Tutorials On Electronic Assembly -SMT, Nano Technology, Smd

Components
Electronic Assembly

Surface Mount Assembly and Rework

The article covers a wide range of topics including hand soldering, machine soldering, and rework. It
also delves into various types of solders, fluxes, and cleaning compounds used in Surface Mount
Assembly manufacturing. Finally, ESD (Electrostatic Discharge) precautions that need to be taken
while working with sensitive components are also provided.

Reliability Enhancement of Electronic Assemblies

The article describes as to how to improve the reliability of electronic assemblies used in commercial
and industrial applications using accelerated stress tests. Particularly, Environmental Stress
Screening (ESS), a popular way of screening electronic assemblies and products has been described.
The basic idea is to subject the units under test (UUTs) to accelerated environmental conditions such
as temperature, humidity, vibration, etc.

Surface Mound Devices – Passive, and Active Components

Brief: The tutorial provides a review of SMD (Surface Mount Devices) components including passive
components, active components, and ICs. SMDs differ from conventional components that the later
use through-hole technology to solder the components whereas SMDs, as the name implies,
soldering is done on the surface of the PCBs itself. One biggest advantage of SMDs is that they allow
for higher density of components allowing smaller footprints. SMD PCAs are widely used in LAPTOPs,
Mobiles, and PDAs. The ICs such as QFP, BGA, SOIC have been discussed.

Introduction to Nano Technology

Convert web pages and HTML files to PDF in your applications with the Pdfcrowd HTML to PDF API Printed with Pdfcrowd.com