at
each office.
What separates TelCom from other analog semiconductor companies is our
customer driven approach. We recognize the analog semiconductor marketplace as
being diverse and broad based and, therefore, have adopted a corporate philosophy
of listening to the rhythm of the marketplace to create cost-effective, timely
solutions for our customers. The breadth of our product portfolio is the direct result
of this focused differentiation strategy. TelCom’s products aim to serve the diversity
of the marketplace - the growth markets as well as the traditional markets.
MARKET: GROWTH VS. TRADITIONAL
Growth Traditional
Personal Control
Markets Computing Communications Instrumentation Systems
Examples File Servers Cellular Phones Test Equipment Process
Notebooks Pagers Meters Industrial
Peripherals Precision Scales
Typical Customer Motorola Tektronix
Compaq Moore Products
Panasonic Omron
NEC

END MARKET APPLICATIONS

Home Entertainment &

Consumer Electronics

Building Controls
Communications

Security Systems
Instrumentation
Power Systems
Product Line

Automotive

Peripherals
Computers

Electronics

Datacom

Displays
Telecom
Display A/D ▼ ▼ ▼

System A/D ▼ ▼ ▼

V/F & F/V Converters ▼ ▼ ▼

Voltage Reference ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼

Op Amps ▼ ▼

Charge Pump Converters ▼ ▼ ▼ ▼ ▼ ▼

Switching Regulators ▼ ▼ ▼ ▼ ▼ ▼

Voltage Detectors ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼

Linear Regulators ▼ ▼ ▼ ▼ ▼

Power MOSFET, Motor & Pin Drivers ▼ ▼ ▼ ▼ ▼ ▼

Temperature Sensors ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼

Data Communications ▼ ▼ ▼ ▼ ▼ ▼ ▼

Display Driver ▼ ▼ ▼ ▼ ▼

Linear Building Blocks ▼ ▼ ▼

PWM's ▼ ▼ ▼

System Supervisors ▼ ▼ ▼ ▼ ▼ ▼
EMPLOYEES AND FACILITIES
TelCom Semiconductor, Inc. employs approximately 320 people worldwide.
TelCom’s wafers are manufactured at company headquarters in Mountain View,
California. This 50,000 square foot manufacturing facility contains a 9,000 square
foot clean room using CMOS and Bipolar technology. In December 1995, TelCom
entered into an agreement with IC WORKS, a private California semiconductor
wafer manufacturer. This guarantees TelCom access to manufacturing capacity
utilizing submicron process technology, which provides TelCom with leading edge
process technology at a fraction of the cost of a dedicated facility. The facility in
Hong Kong employs approximately 140 people and provides an additional 35,000
square feet to conduct final testing and shipment distribution to customers world-
wide.

COMPANY BACKGROUND
Headquarters TelCom Semiconductor, Inc.
1300 Terra Bella Avenue, Mountain View, CA 94043-1836
Tel: (650) 968-9241, Toll Free: (800) 444-5568, Fax: (650) 967-1590
Web: http://www.telcom-semi.com, E-mail: liter@c2smtp.telcom-semi.com

Founded June 1993

Established December 1993

Ownership Public (NASDAQ: TLCM)

Capitalization $144,500,000

President Phillip M. Drayer

Employees Approximately 320 worldwide

Business TelCom Semiconductor, Inc. is a worldwide manufacturer of linear and mixed-


signal devices dedicated to solving problems over a broad spectrum of customer
applications.

Legal Counsel Wilson Sonsini Goodrich & Rosati, PC


PRODUCT PORTFOLIO

Thermal Management Mixed-Signal Power Management System Management Interface

Charge Pump CPU/System Data


Temperature Voltage
DC-DC Supervisors Communications
Sensors References
Converters

Voltage A/D Display


Converters PWMs
Output Drivers

Logic Display A/D Linear


Output Converters Regulators

Serial Chopper- Power


Stabilized MOSFET
Op Amps Drivers

Fan V/F and F/V


Controllers Converters

Linear
Building
Blocks
Mountain View, CA

WORLDWIDE SALES OFFICES

America’s Headquarters & Eastern United States European Headquarters


Western United States
TelCom Semiconductor, Inc. TelCom Semiconductor GmbH
TelCom Semiconductor, Inc. 67 South Bedford Street, Suite 400W Lochhamer Strasse 13
1300 Terra Bella Avenue Burlington, MA 01803 D-82152 Martinsried
Mountain View, CA 94043-1836 TEL: 617-229-5835 Germany
(Shipping & Mailing) FAX: 617-270-9532 TEL: 49-89-89-56-500
P.O. Box 7267 FAX: 49-89-89-56-5022
Mountain View, CA 94039-7267 Product Center
TEL: 650-968-9241 Pacific Rim Headquarters
FAX: 650-967-1590 TelCom Semiconductor, Inc.
Austin Product Center TelCom Semiconductor H.K. Ltd.
Central United States 9101 Burnet Road, Suite 214 10 Sam Chuk Street, Ground Floor
Austin, TX 78758 San Po Kong
TelCom Semiconductor, Inc. TEL: 512-873-7100 Kowloon, Hong Kong
17370 N. Laurel Park Dr., Suite 400E FAX: 512-873-8236 TEL: 852-2350-7380
Livonia, MI 48152 FAX: 852-2354-9957
TEL: 313-591-4021
FAX: 313-591-4592

© TelCom Semiconductor, Inc. 1997 Printed in the U.S.A.

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