Professional Documents
Culture Documents
Microelectronic Engineering
journal homepage: www.elsevier.com/locate/mee
a r t i c l e i n f o a b s t r a c t
Article history: Microgrippers are amongst the preferred tools for microassembly applications and have drawn extensive
Available online 25 July 2012 attention of the researches on their mechanism and actuation principles. One of key parameters is effi-
ciency of microgripping systems in handling more than one part at a time. Multi-part-gripping mecha-
Keywords: nism is one of the least investigated subjects in the published literature. In this paper, an electrostatic
Microassembly microgripping system using comb drive mechanism is designed with the capability of gripping two micro
Microgripper components simultaneously. S-type springs are utilized to amplify the displacement range of microgrip-
Electrostatic actuators
per arms. The objects gripped with this microgripping system are diverse from biomedical (e.g. arrow
Comb-drive actuators
shaped microshuttles); MEMS and microelectronic field with the dimensions from 145 to 100 lm for
the operating voltage of 20–80 V.
A mathematical model with derived formulas is developed showing displacement of the tool versus
applied voltage. Estimation of the performance of comb-drive is done through considering five capacitors
all around a comb finger. The designed model predicts the displacement of the rotor more accurately
compared to dominant method of calculating the equivalent capacity of only two lateral capacitors. Fur-
thermore a multi-field simulation of the electrostatic comb finger of the comb drive is performed using
finite element method. The FEA results show good agreement with the prediction obtained from analyt-
ical model.
Microgripper function is enhanced through introducing a suspension system with optimum stiffness
values. It helps the microgripper work under lower levels of actuating voltage. Finally, to verify analytical
results, the microgripper is fabricated and the displacements are measured that compare well with ana-
lytical results and numerical simulation.
Ó 2012 Elsevier B.V. All rights reserved.
0167-9317/$ - see front matter Ó 2012 Elsevier B.V. All rights reserved.
http://dx.doi.org/10.1016/j.mee.2012.07.096
468 M. Hamedi et al. / Microelectronic Engineering 98 (2012) 467–471
Fig. 4. FEM result in comparison with new (Eq. (5)) and old formulation (Eq. (1)).
the analytical method. According to Fig. 4, analytical results shows which produces higher displacements under lower activation
better agreement with electrostatic multi-field simulation of comb voltage.
finger which is due to considering end capacitors in line with lat-
eral ones as discussed before.
2.6. Fabrication and experiments
2.5. Suspension system enhancement
To fabricate the structure, standard silicon microfabrication
Different types of suspension systems which are commonly processes on P-type single silicon wafer with h100i orientation
used in microgrippers are Clamped–Clamped beam, crab-leg fex- are employed. These processes, as illustrated in Fig. 7, include
ure and folded flexure. A novel design of microgripper which uses dry oxidation, e-beam evaporation, physical vapor deposition
hybrid combination of Folded Flexure and Clamped–Clamped (PVD) and chemical vapor deposition (CVD), standard photolithog-
beam is shown in Fig. 5. Given the free-body-diagram (Fig. 6) raphy, vertical etching, RIE, chemical etching and thin layer
and applying equivalent stiffness, the serial and parallel capacitor deposition.
principles, stiffness for system substructures in axial, lateral and The significant point in fabrication process is to use gold thin
rotational directions are as follows: layer deposition instead of doping which definitely applies lower
! subsequent tensions to the device. This thin layer prevents in-
3
2ETb crease of residual stresses. SEM image of the fabricated structure
K xt ¼ 4 ð6Þ
2L31 þ L32 is illustrated in Fig. 8.
After fabricating the structure, experiments are performed on
the model to measure displacement of the arms. Probe stations
2EbT
K yt ¼ 4 ð7Þ are used to apply the voltage to the gripper so that its arms under-
2L1 þ L2
go displacement that is observed under optical microscope. Image
processing techniques are used to obtain voltage displacement val-
10EbT
K ht ¼ 4 ð8Þ ues. This is done by comparing different number of pixels with re-
6ð1 þ #Þð2L1 þ L2 Þ
gards to the reference pixels showing the position of the arms
where E is the elasticity module and m Poisson’s ratio, and L1 and L2 under no activation.
and b are shown in Fig. 6. Increasing stability of the microgripper is Fig. 9 displays the output displacement in terms of activation
achieved via changing structure stiffness. The hybrid design enjoys voltage for both experimental and FEA works. The measurement
a reduced axial stiffness (K xt ), compared to each elementary design, is done for one of the moving arms while the other is stationary.
Acknowledgment
References
Fig. 9. Displacement versus actuation voltage.
[1] O. Millet, P. Bernardoni, S. Régnier, P. Bidaud, E. Tsitsirisc, D. Collard, L.
Comparing the results shows higher values in FEA approach for Buchaillot, Sensors and Actuators, A 114 (2004) 371–378.
[2] K. Mølhave, O. Hansen, Journal of Micromechanics and Microengineering 15
measuring points which can be attributed to: (2005) 1265–1270.
[3] S.K. Nah, Z.W. Zhong, Sensors and Actuators, A 133 (2007) 218–224.
- In FE model, attenuation of air is ignored which results in [4] D.H. Kim, M.G. Lee, B. Kim, J.H. Shim, Smart Materials and Structures 14 (2005)
1265–1272.
obtaining higher values for displacement. [5] M. Kohl, B. Krevet, E. Just, Sensors and Actuators, A 97–98 (2002) 646–652.
- Possible fabrication errors which are caused by photolithogra- [6] W.S. Hung, A Study on the Design and Analysis of Microgripper for
phy mask printing, distraction of UV beam and intrinsic errors Microassembly, M. Sc. Thesis, University of National Sun-Yat Sen, 2003.
[7] B.C. Morgan, Electrostatic MEMS actuators using gray-scale technology,
related to every single fabrication technique.
Department of Electrical and Computer Engineering, Institute for Systems
- Intrinsic errors of measurement method which basically occur Research, University of Maryland, 2006.
in different measuring approaches. [8] C. Chihchung, L. Chengkuo, Sensors and Actuators, A 115 (2004) 530–539.
[9] J.D. Grade, H. Jerman, T.W. Kenny, Journal of Microelectromechanical Systems
12 (2003) 335–343.
3. Conclusions [10] K. L. Chen, Novel MEMS Grippers for Pick-Place of Micro and Nano Objects,
M.Sc. Thesis, Department of Mechanical and Industrial Engineering, University
In this work, an electrostatic microgripper using comb drive of Toronto, 2009.
[11] I.V. Avdeev, M.R. Lovell, D. Onipede Jr., Journal of Micromechanics and
actuation mechanism is introduced which is capable of gripping Microengineering 13 (2003) 809–815.
two microparts simultaneously. This microgripper is featured by [12] R. Wierzbicki, C. Adda, H. Hotzendorfer, Micro-NanoMechatronics and Human
wide ranges of arm displacement via using s-type springs. A non- Science, Nagoya, Japan, 2007.
[13] B. Solano, A.J. Gallant, G.D. Greggains, D. Wood, M. Herbert, Advances in
linear formulation is derived to calculate the output displacement Materials Research 57 (2008) 67–72.
of movable arms which produced results with better accuracy in