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IDU ODU
项目 XMC-2 XMC-2H XMC-3 XMC-3W XMC-3H XMC-5D
尺寸 (宽×深×高,mm) ≤ 228 x 228 x 75 228 x 228 x 91 ≤ 195 x 195 x 43.5 ≤ 195 x 195 x 70 210 x 210 x 49.5 210 x 210 x 82
E1, STM-1 (o/e), FE (o/e), E1, STM-1 (o/e), FE (o/e), E1, T1, STM-1 (o/e), E1, STM-1 (o/e), STM-4 (o), E1, STM-1 (o/e), STM-4 (o), 频率稳定度 (ppm) ±5 ±5 ±5 ±5 ±5 ±5
业务接口类型
GE (o/e) GE (o/e), 10GE (o) FE (o/e), GE (o/e), 10GE (o) FE (o/e), GE (o/e), 10GE (o) FE (o/e), GE (o/e), 10GE (o) XMC-3 ODU
中频接口数 1 1 1 1 1 2
频段 (GHz) 6–42 6–42 6–42 6–42 5/L6/U6/7/8/11(分体式LH)L6/U6/7/8/11(一体式LH)
N+0 (N ≤ 10), Nx(1+0) (N ≤ 10), N+0 (N ≤ 10), Nx(1+0) (N ≤ 10), N+0 (N ≤ 22), Nx(1+0) (N ≤ 22),
N+0 (N ≤ 6), Nx(1+0) (N ≤ 6), N+0 (N ≤ 16), N+1 (N ≤ 11),
射频配置方式 1+1, N+1 (N ≤ 7), XPIC, 2CA, 1+1, N+1 (N ≤ 7), XPIC, 2CA, 1+1, N+1 (N ≤ 7),
1+1, N+1 (N ≤ 5), XPIC 1+1 FD, XPIC
4 x 4 MIMO 4 x 4 MIMO XPIC, 2CA, 4 x 4 MIMO
微波类型 一体化IP, SDH 一体化IP, SDH, PDH 一体化IP, SDH 一体化IP, SDH, PDH 一体化IP, SDH
1+1, XPIC, PLA\EPLA\EPLA+, 1+1, XPIC, PLA\EPLA\EPLA+, 1+1, XPIC, PLA\EPLA, AM,
1+1, XPIC, PLA\EPLA\EPLA+, 1+1, XPIC, PLA\EPLA, AM, TDM,
关键特性 AM, TDM, PWE3/MPLS, AM, TDM, PWE3/MPLS, TDM, PWE3/MPLS, L3VPN,
AM, TDM, PWE3/MPLS, N+1 PWE3/MPLS, L3VPN, N+1, 空间分集和中频合成
L3VPN, SDB, N+1, CA, MIMO L3VPN, SDB, N+1, CA, MIMO SDB, N+1, CA, MIMO
RFU
项目 RTN 905 1E RTN 905 2E 项目 规格
RTN 905 2F RTN 905s
产品定位 接入层 接入层 接入层 接入层 尺寸 (宽×深×高,mm) 228 x 91 x 228
尺寸 (宽×深×高,mm) 442 x 220 x 44 442 x 220 x 44 442 x 220 x 44 442 x 220 x 44 重量 (kg) ≤ 5.5
高度 1U 1U 1U 1U ≤ 50 (6/7/8/11 GHz)
RFU-SD功耗 (W)
≤ 57 (5 GHz)
方向数 1 2 2 1
E1, STM-1 (o/e), E1, STM-1 (o/e), E1, STM-1 (o/e), FE (o/e), GE (o/e), RFU-NonSD功耗 (W) ≤ 45 (6/7/8/11 GHz)
业务接口类型 FE (o/e), GE (o/e) RFU (6/7/8/11 GHz) L型适配器
≤ 52 (5 GHz)
FE (o/e), GE (o/e) FE (o/e), GE (o/e) 2.5GE (o),10GE (o)
频段 (GHz) 6–42 6–42 6-42 7-38 频段 (GHz) 5/L6/U6/7/8/11
1+1, XPIC, PLA/EPLA, AM, 1+1, XPIC, PLA/EPLA, AM, 1+1, XPIC,CA, PLA/EPLA, 频率稳定率 (ppm) 重量 (kg) < 18.5 < 16 ≤ 25
关键特性 AM, ATPC ±5
TDM, PWE3/MPLS, L3VPN TDM, PWE3/MPLS, L3VPN SDB, AM, MIMO