Professional Documents
Culture Documents
• UEs
– FDD chipsets and UEs
– TDD chipsets and UEs
• RF scanners
• Drive test logging tools and supported UEs
• Drive test post-processing tools
Intra-freq HO,Inter-freq
Hisilicon E2701S 10 / 20 38 / 40 1/2 5/7 3 1/2/3/4/7 HO Availability
Qualcomm 9600 10 / 20 38 / 40 1/2 5/7 3 1/2/3/7 Intra-freq HO Apply for 2.3G regression
Samsung 10 / 20 38 / 40 1/2 5/7 2 1/2/3 Intra-freq HO Verify new platform with FPGA
Altair 7210 10 / 20 38/40/41 1/2 5/7 3 1/2/3/4 Intra-freq HO Lab test ongoing
Intra-freq HO,Inter-freq
ZTE(own) MF820T 10 / 20 38 / 40 1/2 5/7 3 1/2/3/4/7 HO MIIT lab test ongoing
ZTE
(Qualcom) 9200 10 / 20 38 / 40 1/2 5/7 3 1/2/3 Intra-freq HO
Intra-freq HO
Quanta 10/20 38/40/41 1/2 5/7 3 1/2/3/
Gemtek
(Sequans) 10/20 38/40 1/2 5/7 3 1/2/3/4 Intra-freq HO For Sky Brazil, no BF yet
ST-E
Soc Classification level
7 © Nokia Siemens Networks
IODT UE capability (RL15), Nov 2011 status
Lab (cable connected) Lab (OTA) Field
UE Throughput Latency Throughput Latency Throughput Latency
UL:15M / DL:62M MIIT outdoor
(20M bandwidth,1:7,TM3) UL:15M / DL:60M
UL:7M / DL:83M (20M bandwidth,1:7,TM3)
Hisilicon (20M bandwidth,2:7,TM3)
CMCC large scale
UL: 15M / DL: 52M UL:15M / DL:30M
Innofidei (20M bandwidth,1:7,TM3) (20M bandwidth,1:7,TM3)
UL:15M / DL:60M
Qualcomm (20M bandwidth,1:7,TM3)
India trial
UL:15M / DL:59M Cplane:223ms UL:15M / DL:50M
Sequans (20M bandwidth,1:7,TM3) Uplane:23ms (20M bandwidth,1:7,TM3)
Quanta
Gemtek UL:14M / DL:59.4M
(Sequans) (20M bandwidth,1:7,TM3)
ST-E
Soc Classification level
8 © Nokia Siemens Networks
Aeroflex TM500 R&D test terminal TDD + FDD,
Cat4 + beamforming etc advanced support
0.9
huawei
0.8 zte
samsung
0.7
0.6
empirical cdf
0.5
0.4
0.3
0.2
0.1
0
-25 -20 -15 -10 -5 0 5 10 15 20 25
UE Tx Power [dBm]
0.9 huawei
zte
0.8 samsung
0.7
0.6
empirical cdf
0.5
0.4
0.3
0.2
0.1
0
-120 -115 -110 -105 -100 -95 -90 -85 -80 -75 -70
RSRP [dBm]
0.9
huawei
0.8 zte
samsung
0.7
0.6
empirical cdf
0.5
0.4
0.3
0.2
0.1
0
10 20 30 40 50 60 70 80 90 100
PHY tput [Mbits per sec]
• tput differs even between ZTE and Huawei (both use QC chip)
• Message: Performance difference between UEs can be
considerable!! At least two different UE chipsets should be used.
Soc Classification level
13 © Nokia Siemens Networks Presentation / Author / Date
Summary from another UE comparison – South
Korea
• The drive testing for DL throughput was carried out with both LG dongle
[LGE chipset] and Samsung Galaxy SII [Qualcomm chipset] mobile at the
same time in order to evaluate individual UE performance.
• As a result, the LG dongle had 14 dropped calls and Samsung mobile
had none during the drive.
• The following difference in UE performance was observed:
• The receiver sensitivity of LG dongle is a bit better (~4 dB) in average than Samsung
mobile
• The average UE uplink power for PUSCH, PUCCH and RACH transmission is 7 dB, 5.5
dB and 1 dB, respectively, higher with Samsung mobile compared to LG dongle.
• The ACK/NACK response for each PUSCH transmission carried on PHICH indicates
higher number of NACKs (10% rate) in average with LG dongle compared to Samsung
mobile.
• UEs
– FDD chipsets and UEs
– TDD chipsets and UEs
• RF scanners
• Drive test logging tools and supported UEs
• Drive test post-processing tools
To laptop USB
Rx antenna
(N-male)
GPS antenna
(SMA-male)
Soc Classification level
16 © Nokia Siemens Networks
Scanners, PCTEL EX / MX
• UEs
– FDD chipsets and UEs
– TDD chipsets and UEs
• RF scanners
• Drive test logging tools and supported UEs
• Drive test post-processing tools
• UEs
– FDD chipsets and UEs
– TDD chipsets and UEs
• RF scanners
• Drive test logging tools and supported UEs
• Drive test post-processing tools