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∗ e-mail: Mustafa.telli@kocaeli.edu.tr
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Soda Lime Silicate Glass–Copper Metal Joining. . . 483
Fig. 1. Soda lime silicate glass disc on Cu disc samples Figure 4 suggested that both Cu and soda lime sili-
joined at 800 ◦C in air for heat treatment durations of cate glass experienced rather high residual stress levels at
(a) 5, (b) 10 and (c) 20 min. joining interface for used sample profiles. While Cu layer
had highest maximal principal stress levels at the order
Figure 2a illustrates cracking in glass layer at 30× mag- of 450 MPa at joining interface close to formed bubble as
nification secondary electron SEM image and part (b) seen in Fig. 4a, soda lime silicate glass had highest min-
shows bubble formation in glass layer at CuO interface at imal principal stress levels at the order of −400 MPa at
1000× magnification image. Observed cracking in glass towards circumference of glass bonded to copper joining
layer suggested that residual joining stress levels were interface and around formed bubble as seen in Fig. 4b.
high for the used joining sample dimensions. Bubble for- In addition, bubble formation at glass–copper joining in-
mation at soda lime silicate glass and oxidized copper terface was found to be complicating and increasing min-
layer interface suggested that due to chemical reaction imal principal stress that glass experienced near joining
between glass and copper oxide. interface.
4. Conclusion Acknowledgments
Soda lime silicate glass–copper joining in air with a This study was financially supported by scientific re-
heat treatment at 800 ◦C lead copper oxidation and reac- search project 2011-70 of Kocaeli University, Turkey.
tion of formed copper oxide with soda lime silicate glass
resulted in bubble formation at joining interface. Due to References
thermal expansion coefficient difference, high maximal
principal stress levels at copper layer and high minimal [1] D. Lei, Z. Wang, J. Li, Mater. Des. 31, 1813 (2010).
principal stress levels at that glass at interface were ob- [2] C. Chanmuang, M. Naksata, H. Jain, C.E. Lyman,
served for disc on disc sample profiles. While Cu layer Mater. Sci. Eng. A 474, 218 (2008).
had highest maximal principal stress levels at the or- [3] J.E. Shelby, Introduction to Glass Science and Tech-
der of 450 MPa at joining interface and soda lime sili- nology, 2nd ed., The Royal Society of Chemistry,
cate glass had lowest minimal principal stress levels at Cambridge UK 2005.
the order of −400 MPa around formed big bubble at in- [4] J.R. Davis, Copper and Copper Alloys, ASM Spe-
terface and around close to outer joining circumference. cialty Handbook, ASM International, Materials Park,
Observed cracking in glass was consistent with residual OH 2001.
stress calculations around formed big bubble and inter- [5] R.W. Messler, Joining of Materials and Structure:
facial cracks starting from joining interface close to glass From Pragmatic Process to Enabling Technology, El-
outer section close to circumference. For successful cop- sevier, Burlington 2004.
per soda lime silicate glass–copper joining, residual stress [6] “Schott tubing brochure for Ar-glass”, www.schott.
levels and bubble formation due to reaction between ox- com/.
idized copper and soda lime silicate glass needs to be [7] “Pure cold drawn Cu properties”, www.matweb.com/.
minimized.
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