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J Micro-Bio Robot (2017) 13:1–14

DOI 10.1007/s12213-017-0098-2

REVIEW

A review on actuation and sensing techniques


for MEMS-based microgrippers
Sijie Yang1 · Qingsong Xu1

Received: 5 February 2017 / Revised: 13 April 2017 / Accepted: 22 May 2017 / Published online: 30 May 2017
© Springer-Verlag Berlin Heidelberg 2017

Abstract Microelectromechanical system (MEMS) reveals 1 Introduction


excellent flexibility and adaptability in miniaturization
devices owing to its compact dimension, low power con- Currently, there is an increasing trend of development on
sumption, and fine performance. As a typical type of minia- MEMS in the domain of microassembly and micromanipu-
turization tool, MEMS-based robotic microgripper has been lation. Because of their miniature size, tiny MEMS devices
widely employed in the manipulation of tiny micro-objects, exhibit some merits to execute the micro- and nano-scale
material characterizations, and so on. This paper presents tasks [1]. The merits involve light weight, stable perfor-
the state-of-the-art survey of prevalent MEMS-based actua- mance, high resolution, low power consumption, and easy
tion and sensing techniques, which can be applied in micro- integration with other devices. In micromanipulation sys-
grippers. Five main types of actuators are reviewed in this tem, microgripper is a typical end-effector tool, which plays
survey, namely, electro-thermal actuators, electrostatic actu- an important role in the aforementioned applications [2,
ators, shape memory alloy actuators, piezoelectric actuators, 3]. It can be used to execute the grasping-moving-releasing
and electromagnetic actuators. A review of recent sensing operation of tiny-objects and also to protect them in safe
techniques is also conducted, which includes four popular condition [4, 5].
sensing approaches in terms of capacitive sensors, elec- According to working principle, the popular actuators
trothermal sensors, piezoresistive sensors, and piezoelectric for MEMS grippers can be mainly classified into five cat-
sensors. Their advantages, disadvantages, and applications egories, which include electrothermal, electrostatic, shape
have been discussed in detail. Some perspectives on the memory alloy, piezoelectric, and electromagnetic actuators.
future development are presented. Regarding electrothermal actuator [6, 7], it can generate a
large displacement and force based on the thermal expan-
Keywords Microelectromechanical system (MEMS) · sion of the materials under a very low excitation voltage.
Actuator · Sensor · Microgripper Besides, the relatively small dimension is another property
of this kind of actuator. However, due to the restriction of
high working temperature, it cannot be widely used in the
assembly of temperature-sensitive objects. Concerning elec-
trostatic actuator [8, 9], it has two different structures in
terms of transverse and lateral comb drives. It owns some
 Qingsong Xu
capabilities like high frequency response, low power con-
qsxu@umac.mo
sumption, and no hysteresis. However, the relative high
1 Department of Electromechanical Engineering, Faculty of
driving voltage is the major problem of this type of actua-
Science and Technology, University of Macau, Avenida da tor. In particular, the aforementioned two types of actuators
Universidade, Taipa, Macau, China are prevalent in micro-electro-mechanical-system (MEMS).
2 J Micro-Bio Robot (2017) 13:1–14

As for shape memory alloy actuator [10], it reveals some 2.1 Electrothermal actuator
advantages such as high recovery force, large deformation
(up to 10% for a single crystal), and a high working den- Electrothermal actuator works based on the principle of
sity (2.7×107 J m−3 ). But it is also restricted by some thermal expansion. When a current passes through the actu-
drawbacks, such as slow speed and low efficiency. More- ator beams, the beams experience a temperature rising and
over, piezoelectric actuator has superiorities such as large then cause a deformation. Due to the relative small thermal
output force, good operation bandwidth, and very compact strain, it is easy to generate an amplified output force to
dimension. On the contrary, small displacement from the produce a large displacement in one specific direction. This
actuator is the main drawback, which limits its extensive type of actuator can produce a large output force with a rel-
application. Electromagnetic actuator can deliver a large atively low voltage, normally below 10 V. However, thermal
displacement without the influence of nonlinear effect. At actuator often has the predominant compressive stress in the
the same time, it also has some merits like no wearing, quick beams, and buckling may cause the failure of the structure
response, high precision, and easy to control. However, the [22]. According to the configuration, thermal actuator can
relatively large physical size is a big issue of this type of be classified into three types, namely, pseudo-bimorph ther-
actuator. mal actuator (U-shaped actuator) [23, 24], V-shaped thermal
On the other hand, to ensure the safety and accuracy dur- actuator[25, 26], and Z-shaped thermal actuator [27], which
ing the grasp operation, it is necessary to measure the force are detailed in the following.
between the two jaws of a gripper. Thus, sensing techniques
need to be considered crucially [11]. Sensors are required 2.1.1 U-shaped actuator
to measure and obtain the feedback information of the grip-
ping force or displacement of the device. Then, the objects The structure diagram of an U-shaped actuator is illustrated
can be protected during the gripping process because of the in Fig. 1. It consists of two hot (thin) and cold (wide) arms
sensing feedback. Moreover, in MEMS field, a more pre- with a asymmetric design, which is constrained by two
cise sensing method is needed to guarantee the safety of anchors. When a current flows through the structure, the
the grasped object, such as biological cells and blood ves- higher current density causes more heat and expansion on
sel. The reason is that such fragile objects are easier to be cabined hot arm than that on broad cold arm because of the
broken than macro-objects as the gripping force only lies asymmetric structure. Then, the actuator tip experiences a
in the level of micro-Newton (μN). Nowadays, MEMS- transverse motion, which results in an arcing action towards
based microgripper with integrated sensors, which provide the side of cold arm. Based on this U-shaped thermal actu-
high sensitivity and resolution, has found wide applications. ator concept, many U-shaped grippers have been developed
Owing to the integration configuration, the gripper struc- in the literature [29–31].
tures become more compact and stable. Thus, the force data A novel SU8 (Microchem Corp.) polymeric electro-
from the sensors are more reliable. At the same time, it can thermal gripper was invented in [32], which owns the opti-
also improve the safety when the gripper executes the grasp- mized structure and thermal effectively. A scanning electron
ing operation. In this review, several types of sensors are microscope (SEM) photo of the gripper is shown in Fig. 2.
summarized, which include piezoresistive sensors [12–15], This actuator geometry consists of a pair of asymmetrical
capacitive sensors [16–18], electrothermal sensors [19, 20], micro-beams, which generate the expansion in changeable
and piezoelectric sensors [21]. cross-section. The deformations of the two tips are deter-
This paper aims at summarising typical types of actuators mined by the temperature change between hot and cold
and sensors which can serve MEMS-based microgrippers. arms. It is fabricated with a particular combination of sur-
The remaining parts of the paper are arranged as follows. A face micromachining techniques, that permit the release of
review of a variety of MEMS-based actuators is introduced stress-free polymer (SU8)/metal (Au) structures without the
in Section 2. Section 3 describes different categories of sen-
sors which are applied in MEMS area. A brief conclusion
of actuators and sensors and some further discussion about
MEMS-based grippers are outlined in Section 4.

2 Actuators

In this section, some typical MEMS actuators dedicated


to microgrippers are surveyed in terms of their working
principles and different embodies. Fig. 1 Geometry of U-shaped thermal actuator [28]
J Micro-Bio Robot (2017) 13:1–14 3

The first one is that the two slanted beams exhibit some
manufacturing challenges. For example, some small fea-
tures need to be fabricated as glossy surfaces. Generally, the
photolithographic resolution of beam width normally stays
in 2 μm. Another drawback of V-shaped actuator is the
relatively large stiffness [27].
A typical work is reported in the literature [34]. It
presents the design, fabrication, and characterization of
a unique MEMS gripper with integrated actuator by a
novel hybrid design of metallic V-shape actuator (VSA)
and a set of modified Guckel U-shape actuators (mUSA).
The angle between the hot and cold arms of mUSA
has been modified to reduce the desired unidirectional
Fig. 2 SEM photo of a novel SU8 poly-meric electro-thermal gripper
in-plane displacement for enlarging the gripping range.
[32]
Owning to this distinctive structure, it exhibits a great
performance in terms of large tip displacement (173
μm) and good holding force (5 μN) under a rela-
use of sacrificial layers. Besides, there is no parasitic resis- tively low voltage (1 V) with a power consumption of
tance in the cold arm of the actuator. It can produce a stroke 0.85 W.
under a low driving voltage. Experiment results indicate that
such a polymeric gripper can provide a displacement of 262 2.1.3 Z-shaped actuator
μm along with a energy consumption of 64 mA under the
driving voltage of 1.94 V. Concerning the Z-shaped actuator, it overcomes the afore-
mentioned problems arising from V-shaped thermal actu-
2.1.2 V-shaped actuator ator. It works based on the principle which is similar to
V-shaped actuator. As shown in Fig. 3b, the Z-shaped beam
The V-shaped thermal actuator is shown in Fig. 3a. As is composed of a central shuttle and two Z-beams in both
compared with U-shaped one, it exhibits some superiori- sides of the shuttle. The central shuttle is guided by thermal
ties, such as larger force and lower power consumption. bending beams. Thus, a linear motion of the shuttle can be
Meanwhile, V-shaped actuator has been widely use in produced when the current passes through the whole beams.
nanopositioners [33] and nano-testing systems [26]. This Z-shaped thermal beams have been used as actuators in
actuator presents a symmetric configuration, where two MEMS stage design. A MEMS microgripper composing of
slanted beams are connected to a central shuttle beam. Rely- a Z-beams thermal actuator is devised in recent work [35].
ing on the principle of thermal expansion, the central beam With the help of a rotating amplifier mechanism, thermal
generates a straight displacement by the two symmetrical Z-beams act as the actuating source, which exhibits a large
slanted beams. However, it has two main shortcomings. gripping displacement of 80 μm with a really low input volt-
age of 6 V. Additionally, in order to achieve a sub-nanometer
resolution, a MEMS stage with integrated Z-beams and a
compliant displacement amplification is designed in [36].
With the driving voltage of ±15 V applied, the stage deliv-
ers a motion range of ±1 μm with the resolution around 0.3
nm.
These three types of thermal actuators work based
on the same principle of thermal expansion. U-shaped
actuator is the most commonly used thermal actuator in
microgrippers. However, the restriction of this type of
actuator lies in the relatively large physical dimension.
In comparison with the U-shaped actuator, V-shaped one
can produce a smaller displacement and larger force. In
addition, the fabrication problem of V-shaped actuator
is overcome by Z-shaped one. In the meantime, the Z-
shaped actuator offers a larger range of displacement and
Fig. 3 a V-shaped thermal actuator; b Z-shaped thermal actuator [27] force.
4 J Micro-Bio Robot (2017) 13:1–14

the pull-in problem of microgripper, which is caused when


a large displacement is produced. Hence, this design avoids
the use of a high voltage in power system. A displacement
of 94 μm can be realized with 100 V applied.
A MEMS gripper (FT-G100 FemtoTools GmbH) to exe-
cute dexterous micromanipulation tasks was proposed in
[43], which is equipped with electrostatic actuator and force
sensor. The gripper is made of silicon with an initial gap
between the two tips. This gripper aims at grasping objects
with the range of 1-100 μm via lateral-comb actuator. Con-
cerning its sensing part, capacitive sensor is realized, which
has the resolution of 50 nN.
Fig. 4 Two configurations of comb electrostatic drive [41]. a Inter-
In [44], a MEMS gripper was fabricated, which was
digitated comb actuator; b parallel-plate actuator
actuated by electrostatic actuator along with integrated elec-
trothermal sensor. The design goal is to fabricate a reliable
2.2 Electrostatic actuator and high precision gripper which can be used in biomedical
and micro-industrial areas. This gripper can provide a dis-
Electrostatic actuator [37–39] has been well developed in placement of 60 μm with a driving voltage of 100 V to grasp
MEMS area, mainly owing to the merits of simple struc- micro-objects of 50–100 μm size. Due to the high sensi-
ture, low power consumption, and fast response. Generally, tivity and compact size, electrothermal sensor is selected to
the configuration of electrostatic actuator consists of two measure the gripping force.
multiple-comb parts which are arranged in parallel. They are As shown in Fig. 6, a MEMS rotary microgripper was
called the fixed comb fingers (stator) and movable comb fin- introduced in [45]. Figure 6a and b present two parts of this
gers (shuttle), respectively. The stators are fixed by anchors. gripper, which includes the rotary electrostatic comb-drive
Hence, one can easily figure out the function of these two and electrothermal sensor. Based on SOI-MEMS process,
groups of comb fingers according to their names. When a the gripper was fabricated to realize a displacement of 90
driving voltage is applied to the structure, it causes a force
between the two combs and induces two motions in the
directions which are parallel and perpendicular to the comb
fingers. Based on this configuration, electrostatic actuators
can be divided into interdigitated comb actuator [40] and
parallel-plate actuator [41], as shown in Fig. 4.
Some electrostatic actuators have been developed with
the design of rotary configuration. One example is reported
in [42], as illustrated in Fig. 5. It demonstrates a novel
design of an rotary electrostatic actuation microgripper. The
utilization of the designed rotary comb actuators overcomes

Fig. 5 3D sketch of a MEMS microgripper with a rotary electrostatic Fig. 6 SEM image of an rotary MEMS gripper with integrated
actuator [42] electrostatic actuator [45]
J Micro-Bio Robot (2017) 13:1–14 5

μm with the actuating voltage below 80 V. Due to the ade- the 3-DOF motion. The total size of this device is 33 mm ×
quate arm length and the biocompatiblity of silicon, this 9 mm × 3 mm. The actuators generate two-axial displace-
gripper can be applied to the manipulation of living cells ments of 7.1 mm and 5.2 mm in x- and y-axes, and offer
and bio-samples. the forces of 100 mN and 130 mN in x- and y-axes, respec-
tively. The gripper is designed with an initial open gap of
2.3 Shape memory alloy actuator 1.15 mm to execute the grasping operation.

When experiencing a deformation, shape memory alloy 2.4 Piezoelectric actuator


(SMA) has the capability of memorizing and getting back
to the originally designed shape. This phenomenon is called As an ionic crystal with asymmetric unit cells, piezoelec-
“shape memory effect” (SME). Actually, it experiences two tric material has a wide application in actuators and sensors
phases, namely, martensite (at low temperature) and austen- [49–51]. The working principle of piezoelectric actuator lies
ite (at high temperature). Specially, in the austenite phase, in that when the unit cells experience deformations induced
the material can obtain a large deformation of 10%, and by the introduced stress, the angles between the positive and
then recovers to its initial state, which is called “superelas- negative ions will be changed. This results in a variable of
ticity” (SE) [46]. Benefiting from SME and SE effects, the vector summation about the electric dipoles. It causes an
actuator has been used in wide applications, such as medi- electric field following the same direction of the applied
cal instruments, industrial areas, military fields, and MEMS stress in the crystal [52]. PZT is made of lead zirconate
devices. Specifically, NiTi and NiTiCu are two most widely titanate and is the most common piezoelectric actuator for
used materials for SMA. nanopositioning application.
In MEMS field, SMA becomes an ideal actuator for As an example, a gripper actuated by two multi-layer
microgrippers, because of its pseudo elasticity, high damp- piezoelectric actuators was reported in [53]. This type of
ing capacity, and biocompatibility. It has a high output actuator offers a larger displacement than piezoelectric stack
performance, and supplies an output force which is 400 actuators. Due to the use of multi-layer piezoelectric ben-
times larger than that produced by magnetic actuator with ders, the maximum displacement of finger tips is over 200
the same volume. However, due to the slow response, SMA μm. In addition, unlike piezoelectric unimorph or bimorph
actuators have low power density. actuator, such actuator can provide a larger force because
In [47], a MEMS gripper is designed for micro-object it is made of multiple layers of piezoelectric ceramics.
manipulation and assembly. It is actuated by Ni-Ti SMA Another multimorph piezoelectric gripper has been devel-
spring in cooperation with Si spring to achieve the gripping oped in [54].
range of 120 μm, as shown in Fig. 7. The total dimension As shown in Fig. 8, a piezoelectric microgripper
of this gripper is 2730 μm × 1500 μm × 50 μm. The two was designed and fabricated in [55]. Micro-cantilevers,
jaws are fixed by four Ni-Ti films, which are connected to which are made of sol-gel multi-coated PZT
the frame. SMA and Si springs have the ability to remember
and return to the positions of the two tips. The heat to actu-
ate the SMA and the feedback of sensor are generated by a
designed control circuit.
A novel SMA micromanipulator was designed in [48]
aiming at moving small objects. A number of SMA actu-
ators and a gripping mechanism were combined to realize

Fig. 7 3D scheme of a MEMS gripper with SMA actuator and silicon Fig. 8 3-D schematic diagram of an out-of-plane PZT microgripper
springs [47] with two cantilevers [55]
6 J Micro-Bio Robot (2017) 13:1–14

(Pb(Zr0.52Ti0.48)O3) films, have an ability of actuating actuators. In addition, a superelastic alloy gripper driven by
the gripper to conduct out-of-plane tasks. By utilizing elec- electromagnetic actuator was reported in [59]. It is com-
tromechanical and gripping characteristics, two types of posed of electromagnetic actuator, push shaft, and elastic
PZT cantilevers, namely, micro PZT and OPPMG, act as hinge. With the Lorentz force, which is caused by the cur-
two support layers. The accuracy of gripping and position- rent flow in a magnetic field, it is able to generate the
ing objects was testified by gripping a 100 μm diameter gripping range of 300 μm with a gripping force of 18 mN.
metallic ball with the actuating voltage of 7 V. During the
experiment, no adhesion problem is resulted from the two 2.6 Multi-axis actuator
gripper tips and the ball.
A piezoelectric actuation MEMS gripper was manufac- To accomplish some complex tasks and to acquire com-
tured in [56], and the diagram is shown in Fig. 9. The size of prehensive data from the grasped objects, multi-degree-of-
the entire gripper structure is 16.8 mm width, 6 mm length, freedom (DOF) MEMS grippers have been designed for
and 0.5 mm thickness. This structure consists of five differ- specific tasks in the literature.
ent parts, which include piezoelectric actuator, rotary arms, The previous work [60] introduces a monolithic design
fixing part, block, and gripping tips. In order to reduce the of a two-axis MEMS gripper, which is actuated by electro-
adhesion force, this gripper decreases the contact area by static actuators integrated with capacitive sensors. One of
using teeth shape on tips. A displacement of 10.2 μm was the unique characteristics of this gripper is that both arms
generated by the piezoelectric actuator with the driving volt- are actuated and sensed in two axes. The capacitive sen-
age of 120 V. An amplified gripping range of 142.8 μm was sors exhibit the responsibilities of detecting the position and
obtained to grasp objects. force signals in non-contact and contact processes. With a
120-V voltage applied, an x-axis displacement of 70 μm
2.5 Electromagnetic actuator and a y-axis displacement of 18 μm are generated by the
tips with the force capability of 190 μN.
Electromagnetic actuator works based on the principle that A gripper for microtensile testing is proposed in the liter-
when a current flows through a wire coil, it generates a force ature [61]. The structure is shown in Fig. 10, which demon-
in the presence of a magnetic field [57]. This type of actu- strates the monolithically integrated two-axis microtensile
ator is commonly applied in macroscopic application, as it tester. It is designed to detect the internal/external stresses
can produce a high efficiency and large force. Moreover, it and some physical parameters of plant cells for establish-
also can be used in MEMS. In the literature, an advanced ing an relevant and accurate mathematical model to forecast
hybrid nanopositioner equipped with electromagnetic actua- the cell growth. With the integrated two-axis tester, the
tor was reported in [58], where two voice-coil-type actuators device enables the measurement of tensility, compression,
are employed for actuation. By this concept of actuator and shear forces. In order to determine the stiffness of
design, a larger displacement is generated with a lower plant cells, two end-effectors (tips) are designed with an ini-
voltage as compared with electrostatic and piezoelectric tial open range of 30 μm. Two electrostatic actuators are

Fig. 10 Two-axis monolithic microtensile tester which is composed of


Fig. 9 The structure and basic working diagram of a microgripper, two-axis force sensors, two actuators with displacement sensors, and a
which is driven by a rear-mounted piezoelectric actuator [56] pair of end-effectors [61]
J Micro-Bio Robot (2017) 13:1–14 7

orthogonally arranged to actuate both x- and y-axes with out-of-plane part. Experimental result shows that the in-
the displacement range of ±16 μm. The sensing arm con- plane displacement of the tip is 82 μm with 0.039 W. In
sists of two capacitive force sensors, which can detect the addition, the out-of-plane swing of the tip is 18 μm when
forces with the range of ±60μN and the resolution of 20 the input voltage changes from 0 to 90 V (0 to 0.36 W) and
nm in x-axis and measure the position in y-axis simulta- vice versa.
neously. A MEMS gripper with two-axis V-beam thermal
actuators and sensors is introduced in [62], as shown in 2.7 Summary of MEMS actuators
Fig. 11. This design aims at measuring soft materials in
two compressive and shear directions. Two orthogonally In view of the different working principles, the actuators can
arranged V-shaped thermal actuators drive the left gripper be mainly classified into five types, namely, electrothermal
arm in compressive and shear directions. Furthermore, this actuator, electrostatic actuator, shape memory alloy actua-
gripper uses two nano-Newton-resolution triplate differen- tor, piezoelectric actuator, and electromagnetic actuator. The
tial capacitive sensors to test the force in compressive and advantages, disadvantages, and principles of these actuat-
shear directions. The resolutions for the compressive force ing methods are discussed in the aforementioned discussion.
and shear force sensing are 7.7 nN and 57.5 nN, respec- For a clear comparison of these five actuation schemes,
tively. However, when the actuators actuate the arm in two their characteristics are listed in Table 1. Specifically, cre-
orthogonal directions, the motion coupling problem needs ative structures can improve the actuator performance to
to be overcome. some extent. The electrothermal actuator exhibits three
To achieve the goal of independent in-plane and out-of- kinds of beam structures, i.e., U-shaped, V-shaped, and Z-
plane motions, a MEMS gripper with integrated electrother- shaped beams, respectively. They exhibit different features
mal actuator was reported in [63], which owns two degrees although they follow the same working principle. Besides,
of freedom. Its geometry is illustrated in Fig. 12. This grip- electrostatic actuator can change the parallel arrangement
per is manufactured by metal-MUMPs technique. It owns into rotating distribution to satisfy the design goal as shown
a good flexibility by using multiple materials including sil- in [42]. Therefore, the structure and arrangement design of
icon nride nickel and polysilicon. A large displacement is actuators can be the breakthrough point in future MEMS
supplied by the thermal actuator. U-shaped actuator, which gripper design.
contains hot and cold arms, is employed to realize the func-
tion of in-plane movement. For the out-of-plane motion, the
gripper structure is designed with separately arranged upper 3 Sensors
nickel and lower silicon nitride beams. There is a joint link
between the nickel and nitride beams at the end to ensure In this section, typical MEMS sensors for microgrippers are
that the electricity and heat can transmit between the two reviewed in detail.
beam structures. Thus, it enables the vertical motion of the
3.1 Capacitive sensor

Capacitive sensor has been widely employed in MEMS


field. As a relatively simple method, capacitive sensing
technique has a prevalent trend of use in micro/nano-
position sensing device. It usually cooperates with micro-
actuator to realize the high-resolution detection in MEMS
and NEMS systems. Capacitive sensor is also an effec-
tive tool to measure the force ranging from pN to mN
scale [64–66]. Capacitive sensing has the same structure
as capacitive actuator. As a non-contact detecting method,
capacitive sensor follows the principle of measuring the
capacitance change between the stator and electrode, which
is caused by the moving electrode shuttle. Capacitive
force sensors have the abilities of high sensitivity, low
power consumption, large bandwidth, and large dynamic
range. Robustness and drift-free are another two capabili-
ties of capacitive sensors. In contrast, a complex electronics
Fig. 11 SEM photo of a MEMS microgripper with V-shaped actuator needs to be considered to suppress the high sensitivity to
and two capacitive sensors [62] noise.
8 J Micro-Bio Robot (2017) 13:1–14

Fig. 12 3-D scheme of a


MEMS gripper which has the
capability of in-plane and
out-of-plane motions [63]

A dual-axis force sensing gripper is demonstrated in gripping range of 63 μm is generated. The force sensor has
[67], as shown in Fig. 13. This MEMS microgripper is the force range of ±144 μN with the resolution of 0.61 μN.
newly designed with integrated electrostatic actuator and In addition, the sensitivity of the gripping force sensing is
capacitive force sensor. It exhibits a unique characteristic 5.5 times higher than that of the interaction force sensing.
of dual-axis sensing by using a single force sensor, which
can detect the gripping force and environmental interaction 3.2 Electrothermal sensor
force in two directions without interfering. The configu-
ration of the gripper is devised based on the concept of Unlike other types of sensing methods, electrothermal sens-
compliant rotary bearing in cooperation with linear guid- ing technique has been investigated for application in
ing flexure mechanisms. Owing to this concept, the gripper MEMS for just a few years. Some work with the ther-
exhibits a compact size. By applying an input of 72 V, a mal sensing method has been reported in recent works [68,

Table 1 Comparison of five different types of actuation techniques

Actuator type Pros Cons Working principle Examples

Electrothermal Large displacement Low High working temperature Thermal expansion [32, 34]
voltage dimension
Electrostatic Fast frequency response Large dimension Pull- Electrostatic force [42, 43]
Low power consumption in problem Complicated
No hysteresis circuit
Shape memory alloy Flexibility Low effi- Hysteresis Large power Materials deformation [47, 48]
ciency Large frequency consumption
response
Piezoelectric Large force Good opera- displacement Piezoelectric effect [53, 55, 56]
tion bandwidth
Electromagnetic Large displacement No Relatively large dimen- Magnetization effect [59]
nonlinear effect No sion Difficult to manu-
wearing Quick response facture
High precision Easy to
control
J Micro-Bio Robot (2017) 13:1–14 9

(a)

(b)

Fig. 14 Working concept diagram of two U-shaped thermal displace-


ment sensor [71]

Another thermal position sensor was reported in [72].


The SEM image of the sensor is given in Fig. 15. A ther-
mal chevron actuator in corporation with a thermal position
sensor is illustrated in this work. Two doped silicon beam-
shaped resistive heaters act as position sensors. By applying
an excitation voltage through the beams, the heat of the
two sensors will experience temperature variation which is
caused by the current. There is also a heat sink placed above
the pair of beams, which has a gap distance of 2 μm. With-
Fig. 13 Schematic diagram of a MEMS gripper with a dual-axis
out a voltage applied, the heat sink plate stays at the rest
capacitive force sensor [67] position (middle of two resistor beams), and the resistances
of the sensors remain constant. Once a voltage is applied,
the heat plate moves forward, and then the resistances of the
69]. By utilizing micro-heaters, the displacement of a micro
two sensors will change. Hence, the displacement can be
scanner is measured, which has a fine resolution below 1
measured by detecting the resistance change value between
nm. In [70], a single-beam electrothermal sensor was added
the two sensors. The measuring range of this device is 14.4
in the structure. However, this design did not consider more
μm and the sensor drift is 8.9 nm over 2000 s.
details about the thermal coupling and differential sensing
Electrothermal force sensor is also applied in a MEMS
approach of one-chip sensing. As shown in Fig. 14, the
rotary microgripper in recent work [73], as illustrated in Fig.
thermal sensor is made of single-crystal silicon by standard
16. This gripper has an initial opening range of 100 μm. It is
bulk mircomachining technology. It is composed of two
elongated U-shaped cantilevers. As the sensing element,
the resistive heater is built with moderately doped silicon.
Besides, the support legs are used for electrical leads, which
are fabricated with highly doped silicon. When a voltage
is applied to the legs of cantilevers, the current flow will
cause the temperature increase of the heater. This micoma-
chined silicon displacement sensor follows the principle of
heat conduction from device surface to ambient air, with
the resolution under 1 nm in motion range of 100 μm and
dynamic range of 10 kHz. Moreover, differential measure-
ment structures are employed to minimize the drift by using
a symmetrical pair of sensors. Each sensor has a power con-
sumption of 10 mW and response time (also, time constant) Fig. 15 SEM image of a microgripper with thermal chevron actuator
of about 100 μs [71]. and thermal position sensor [72]
10 J Micro-Bio Robot (2017) 13:1–14

Fig. 16 The scheme of a


microgripper with rotary comb
drives and two sets of thermal
displacement sensors [73]

composed of rotary comb drives and two sets of thermal dis- where R and L represent the resistance and length, respec-
placement sensors. The thermal principle is similar to that tively. G is the strain factor. R and L are the change
in [72]. The heat plates are connected to a curved shuttle values of the resistance and deformation, respectively.
and positioned next to the sensors with a distance of 3 μm. Piezoresistive force sensor has been applied in grippers
A large displacement of 85 μm is achieved under 80 V and and other tools in the literature. For instance, a micro-
the sensitivity is 1.95 μN·V−1 . gripper with integrated piezoresistive sensor is proposed
in [79] aiming at manipulating tiny objects such as bio-
3.3 Piezoresistive sensor logical cells. Another microgripper is introduced in [80],
which is actuated by a thermal actuator and equipped with
Piezoresistive sensing technique has been extensively piezoresistive force sensor. It owns a very simple fabrica-
employed for micro-force measurement. Based on the tion process, whereas it has the drawback of low sensitivity,
piezoresistive effect, which was first introduced by Lord which cannot be used to detect small force. A sidewall sur-
Kelvin in 1856, it easily offers a transduction mechanism face piezoresistive force sensor is employed in a MEMS
which can convert the mechanical deformations into elec- gripper in [81]. The configuration of the MEMS gripper is
trical signals [74, 75]. Generally, when the element expe- shown in Fig. 17, where the end-effector is composed of
riences a strain and deformation, the resistance value will four arm structures. Force sensor cantilevers are arranged
change synchronously. In MEMS field, it is employed for in both sides of the two gripper arms. These sensors real-
applications like accelerometer, force sensor [76], gyro- ize the detection of force ranging from 5 to 500 μN. The
scope [77], and so on. According to the working principle as two arms in the middle part are actuated by electrostatic
shown in the following equation, the relationship between comb drive. During the gripping task, the moveable arms
the strain and resistance is linear [78]. undergo deformations and then move forward to the fixed
arms. These deformations can be measured by the piezore-
sistive sensors which are fixed at the end of the cantilevers.
R L The deflection and the gripping force are in proportional
=G· (1)
R L relation.

Fig. 17 The 3-D diagram of a


piezoresistive cantilever in
MEMS gripper whose
end-effector is composed of four
arm structures. [81]
J Micro-Bio Robot (2017) 13:1–14 11

Table 2 Comparison of four different types of sensing techniques

Sensor type Pros Cons Resolution Working principle Examples

Capacitive High sensitivity Large band- Large dimension Complicated μN Capacitance change [67]
width No drift Robustness Fast circuit
response speed
Electrothermal Small dimension Simple struc- Low response speed Large con- μN Resistance change [70, 72, 73]
ture High resolution sumption
Piezoelectric Wide measurement range No Complex manufacturing process μN or sub-μN Piezoelectric effect [79, 81]
extra voltage needed Wide band- Low spatial resolution Cannot
width work in high temperature
Piezoresistive Simple material High bandwidth Sensitive to ambient tempera- mN Resistance change [59]
Flexibility Large frequency ture Hysteresis Large power con-
response sumption

3.4 Piezoelectric sensor 4 Conclusions

Piezoelectric material experiences an increasing interest in It is universally acknowledged that MEMS-based microgip-
MEMS domain because of its capability of high energy per plays a crucial role in micromanipulation and
density and suitability for miniaturization. It has a transduc- microassembly domains. This paper conducts a review of
tion mechanism which can directly transfer the mechanical several fashionable actuation and sensing methods related
signal into electrical signal. Such conversion is reversible. to MEMS microgrippers emerged in the past two decades.
Generally, piezoelectric sensors are used as transducers and It is necessary to understand and have a clear comparison
resonators. The measured resonance frequency and ampli- among these tools, because they are the fundamental of
tude are dependent on the materials and dimensions of the microelectromechanical systems.
device, as well as mechanical and interfacial inputs to the A perspective view of the further development on the
device [82]. actuation and sensing techniques are summarized as fol-
As a piezoelectric material, PVDF polymer has a great lows.
stability, flexibility, and biocompatibility. It offers a wide
bandwidth, high linearity, and high signal to noise ratio [83, 4.1 More functionality and flexibility
84]. In the literature [59], PVDF has been employed to guar-
antee the feedback information of force measurement when In order to execute various tasks for different applications
the gripper manipulates a fragile object. This gripper can such as industry, electronic equipments and so on, different
achieve a large gripping displacement of 300 μm, and the grippers which have diverse structures cooperated with dif-
maximum gripping force is 18 μN. The piezoelectric force ferent actuators and sensors will appear in real life. Also,
sensor has the sensitivity of 39.5 mN·V−1 . the grippers will be applied to not only simple jobs, but also
more complex tasks. In the meantime, microgrippers will
3.5 Summary of MEMS sensors have more degrees of freedom to cater for the requirement
of diverse applications.
The aforementioned sensing methods all exhibit well accu-
racy and flexibility in micro- and nano-scale force sensing. 4.2 High integration with electronics
The differences among these sensing strategies in terms
of merits, drawbacks and working principles are tabu- The technique of integrated circuit (IC) is the foundation
lated in Table 2. It is worth mentioning that the dual- of MEMS device. Owing to the increasingly mature design
axis sensing capability as introduced in [67] improves methods and core techniques, design of stable microgripper
the safety and accuracy of the microgripper. Hence, it system will be realized. Yet, the complexity of the MEMS
is predicted that multi-level force sensor will play an gripper design will be continuously increased for the sake
increasingly important role for MEMS gripper design in of pursuing higher degree of precision and miniaturization.
the future work. Moreover, similar to actuators, to real- Hence, it is expected that MEMS gripper will be highly
ize the microgripper’s design goal, creative structures can integrated with electronics, logic circuits, computing and
also improve the capabilities of sensing part in a positive decision loops into an IC-based chip with smaller footprint
way. size.
12 J Micro-Bio Robot (2017) 13:1–14

4.3 More intensive competition in marketing 12. Molhave K, Hansen O (2005) Electro-thermally actuated micro-
grippers with integrated force-feedback. J Micromech Microeng
15(6):1265–1270
MEMS products have a close connection with the mar- 13. Duc TC, Lau G-K, Creemer JF, Sarro PM (2008) Electrother-
ket. To cater for the market requirement, it is foreseen that mal microgripper with large jaw displacement and integrated force
MEMS products (not only including grippers) will actualize sensors. J Microelectromech Syst 17(6):1546–1555
more functionality, miniaturization, and low cost, which are 14. Greitmann G, Buser RA (1996) Tactile microgripper for auto-
mated handling of microparts. Sens Actuators A Phys 53(1):410–
a big challenge for other products. Hence, MEMS fabrica- 415
tion methods and techniques will be developed to a higher 15. Tibrewala A, Phataralaoha A, Buttgenbach S (2008) Simula-
level in next few years to satisfy the market needs. tion, fabrication and characterization of a 3D piezoresistive force
sensor. Sens Actuators A Phys 147(2):430–435
16. Bazaz SA, Khan F, Shakoor RI (2011) Design, simulation and
4.4 Shorter fabrication and manufacturing period testing of electrostatic SOI MUMPs based microgripper inte-
grated with capacitive contact sensor. Sens Actuators A Phys
Along with the development on the fabrication process of 167(1):44–53
17. Khan F, Bazaz SA, Sohail M (2010) Design, implementation
MEMS devices, original equipment manufacturers will pur-
and testing of electrostatic SOI MUMPs based microgripper,
sue a shorter manufacturing period and a faster fabrication Microsyst. Technol. 16(11):1967–1965
speed. Besides, MEMS fabless model will become possible 18. Sun Y, Fry SN, Potasek DP, Bell D, Nelson BJ (2005) Character-
in the near future. izing fruit fly flight behavior using a microforce sensor with a new
comb-drive configuration. J Microelectromech Syst 14(1):4–11
19. Coskun MB, Moore S, Moheimani SOR, Neild A, Alan T (2014)
Acknowledgments The work was support by the Macao Science Zero displacement microelectromechanical force sensor using
and Technology Development Fund under Grant No.: 090/2015/A3 feedback control. Appl Phys Lett 104(15):153–502
and 052/2014/A1. 20. Lin Q, Jiang FK, Wang XQ, Xu Y, Han ZG, Tai YC, Lew J, Ho
CM (2004) Experiments and simulations of MEMS thermal sen-
sors for wall shear-stress measurements in aerodynamic control
applications. J Micromech Microeng 14(12):1640–1649
References 21. Wang Y, Zheng J, Ren G, Zhang P, Xu C (2011) A flexible piezo-
electric force sensor based on PVDF fabrics. Smart Mater Struct
1. Mackay RE, Le HR, Keatch RP (2011) Design optimisation 20(4):045–009
and fabrication of SU-8 based electro-thermal micro-grippers. J 22. Hubbard NB, Culpepper ML, Howell LL (2006) Actuators for
Micro-Nano Mechatron 6(1):13–22 micropositioners and nanopositioners. Appl Mech Rev 59(6):324–
2. Chowdhury S, Thakur A, Wang C, Svec P, Losert W, Gupta SK 334
(2014) Automated manipulation of biological cells using gripper 23. Huang Q, Lee N (1999) Analysis and design of polysilicon
formations controlled by optical tweezers. IEEE Trans Autom Sci thermal flexure actuator. J Micromech Microeng 9(1):64
Eng 11(2):338–347 24. Hickey R, Kujath M, Hubbard T (2002) Heat transfer analysis
3. Su J, Qiao H, Ou Z, Liu Z-Y (2015) Vision-based caging grasps of and optimization of two-beam microelectromechanical thermal
polyhedron-like workpieces with a binary industrial gripper. IEEE actuators. J Vac Sci Tech A 20(3):971–974
Trans Autom Sci Eng 12(3):1033–1046 25. Zhu Y, Espinosa HD (2005) An electromechanical material testing
4. Deole U, Lumia R, Shahinpoor M, Bermudez M (2008) Design system for in situ electron microscopy and applications. Proc Natl
and test of IPMC artificial muscle microgripper. J Micro-Nano Acad Sci 102(41):14504–14508
Mechatron 4(3):95–102 26. Zhu Y, Corigliano A, Espinosa HD (2006) A thermal actuator for
5. Chang B, Shah A, Routa I, Lipsanen H, Zhou Q (2014) Low- nanoscale in situ microscopy testing: design and characterization.
height sharp edged patterns for capillary self-alignment assisted J Micromech Microeng 16(2):242–253
hybrid microassembly. J. Micro-Nano Mechatron 9(1):1–10 27. Guan C, Zhu Y (2010) An electrothermal microactuator with Z-
6. Zhang R, Chu J, Wang H, Chen Z (2013) A multipurpose shaped beams. J Micromech Microeng 20(8):085–014
electrothermal microgripper for biological micro-manipulation. 28. Mankame N, Ananthasuresh G (2001) Comprehensive ther-
Microsyst Technol 19(1):89–97 mal modelling and characterization of an electro-thermal-
7. Kim K, Liu X, Zhang Y, Sun Y (2008) Micronewton force- compliant microactuator. J Micromechan Microeng 11(5):452–
controlled manipulation of biomaterials using a monolithic 462
MEMS microgripper with two-axis force feedback. In: Proceed- 29. Zhang R, Chu J, Wang HX, Chen Z (2013) A multipurpose
ings of the International Conference IEEE Robotics and Automa- electrothermal microgripper for biological micro-manipulation. J
tion, pp 3100–3105 Microelectromech Syst 19(1):89–97
8. Beyeler F, Neild A, Oberti S, Bell D, Sun Y, Dual J, Nelson 30. Chronis N, Lee LP (2005) Electrothermally activated SU-8 micro-
BJ (2007) Monolithically fabricated microgripper with integrated gripper for single cell manipulation in solution. J Microelec-
force sensor for manipulating microobjects and biological cells tromech Syst 14(4):857–863
aligned in an ultrasonic field. J Microelectromech Syst 16(1):7–15 31. Zhang R, Chu J, Chen Z (2011) A novel SU-8 electrothermal
9. Voland BE, Heerlein H, Rangelow IW (2002) Electrostatically microgripper based on type synthesis of kinematic chain method.
driven microgripper. Microelectron Eng 61:1015–1023 In: Proceedings 16th International Conference Solid-State Sen-
10. Roch I, Bidaud P, Collard D, Buchaillot L (2003) Fabrication and sors, Actuators and Microsystems Conference (TRANSDUC-
characterization of an SU-8 gripper actuated by a shape memory ERS), pp 466–469
alloy thin film. J Micromech Microeng 12(2):330–336 32. Solano B, Wood D (2007) Design and testing of a polymeric
11. Wei Y, Xu Q (2015) An overview of micro-force sensing tech- microgripper for cell manipulation. Microelectro Eng 84(5):1219–
niques. Sens Actuators A Phys 234(1):359–374 1222
J Micro-Bio Robot (2017) 13:1–14 13

33. Chu LL, Gianchandani YB (2003) A micromachined 2D posi- of high-sensitivity piezoelectric microelectromechanical systems
tioner with electrothermal actuation and sub-nanometer capacitive accelerometers. J Microelectromech Syst 12(4):433–439
sensing. J Micromech Microeng 13(2):297–285 51. Lee SS, Reid RP, White RM (1996) Piezoelectric can-
34. Khazaai JJ, Qu H, Shillor M, Smith L (2011) Design and fab- tilever microphone and microspeaker. J Microelectromech Syst
rication of electro-thermally activated micro gripper with large 5(4):238–242
tip opening and holding force. In: Proceedings IEEE Sensors 52. Maluf N (2002) An introduction to microelectromechanical sys-
Limerick, pp 1445–1448 tems engineering. Meas Sci Technol 13(2):229
35. Yang S, Xu Q (2016) Design of a microelectromechanical systems 53. Park J, Moon W (2003) A hybrid-type micro-gripper with an
microgripper with integrated electrothermal actuator and force integrated force sensor. Microsyst Technol 9(8):511–519
sensor. Int J Adv Robot Sys 5:13 54. Xu Q (2013) Precision position/force interaction control of a
36. Xi X, Clancy T, Wu X, Sun Y, Liu X (2015) A MEMS XY-stage piezoelectric multimorph microgripper for microassembly. IEEE
with sub-nanometer positioning resolution, In: Proceedings 2015 Trans Autom Sci Eng 10(3):503–514
IEEE International Conference on Mechatronics and Automation 55. Jeon C-S, Park J-S, Lee S-Y, Moon C-W (2007) Fabrication and
(ICMA), pp 988–993 characteristics of out-of-plane piezoelectric micro grippers using
37. Krishnamoorthy U, Lee D, Solgaard O (2003) Self-aligned verti- MEMS processes. Thin Solid Films 515(12):4901–4904
cal electrostatic combdrives for micromirror actuation. J Micro- 56. Kim WH, Park J, Shin KS, Park KB, Seong WK, Moon CW
electromech Syst 12(4):458–464 (2005) Simulation and fabrication of silicon micro-grippers actu-
38. Lee AP, McConaghy CF, Sommargren G, Krulevitch P, Camp- ated by piezoelectric actuator. Mater Sci Forum 475:1885–1888
bell EW (2003) Vertical-actuated electrostatic comb drive with in 57. Devasia S, Eleftheriou E, Moheimani SOR (2007) A survey
situ capacitive position correction for application in phase shifting of control issues in nanopositioningy. IEEE Trans Control Syst
diffraction interferometry. J Microelectromech Syst 12(6):960– Technol 15(5):802–823
971 58. Lantz MA, Rothuizen H, Drechsler U, Haeberle W, Despont M
39. Jensen BD, Mutlu S, Miller S, Kurabayashi K, Allen JJ (2003) (2007) A vibration resistant nanopositioner for mobile parallel-
Shaped comb fingers for tailored electromechanical restoring probe storage applications. J Microelectromech Syst 16(1):130–
force. J Microelectromech Syst 12(3):373–383 139
40. Zhao Y, Cu T (2003) Fabrication of high-aspect-ratio polymer- 59. Kim DH, Lee MG, Kim B, Sun Y (2005) A superelastic alloy
based electrostatic comb drives using the hot embossing tech- microgripper with embedded electromagnetic actuators and piezo-
nique. J Micromech Microeng 13(3):430 electric force sensors: a numerical and experimental study. Smart
41. Barbastathis G, Gregory N (2006) Dynamic pull-in of parallel- Mater Struct 14(6):1256
plate and torsional electrostatic MEMS actuators. J Microelec- 60. Jia Y, Jia M, Xu Q (2014) A dual-axis electrostatically driven
tromech Syst 15(4):811–821 MEMS microgripper. Int J Adv Robot Syst 11(Article ID 187):.
42. Chang H, Zhao H, Ye F, Yuan G, Xie J, Kraft M, Yuan W (2014) doi:10.5772/59677
A rotary comb-actuated microgripper with a large displacement 61. Muntwyler S, Kratochvil BE, Beyeler F, Nelson BJ (2010) Two-
range. Microsyst technol 20(1):119–126 axis micro-tensile tester chip for measuring plant cell mechanics.
43. Boudaoud M, Haddab Y, Le Gorrec Y (2010) Modelling In: Proceedings of IEEE Sensors, pp 2451–2454
of a MEMS-based microgripper: application to dexterous 62. Qu J, Zhang W, Jung A, Sliva S, Liu X (2015) A MEMS micro-
micrOmanipulation. In: Proceedings IEEE /RSJ International gripper with two-axis actuators and force sensors for microscale
Conference on Intelligent and Robotic Systems, pp 5634– mechanical characterization of soft materials. In: Proceedings
5639 IEEE International Conference on Automation Science and Engi-
44. Piriyanont B, Moheimani SOR, Lai Y (2013) Design, modeling, neering (CASE), pp 1620–1625
and characterization of a MEMS micro-gripper with an integrated 63. Chen D-S, Yeh P-F, Chen Y-F, Tsai C-W, Yin C-Y, Lai R-J,
electrothermal force sensor. In: Proceedings of IEEE/ASME Inter- Tsai J-C (2014) An electrothermal actuator with two degrees of
national Conference on Advanced Intelligent Mechatronics, pp freedom serving as the arm of a MEMS gripper. IEEE Trans Ind
348–353 Electron 61(10):5465–5471
45. Piriyanont B, Moheimani SOR (2014) MEMS rotary microgripper 64. Sergio M, Manaresi N, Tartagni M, Guerrieri R, Canegallo R
with integrated electrothermal force sensor. J Microelectromech (2002) A textile based capacitive pressure sensor. In: Proceedings
Syst 23(6):1249–1251 of IEEE Sensors, pp 1625–1630
46. Sreekumar M, Nagarajan T, Singaperumal M, Zoppi M, Molfino 65. Ko C-T, Tseng S-H, Lu M. S-C (2006) A CMOS micromachined
R (2007) Critical review of current trends in shape memory alloy capacitive tactile sensor with high-frequency output. IEEE/ASME
actuators for intelligent robots. Ind Robot 34(4):285–294 J Microelecromechan Syst 15(6):1708–1714
47. Munasinghe KC, Bowatta BGCT, Abayarathne HYR, 66. Shkel YM, Ferrier NJ (2003) Electrostriction enhancement of
Kumararathna N, Maduwantha LKAH, Arachchige NMP, Ama- solid-state capacitance sensing Mechatronics, IEEE/ASME Trans
rasinghe YWR (2016) New MEMS based micro gripper using Mechatron 8(3):318–325
SMA for micro level object manipulation and assembling. In: 67. Xu Q (2015) Design, fabrication, and testing of an MEMS micro-
Proceedings 2016 Moratuwa Engineering Research Conference gripper with dual-axis force sensor. IEEE Sensors J 15(10):6017–
(MERCon), pp 36–41 6026
48. AbuZaiter A, Nafea M, Ali MSM (2016) Development of a shape- 68. Hogervorst1 RP, Krijnen B, Brouwer DM, Engelen JBC, Staufer
memory-alloy micrOmanipulator based on integrated bimorph U (2010) A single-mask thermal displacement sensor in MEMS.
microactuators. Mechatronics 38:16–28 In: Proceedings of 10th International Conference on Euro-
49. Bernstein JJ, Finberg SL, Houston K, Niles LC, Chen HD, Cross pean Society Precision Engineering Nanotechnology, Delft, The
EL, Li KK, Udayakumar K (1997) Micromachined high frequency Netherlands, pp 462–465
ferroelectric sonar transducers. IEEE Trans Ultrason Ferroelect 69. Binning GK, Despont M, Lantz MA, Vettiger P (2007) Thermal
Freq Contr 44(5):960–969 movement sensor, U.S. Patent 7 186 019
50. Wang LP, Wolf RA, Wang Y, Deng KK, Zou LC, Davis RJ, 70. Durig U (2005) Fundamentals of micromechanical thermoelectric
Trolier-McKinstry S (2003) Design, fabrication, and measurement sensors. J Appl Phys 98(4):044906-1-044906-14
14 J Micro-Bio Robot (2017) 13:1–14

71. Lantz MA, Binnig GK, Despont M, Drechsler U (2005) A 78. Kane BJ, Cutkosky MR, Kovacs GTA (2000) A traction stress
micromechanical thermal displacement sensor with nanometre sensor array for use in high-resolution robotic tactile imaging. J
resolution. Nanotechnology 16(8):1089–1094 Microelectromech Syst 9(4):425–434
72. Zhu Y, Bazaei A, Moheimani SOR, Yuce MR (2010) A microma- 79. Han K, Lee SH, Moon W, Park J (2006) Fabrication of the micro-
chined nanopositioner with on-chip electrothermal actuation and gripper with a force sensor for manipulating a cell. In: Proceedings
sensing. IEEE Electron Device Lett 31(10):1161–1163 of SICE-ICASE International of Joint Conference, pp 5833–
73. Piriyanont B, Fowler AG, Moheimani SOR (2015) Force- 5836
controlled mems rotary microgripper. J Microelectromech Syst 80. Molhave K, Hansen O (2005) Electro-thermally actuated micro-
24(4):1164–1172 grippers with integrated force-feedback. J Micromech Microeng
74. Mei T, Ge Y, Chen Y, Ni L, Liao W-H, Xu Y, Li WJ (1999) 15(6):1265–1270
Design and fabrication of an integrated three-dimensional tac- 81. Chen T, Chen L, Sun L, Wang J, Li X (2008) A sidewall piezore-
tile sensor for space robotic applications. In: Proceedings of sistive force sensor used in a MEMS gripper. In: Proceedings of
12th IEEE International Conference on Micro Electro Mechanical 2008 IEEE International Conference on Robotics and Applica-
Systems, Orlando, FL, pp 112–117 tions (ICIRA), pp 207–216
75. Hasegawa Y, Shikida M, Shimizu T, Miyaji T, Sasaki H, Sato 82. Tadigadapa S, Mateti K (2009) Piezoelectric MEMS sensors:
K, Itoigawa K (2004) A micromachined active tactile sensor for state-of-the-art and perspectives. Meas Sci Technol 20(9):092–
hardness detection. Sens Actuators A Phys 114(2-3):141–146 001
76. Sugiyama S, Takigawa M, Igarashi I (1983) Integrated piezoresis- 83. Dargahi J, Parameswaran M, Payandeh S (2000) A microma-
tive pressure sensor with both voltage and frequency output. Sens chined piezoelectric tactile sensor for an endoscopic grasper-
Actuators 4:113–120 theory, fabrication and experiments. J Microelectromech Syst
77. Gretillat F, Gretillat MA, de Rooij NF (1999) Improved 9(3):329–335
design of a silicon micromachined gyroscope with piezoresistive 84. Kim DH, Kim B, Kang HJ (2004) Development of a piezoelectric
detection and electromagnetic excitation. J Microelectromech Syst polymer-based sensorized microgripper for microassembly and
8(3):243–250 micrOmanipulation. Microsyst Technol 10(4):275–280

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