RT8057

®
RT8057
2.25MHz 1A Synchronous Step-Down Converter

General Description Features
The RT8057 is a high efficiency Pulse-Width-Modulated  2.7V to 5.5V Wide Input Operation Range
(PWM) step-down DC/DC converter, capable of delivering  2.25MHz Fixed-Frequency PWM Operation
1A output current over a wide input voltage range from 2.7V  Up to 1A Output Current
to 5.5V. The RT8057 is ideally suited for portable electronic  Up to 90% Efficiency
devices that are powered from 1-cell Li-ion battery or from  0.6V Reference Allows Low Output Voltage
other power sources such as cellular phones, PDAs, hand-  Internal Soft-Start
held devices, game console and related accessories.  No Schottky Diode Required
 Internal Compensation to Reduce External
The internal synchronous rectifier with low R DS(ON)
Components
dramatically reduces conduction loss at PWM mode.
 Low Dropout Operation : 100% Duty Cycle
No external Schottky diode is required in practical
 RoHS Compliant and Halogen Free
applications. The RT8057 enters Low Dropout Mode when
normal Pulse -Width Mode cannot provide regulated output
Applications
voltage by continuously turning on the upper P-MOSFET.
 Portable Instruments
The RT8057 enters shut-down mode and consumes less
 Game Console and Accessories
than 1μA when the EN pin is pulled low. The switching
 Microprocessors and DSP Core Supplies
ripple is easily smoothed-out by small package filtering
 Cellular Phones
elements due to a fixed operating frequency of 2.25MHz.
 Wireless and DSL Modems
The RT8057 is available in a small WDFN-6SL 2x2 package.
 PC Cards
Ordering Information Pin Configurations

RT8057 (2) (TOP VIEW)
Taping Type ( Pin1 at Q2)
LX 1 6 GND
GND
Package Type NC 2 5 VIN

QW : WDFN-6SL 2x2 (W-Type) FB 3 7 4 EN
Lead Plating System
G : Green (Halogen Free and Pb Free) WDFN-6SL 2x2
Note :
Richtek products are :
Marking Information
J7 : Product Code
 RoHS compliant and compatible with the current require-
J7W W : Date Code
ments of IPC/JEDEC J-STD-020.
 Suitable for use in SnPb or Pb-free soldering processes.
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
DS8057-04 February 2014 www.richtek.com

1
RT8057
Typical Application Circuit
RT8057 L1
2.2µH
VIN 5 1 VOUT
VIN LX
2.3V
CIN 4 EN COUT
4.7µF C1 R1 10µF
10pF 680k
3
FB
6, 7 (Exposed Pad)
GND R2
240k
Function Pin Description

Pin No. Pin Name Pin Function
1 LX Switch Node. Connect to the external inductor.
2 NC No Internal Connection. Connect to GND.
3 FB Feedback Pin. Connect to the external resistor divider.
4 EN Chip Enable (Active High).
5 VIN Power Input. Connect to the input capacitor.
6, Power GND. The Exposed Pad must be soldered to a large PCB and connected
GND
7 (Exposed Pad) to GND for maximum power dissipation.
Function Block Diagram

EN VIN
RS1
OSC &
Current
Shutdown
Limit
Control
Detector
Slope
Compensation
Current
Sense
Error Control
Amplifier Driver LX
FB Logic
PWM
RC Comparator
RS2
COMP UVLO &
Power Good GND
Detector VREF
www.richtek.com DS8057-04 February 2014

2
RT8057
Absolute Maximum Ratings (Note 1)
 Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------ 6.5V
 Power Dissipation, PD @ TA = 25°C
WDFN-6SL 2x2 ------------------------------------------------------------------------------------------------------------ 0.606W
 Package Thermal Resistance (Note 2)
WDFN-6SL 2x2, θJA ------------------------------------------------------------------------------------------------------- 165°C/W
WDFN-6SL 2x2, θJC ------------------------------------------------------------------------------------------------------ 8.2°C/W
 Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
 Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
 Storage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C
 ESD Susceptibility (Note 3)
HBM -------------------------------------------------------------------------------------------------------------------------- 2kV
MM ---------------------------------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions (Note 4)

 Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------ 2.7V to 5.5V
 Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
 Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 3.6V, TA = 25°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Output Current IOUT VIN = 2.7V to 5.5V -- -- 1 A
Quiescent Current IQ IOUT = 0mA -- 81 -- A
2 -- 2
Reference Voltage (0.6V) VREF %
Note 5 2.5 -- 2.5
VIN Rising 2 2.2 2.4 V
Under Voltage Lockout Threshold VUVLO
Hysteresis -- 0.2 -- V
Shutdown Current ISHDN -- 0.1 1 A
Switching Frequency -- 2.25 -- MHz
EN Threshold Logic-High VIH 1 -- VIN V

Voltage Logic-Low VIL -- -- 0.4 V
Thermal Shutdown Temperature TSD -- 150 -- °C
Switch On High Side RDS(ON)_H ISW = 0.2A -- 250 -- m
Resistance Low Side RDS(ON)_L ISW = 0.2A -- 200 -- m
Peak Current Limit ILIM 1.1 1.5 2 A
Output Voltage Line Regulation VIN = 2.7V to 5.5V -- -- 1 %/V
Output Voltage Load Regulation 0mA < IOUT < 0.6A -- -- 1 %
Start-Up Time tss Guaranteed by Design 200 300 400 s

3
RT8057
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
Note 2. θJA is measured in natural convection at TA = 25°C on a low-effective thermal conductivity test board of JEDEC 51-3 thermal
measurement standard. The measurement case position of θJC is on the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The reference voltage accuracy is ±2.5% at recommended ambient temperature range, guaranteed by design.

4
RT8057
Typical Operating Characteristics
Efficiency vs. Output Current Output Voltage vs. Input Voltage
100 2.38
90 VIN = 5V
2.36
80 VIN = 3.3V
2.34
Output Voltage (V)

70
Efficiency (%)
2.32
60
50 2.30
40 2.28
30
2.26
20
10 2.24
VOUT = 2.3V VOUT = 2.3V, IOUT = 0A
0 2.22
0.0 0.2 0.4 0.6 0.8 1.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Current (A) Input Voltage (V)
Frequency vs. Input Voltage Frequency vs. Temperature

2.40 2.30
2.35 2.25
VIN = 3.3V
2.30 2.20
Frequency (MHz)1
Frequency (MHz)1
2.25 2.15 VIN = 5V
2.20 2.10
2.15 2.05
2.10 2.00
2.05 VIN = 5V, VOUT = 2.3V, 1.95

IOUT = 0.2A VOUT = 2.3V, IOUT = 0.2A
2.00 1.90
2.5 3.0 3.5 4.0 4.5 5.0 5.5 -50 -25 0 25 50 75 100 125
Input Voltage (V) Temperature (°C)
Output Current Limit vs. Input Voltage Output Current Limit vs. Temperature
1.6 1.6
1.5 1.5
Output Current Limit (A)
Output Current limit (A)
1.4 1.4
1.3 1.3
1.2 1.2
1.1 1.1
VOUT = 2.3V VIN = 5V, VOUT = 2.3V

1.0 1.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 -50 -25 0 25 50 75 100 125
Input Voltage (V) Temperature (°C)

5
RT8057
Output Voltage vs. Temperature Reference Voltage vs. Temperature

2.35 0.608
2.34 0.606
Reference Voltage (V)

2.33
0.604
Output Voltage (V)
2.32
0.602
2.31
2.30 0.600
2.29 0.598
2.28
0.596
2.27
2.26 VIN = 5V, VOUT = 2.3V, 0.594
IOUT = 0A VIN = 5V, VOUT = 2.3V
2.25 0.592
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
Output Ripple Output Ripple
VLX VLX
(5V/Div) (5V/Div)
VOUT
(5mV/Div)
VOUT
(5mV/Div)
VIN = 3.3V, VOUT = 2.3V,
VIN = 5V, VOUT = 2.3V, IOUT = 1A IOUT = 1A
Time (250ns/Div) Time (250ns/Div)
Load Transient Response Load Transient Response
VOUT VOUT
(100mV/Div) (100mV/Div)
IOUT IOUT
(500mA/Div) (500mA/Div)
VIN = 5V, VOUT = 2.3V, VIN = 5V, VOUT = 2.3V,
IOUT = 0A to 1A IOUT = 0.4A to 1A
Time (100μs/Div) Time (100μs/Div)

6
RT8057
Power On from EN Power Off from EN

VIN = 5V, VOUT = 2.3V,
IOUT = 1A
VEN VEN
(2V/Div) (2V/Div)
VOUT VOUT
(2V/Div) (2V/Div)
IOUT IOUT
(500mA/Div) VIN = 5V, VOUT = 2.3V, (500mA/Div)
IOUT = 1A
Time (100μs/Div) Time (100μs/Div)
UVLO vs. Temperature En Threshold vs. Temperature

2.4 0.80
2.3 0.78
Turn On
Turn On
2.2 0.76
EN Threshold (V)
0.74
2.1
UVLO (V)
0.72
2.0 Turn Off
0.70
1.9
0.68
1.8
0.66
Turn Off
1.7 0.64
1.6 0.62
VOUT = 2.3V VIN = 5V, VOUT = 2.3V
1.5 0.60
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
Output Voltage vs. Output Current

2.34
2.33
2.32
Output Voltage (V)
2.31
2.30
2.29
2.28
2.27
VIN = 5V, VOUT = 2.3V
2.26
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Output Current (A)

7
RT8057
Application Information
The basic RT8057 application circuit is shown in Typical Low Supply Operation
Application Circuit. External component selection is The RT8057 is designed to operate down to an input supply
determined by the maximum load current and begins with voltage of 2.7V. One important consideration at low input
the selection of the inductor value and operating frequency supply voltages is that the RDS(ON) of the P-Channel and
followed by CIN and COUT. N-Channel power switches increases. The user should
calculate the power dissipation when the RT8057 is used
Output Voltage Setting
at 100% duty cycle with low input voltages to ensure that
The output voltage is set by an external resistive divider thermal limits are not exceeded.
according to the following equation :
R1 Under Voltage Protection (UVP)
VOUT  VREF x (1 )
R2 The output voltage can be continuously monitored for under
where VREF equals to 0.6V typical. The resistive divider voltage protection. When the output voltage is less than
allows the FB pin to sense a fraction of the output voltage 33% of its set voltage threshold after OCP occurs, the
as shown in Figure 1. under voltage protection circuit will be triggered to auto
VOUT re-soft-start.
R1 Input Voltage Over Voltage protection (VIN OVP)

FB
When the input voltage (VIN) is higher than 6V, VIN OVP
RT8057 R2 will be triggered and the IC stops switching. Once the
GND input voltage drops below 6V, the IC will return to normal
operation.
Figure 1. Setting the Output Voltage
Output Over Voltage Protection (VOUT OVP)
Soft-Start
When the output voltage exceeds more than 5% of the
The RT8057 contains an internal soft-start clamp that nominal reference voltage, the feedback loop forces the
gradually raises the clamp on the FB pin. internal switches off within 50μs. Therefore, the output
over voltage protection is automatically triggered by the
100% Duty Cycle Operation
loop.
When the input supply voltage decreases toward the output
voltage, the duty cycle increases toward the maximum Short Circuit Protection
on-time. Further reduction of the supply voltage forces When the output is shorted to ground, the inductor current
the main switch to remain on for more than one cycle, decays very slowly during a single switching cycle. A
eventually reaching 100% duty cycle. current runaway detector is used to monitor inductor
The output voltage will then be determined by the input current. As current increases beyond the control of current
voltage minus the voltage drop across the internal loop, switching cycles will be skipped to prevent current
P-MOSFET and the inductor. runaway from occurring.
Table 1. Inductors
Component
Series Inductance (H) DCR (m) Current Rating (mA) Dimensions (mm)
Supplier
NR4018
TAIYO YUDEN 2.2H 60 2700 4 X 4 X 1.8
T2R2M

8
RT8057
CIN and COUT Selection RMS current handling requirements. Dry tantalum, special
The input capacitance, C IN, is needed to filter the polymer, aluminum electrolytic and ceramic capacitors are
trapezoidal current at the source of the top MOSFET. To all available in surface mount packages. Special polymer
prevent large ripple voltage, a low ESR input capacitor capacitors offer very low ESR, but have lower capacitance
sized for the maximum RMS current should be used. RMS density than other types. Tantalum capacitors have the
current is given by : highest capacitance density, but it is important to only
use types that have been surge tested for use in switching
VOUT VIN
IRMS  IOUT(MAX) 1 power supplies. Aluminum electrolytic capacitors have
VIN VOUT
significantly higher ESR, but can be used in cost-sensitive
This formula has a maximum at VIN = 2VOUT, where IRMS = applications provided that consideration is given to ripple
IOUT/2. This simple worst case condition is commonly used current ratings and long term reliability. Ceramic capacitors
for design because even significant deviations do not result have excellent low ESR characteristics, but can have a
in much difference. Choose a capacitor rated at a higher high voltage coefficient and audible piezoelectric effects.
temperature than required. The high Q of ceramic capacitors with trace inductance
Several capacitors may also be paralleled to meet size or can also lead to significant ringing.
height requirements in the design.
Using Ceramic Input and Output Capacitors
The selection of COUT is determined by the effective series Higher value, lower cost ceramic capacitors are now
resistance (ESR) that is required to minimize voltage ripple becoming available in smaller case sizes. Their high ripple
and load step transients, as well as the amount of bulk current, high voltage rating and low ESR make them ideal
capacitance that is necessary to ensure that the control
for switching regulator applications. However, care must
loop is stable. Loop stability can be checked by viewing
be taken when these capacitors are used at the input and
the load transient response. The output ripple, ΔVOUT, is
output. When a ceramic capacitor is used at the input
determined by :
and the power is supplied by a wall adapter through long
 1 
VOUT  IL ESR   wires, a load step at the output can induce ringing at the
 8fCOUT 
input, VIN. At best, this ringing can couple to the output
The output ripple is highest at maximum input voltage and be mistaken as loop instability. At worst, a sudden
since ΔIL increases with input voltage. Multiple capacitors inrush of current through the long wires can potentially
placed in parallel may be needed to meet the ESR and cause a voltage spike at VIN large enough to damage the
part.
Table 2. Capacitors for CIN and COUT

Component Supplier Part No. Capacitance (F) Case Size
MuRata GRM31CR71A475KA01 4.7F 1206
MuRata GRM31CR71A106KA01 10F 1206

9
RT8057
Thermal Considerations Layout Considerations
For continuous operation, do not exceed absolute Follow the PCB layout guidelines for optimal performance
maximum junction temperature. The maximum power of the RT8057.
dissipation depends on the thermal resistance of the IC  Connect the terminal of the input capacitor(s), CIN, as
package, PCB layout, rate of surrounding airflow, and close as possible to the VIN pin. This capacitor provides
difference between junction and ambient temperature. The the AC current into the internal power MOSFETs.
maximum power dissipation can be calculated by the
 LX node experiences high frequency voltage swing and
following formula :
should be kept within a small area. Keep all sensitive
PD(MAX) = (TJ(MAX) − TA) / θJA small-signal nodes away from the LX node to prevent
where TJ(MAX) is the maximum junction temperature, TA is stray capacitive noise pick up.
the ambient temperature, and θJA is the junction to ambient  Flood all unused areas on all layers with copper. Flooding
thermal resistance. with copper will reduce the temperature rise of power
For recommended operating condition specifications of components. Connect the copper areas to any DC net
the RT8057, the maximum junction temperature is 125°C (VIN, VOUT, GND, or any other DC rail in the system).
and TA is the ambient temperature. The junction to ambient  Connect the FB pin directly to the feedback resistors.
thermal resistance, θ JA , is layout dependent. For The resistive voltage divider must be connected between
WDFN-6SL 2x2 packages, the thermal resistance, θJA, is VOUT and GND.
165°C/W on a standard JEDEC 51-3 single-layer thermal
test board. The maximum power dissipation at TA = 25°C LX should be connected to inductor by
wide and short trace. Keep sensitive
can be calculated by the following formula :
components away from this trace.
PD(MAX) = (125°C − 25°C) / (165°C/W) = 0.606W for COUT
VOUT
WDFN-6SL 2x2 package
L1
The maximum power dissipation depends on the operating LX 1 6 GND
GND
CIN
ambient temperature for fixed T J(MAX) and thermal NC 2 5 VIN
resistance, θJA. For the RT8057 package, the derating C1 FB 3 7 4 EN
VOUT
curve in Figure 2 allows the designer to see the effect of Input capacitor must
R1 R2
be placed as close to
rising ambient temperature on the maximum power
the IC as possible.
dissipation.
Figure 3. PCB Layout Guide
0.65
Maximum Power Dissipation (W)1
Single-Layer PCB
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0 25 50 75 100 125
Ambient Temperature (°C)
Figure 2. Derating Curve for the RT8057 Package


10
RT8057
Outline Dimension
D D2
E E2
SEE DETAIL A
1
2 1 2 1
e
b
A DETAIL A
A3 Pin #1 ID and Tie Bar Mark Options
A1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.200 0.350 0.008 0.014
D 1.900 2.100 0.075 0.083
D2 1.550 1.650 0.061 0.065
E 1.900 2.100 0.075 0.083
E2 0.950 1.050 0.037 0.041
e 0.650 0.026
L 0.200 0.300 0.008 0.012
W-Type 6SL DFN 2x2 Package
Richtek Technology Corporation

14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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®

2.25MHz 1A Synchronous Step-Down Converter

Ordering Information Pin Configurations

Package Type NC 2 5 VIN

DS8057-04 February 2014 www.richtek.com

Function Pin Description

Function Block Diagram

www.richtek.com DS8057-04 February 2014

Recommended Operating Conditions (Note 4)

EN Threshold Logic-High VIH 1 -- VIN V

DS8057-04 February 2014 www.richtek.com

www.richtek.com DS8057-04 February 2014

Output Voltage (V)

Frequency vs. Input Voltage Frequency vs. Temperature

2.25 2.15 VIN = 5V

2.05 VIN = 5V, VOUT = 2.3V, 1.95

VOUT = 2.3V VIN = 5V, VOUT = 2.3V

DS8057-04 February 2014 www.richtek.com

Output Voltage vs. Temperature Reference Voltage vs. Temperature

Reference Voltage (V)

Output Ripple Output Ripple

Time (250ns/Div) Time (250ns/Div)

Load Transient Response Load Transient Response

Time (100μs/Div) Time (100μs/Div)

www.richtek.com DS8057-04 February 2014

Power On from EN Power Off from EN

Time (100μs/Div) Time (100μs/Div)

UVLO vs. Temperature En Threshold vs. Temperature

Output Voltage vs. Output Current

DS8057-04 February 2014 www.richtek.com

R1 Input Voltage Over Voltage protection (VIN OVP)

www.richtek.com DS8057-04 February 2014

Table 2. Capacitors for CIN and COUT

DS8057-04 February 2014 www.richtek.com

Figure 2. Derating Curve for the RT8057 Package

www.richtek.com DS8057-04 February 2014

Dimensions In Millimeters Dimensions In Inches

W-Type 6SL DFN 2x2 Package

Richtek Technology Corporation

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