16G PowerEdge E3 Drives Features Participant Guide - pdf-1

16G POWEREDGE E3
DRIVES FEATURES
PARTICIPANT GUIDE
16G PowerEdge E3 Drives Features-SSP
© Copyright 2023 Dell Inc Page 2

Table of Contents
E3 Drives Overview 4
Introduction 4
E3.S Drives in PowerEdge 16G Servers 6
E3 Drives Architecture 10
E3 Drives Form Factor 10
E3 Drives Mechanical Design and Carrier 12
Scavenger Hunt Activity - NVMe PCIe SSD Drives 17
You Have Completed This Content 20
Appendix 21
Glossary 22

E3 Drives Overview
E3 Drives Overview
Introduction
The Enterprise and Data Center Small Form Factor (EDSFF) is an SSD
design for NAND Peripheral Component Interconnect Express (PCIe)
storage drives. EDSFF optimizes storage in enterprise, private, and public
data centers.
E3 short single thickness (E3.S) drives.
The following are the purpose and benefits of using EDSFF E3 drives.

E3 Drives Overview
Purpose
• Higher interface speed with PCIe Gen5.

• E3.x1 replaces 2.5" and U.2 form factor.
• Serve as a common form factor for accelerator and computational
storage.
Benefits
• Optimized for high-speed signal.

• Better air impedance and thermal resistance.
• Optimized to fit more front-end accessible devices and more future
proof.
1 E3.x can be E3.S, E3.S 2T, E3.L or E3.L 2T which are the four different
types of E3 Drives.

E3 Drives Overview
E3.S Drives in PowerEdge 16G Servers
The E3 Drives used for 16G PowerEdge Servers are E3.S with the max
power of 25 W.
The PERC controller models that support E3.S drives are PERC 11
H755N and PERC 12 H965i. E3 drives attached to a PERC controller runs
at Gen 4 speeds.
E3 drives attached to an onboard controller, S160 runs at Gen 5 speeds.
Click each tab to view the examples of E3.S configuration.
E3.S in C6600
Example of E3.S drives used in C6600.
E3.S x8 configuration in C6600.
E3.S in MX760c
Example of E3.S drives used in MX760c along with the backplane.
E3.S x8 configuration in MX760c.

E3 Drives Overview
E3X8 backplane front view.
E3X8 backplane rear view.
Go to: Table for more information of high-level product

features for industry E3.S drives.

E3 Drives Overview
Tip: See page 8 and 9 of the participant guide that is

attached to the course for the comparison between 2.5" and
E3.S drives.
EDSFF E3.S drives have several advantages in the number of drives that
are supported in newer platforms comparing to the previous generation
2.5" drives.
The table shows the comparison between the previous generation of 2.5"
drives and EDSFF E3.S drives.
Properties 2.5" EDSFF E3.S
Interface PCIe Gen4/SATA/SAS PCIe Gen4 and

PCIe Gen5
Dimension (mm) 70 x 100 x (7 / 15 height) case E3.L 76 x 142.2

Case or Card SATA 7 mm height x (7.5 / 16.8
SAS/NVMe 15 mm height case)
E3.S 76 x
112.75 x (7.5 /
16.8 case)
Connector SFF 8639 SFF-TA1002

Number of lanes x1 SATA, x2 SAS, x4 PCIe and TA-1009
U.2 and U.3 pin out profiles Up to x16
E3.S SSD is
x4.
Max Power 15 W (7 mm) E3.L 40 W (7.5

25 W (15 mm) mm) / 70 W
(16.8 mm)
E3.S 25 W (7.5
mm) / 40 W
(16.8 mm)

E3 Drives Overview
Number of Drives in 24 Up to 46 E3.L

2U 1T (7.5 mm) for
Storage
32 E3.S in 16G
Number of Drives in 10 16 E3.S in 16G

1U 8 E3.S with
front I/O for
CET
Max Capacity 30 TB SAS offering today E3.L 7.5 mm

30 TB PCIe offering today NA-64TB
E3.S 7.5 mm
15TB-30TB

E3 Drives Architecture
E3 Drives Form Factor
There are four different types of form factors for E3 Drives. The drives
come in different dimensions and power profile.
The usage of E3 drives is based on the different form factor and power
profile.
Click the information icon to learn more.
1: E3 long single thickness device (E3.L)
• Height - 76 mm
• Length - 142.2 mm
• Thickness - 7.5 mm

• Max Power - 40 W
• Target usage - dense and storage-centric chassis that use deeper
chassis.
2: E3 short single thickness device (E3.S)
• Height - 76 mm
• The only form factor that is supported in PowerEdge platforms now.
• Target usage - Primary server storage (right size).
• It is needed for modular and short chassis.
3: E3 short double thickness device (E3.S 2T)
• Height - 76 mm
• Target usage - High-end SCM device and pluggable I/O devices.
4: E3 long double thickness device (E3.L 2T)
• Height - 76 mm

• Target usage - Accelerators and computational storage.
E3 Drives Mechanical Design and Carrier
The mechanical design of E3 drives is based on Kioxia CD7 E3.S2. A

carrier is used to hold the E3.S drive, and it has two screws on it.
The status LEDs are embedded on the mechanical cover of E3.S models.
Click each tab to view the mechanical design and the carrier of E3.S
drive.
Kioxia CD7 E3.S
2 CD7 (E3.S) SSD drive developed by Kioxia Corporation, a global leader

in flash memory, and solid state drives.

Kioxia CD7 E3.S mechanical design.

E3.S mechanical cover and base side.
E3.S Carrier

Carrier used for E3.S drives.

Illustration of E3.S carrier (DPN:NV2RX).

Scavenger Hunt Activity - NVMe PCIe SSD Drives
Scavenger Hunt Activity
Instructions
1. Open the sample SMART log file.

2. Analyze the log file.
3. Use the log file to answer the questions.
4. See the participant guide to find the correct answers.
Important: Use the sample SMART log file for learning

purpose only. E3.S drives SMART log is similar to NVMe
PCIe SSD SMART log. The sample SMART log file is pulled
using HII.
The SMART log that is collected through SupportAssist TSR collection

shows in JSON format. The SMART log that is pulled using OMSA or HII
shows in text format.

Illustration of SMART log file in SupportAssist TSR collection.
Activity
Question 1
What is the size of the NVMe SSD?
Answer: Use the search function, CTRL + F to search for "Model

Number" in the sample SMART log file. The size is shown towards to end
of the model.
Question 2
What is the PCI Vendor ID for the NVMe SSD?
Answer: Use the search function, CTRL + F to search for "PCI Vendor ID"
in the sample SMART log file.

Question 3
What is the amount data written to the NVMe SSD?
Answer: Use the search function, CTRL + F to search for "Data Written"
in the sample SMART log file.
Scavenger Hunt Activity Wrap Up
Notes
Tip: See the participant guide under the Resources tab.

You Have Completed This Content
Click the Save Progress and Exit button in the course menu to
record this content as complete.
Go to the next learning or assessment, if applicable.

Appendix
E3.S Product Features

The table illustrates the high-level product features for industry E3.S
drives.
Parameter Description
Interface PCIe Gen4 x4 and Gen5 x4 with

NVMe protocol
Form Factor E3.S 1T (7.5 mm height)
Power up to 25 W
Swim Lane Value DC Read Intensive (one

Drive Writes per Day - DWPD) @ 5
years
Perf. Ent. Read Intensive (one
DWPD) @ 5 years
Perf. Ent. Mixed Used (three
DWPD) @ 5 years
Capacities 1.92 TB or 3.84 TB or 7.68 TB or

15 TB
Performance Varies by capacity and value or

perf or DWPD

Glossary
10 Gigabit Media Independent Interface (XGMII)
XGMII connects full duplex 10 GbE ports to each other and to other
devices on a printed circuit board. XGMII is typically used for on-chip
connections.
15G
Generation 15 modifier to distinguish different features available for
generation 15 servers.
2S
Two socket form factor. Used to identify the family of servers. PowerEdge
servers can have 1S, 2S, or 4S. See the PowerEdge rack server portfolio
page for details.
AI
Artificial Intelligence (AI) is the designing and building of intelligent agents
that receive precepts from the environment and act to affect that
environment.
Boot Optimized Server Storage (BOSS)

Dell Technologies boots optimized storage solution. RAID solution card
that is designed for booting a server's operating system.
DIMM
Direct Access Inline Memory Module. DIMMs are available in varying
capacities. All DIMMs in a cache must have the same capacity
DL
Deep Learning (DL) is a form of Machine Learning which uses Artificial
Neural Networks.
DRAM

x4, x8, and x16 DIMMs refers to the width of the DRAM components on a
memory module. x4 DIMMs use DRAM components that have a 4-bit data
width. x8 DIMMs use components with an 8-bit data width. x16 DIMMs
use components with a 16-bit data width.
E3 Drives
The Enterprise and Data Center Small Form Factor (EDSFF) is an SSD
design for NAND and Storage Class Memory (SCM). EDSFF optimizes
storage in enterprise, private, and public data centers.
HCI
Hyper Converged infrastructure (HCI) combines compute, virtualization,
storage, and networking in a single cluster.
HII
The Human Interface Infrastructure (HII) configuration utility is a storage
management application integrated into the System BIOS <F2> It is used
to configure and manage RAID disk groups, virtual disks, and physical
disks. This utility is independent of the operating system.
HPC
High performance computing (HPC) is the ability to process data and
perform complex calculations at high speeds.
HW RAID
Form of RAID. The motherboard or a separate RAID card handles the
processing.
iDRAC
The Integrated Dell Remote Access Controller (iDRAC) is designed for
secure local and remote server management and helps IT administrators
deploy, update, and monitor PowerEdge servers.
IDSDM

Redundant SD-card module for embedded hypervisors. PowerEdge
servers can boot to the hypervisor out-of-the-box. The embedded
hypervisor is mirrored across dual SD cards using an integrated hardware
controller.
IEEE 802.3
The Electrical and Electronics Engineers (IEEE) 802.3 is a collection of
IEEE standards. The working group defining the physical layer and Media
Access Control (MAC) of Data Link Layer in the Ethernet set the
standards.
Intel Ice Lake

Codename for the 3rd generation Xeon Scalable server processors.
Inter-Integrated Circuit (I2C)

I2C is a serial communication bus that is used for attaching lower-speed
peripheral ICs to processors and microcontrollers in short-distance,
intraboard communication.
IoT
The Internet of things (IoT) describes the network of physical objects such
as sensors, software, and other technologies for the purpose of
connecting and exchanging data with other devices and systems over the
Internet. (Wikipedia)
LAN On Motherboard (LOM)

Short for LAN on motherboard. The term sees a chip or chipset capable of
network connections that has been embedded directly on the motherboard
of a desktop, workstation, or server. Instead of requiring a separate
network interface card to access a local-area network, such as Ethernet,
the circuits are attached to the motherboard. An advantage of a LOM
system is an extra available PCIslot that is not being used by the network
interface controller.
Latency

Latency is the response time or the period of time that a component waits
for an answer from another component. Latency is the time it takes for the
storage to respond to a request.
LRDIMM
Load-Reduced DIMM. Has higher densities than RDIMMs. Uses a
memory buffer chip to reduce the load on the server memory bus.
Media Access Control (MAC) address

The server is connected to the network through a switch. A Media Access
Control (MAC) address identifies the switch. A MAC address is a unique
identifier for an Ethernet or NIC over a network
micro Secure Digital card (uSD)

Type of removable flash storage commonly used in servers and other
computing devices. It is used to store data and software, and can be
easily removed or replaced as needed.
ML
Machine Learning (ML) is an application of AI where systems use data to
learn how to respond, rather than being explicitly programmed.
MT/s
Mega-Transfers per Second (MT/s). Measurement of bus and channel
speed in millions of cycles per second.
Multicasting
Multicasting involves sending the same message to many endpoints such
as in a video conferencing facility.
NVDIMM
Non-Volatile DIMM
NVMe
Non-Volatile Memory Express (NVMe). Communications interface for
PCIe-based SSDs. Used to increase efficiency and performance.

OCP
Open Compute Project (OCP) is an organization that shares designs of
data center products and best practices among companies. OCP designs
and projects include server designs, data storage, rack designs, and open
networking switches. Read more information about the organization by
going to www.opencompute.org.
OMSA
OpenManage Server Administrator (OMSA) is a software agent that
provides a comprehensive, one-to-one systems management solution in
integrated web browser-based graphical user interface (GUI) or command
line interface(CLI) throught the operating system.
OMSA
OpenManage Server Administrator (OMSA) is a software agent that
provides a comprehensive, one-to-one systems management solution in
integrated web browser-based graphical user interface (GUI) or command
line interface(CLI) throught the operating system.
PCH
Platform controller hub (PCH) controls certain data paths and support
functions used in conjunction with Intel CPUs.
PCIe
Peripheral component interconnect express (PCIe) is an interface
standard for connecting high-speed components.
PERC
PowerEdge RAID Controller (PERC). Family of controllers that enhance
performance, increase reliability, add fault tolerance, and simplifies
management.
RAID
Redundant Arrays of Independent Disks (RAID). RAID controllers combine
multiple server physical hard drives together into a virtual drive or multiple
drives to improve data efficiency and protection.

RDIMM
Registered DIMM. Dual in-line memory module (DIMM) with improved
reliability.
RSA SecurID
RSA SecurID is multi-factor authentication (MFA) technology used to
protect network resources, such as applications and websites. MFA
mitigates risk and maintains compliance without disrupting employee
productivity. MFA can confirm user identities to ensure they are only
granted access to the resources they need to do their jobs. RSA SecurID
can quickly and securely provide appropriate access to resources both on-
premises and in the cloud.
SAS
SAS (serial-attached SCSI) is a type of SCSI that uses serial signals to
transfer data, instructions, and information. SAS drives are dual ported.
SATA
SATA (Serial Advanced Technology Attachment) uses serial signals to
transfer data, instructions, and information. SATA drives have only a
single port.
SDS
Storage data services such as APEX Data Storage Services. APEX is an
as-a-Service portfolio of scalable and elastic storage resources. The
storage as-a-Service model simplifies the storage process.
Secure Enterprise Key Manager (SEKM)

SEKM is a licensed feature that allows users to apply iDRAC9 to
authenticate with Gemalto/SafeNet AT KeySecure Management Server
through the Key Management Interoperability Protocol (KMIP). To protect
the data against server theft, the SEKM enables the KEY to be held on
either the iDRAC iLKM or a remote KMS server as opposed to getting
stored locally on the PERC.
Self-Describing I/O (SDIO)

Self-describing data is data and metadata that describes the format and
meaning of a message. SDIO usually contains data needed to understand
the message, and the information necessary to complete a task.
SMART
Self-Monitoring, Analysis and Reporting Technology (SMART) is a
monitoring system included in hard disk drives (HDDs) and solid state
drives (SSDs). Its primary function is to detect and report various
indicators of drive reliability with the intent of anticipating imminent
hardware failures.
SNAP I/O
Balances I/O performance. CPUs share one adapter, which prevents data
from traversing the inter-processor link when accessing remote memory.
SP
A service provider (SP) is a company that provides its subscribers access
to the internet.
STP cable
Shielded Twisted Pair (STP) Ethernet cable that is commonly used for
high-speed networks. A metallic substance shields STP. An additional
metal foil wraps each set of twisted wire pairs together.
UDIMM
Unregistered or unbuffered DIMM. UDIMMs do not have an onboard
register as seen with an RDIMM. UDIMMs are typically used in desktops
and laptops.
UEFI boot
Unified Extensible Firmware Interface (UEFI). UEFI secure boot prevents
systems from booting from unsigned or unauthorized preboot device
firmware, applications, and operating system boot loaders. Without secure
boot enabled, systems are vulnerable to malware corrupting the startup
process. UEFI is a firmware interface that connects the firmware to the
operating system. UEFI initializes the hardware components and starts the
operating system.

Unique Identifier (UID)
A UID is a numeric or alphanumeric string for an element within a system.
UIDs address an element for access, interaction, management, and
monitoring.
UTP cable
Unshielded Twisted Pair (UTP) Ethernet cable that is commonly used
between a system and wall. It is also used for desktop communication
applications.

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16G POWEREDGE E3

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 2

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 3

E3 short single thickness (E3.S) drives.

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 4

• Higher interface speed with PCIe Gen5.

• Optimized for high-speed signal.

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 5

E3.S Drives in PowerEdge 16G Servers

E3 drives attached to an onboard controller, S160 runs at Gen 5 speeds.

Click each tab to view the examples of E3.S configuration.

Example of E3.S drives used in C6600.

E3.S x8 configuration in C6600.

Example of E3.S drives used in MX760c along with the backplane.

E3.S x8 configuration in MX760c.

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 6

E3X8 backplane front view.

E3X8 backplane rear view.

Go to: Table for more information of high-level product

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 7

Tip: See page 8 and 9 of the participant guide that is

Properties 2.5" EDSFF E3.S

Interface PCIe Gen4/SATA/SAS PCIe Gen4 and

Dimension (mm) 70 x 100 x (7 / 15 height) case E3.L 76 x 142.2

Connector SFF 8639 SFF-TA1002

Max Power 15 W (7 mm) E3.L 40 W (7.5

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 8

Number of Drives in 24 Up to 46 E3.L

Number of Drives in 10 16 E3.S in 16G

Max Capacity 30 TB SAS offering today E3.L 7.5 mm

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 9

E3 Drives Form Factor

Click the information icon to learn more.

1: E3 long single thickness device (E3.L)

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 10

2: E3 short single thickness device (E3.S)

3: E3 short double thickness device (E3.S 2T)

4: E3 long double thickness device (E3.L 2T)

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 11

E3 Drives Mechanical Design and Carrier

The mechanical design of E3 drives is based on Kioxia CD7 E3.S2. A

Kioxia CD7 E3.S

2 CD7 (E3.S) SSD drive developed by Kioxia Corporation, a global leader

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 12

Kioxia CD7 E3.S mechanical design.

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 13

E3.S mechanical cover and base side.

16G PowerEdge E3 Drives Features-SSP

© Copyright 2023 Dell Inc Page 14

Carrier used for E3.S drives.

16G PowerEdge E3 Drives Features-SSP