Heat and Mass Transfer SI Edition 2nd Edition Rolle Solutions Manual

Heat and Mass Transfer SI Edition 2nd

Edition Rolle Solutions Manual
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Heat and Mass Transfer SI Edition 2nd Edition Rolle Solutions Manual

Heat and Mass Transfer, SI Edition

Solutions Manual
Second Edition

This solutions manual sets down the answers and solutions for the Discussion Questions, Class
Quiz Questions, and Practice Problems. There will likely be variations of answers to the
discussion questions as well as the class quiz questions. For the practice problems there will
likely be some divergence of solutions, depending on the interpretation of the processes,
material behaviors, and rigor in the mathematics. It is the author’s responsibility to provide
accurate and clear answers. If you find errors please let the author know of them at
<rolle@uwplatt.edu>.

Chapter 2
Discussion Questions

Section 2-1

1. Describe the physical significance of thermal conductivity.

Thermal conductivity is a parameter or coefficient used to quantitatively
describe the amount of conduction heat transfer occurring across a unit area of
a bounding surface, driven by a temperature gradient.
2. Why is thermal conductivity affected by temperature?
Conduction heat transfer seems to be the mechanism of energy transfer
between adjacent molecules or atoms and the effectiveness of these transfers is
strongly dependent on the temperatures. Thus, to quantify conduction heat
transfer with thermal conductivity means that thermal conductivity is strongly
affected by temperature.
3. Why is thermal conductivity not affected to a significant extent by material density?
Thermal conductivity seems to not be strongly dependent on the material
density since thermal conductivity is an index of heat or energy transfer
between adjacent molecules and while the distance separating these molecules
is dependent on density, it is not strongly so.

Section 2-2

4. Why is heat of vaporization, heat of fusion, and heat of sublimation accounted as energy
generation in the usual derivation of energy balance equations?
Heats of vaporization, fusion, and sublimation are energy measures accounting
for phase changes and not directly to temperature or pressure changes. It is

19
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 convenient, therefore, to account these phase change energies as lumped
terms, or energy generation.

Section 2-3

5. Why are heat transfers and electrical conduction similar?

Heat transfer and electrical conduction both are viewed as exchanges of
energy between adjacent moles or atoms, so that they are similar.
6. Describe the difference among thermal resistance, thermal conductivity, thermal
resistivity, and R-Values.
Thermal Resistance is the distance over which conduction heat transfer occurs
times the inverse of the area across which conduction occurs and the thermal
conductivity, and thermal resistivity is the distance over which conduction
occurs times the inverse of the thermal conductivity. The R-Value is the same as
thermal resistivity, with the stipulation that in countries using the English unit
system, 1 R-Value is 1 hr∙ft2 ∙0F per Btu.

Section 2-4

7. Why do solutions for temperature distributions in heat conduction problems need to

converge?
Converge is a mathematical term used to describe the situation where an
answer approaches a unique, particular value.
8. Why is the heat conduction in a fin not able to be determined for the case where the
base temperature is constant, as in Figure 2-9?
The fin is an extension of a surface and at the edges where the fin surface
coincides with the base, it is possible that two different temperatures can be
ascribed at the intersection, which means there is no way to determine
precisely what that temperature is. Conduction heat transfer can then not be
completely determined at the base.
9. What is meant by an isotherm?
An isotherm is a line or surface of constant or the same temperature.
10. What is meant by a heat flow line?
A heat flow line is a path of conduction heat transfer. Conduction cannot cross a
heat flow line.

Section 2-5

11. What is a shape factor?

The shape factor is an approximate, or exact, incorporating the area, heat flow
paths, isotherms, and any geometric shapes that can be used to quantify
conduction heat flow between two isothermal surfaces through a heat
conducting media. The product of the shape factor, thermal conductivity, and
temperature difference of the two surfaces predicts the heat flow.

20
© 2016 Cengage Learning®. May not be scanned, copied or duplicated, or posted to a publicly accessible website, in whole or in part.
 12. Why should isotherms and heat flow lines be orthogonal or perpendicular to each
other?
Heat flow occurs because of a temperature difference and isotherms have no
temperature difference. Thus heat cannot flow along isotherms, but must be
perpendicular or orthogonal to isotherms.

Section 2-6

13. Can you identify a physical situation when the partial derivatives from the left and right
(see Equations 2-85 and 2-86) are not the same?
Often at a boundary between two different conduction materials the left and
the right gradients could be different. Another situation could be if radiation or
convection heat transfer occurs at a boundary and then again the left and right
gradients or derivatives could be different.

Section 2-7

14. Can you explain when fins may not be advantageous in increasing the heat transfer at a
surface?
Fins may not be a good solution to situations where a highly corrosive,
extremely turbulent, or fluid having many suspended particles is in contact with
the surface.
15. Why should thermal contact resistance be of concern to an engineer?
Thermal contact resistance inhibits good heat transfer, can mean a significant
change in temperature at a surface of conduction heat transfer, and can provide
a surface for potential corrosion.

Class Quiz Questions

1. What is the purpose of the negative sign in Fourier’s law of conduction heat transfer?
The negative sign provides for assigning a positive heat transfer for negative
temperature gradients.
2. If a particular 20-cm thick material has a thermal conductivity of 17 W/ m∙K, what is its
R-value?

ℎ
The R-value is the thickness times the inverse thermal conductivity;

−  = = (20 × 10 )/(17 W/ ∙ ) = 0.012 m ∙ K/W


3. What is the thermal resistance of a 10-m2 insulation board, 30 cm thick, and having
thermal conductivity of 0.03 W/m∙K?
The thermal resistance is
∆x / A ⋅ κ = ( 0.3m ) / (10m 2 ) ( 0.03W / m ⋅ K ) = 1.0 K / W

21
© 2016 Cengage Learning®. May not be scanned, copied or duplicated, or posted to a publicly accessible website, in whole or in part.
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