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TPS560430
SLVSE22B – SEPTEMBER 2017 – REVISED JUNE 2018
CIN CBOOT 95
L
VOUT 90
EN SW
Efficiency (%)
85
RFBT
80
GND FB COUT
RFBB 75
70
VIN = 8 V
Copyright © 2017, Texas Instruments Incorporated 65 VIN = 12 V
VIN = 24 V
60
0.01 0.1 1
IOUT (A) D000
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TPS560430
SLVSE22B – SEPTEMBER 2017 – REVISED JUNE 2018 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................. 10
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 14
3 Description ............................................................. 1 9 Application and Implementation ........................ 15
4 Revision History..................................................... 2 9.1 Application Information............................................ 15
9.2 Typical Application ................................................. 15
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 3 10 Power Supply Recommendations ..................... 22
7 Specifications......................................................... 4 11 Layout................................................................... 22
11.1 Layout Guidelines ................................................. 22
7.1 Absolute Maximum Ratings ...................................... 4
11.2 Layout Example .................................................... 23
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4 12 Device and Documentation Support ................. 24
7.4 Thermal Information .................................................. 4 12.1 Device Support...................................................... 24
7.5 Electrical Characteristics........................................... 5 12.2 Documentation Support ........................................ 24
7.6 Timing Requirements ................................................ 6 12.3 Receiving Notification of Documentation Updates 24
7.7 Switching Characteristics .......................................... 6 12.4 Community Resources.......................................... 24
7.8 Typical Characteristics .............................................. 7 12.5 Trademarks ........................................................... 24
12.6 Electrostatic Discharge Caution ............................ 24
8 Detailed Description .............................................. 9
12.7 Glossary ................................................................ 25
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9 13 Mechanical, Packaging, and Orderable
Information ........................................................... 25
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Changed marketing status of the TPS560430X orderable from Product Preview to Production........................................... 3
• Changed marketing status of the TPS560430Y orderable from Product Preview to Production........................................... 3
• Changed marketing status of the TPS560430YF orderable from Product Preview to Production. ....................................... 3
• Added Figure 4 Efficiency vs Load Current............................................................................................................................ 7
• Added Figure 5 Efficiency vs Load Current............................................................................................................................ 7
DBV Package
6-Pin SOT-23-6
Top View
CB 1 6 SW
GND 2 5 VIN
FB 3 4 EN
Pin Functions
PIN (1)
TYPE DESCRIPTION
NO. NAME
Bootstrap capacitor connection for high-side FET driver. Connect a high quality 100-nF capacitor
1 CB P
from this pin to the SW pin.
Power ground terminals, connected to the source of low-side FET internally. Connect to system
2 GND G
ground, ground side of CIN and COUT. Path to CIN must be as short as possible.
Feedback input to the convertor. Connect a resistor divider to set the output voltage. Never short
3 FB A
this terminal to ground during operation.
Precision enable input to the convertor. Do not float. High = on, Low = off. Can be tied to VIN.
4 EN A
Precision enable input allows adjustable UVLO by external resistor divider.
Supply input terminal to internal bias LDO and high-side FET. Connect to input supply and input
5 VIN P
bypass capacitors CIN. Input bypass capacitors must be directly connected to this pin and GND.
Switching output of the convertor. Internally connected to source of the high-side FET and drain of
6 SW P
the low-side FET. Connect to power inductor.
7 Specifications
7.1 Absolute Maximum Ratings
(1)
Over the recommended operating junction temperature range of -40 °C to 125 °C (unless otherwise noted)
PARAMETER MIN MAX UNIT
VIN to GND –0.3 38
Input Voltages EN to GND –0.3 VIN + 0.3 V
FB to GND –0.3 5.5
SW to GND –0.3 VIN + 0.3
Output Voltages SW to GND less than 10 ns transient –3.5 38 V
CB to SW –0.3 5.5
(2)
TJ Junction temperature –40 150
°C
Tstg Storage temperature –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Operating at junction temperatures greater than 125°C, although possible, degrades the lifetime of the device.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not guarantee specific
performance limits. For guaranteed specifications, see Electrical Characteristics
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These
values were calculated in accordance with JESD 51-7, and simulated on a specified JEDEC board. They do not represent the
performance obtained in an actual application.
100 100
90 90
80 80
70 70
Efficiency (%)
Efficiency (%)
60 60
50 50
40 FPWM, 8 VIN 40 FPWM, 8 VIN
FPWM, 12 VIN FPWM, 12 VIN
30 FPWM, 24 VIN 30 FPWM, 24 VIN
FPWM, 36 VIN FPWM, 36 VIN
20 PFM, 8 VIN 20 PFM, 8 VIN
PFM, 12 VIN PFM, 12 VIN
10 PFM, 24 VIN 10 PFM, 24 VIN
PFM, 36 VIN PFM, 36 VIN
0 0
0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1
IOUT (A) D001
IOUT (A) D002
fSW = 1.1 MHz VOUT = 3.3 V fSW = 1.1 MHz VOUT = 5 V
Efficiency (%)
60 60
50 50
40 40
30 FPWM, 15 VIN 30 FPWM, 8 VIN
FPWM, 24 VIN FPWM, 12 VIN
20 FPWM, 36 VIN 20 FPWM, 24 VIN
PFM, 15 VIN PFM, 8 VIN
10 PFM, 24 VIN 10 PFM, 12 VIN
PFM, 36 VIN PFM, 24 VIN
0 0
0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1
IOUT (A) D003 IOUT (A) D011
fSW = 1.1 MHz VOUT = 12 V fSW = 2.1 MHz VOUT = 3.3 V
60
VOUT (V)
50 5.033
40
5.032
30 FPWM, 8 VIN
FPWM, 12 VIN
20 FPWM, 24 VIN
PFM, 8 VIN 5.031
10 PFM, 12 VIN
PFM, 24 VIN
0 5.03
0.0001 0.001 0.01 0.1 1 0 0.1 0.2 0.3 0.4 0.5 0.6
IOUT (A) IOUT (A) D004
D012
fSW = 2.1 MHz VOUT = 5 V fSW = 1.1 MHz VOUT = 5 V FPWM version
5.035
5
5.034
4.5
VOUT (V)
VOUT (V)
5.033
4
5.032
IOUT = 0 mA IOUT = 300 mA
IOUT = 100 mA IOUT = 600 mA IOUT = 0 mA
3.5 IOUT = 100 mA
5.031
IOUT = 300 mA
IOUT = 600 mA
5.03 3
5 10 15 20 25 30 35 40 4 4.5 5 5.5 6 6.5 7
VIN (V) D005 VIN (V) D006
fSW = 1.1 MHz VOUT = 5 V FPWM version fSW = 1.1 MHz VOUT = 5 V FPWM version
3.8
75
3.7
VIN UVLO (V)
IQ (PA)
70 3.6 Rising
Falling
3.5
65
3.4
60 3.3
-50 0 50 100 150 -50 0 50 100 150
Temperature (qC) D007
Temperature (qC) D008
VFB = 1.1 V PFM verison
1.1
0.9998
Reference Voltage (V)
0.9996 1
0.9994
0.9992 0.9
0.999
0.8
0.9988
0.9986 0.7
-50 0 50 100 150 -50 0 50 100 150
Temperature (qC) D009
Temperature (qC) D010
Figure 11. Reference Voltage vs Temperature Figure 12. HS and LS Current Limit vs Temperature
8 Detailed Description
8.1 Overview
The TPS560430 regulator is an easy to use synchronous step-down DC-DC converter operating from 4-V to 36-
V supply voltage. It is capable of delivering up to 600-mA DC load current in a very small solution size. The
family has multiple versions applicable to various applications, refer to Device Comparison Table for detailed
information.
The TPS560430 employs fixed-frequency peak-current mode control. The device enters PFM Mode at light load
to achieve high efficiency for PFM version. And FPWM version is provided to achieve low output voltage ripple,
tight output voltage regulation, and constant switching frequency at light load. The device is internally
compensated, which reduces design time, and requires few external components.
Additional features such as precision enable and internal soft-start provide a flexible and easy to use solution for
a wide range of applications. Protection features include thermal shutdown, VIN under-voltage lockout, cycle-by-
cycle current limit, and hiccup mode short-circuit protection.
The family requires very few external components and has a pin-out designed for simple, optimum PCB layout.
EN
VCC
LDO VIN
Enable
Precision
CB
Enable
HSI Sense
Internal
SS
EA
REF
RC
TSD UVLO
+
FB
CC
Slope
Ton_min/Toff_min Comp
Detector Freq HICCUP Zero
Foldback Detector Cross
LSI Sense
Oscillator
FB
GND
tON tOFF
t
0
TSW
iL
ILPK
Inductor Current
IOUT
DiL
t
0
Figure 13. SW Node and Inductor Current Waveforms in Continuous Conduction Mode (CCM)
The TPS560430 employs fixed-frequency peak-current mode control. A voltage feedback loop is used to get
accurate DC voltage regulation by adjusting the peak-current command based on voltage offset. The peak
inductor current is sensed from the high-side switch and compared to the peak current threshold to control the
ON time of the high-side switch. The voltage feedback loop is internally compensated, which allows for fewer
external components, makes it easy to design, and provides stable operation with almost any combination of
output capacitors. The regulator operates with fixed switching frequency at normal load condition. At light-load
condition, the TPS560430 operates in PFM mode to maintain high efficiency (PFM version) or in FPWM mode for
low output voltage ripple, tight output voltage regulation, and constant switching frequency (FPWM version).
RFBT
FB
RFBB
8.3.3 Enable
The voltage on the EN pin controls the ON or OFF operation of TPS560430. A voltage of less than 0.95 V shuts
down the device, while a voltage of more than 1.36 V is required to start the regulator. The EN pin is an input
and cannot be left open or floating. The simplest way to enable the operation of the TPS560430 is to connect the
EN to VIN. This allows self-start-up of the TPS560430 when VIN is within the operating range.
Many applications will benefit from the employment of an enable divider RENT and RENB (Figure 15) to establish a
precision system UVLO level for the converter. System UVLO can be used for supplies operating from utility
power as well as battery power. It can be used for sequencing, ensuring reliable operation, or supply protection,
such as a battery discharge level. An external logic signal can also be used to drive EN input for system
sequencing and protection. Kindly note that, the EN pin voltage should never be higher than VIN + 0.3 V. It is not
recommended to apply EN voltage when VIN is 0 V.
VIN
RENT
EN
RENB
Figure 16. Frequency Foldback at TON_MIN Figure 17. Frequency Foldback at TOFF_MIN
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
VIN 12 V
VIN CB
CBOOT
CIN
0.1 µF L
2.2 µF
10 µH
VOUT 5 V
EN SW
RFBT
88.7 NŸ
GND FB COUT
22 µF
RFBB
22.1 NŸ
The external components have to fulfill the needs of the application, but also the stability criteria of the device's
control loop. Table 1 can be used to simplify the output filter component selection.
iL [500mA/div]
iL [500mA/div]
VEN [2V/div]
VIN [5V/div]
VOUT [2V/div]
VOUT [2V/div]
iL [500mA/div]
iL [500mA/div]
VIN [10V/div]
VOUT(AC) [100mV/div]
VOUT(AC) [50mV/div]
iOUT [200mA/div]
iL [500mA/div]
Unless otherwise specified the following conditions apply: VIN = 12 V, VOUT = 5 V, fSW = 1.1 MHz, L = 18 µH, COUT = 22 µF, TA
= 25 °C
iL [500mA/div] iL [500mA/div]
11 Layout
VOUT
GND
CB SW
FB EN
Input Bypass
Output Voltage Capacitor
Set Resistor
GND
12.5 Trademarks
E2E is a trademark of Texas Instruments.
SIMPLE SWITCHER, WEBENCH are registered trademarks of Texas Instruments.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 23-Feb-2023
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TPS560430X3FDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 N3XF Samples
TPS560430X3FDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 N3XF Samples
TPS560430XDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAXS Samples
TPS560430XDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAXS Samples
TPS560430XFDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAXF Samples
TPS560430XFDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAXF Samples
TPS560430YDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAYS Samples
TPS560430YDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAYS Samples
TPS560430YFDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAYF Samples
TPS560430YFDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 NAYF Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 23-Feb-2023
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive : TPS560430-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Feb-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Feb-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
C
3.0
2.6 0.1 C
1.75
B A 1.45 MAX
1.45
PIN 1
INDEX AREA
1
6
2X 0.95
3.05
2.75
1.9 5
2
4
3
0.50
6X
0.25
0.15
0.2 C A B (1.1) TYP
0.00
0.25
GAGE PLANE 0.22
TYP
0.08
8
TYP 0.6
0 TYP SEATING PLANE
0.3
4214840/C 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0006A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2 5
2X (0.95)
3 4
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214840/C 06/2021
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0006A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2 5
2X(0.95)
3 4
(R0.05) TYP
(2.6)
4214840/C 06/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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