Professional Documents
Culture Documents
Contents
Package style ITAVM VRRM/VDRM (V) Type Page
IFAVM
800
1200
1600
2000
1400
1800
2200
A
1 Thyristor Modules
25 l l l l MCC 19 E2 - 2
21 l l MCC 21 new E2 - 6
32 l l l l MCC 26 E2 - 8
1 51 l l l l l MCC 44 E2 - 14
60 l l l l l MCC 56 E2 - 18
64 l MCC 60 new E2 - 22
115 l l l l l MCC 72 E2 - 24
104 l l MCC 94 E2 - 28
2 116 l l l l l MCC 95 E2 - 30
1 32 l l l l MCD 26 E2 - 8
6 38 l l MCD 40 E2 - 12
1 51 l l l l l MCD 44 E2 - 14
64 l l l l l MCD 56 E2 - 18
1
64 600 MDC 56 new E2 - 18
1 115 l l l l l MCD 72 E2 - 24
1 104 l l MCD 94 E2 - 28
5 1 116 l l l l l MCD 95 E2 - 30
V V Version 1 B Version 8 B
3 6 7 1 5 4 2
VRGM 10 V
Advantages
TVJ -40...+125 °C
TVJM 125 °C
l
Space and weight savings
Tstg -40...+125 °C
l
Simple mounting with two screws
l
Improved temperature and power
VISOL 50/60 Hz, RMS t = 1 min 3000 V~ cycling
IISOL ≤ 1 mA t=1s 3600 V~ l
Reduced protection circuits
Md Mounting torque (M5) 2.5-4.0/22-35 Nm/lb.in.
Terminal connection torque (M5) 2.5-4.0/22-35 Nm/lb.in.
Weight Typical including screws 90 g
Data according to IEC 60747 and refer to a single thyristor unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
1
10 100 mA 1000
IG
Fig. 2 Gate trigger delay time
Dimensions in mm (1 mm = 0.0394")
Version 1 B Version 8 B
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM: Crest value, t: duration at case temperature
Thyristor Modules
3 6 1 5 2 TO-240 AA
VRSM VRRM Type 3 6
7
2 4
VDSM VDRM 5
1
V V
900 800 MCC 21-08io8 B
1300 1200 MCC 21-12io8 B
1500 1400 MCC 21-14io8 B
1700 1600 MCC 21-16io8 B
Data according to DIN/IEC 747 and refer to a single thyristor unless otherwise stated.
Dimensions in mm (1 mm = 0.0394")
3 6 7 1 5 4 2
1
10 100 mA 1000
IG
Fig. 2 Gate trigger delay time
Dimensions in mm (1 mm = 0.0394")
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
A A/K G K SOT-227 B, G
VRSM VRRM Type
VDSM VDRM miniBLOC K
V V
1300 1200 MCD 40-12io6 A
1700 1600 MCD 40-16io6 A/K
K = Cathode, A = Anode, G = Gate,
A/K = Common output
∫i dt
2
TVJ = 45°C t = 10 ms (50 Hz), sine 1250 As2 l
DC motor control
VR = 0 t = 8.3 ms (60 Hz), sine 1220 A2 s l
Softstart AC motor controller
l
Light, heat and temperature control
TVJ = TVJM t = 10 ms (50 Hz), sine 1010 A2 s l
Half controlled rectifier bridge
VR = 0 t = 8.3 ms (60 Hz), sine 1010 A2 s
(di/dt)cr TVJ = TVJM repetitive, IT = 45 A 100 A/µs
f = 50 Hz, tP =200 µs
VD = 2/3 VDRM Advantages
IG = 0.45 A non repetitive, IT = ITAVM 500 A/µs l
Space and weight savings
diG/dt = 0.45 A/µs l
Simple mounting with two screws
(dv/dt)cr TVJ = TVJM; VDR = 2/3 VDRM 1000 V/µs
l
Improved temperature and power
RGK = ∞; method 1 (linear voltage rise) cycling
l
Reduced protection circuits
PGM TVJ = TVJM tP = 30 µs 10 W
IT = ITAVM tP = 300 µs 5 W
PGAV 0.5 W
VRGM 10 V
TVJ -40...+125 °C
TVJM 125 °C
Tstg -40...+125 °C
VISOL 50/60 Hz, RMS IISOL ≤ 1 mA 2500 V~
Md Mounting torque (M4) 1.5/13 Nm/lb.in.
Terminal connection torque (M4) 1.5/13 Nm/lb.in.
Weight Typical including screws 30 g
Data according to IEC 60747 refer to a single thyristor/diode unless otherwise stated.
031
IXYS reserves the right to change limits, test conditions and dimensions
MCC
Version 1 B
Symbol Test Conditions Maximum Ratings
ITRMS, IFRMS TVJ = TVJM 80 A
3 6 1 5 2
ITAVM, IFAVM TC = 83°C; 180° sine 51 A
TC = 85°C; 180° sine 49 A MCC
ITSM, IFSM TVJ = 45°C; t = 10 ms (50 Hz), sine 1150 A Version 8 B
VR = 0 t = 8.3 ms (60 Hz), sine 1230 A
TVJ = TVJM t = 10 ms (50 Hz), sine 1000 A 3 1 5 2
VR = 0 t = 8.3 ms (60 Hz), sine 1070 A
MCD
∫i2dt TVJ = 45°C t = 10 ms (50 Hz), sine 6600 A2s Version 8 B
VR = 0 t = 8.3 ms (60 Hz), sine 6280 A2 s
TVJ = TVJM t = 10 ms (50 Hz), sine 5000 A2 s
VR = 0 t = 8.3 ms (60 Hz), sine 4750 A2 s
(di/dt)cr TVJ = TVJM repetitive, IT = 150 A 150 A/µs Features
f =50 Hz, tP =200 µs
VD = 2/3 VDRM l
International standard package,
IG = 0.45 A non repetitive, IT = ITAVM 500 A/µs JEDEC TO-240 AA
diG/dt = 0.45 A/µs l
Direct copper bonded Al2O3 -ceramic
base plate
(dv/dt)cr TVJ = TVJM; VDR = 2/3 VDRM 1000 V/µs l
Planar passivated chips
RGK = ∞; method 1 (linear voltage rise) l
Isolation voltage 3600 V~
PGM TVJ = TVJM tP = 30 µs 10 W l
UL registered, E 72873
IT = ITAVM tP = 300 µs 5 W
l
Gate-cathode twin pins for version 1B
PGAV 0.5 W
Applications
VRGM 10 V
l
DC motor control
TVJ -40...+125 °C l
Softstart AC motor controller
TVJM 125 °C l
Light, heat and temperature control
Tstg -40...+125 °C
VISOL 50/60 Hz, RMS t = 1 min 3000 V~ Advantages
IISOL ≤ 1 mA t=1s 3600 V~
l
Space and weight savings
Md Mounting torque (M5) 2.5-4.0/22-35 Nm/lb.in. l
Simple mounting with two screws
Terminal connection torque (M5) 2.5-4.0/22-35 Nm/lb.in. l
Improved temperature and power
Weight Typical including screws 90 g cycling
l
Reduced protection circuits
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
1
10 100 mA 1000
IG
Fig. 2 Gate trigger delay time
Dimensions in mm (1 mm = 0.0394")
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
V V Version 1 Version 8
900 800 MCC 56-08io1 B MCD 56-08io1 B MCC 56-08io8 B MCD 56-08io8 B
1300 1200 MCC 56-12io1 B MCD 56-12io1 B MCC 56-12io8 B MCD 56-12io8 B
1500 1400 MCC 56-14io1 B -- MCC 56-14io8 B MCD 56-14io8 B
1700 1600 MCC 56-16io1 B MCD 56-16io1 B MCC 56-16io8 B MCD 56-16io8 B 3 6 7 1 5 4 2
1900 1800 MCC 56-18io1 B -- MCC 56-18io8 B MCD 56-18io8 B
MCD
Symbol Test Conditions Maximum Ratings Version 1
ITRMS, IFRMS TVJ = TVJM 100 A 3 6 1 5 2
ITAVM, IFAVM TC = 83°C; 180° sine 64 A
TC = 85°C; 180° sine 60 A MCC
ITSM, IFSM TVJ = 45°C; t = 10 ms (50 Hz), sine 1500 A Version 8
VR = 0 t = 8.3 ms (60 Hz), sine 1600 A
3 1 5 2
TVJ = TVJM t = 10 ms (50 Hz), sine 1350 A
VR = 0 t = 8.3 ms (60 Hz), sine 1450 A MCD
∫i2dt TVJ = 45°C t = 10 ms (50 Hz), sine 11 200 A2s Version 8
VR = 0 t = 8.3 ms (60 Hz), sine 10 750 A2 s
3 6 7 1 2
TVJ = TVJM t = 10 ms (50 Hz), sine 9100 A2 s
VR = 0 t = 8.3 ms (60 Hz), sine 8830 A2 s MDC
(di/dt)cr TVJ = TVJM repetitive, IT = 150 A 150 A/µs Version 1
f =50 Hz, tP =200 µs
VD = 2/3 VDRM Features
IG = 0.45 A non repetitive, IT = ITAVM 500 A/µs l
International standard package,
diG/dt = 0.45 A/µs JEDEC TO-240 AA
(dv/dt)cr TVJ = TVJM; VDR = 2/3 VDRM 1000 V/µs
l
Direct copper bonded Al2O3 -ceramic
RGK = ∞; method 1 (linear voltage rise) base plate
l
Planar passivated chips
PGM TVJ = TVJM tP = 30 µs 10 W l
Isolation voltage 3600 V~
IT = ITAVM tP = 300 µs 5 W l
UL registered, E 72873
PGAV 0.5 W l
Gate-cathode twin pins for version 1B
VRGM 10 V
Applications
TVJ -40...+125 °C
TVJM 125 °C l
DC motor control
Tstg -40...+125 °C l
Softstart AC motor controller
l
Light, heat and temperature control
VISOL 50/60 Hz, RMS t = 1 min 3000 V~
IISOL ≤ 1 mA t=1s 3600 V~
Advantages
Md Mounting torque (M5) 2.5-4.0/22-35 Nm/lb.in.
Terminal connection torque (M5) 2.5-4.0/22-35 Nm/lb.in.
l
Space and weight savings
l
Simple mounting with two screws
Weight Typical including screws 90 g l
Improved temperature and power
cycling
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
l
Reduced protection circuits
031
1
10 100 mA 1000
IG
Fig. 2 Gate trigger delay time
Dimensions in mm (1 mm = 0.0394")
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
3 6 7 1 5 4 2 TO-240 AA 6
VRSM VRRM Type 3 7
2 4
VDSM VDRM 1 5
V V
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
928
IXYS reserves the right to change limits, test conditions and dimensions
1
10 100 mA 1000
IG
Fig. 2 Gate trigger delay time
3 6 7 1 5 4 2
MCC
Version 1 B
Symbol Test Conditions Maximum Ratings
3 1 5 4 2
ITRMS, IFRMS TVJ = TVJM 180 A
ITAVM, IFAVM TC = 63°C; 180° sine 115 A MCD
TC = 85°C; 180° sine 85 A Version 1 B
ITSM, IFSM TVJ = 45°C; t = 10 ms (50 Hz), sine 1700 A
VR = 0 t = 8.3 ms (60 Hz), sine 1800 A 3 6 1 5 2
TVJ = TVJM t = 10 ms (50 Hz), sine 1540 A MCC
VR = 0 t = 8.3 ms (60 Hz), sine 1640 A Version 8 B
∫i2dt TVJ = 45°C t = 10 ms (50 Hz), sine 14 450 A2s
VR = 0 t = 8.3 ms (60 Hz), sine 13 500 A2 s 3 1 5 2
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
3 6 7 1 5 4 2
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
839
1
10 100 mA 1000
IG
Fig. 2 Gate trigger delay time
Dimensions in mm (1 mm = 0.0394") RthJC for various conduction angles d: RthJK for various conduction angles d:
d RthJC (K/W) d RthJK (K/W)
DC 0.22 DC 0.42
180° 0.23 180° 0.43
120° 0.25 120° 0.45
60° 0.27 60° 0.47
30° 0.28 30° 0.48
MCC
Symbol Test Conditions Maximum Ratings Version 1
Dimensions in mm (1 mm = 0.0394")
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
3 6 7 1 5 4 2 6 7
VRSM VRRM Type 3
2 4
VDSM VDRM 5
1
V V
900 800 MCC 122-08io1
1300 1200 MCC 122-12io1
1500 1400 MCC 122-14io1
1700 1600 MCC 122-16io1
1900 1800 MCC 122-18io1
3 6 7
VRSM VRRM Type 2 4
5
VDSM VDRM 1
V V Version 1 Version 1
900 800 MCC 132-08io1 MCD 132-08io1
1300 1200 MCC 132-12io1 MCD 132-12io1
1500 1400 MCC 132-14io1 MCD 132-14io1
1700 1600 MCC 132-16io1 MCD 132-16io1
1900 1800 MCC 132-18io1 MCD 132-18io1
3 6 7 1 5 4 2
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
032
MCC MCD
4000 106
ITSM
i2 t
A
A2s
3000
50 Hz
80 % VRRM
TVJ = 45°C
TVJ = 125°C
2000 105
TVJ = 45°C
TVJ = 125°C
1000
0 104
0.001 0.01 0.1 s 1 1 ms 10
t t
Fig. 3 Surge overload current Fig. 4 i2t versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
3 6 7
VRSM VRRM Type 2 4
5
VDSM VDRM 1
V V
2100 2000 MCC 161-20io1 MCD 161-20io1
2300 2200 MCC 161-22io1 MCD 161-22io1
3 6 7 1 5 4 2
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
Dimensions in mm (1 mm = 0.0394") RthJC for various conduction angles d: RthJK for various conduction angles d:
d RthJC (K/W) d RthJK (K/W)
DC 0.155 DC 0.225
180° 0.167 180° 0.237
120° 0.175 120° 0.245
60° 0.197 60° 0.262
30° 0.226 30° 0.296
3 6 7
VRSM VRRM Type 2 4
5
VDSM VDRM 1
V V Version 1 Version 1
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
Dimensions in mm (1 mm = 0.0394")
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
3 6 7 1 5 4 2 3 76
VRSM VRRM Type
2 5
VDSM VDRM 4
V V
1300 1200 MCC 170-12io1 1
1500 1400 MCC 170-14io1
1700 1600 MCC 170-16io1
1900 1800 MCC 170-18io1
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
0.01 0.1 1 A 10
IG
Dimensions in mm (1 mm = 0.0394")
Fig. 2 Gate trigger delay time
M8x20
TVJ = 45°C
100
1000
0 104 0
0.001 0.01 0.1 s 1 1 ms 10 0 25 50 75 100 125 °C 150
t t TC
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
400
Ptot Fig. 5 Power dissipation versus on-
RthKA K/W
state current and ambient
W 0.1
0.2
temperature (per thyristor or
300 0.3 diode)
0.4
0.6
0.8
1.0
200
DC
180° sin
120°
60°
100 30°
0
0 100 200 300 A 0 25 50 75 100 125 °C 150
ITAVM/IFAVM TA
2000
Ptot Fig. 6 Three phase rectifier bridge:
RthKA K/W Power dissipation versus direct
W
0.04
output current and ambient
0.06
1500 0.08 temperature
0.1
0.15
0.2
0.3
1000
Circuit
B6
3xMCC170
500
0
0 200 400 600 A 0 25 50 75 100 125 °C 150
IdAVM TA
2000
Ptot Fig. 7 Three phase AC-controller:
W RthKA K/W Power dissipation versus RMS
0.04
output current and ambient
0.06 temperature
1500
0.08
0.1
0.15
0.2
1000 0.3
Circuit
W3
3xMCC170
500
0
0 100 200 300 400 A 0 25 50 75 100 125 °C 150
IRMS TA
0.25
Fig. 8 Transient thermal impedance
K/W junction to case (per thyristor or
ZthJC
diode)
0.20
RthJC for various conduction angles d:
d RthJC (K/W)
0.15
DC 0.160
180° 0.171
30°
0.10 60° 120° 0.180
120° 60° 0.203
180° 30° 0.247
DC
0.05
Constants for ZthJC calculation:
i Rthi (K/W) ti (s)
0.00
10-3 10-2 10-1 100 101 s 102 1 0.0077 0.00054
t 2 0.0413 0.098
3 0.096 0.54
4 0.0149 12
0.30
Fig. 9 Transient thermal impedance
K/W junction to heatsink (per thyristor
0.25 or diode)
ZthJK
RthJK for various conduction angles d:
0.20
d RthJK (K/W)
DC 0.200
0.15
180° 0.211
30° 120° 0.220
0.10 60° 60° 0.243
120°
180°
30° 0.287
DC
0.05
Constants for ZthJK calculation:
i Rthi (K/W) ti (s)
0.00
10-3 10-2 10-1 100 101 s 102 1 0.0077 0.00054
t 2 0.0413 0.098
3 0.096 0.54
4 0.0149 12
5 0.04 12
3
2 7
VRSM VRRM Type 6
5
VDSM VDRM 1 4
V V Version 1 Version 1
900 800 MCC 220-08io1 MCD 220-08io1
1300 1200 MCC 220-12io1 MCD 220-12io1
1500 1400 MCC 220-14io1 MCD 220-14io1
1700 1600 MCC 220-16io1 MCD 220-16io1
3 6 7 1 5 4 2
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
Dimensions in mm (1 mm = 0.0394")
Threaded spacer for higher Anode/
MCC MCD Cathode construction:
Type ZY 250, material brass
20 12
14
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
3 76
2 5
4
VRSM VRRM Type
VDSM VDRM
V V 1
3 6 7 1 5 4 2
IXYS reserves the right to change limits, test conditions and dimensions
0.01 0.1 1 A 10
Dimensions in mm (1 mm = 0.0394") IG
Fig. 2 Gate trigger delay time
MCC MCD
M8x20 M8x20
150
2000 100
50
0 104 0
0.001 0.01 0.1 s 1 1 ms 10 0 25 50 75 100 125 °C 150
t t TC
Fig. 3 Surge overload current Fig. 4 I2t versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM: Crest value, t: duration at case temperature
500
Ptot
Fig. 5 Power dissipation versus on-
RthKA K/W
W state current and ambient
0.1
0.2 temperature (per thyristor or
400
0.3 diode)
0.4
0.6
300 0.8
1
DC
200 180° sin
120°
60°
30°
100
0
0 100 200 300 A 0 25 50 75 100 125
°C 150
ITAVM TA
2000
Ptot
Fig. 6 Three phase rectifier bridge:
RthKA K/W Power dissipation versus direct
W
0.03 output current and ambient
0.05
1500 0.08 temperature
0.1
0.15
0.2
0.3
1000
Circuit
B6
3xMCC224
500
0
0 200 400 600 A 0 25 50 75 100 °C
125 150
IdAVM TA
745
2000
Fig. 7 Three phase AC-controller:
W RthKA K/W Power dissipation versus RMS
0.03 output current and ambient
0.05
Ptot
1500 0.08 temperature
0.1
0.15
0.2
0.3
1000
Circuit
W3
3xMCC224
500
0
0 100 200 300 400 500 A 0 25 50 75 100 125 °C 150
TA
IRMS
0.25
Fig. 8 Transient thermal impedance
K/W junction to case (per thyristor or
diode)
0.20
RthJC for various conduction angles d:
d RthJC (K/W)
ZthJC
0.15
DC 0.139
180° 0.148
30° 120° 0.156
0.10 60°
120°
60° 0.176
180° 30° 0.214
DC
0.05 Constants for ZthJC calculation:
i Rthi (K/W) ti (s)
0.00 1 0.0067 0.00054
10-3 10-2 10-1 100 101 s 102
2 0.0358 0.098
t
3 0.0832 0.54
4 0.0129 12
0.30
Fig. 9 Transient thermal impedance
K/W junction to heatsink (per thyristor
0.25 or diode)
ZthJK RthJK for various conduction angles d:
0.20
d RthJK (K/W)
DC 0.179
0.15 180° 0.188
30° 120° 0.196
0.10 60° 60° 0.216
120° 30° 0.256
180°
DC
0.05 Constants for ZthJK calculation:
i Rthi (K/W) ti (s)
0.00
10-3 10-2 10 -1 100 101 s 102 1 0.0067 0.00054
t
2 0.0358 0.098
3 0.0832 0.54
4 0.0129 12
5 0.04 12
745
3 76
VRSM VRRM Type 2 5
4
VDSM VDRM
V V
1
1300 1200 MCC 225-12io1 MCD 225-12io1
1500 1400 MCC 225-14io1 MCD 225-14io1
1700 1600 MCC 225-16io1 MCD 225-16io1
1900 1800 MCC 225-18io1 MCD 225-18io1
3 6 7 1 5 4 2
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
IG = 1 A; diG/dt = 1 A/µs
Fig. 1 Gate trigger characteristics
tq TVJ = TVJM; IT = 300 A, tP = 200 µs; -di/dt = 10 A/µs typ. 200 µs
VR = 100 V; dv/dt = 50 V/µs; VD = 2/3 VDRM
100 TVJ = 25C
QS TVJ = 125°C; IT, IF = 300 A; -di/dt = 50 A/µs 550 µC
IRM 235 A µs
tgd
RthJC per thyristor (diode); DC current 0.157 K/W
per module other values 0.08 K/W typ. Limit
RthJK per thyristor (diode); DC current see Fig. 8/9 0.197 K/W
per module 0.1 K/W
10
dS Creeping distance on surface 12.7 mm
dA Creepage distance in air 9.6 mm
a Maximum allowable acceleration 50 m/s2
0.01 0.1 1 A 10
IG
MCC MCD
M8x20 M8x20
2000 100
0 104 0
0.001 0.01 0.1 s 1 1 ms 10 0 25 50 75 100 125 °C 150
t t TC
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
400
Ptot RthKA K/W Fig. 5 Power dissipation versus on-
W 0.1
state current and ambient
0.2 temperature (per thyristor or
300 0.3 diode)
0.4
0.6
0.8
1.0
200
DC
180° sin
120°
60°
100 30°
0
0 100 200 300 A 0 25 50 75 100 125 °C 150
ITAVM/IFAVM TA
2000
Ptot RthKA K/W
Fig. 6 Three phase rectifier bridge:
W Power dissipation versus direct
0.03
0.05 output current and ambient
1500 0.08 temperature
0.1
0.15
0.2
0.3
1000
Circuit
B6
3xMCC225
500
3xMCD225
0
0 200 400 600 A 0 25 50 75 100 125 °C 150
IdAVM TA
Circuit
500 W3
3xMCC225 or
3xMCD225
0
0 100 200 300 400 A 0 25 50 75 100 125 °C 150
IRMS TA
0.25
Fig. 8 Transient thermal impedance
K/W junction to case (per thyristor or
ZthJC
diode)
0.20
RthJC for various conduction angles d:
d RthJC (K/W)
0.15
DC 0.157
180° 0.168
30°
0.10 60° 120° 0.177
120° 60° 0.200
180° 30° 0.243
DC
0.05
Constants for ZthJC calculation:
i Rthi (K/W) ti (s)
0.00
10-3 10-2 10-1 100 101 s 102 1 0.0076 0.00054
t 2 0.0406 0.098
3 0.0944 0.54
4 0.0147 12
0.30
Fig. 9 Transient thermal impedance
K/W junction to heatsink (per thyristor
ZthJK 0.25 or diode)
RthJK for various conduction angles d:
0.20
d RthJK (K/W)
DC 0.197
0.15
180° 0.208
30° 120° 0.217
0.10 60° 60° 0.240
120°
180°
30° 0.283
DC
0.05
Constants for ZthJK calculation:
i Rthi (K/W) ti (s)
0.00
10-3 10 -2 10 -1 100 101
s 102
1 0.0076 0.00054
t 2 0.0406 0.098
3 0.0944 0.54
4 0.0147 12
5 0.04 12
3
2 7
VRSM VRRM Type 6
5
1 4
VDSM VDRM
V V Version 1 Version 1
900 800 MCC 250-08io1 MCD 250-08io1
1300 1200 MCC 250-12io1 MCD 250-12io1
1500 1400 MCC 250-14io1 MCD 250-14io1
1700 1600 MCC 250-16io1 MCD 250-16io1
1900 1800 MCC 250-18io1
3 6 7 1 5 4 2
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
Dimensions in mm (1 mm = 0.0394")
Threaded spacer for higher Anode/
Cathode construction:
MCC MCD
Type ZY 250, material brass
20 12
14
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
0.15
Fig. 8 Transient thermal impedance
30° junction to case (per thyristor or
K/W
DC diode)
ZthJC RthJC for various conduction angles d:
0.10 d RthJC (K/W)
DC 0.129
180°C 0.131
120°C 0.131
60°C 0.132
0.05
30°C 0.132
0.20
Fig. 9 Transient thermal impedance
K/W junction to heatsink (per thyristor
30°
DC
or diode)
ZthJK
0.15 RthJK for various conduction angles d:
d RthJK (K/W)
DC 0.169
0.10 180°C 0.171
120°C 0.172
60°C 0.172
30°C 0.173
0.05
Constants for ZthJK calculation:
i Rthi (K/W) ti (s)
0.00 1 0.0033 0.099
10-3 10-2 10-1 100 101 s 102 2 0.0159 0.168
t 3 0.1053 0.456
4 0.04 1.36
835
3 76
VRSM VRRM Type 2 5
4
VDSM VDRM
V V
1300 1200 MCC 255-12io1 MCD 255-12io1 1
1500 1400 MCC 255-14io1 MCD 255-14io1
1700 1600 MCC 255-16io1 MCD 255-16io1
1900 1800 MCC 255-18io1 MCD 255-18io1
3 6 7 1 5 4 2
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
0.01 0.1 1 A 10
Dimensions in mm (1 mm = 0.0394") IG
Fig. 2 Gate trigger delay time
MCC 255 MCD 255
M8x20 M8x20
6000
TVJ = 130°C
105 200
4000
100
2000
0 104 0
0.001 0.01 0.1 s 1 1 ms 10 0 25 50 75 100 125 °C 150
t t TC
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
500
Ptot RthKA K/W Fig. 5 Power dissipation versus on-
W
0.1 state current and ambient
400 0.2 temperature (per thyristor or
0.3 diode)
0.4
0.6
300 0.8
1.0
DC
200 180° sin
120°
60°
30°
100
0
0 100 200 300 A 0 25 50 75 100 125 °C 150
ITAVM/IFAVM TA
2000
Ptot
RthKA K/W Fig. 6 Three phase rectifier bridge:
W Power dissipation versus direct
0.03
0.06 output current and ambient
1500 0.1 temperature
0.15
0.2
0.3
0.4
1000
Circuit
B6
3xMCC255 or
500
3xMCD255
0
0 200 400 600 A 0 25 50 75 100 125 °C 150
IdAVM TA
Circuit
W3
500 3xMCC255 or
3xMCD255
0
0 100 200 300 400 500 A 0 25 50 75 100 125 °C 150
IRMS TA
0.25
Fig. 8 Transient thermal impedance
K/W
ZthJC junction to case (per thyristor or
0.20 diode)
RthJC for various conduction angles d:
0.15
d RthJC (K/W)
DC 0.139
30° 180° 0.148
0.10 60° 120° 0.156
120° 60° 0.176
180°
DC
30° 0.214
0.05
Constants for ZthJC calculation:
i Rthi (K/W) ti (s)
0.00
10-3 10-2 10-1 100 101 s 102 1 0.0066 0.00054
t 2 0.0358 0.098
3 0.0831 0.54
4 0.0129 12
0.30
Fig. 9 Transient thermal impedance
K/W
junction to heatsink (per thyristor
0.25
ZthJK
or diode)
RthJK for various conduction angles d:
0.20
d RthJK (K/W)
0.15
DC 0.179
180° 0.188
30° 120° 0.196
0.10 60°
120°
60° 0.216
180° 30° 0.254
DC
0.05
Constants for ZthJK calculation:
0.00
i Rthi (K/W) ti (s)
10-3 10-2 10-1 100 101 s 102
1 0.0066 0.00054
t 2 0.0358 0.098
3 0.0831 0.54
4 0.0129 12
5 0.04 12
3
2 76
VRSM VRRM Type 5
VDSM VDRM 1 4
V V Version 1 Version 1
900 800 MCC 310-08io1 MCD 310-08io1
1300 1200 MCC 310-12io1 MCD 310-12io1
1500 1400 MCC 310-14io1 MCD 310-14io1
1700 1600 MCC 310-16io1 MCD 310-16io1
1900 1800 MCC 310-18io1 MCD 310-18io1
3 6 7 1 5 4 2
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
030
Dimensions in mm (1 mm = 0.0394")
Threaded spacer for higher Anode/
MCC MCD Cathode construction:
Type ZY 250, material brass
20 12
14
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
0.15
Fig. 8 Transient thermal impedance
K/W
junction to case (per thyristor or
diode)
ZthJC 30° RthJC for various conduction angles d:
DC
0.10 d RthJC (K/W)
DC 0.112
180°C 0.113
120°C 0.114
60°C 0.115
0.05
30°C 0.115
0.20
Fig. 9 Transient thermal impedance
K/W
junction to heatsink (per thyristor
ZthJK or diode)
30°
0.15 DC RthJK for various conduction angles d:
d RthJK (K/W)
DC 0.152
0.10 180°C 0.154
120°C 0.154
60°C 0.155
30°C 0.155
0.05
Constants for ZthJK calculation:
i Rthi (K/W) ti (s)
0
0.00 1 0.003 0.099
10-3 10-2 10-1 100 101 s 102 2 0.0143 0.168
t
3 0.0947 0.456
4 0.04 1.36
835
3 76
VRSM VRRM Type 2 5
4
VDSM VDRM
V V
1
1300 1200 MCC 312-12io1 MCD 312-12io1
1500 1400 MCC 312-14io1 MCD 312-14io1
1700 1600 MCC 312-16io1 MCD 312-16io1
1900 1800 MCC 312-18io1 MCD 312-18io1
3 6 7 1 5 4 2
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
0.01 0.1 1 A 10
Dimensions in mm (1 mm = 0.0394") IG
4000
200
2000
100
0 104 0
0.001 0.01 0.1 s 1 1 ms 10 0 25 50 75 100 125 °C 150
t t TC
Fig. 3 Surge overload current Fig. 4 I2t versus time (1-10 ms) Fig. 4a Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
600
Ptot
Fig. 5 Power dissipation versus on-
RthKA K/W
W state current and ambient
0.06
500 0.1 temperature (per thyristor or
0.2 diode)
0.3
400 0.4
0.6
0.8
300
DC
180° sin
120°
200
60°
30°
100
0
0 100 200 300 400 500 A 0 25 50 75 100 125
°C 150
ITAVM / IFAVM TA
3000
Ptot
Fig. 6 Three phase rectifier bridge:
W RthKA K/W Power dissipation versus direct
2500
0.02 output current and ambient
0.04
0.07 temperature
0.1
2000 0.15
0.2
0.3
1500
Circuit
1000 B6
3xMCC312 or
3xMCD312
500
0
0 200 400 600 800 A 0 25 50 75 100 °C
125 150
IdAVM TA
3000
Fig. 7 Three phase AC-controller:
W Power dissipation versus RMS
RthKA K/W
2500 0.02
output current and ambient
Ptot 0.04 temperature
0.07
2000 0.1
0.15
0.2
1500 0.3
1000 Circuit
W3
3xMCC312 or
500 3xMCD312
0
0 200 400 600 A 0 25 50 75 100 125 °C 150
TA
IRMS
3
3 5 4 2 5
VRSM VRRM Type 2 4
VDSM VDRM
V V
Data according to IEC 60747 refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
030
0.01 0.1 1 A 10
IG
2000 100
0 105 0
0.001 0.01 0.1 s 1 1 ms 10 0 25 50 75 100 125 °C 150
t t TC
Fig. 3 Surge overload current Fig. 4 I2t versus time (1-10 ms) Fig. 5 Maximum forward current
ITSM: Crest value, t: duration at case temperature
1000
Ptot Fig. 6 Power dissipation versus on-
W
RthKA K/W state current and ambient
0.03
temperature
800
0.07
0.12
0.2
600 0.3
0.4
0.6
DC
400 180° sin
120°
60°
30°
200
0
0 200 400 600 800 A 0 25 50 75 100 125 °C 150
ITAVM TA
4000
W
Fig. 7 Three phase rectifier bridge:
RthKA K/W
3500 Power dissipation versus direct
0.01
Ptot output current and ambient
0.02
3000 0.03 temperature
0.045
2500 0.06
0.08
0.12
2000
1500
Circuit
1000 B6
6xMCO450
500
0
0 300 600 900 1200 A 0 25 50 75 100 125 °C 150
IdAVM TA
4000
Fig. 8 Three phase AC-controller:
W RthKA K/W
Power dissipation versus RMS
3500 0.01
output current and ambient
0.02
Ptot
3000 0.03 temperature
0.045
0.06
2500
0.08
0.12
2000
1500
Circuit
1000 W3
6xMCO450
500
0
0 300 600 900 A 0 25 50 75 100 125 °C 150
TA
IRMS
0.14
Fig.10 Transient thermal impedance
K/W junction to heatsink
0.12
3
3 5 4 2 5
VRSM VRRM Type 2 4
VDSM VDRM
V V
1300 1200 MCO 500-12io1
1500 1400 MCO 500-14io1
1700 1600 MCO 500-16io1
1900 1800 MCO 500-18io1
Data according to IEC 60747 refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
030
0.01 0.1 1 A 10
Dimensions in mm (1 mm = 0.0394") IG
M8x20
52
49
10
200
2000
100
0 105 0
0.001 0.01 0.1 s 1 1 ms 10 0 25 50 75 100 125 °C 150
t t TC
Fig. 3 Surge overload current Fig. 4 ∫i2dt versus time (1-10 ms) Fig. 5 Maximum forward current
ITSM, IFSM: Crest value, t: duration at case temperature
1200
Ptot
Fig. 6 Power dissipation versus on-
RthKA K/W
W state current and ambient
0.03 temperature
1000
0.07
0.12
0.2
800 0.3
0.4
0.6
600
DC
180° sin
120°
400
60°
30°
200
0
0 200 400 600 800 A 0 25 50 75 100 125
°C 150
ITAVM / IFAVM TA
5000
W
Fig. 7 Three phase rectifier bridge:
4500 RthKA K/W Power dissipation versus direct
0.01 output current and ambient
4000 0.02
Ptot 0.03
temperature
3500 0.045
0.06
3000 0.08
0.12
2500
2000
1500
Circuit
1000 B6
6xMCO500
500
0
0 300 600 900 1200 1500 A 0 25 50 75 100 °C
125 150
IdAVM TA
5000
W
Fig. 8 Three phase AC-controller:
RthKA K/W
4500 Power dissipation versus RMS
0.01
output current and ambient
0.02
Ptot 4000 temperature
0.03
3500 0.045
0.06
3000 0.08
0.12
2500
2000
Circuit
1500 W3
6xMCO500
1000
500
0
0 300 600 900 1200 A 0 25 50 75 100 125 °C 150
TA
IRMS
0.12
Fig. 9 Transient thermal impedance
K/W junction to case (per thyristor)
0.10
RthJC for various conduction angles d:
3
3 5 4 2 5
VRSM VRRM Type 2 4
VDSM VDRM
V V
2100 2000 MCO 600-20io1
2300 2200 MCO 600-22io1
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
748
Dimensions in mm (1 mm = 0.0394")
52
49
10
120
IRM
60 MCC94
MCC95
MCC72
MCC56
40
MCC44
MCC 60
MCC26
MCC19
20
0
0 2 4 6 8 10 A/s 12
-di/dt