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UV cameras for Semiconductor Microchip

Manufacturing Applications
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WHITE PAPER UV cameras for Semiconductor Microchip
Manufacturing Applications

1 Introduction

The semiconductor-based electronics industry demands high-quality and reliable

microchips for use in a wide range of products we use daily, and any inconsistency
or defect in the chip manufacturing process can have serious consequences. To
maintain the highest production standards, semiconductor manufacturers rely on
various quality control tools, including inspection systems with ultraviolet (UV)
cameras. Cameras with UV image sensors leverage how surface features diffuse
reflected UV wavelengths. These UV images provide visual information for
detecting minute surface defects and inconsistencies that other inspection
methods may miss.
This white paper explains how the semiconductor industry leverages UV camera
technology for various inspection applications during manufacturing. We also
discuss key factors to consider when selecting a UV camera for these applications.

2 A closer look at ultraviolet light in the

electromagnetic spectrum

UV cameras utilize imaging technology that captures images using UV light in the
190 to 400 nm wavelength range. Unlike visible light, UV light has a shorter
wavelength, and its diffuse reflection from a surface reveals irregularities
(typically 30 nm or less) that are undetectable at larger wavelengths. This allows
UV imaging to detect microscopic surface features, such as imperfections and
defects, that are invisible to the human eye.
UV light’s absorption, transmittance, and reflectance vary for different materials,
making it helpful in identifying and inspecting specific components or defects. In
addition, UV cameras have bandpass filters and optics that are purpose-built for
UV wavelengths, using specialized materials like quartz glass to achieve
exceptional transmittance and resolution that enhance their ability to capture
precise details.

The place of ultraviolet in the electromagnetic spectrum

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WHITE PAPER 3 Applications of semiconductor manufacturing
inspection systems with UV industrial cameras
These days, microchips contain billions of transistors packed into ever smaller
dimensions which is possible with lithography machines that etch the complex
circuitry connecting these using deep UV light created by excimer and diode lasers
in the 193nm – 365 nm wavelength range. Some extreme UV lithography
machines use light with wavelengths as low as 13 nm, but these are uncommon
for most mass-market microchip manufacturing.
Next, we explore several applications where UV cameras have proven effective in
identifying and detecting defects in microchip manufacturing using lithography
technology, improving product quality, increasing efficiency, and reducing costs.

Bare wafer inspection

Monocrystalline silicon is the starting material for semiconductor manufacturing.
It is artificially grown into a brick-shaped ingot and then thinly sliced into what are
known as bare wafers or substrate wafers. These bare wafers provide the
foundation for building the integrated circuits that drive electronic devices.

Silicon wafers for semiconductor microchip manufacturing

The inspection process examines the surface of silicon wafers for contamination or
defects, which can be very small, sometimes measuring only a few micrometers in size.

While bare wafers are usually inspected using visible (VIS) and shortwave infrared (SWIR)
wavelengths, the shorter UV wavelengths offer the highest accuracy for identifying
surface defects on the wafer.

A UV light source illuminates the bare wafer while UV cameras, alongside VIS and SWIR
cameras, capture high-resolution images of the wafer’s surface. These images are then
analyzed using advanced image processing algorithms to detect and classify any defects.

Several types of defects can be detected using UV cameras. These include particles
inadvertently introduced during manufacturing by the environment such as dust or
scratches caused by mishandling.

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Patterned wafer inspection
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Inspecting patterned wafers involves identifying and analyzing defects or errors in
the pattern transferred onto the wafer surface during lithography. These defects
may include surface-pattern imperfections, misalignments, or missing features.

Inspecting patterned wafers using UV light

During an inspection, UV light illuminates the wafer, which causes the pattern on
the surface of the wafer to reflect or absorb the light differently from the
surrounding material. UV cameras then capture images of the wafer surface,
which are analyzed to identify deviations in the reflected or absorbed UV light.
By analyzing the images captured by the UV camera, manufacturers can
determine the defects' size, shape, and location and take corrective action to
improve the yield and quality of the final product.

Photomask alignment
During the photomask alignment process of semiconductor manufacturing, a
pattern is transferred onto the wafer surface. UV light detects minute variations in
the reflected or absorbed UV light caused by a misalignment between the
photomask and the wafer surface. This critical process requires high-resolution
images of the illuminated photomask, which are captured and analyzed to adjust
the photomask alignment. A UV camera captures such images precisely, and the
resulting accurate pattern transfer ensures the production of high-quality
semiconductor devices.

Wafer bonding
This process joins two wafers (thin slices of a material) together to form a single
integrated structure. This process is widely used in the semiconductor industry to
manufacture microelectronic devices, such as sensors, LEDs, and microprocessors.
UV cameras monitor the bonding process and ensure that the wafers are correctly
aligned and bonded without defects or voids. Shining UV light on the wafers

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WHITE PAPER activates the adhesive and promotes surface activation during bonding, while UV
cameras visualize the bonding process in real time.

4 Factors to consider when selecting a UV camera for

semiconductor manufacturing applications
Choosing the right UV camera for semiconductor manufacturing applications
requires considering several factors essential to achieving reliable and precise
inspection results. These include quantum efficiency, resolution, dynamic range,
signal-to-noise ratio, lighting, and some customization options.

Quantum Efficiency
A camera’s quantum efficiency (QE) measures the number of electrons released
by a photoelectric cell when it absorbs photons of incident radiation. For UV
applications, the camera must be able to detect and generate a strong signal from
the slightest amount of incident UV light on the sensor surface. The efficiency of
this process is measured by QE, with higher numbers indicating more conversion
of incident UV photons into detectable electrons.
Machine vision applications categorize ultraviolet (UV) light into three bands:
UVA, UVB, and UVC. UVA encompasses the longest wavelength of the UV
spectrum, ranging between 320 and 400 nm, and is detectable by some visible
light cameras with limited sensitivity. UVB spans the range between 280 and 320
nm, which requires specialized UV cameras due to their higher sensitivity and
ability to detect finer details. Finally, UVC has the shortest wavelength of the
three, ranging between 100 and 280 nanometers.

The ultraviolet spectrum.

Today's UV cameras can detect light with a sensitivity range that begins around
190 nm. Additionally, within the UV range, they can achieve a QE of up to 50%,
allowing for efficient detection of UV light. JAI’s GO-8105M-5GE-UV camera
model offers remarkable ~40-50% quantum efficiency in the UVB and UVA
regions, with ample QE extending into the UVC range.

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Spectral response of JAI GO-8105M-5GE-UV camera

*Sensitivity extends below 200 nm, but specific Quantum Efficiency has not yet been measured.

This model provides an attractive alternative to more expensive scientific UV

cameras. It is important to note that while the camera’s spectral response also
spans the visible and near-infrared regions, a filter that blocks visible and near-
infrared light is recommended for UV imaging to optimise the camera’s parasitic
light sensitivity (PLS) regions.

This camera’s overall UV spectral response makes it useful in various

semiconductor inspection systems. For example, the camera is ideal for mask
inspection to ensure the even application of the photoresist agent on the
semiconductor before exposure. The short wavelengths used here reveal the
minutest surface features and identify defects.

Resolution and lens selection

A camera’s resolution determines the level of detail captured in an image. A
higher-resolution camera can detect minute defects and inconsistencies in
semiconductor materials. It is also essential to select a suitable lens optimized for
UV imaging to achieve optimal image quality. A high-quality lens with a high
transmission rate for UV wavelengths can reduce distortions, increase contrast,
and minimize aberrations, resulting in sharper and clearer images. By combining a
high-resolution camera with a suitable lens operated under a homogenous light
source, semiconductor manufacturers can improve their inspection process and
accurately detect defects.

Dynamic Range
Dynamic range refers to the ability of a camera to capture and differentiate
between different brightness levels in a scene without losing detail or
information. During semiconductor inspection, the inspected surface may contain

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WHITE PAPER features with varying brightness or contrast levels. For example, inspecting wafers
with a highly reflective surface can be challenging. A camera with a high dynamic
range will capture a broader range of brightness levels, preserving all the details
in the brightest and darkest areas. It allows surface defects, such as scratches or
contamination, to be detected and analyzed more accurately.
Similarly, using a camera with a high dynamic range enhances inspecting the
topography of a semiconductor surface. The camera captures the surface texture,
including any irregularities or bumps which reveal defects or inconsistencies.

Signal-to-Noise Ratio
The Signal-to-noise ratio (SNR) — the ratio of the amplitude of a signal to the
amplitude of the noise present in the signal — measures the signal quality. In the
context of UV cameras for semiconductor inspection, a high SNR is desirable as it
better detects subtle variations in the inspected surface.
In practical terms, a camera with a high SNR produces clearer images with less
noise, allowing for better detection of subtle variations in the inspected surface.

Lighting
Several factors influence the appropriate lighting required for UV cameras in
semiconductor inspection. First, the wavelength of the light used for illumination
should be within the sensitivity range of UV cameras. Depending on what stage of
the process is being inspected, this could be anwhere from around 365 nm all the
way down to 193 nm and could involve LEDs or laser light sources. Second, the
intensity of the lighting should be sufficient to illuminate the inspected area
without causing overexposure or underexposure. Additionally, the lighting should
be uniform across the entire field of view, with minimal heat generation, to avoid
damaging the semiconductor.
The spectral distribution of the lighting should be known and understood, as it
affects the contrast and color rendering of the images. Furthermore, the lighting
source should be stable and have a long lifetime to minimize the need for
frequent replacements or adjustments. Ensuring these will make the
semiconductor inspection processes accurate, efficient, and effective.

Customization
Conformal coating
When selecting UV cameras for applications with a conformal coating applied to
surfaces, one must consider the camera's compatibility with different coating
materials and application methods.
A customized coating may be needed to protect the UV camera from harsh

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chemicals during semiconductor manufacturing and vacuum operations. The
compatibility of the coating material with the camera’s surface and optical
properties must be kept in mind to avoid affecting the camera’s performance.
It is also necessary to consider the thickness and quality of the coating. The
thickness of the layer can affect the clarity of the camera’s optics, while a low-
quality coating can introduce imperfections that may affect the accuracy of the
camera.
Glassless option
UV cameras use glass filters to protect the sensor from environmental factors, but
these filters can introduce distortions, reflections, and absorption that affect the
accuracy of the camera. As a result, some applications require glassless UV
cameras to eliminate the potential for optical distortions and improve accuracy.
The GO-8105M-5GE-UV camera is available in a “glassless” configuration (GO-
8105M-5GE-UV-GL) with a removable cover glass over the sensor for use in laser
profiling and other applications where even UV-compatible quartz glass in the
optical path might prove problematic.
5 Conclusion
The use and impact of electronic devices in our daily lives require that these
perform flawlessly, which, in turn, entails that their internal components — the
microchips that drive such devices — are manufactured to the highest quality
standards and reliability. Many of these manufacturing processes use UV light
sources, which require UV-sensitive cameras for quality inspections at every step
of the process. With the ability to detect defects and anomalies that are difficult
to identify using other imaging technologies, UV cameras are essential in ensuring
the quality and reliability of semiconductor components.
As the electronics industry grows, the demand for high-quality UV cameras in
semiconductor manufacturing will undoubtedly increase. By harnessing the
advantages of UV cameras, semiconductor manufacturers can ensure the highest
standards of quality and reliability while minimizing costs.
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