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This case study demonstrates that Alloy 601 (UNS N06601) is susceptible to strain-age cracking. The
observation illustrates the potential importance of post weld heat treatment to the successful utilization of
this alloy in certain applications.
Henrik Stahl, Haldor Topsøe A/S, Lyngby, Denmark; Gaylord Smith, Special Metals Corporation, Huntington, WV, USA; and
Sophie Wastiaux, Air Liquide, Champigny-sur-Marne Cedex, France. Contact e-mail: gsmith@smcwv.com.
busted with air to form a flue gas of 1250 °C (2280 a crack was observed at one hairpin close to the outlet
°F). This flue gas flows into the reformer shell and header. The location is indicated on Fig. 1.
passes through the annular channel between the flue The crack was in the heat-affected zone of the
gas tube and the reformer tube to the flue gas outlet weld and had developed parallel to the weld (along
chamber. The gas leaves the reformer through the the fusion line). The crack appeared to be brittle. A
flue gas outlet nozzle. micrograph of the crack (Fig. 4) shows the typical
The feed gas flows through the inlet gas nozzle at intergranular crack morphology.
the top of the reformer shell and is then distributed The material used to construct the outlet manifold
through a manifold system to the inlet hole at the system is Alloy 601. This alloy was selected because
top of each reformer tube. The characteristic lay- the reformed gas has a high carbon potential. When
out of an HTCR tube is shown in Fig. 2. The gas the reformed gas is cooled from 900 to 600 °C (1650
flows from the top of the reformer down through to 1110 °F) in the bayonet tube and is flowing
the catalyst to the bottom end of the reformer tube through the outlet manifold system, there is a severe
and returns through the bayonet tube to the top end risk of metal dusting corrosion. Alloy 601 is con-
where the reformed gas exits via a 90° bend through sidered one of the materials most resistant to this
the reformer tube wall, the outlet manifold system, failure process.
and the gas outlet nozzle.
The crack resulted from a kind of the so-called
strain-age or stress relaxation cracking. This had not
Cracks
previously been reported for an application of Alloy
Two skid-mounted hydrogen production units, 601. However, the subsequent investigations showed
each with a capacity of 5000 nm3/h, were installed that Alloy 601 at a temperature between 600 and
in Belgium. A picture of this plant is shown in Fig. 650 °C (1110 and 1200 °F) will develop carbon
3. After the units had been in operation for one year, precipitation that over time (in this case, one year)
reduces the ductility of the material in hot condition.
This change in microstructure could lead to stress
relaxation cracking.
Fig. 2 Layout of HTCR tube Fig. 3 Skid-mounted hydrogen production units, Belgium
Conclusion
Metal dusting can cause a significant amount of
expensive damage to ammonia, hydrogen, carbon
monoxide, and methanol plants. One of the means
of limiting this development has been to design the
equipment parts, considered subject to metal dusting
attack, with Alloy 601. This will typically mean parts
subjected to a reformed gas at 600 oC (1110 °F). The
risk of stress relaxation cracking of Alloy 601 at
exactly this temperature has not previously been
reported, but it must be considered a major risk that
Fig. 4 Typical intergranular crack must be dealt with in the design phase.
The means of avoiding or minimizing the risk of • Include proper heat treatment of the reactor and
cracks could be one or more of the following: downstream equipment that operates in this
• Arrange the process design to avoid temperatures temperature range.
between 575 and 650 °C (1065 and 1200 °F).
• Select a material that has a good resistance against Reference
metal dusting and does not develop the precipi- 1. J.C. Van Wortel: Technical Research Centre of Finland,
tation that causes stress relaxation cracking, such BALTICA IV: Plant Maintenance for Managing Life &
as Inconel 690. Performance, Vol. 2 (Finland), Sept. 1998, pp. 637-647.
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ISTFA 2001
th
27 International Symposium for Testing and Failure Analysis
11-15 November 2001 • Santa Clara, California, USA
Sponsored by the ASM Electronic Device Failure Analysis Society (EDFAS)
ISTFA solicits original, previously unpublished papers on a wide range of Testing and Failure Analysis topics of practical value
to anyone working to detect, understand and eliminate electronic device failures. Non-commercial papers from equipment vendors
dealing with new or unique tools and methodologies, applications and results are welcome. Papers will be selected for inclusion in
the technical program on the basis of appropriateness and quality of data, technical importance, novelty/originality, and interpretation
of results. Paper acceptance is based entirely on the information included in the abstract.
We are currently seeking papers on (but not limited to) the following relevant topics:
• Advanced Fault Localization Techniques • Sample Preparation and Deprocessing Methods
• Discrete/Passive Component Failure Analysis • Testing and Device Characterization
• Backside and Flip-Chip Analysis Techniques • Micro-Electro Mechanical Systems (MEMS)
• Defect Characterization Methods • Case Histories
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• Compound Semiconductor Devices • Signature Analysis