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INTRODUCTION TO ENGINEERING
MATERIALS I
(ENG 207)
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a) IONIC BONDING
Ionic bonding is always found in materials that are composed of both metallic (electropositive) and nonmetallic
(electronegative) elements that are situated at the horizontal extremities of the periodic table. The attractive bonding forces are
columbic; that is, positive and negative ions [cations and anions], by virtue of their net electrical charge, attract one another.
The predominant bonding in ceramic materials is ionic. Ceramic materials are most frequently oxides, nitrides, carbides and
halides, and range from clay-based products, to cement, glasses and technical or engineered ceramics. Ionic materials are
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characteristically hard and brittle and furthermore, electrically and thermally insulative.
b) COVALENT BONDING
Two atoms that are covalently bonded will each contribute at least one electron to the bond, and the shared electrons may be
considered to belong to both atoms. For N valence electrons, an atom can covalently bond with at most 8 – N other atoms.
Polymeric materials (plastics and rubber) typify this bond, the basic molecular structure being a long chain of carbon atoms
[catenation] that are covalently bonded together. Also, this type of bonding is found in elemental semiconductors [the
metalloids of Group IVA] such as carbon (diamond), silicon and germanium, and other solid compounds [especially compound
semiconductors] composed of elements that are located close to Group IVA, such as gallium arsenide (GaAs), indium
antimonide (InSb), and silicon carbide (SiC).
It is possible to have inter-atomic bonds that are partially ionic and partially covalent, and, in fact, very few compounds exhibit
pure ionic or covalent bonding. For a compound [e.g. ceramics and compound semiconductors], the degree of either bond type
depends on the relative positions of the constituent atoms in the periodic table or the difference in their electronegativities. The
wider is the separation (both horizontally and vertically) from the lower left to the upper right-hand corner (i.e. the greater the
difference in electronegativity), the more ionic the bond. Conversely, the closer the atoms are together (i.e. the smaller the
difference in electronegativity), the greater the degree of covalency. The percentage ionic character may be given by the
expression:
( )
[ ]
Where, XA and XB are the electonegativities for elements A and B forming the bond respectively, A being the more
electronegative. It follows that the percentage covalent character can be expressed as:
( )
[ ]
c) METALLIC BONDING
Metallic bonding is found in metals and their alloys. Metallic materials have one, two, or at most, three valence electrons. These
valence electrons are not bound to any particular atom in the solid and are more or less free to drift throughout the entire metal.
They may be thought of as belonging to the metal as a whole, or forming a ―sea of electrons‖ or an ―electron cloud‖. The
remaining nonvalence electrons and atomic nuclei form what are called ion cores, which possess a net positive charge equal in
magnitude to the total valence electron charge per atom. The free electrons shield the positively charged ion cores from
mutually repulsive electrostatic forces, which they would otherwise exert upon one another; consequently the metallic bond is
nondirectional in character. In addition, these free electrons act as a ―glue‖ to hold the ion cores together. Metals are good
conductors of both heat and electricity because of their free electrons.
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component materials. A large number of composite types are represented by different combinations of metals, ceramics, and
polymers. Furthermore, some naturally occurring materials are composites—for example, wood (consisting of cellulose fibre
as reinforcement and lignin as binder) and bone (consisting of the ceramic hydroxyapatite and the protein/polymer collagen).
However, most composites are synthetic (or human-made), e.g. concrete and fibreglass.
Table 1: Representative examples, applications, and properties for each category of materials
Semiconductors: Semiconductors have electrical properties that are intermediate between the electrical conductors (i.e.,
metals and metal alloys) and insulators (i.e., ceramics and polymers). Furthermore, the electrical characteristics of these
materials are extremely sensitive to the presence of minute concentrations of impurity atoms (dopants), for which the
concentrations may be controlled over very small spatial regions. Semiconductors have made possible the advent of integrated
circuitry that has totally revolutionized the electronics and computer industries (not to mention our lives) over the past three
decades. Group IV of the periodic table contain elemental semiconductors (Si and Ge) while compound semiconductors are
made from elements of Groups III and V (the so-called III-V compounds) or II and VI (II-VI compounds).
Biomaterials: Biomaterials are employed in components implanted into the human body to replace diseased or damaged body
parts. These materials must not produce toxic substances and must be compatible with body tissues (i.e., must not cause
adverse biological reactions). All of the preceding materials—metals, ceramics, polymers, composites, and semiconductors—
may be used as biomaterials. For example, some of the biomaterials that are utilized in artificial hip replacements and as dental
implants, e.g. titanium and stainless steels.
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Figure 1: Functional classification of materials. [Notice that metals, plastics, and ceramics occur in different categories. A
limited number of examples in each category are provided.]
Smart Materials: Smart (or intelligent) materials are a group of new and state-of-the-art materials now being developed that
will have a significant influence on many of our technologies. The adjective smart implies that these materials are able to
sense changes in their environment and then respond to these changes in predetermined manners—traits that are also found in
living organisms. In addition, this ―smart‖ concept is being extended to rather sophisticated systems that consist of both smart
and traditional materials. Components of a smart material (or system) include some type of sensor (that detects an input
signal), and an actuator (that performs a responsive and adaptive function). Actuators may be called upon to change shape,
position, natural frequency, or mechanical characteristics in response to changes in temperature, electric fields, and/or
magnetic fields. Four types of materials are commonly used for actuators: shape-memory alloys, piezoelectric ceramics,
magnetostrictive materials, and electrorheological/magnetorheological fluids. These materials are used in
microelectromechanical systems and devices (MEMS).
Nanomaterials: One new material class that has fascinating properties and tremendous technological promise is the
nanomaterials. Nanomaterials may be any one of the four basic types—metals, ceramics, polymers, and composites.
However, unlike these other materials, they are not distinguished on the basis of their chemistry, but rather, size; the nano-
prefix denotes that the dimensions of these structural entities are on the order of a nanometer (10–9 m)—as a rule, less than 100
nanometers (equivalent to approximately 500 atom diameters). Examples are carbon nanotubes, fullerenes, dendrimers,
nanoparticles, nanowires and quantum dots, etc.
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crystals or grains (size, shape, etc.) and that of the regions between them, known as the grain boundaries, also affect the properties
of materials. A micrograph of stainless steel showing grains and grain boundaries is shown in Figure 2.
One of the most fascinating aspects of materials science involves the investigation of a material’s structure. The structure of
materials has a profound influence on many properties of materials, even if the overall composition does not change! For example,
if you take a pure copper wire and bend it repeatedly, the wire not only becomes harder but also becomes increasingly brittle!
Eventually, the pure copper wire becomes so hard and brittle that it will break! The electrical resistivity of the wire will also
increase as we bend it repeatedly. In this simple example, take note that we did not change the material’s composition (i.e., its
chemical make-up). The changes in the material’s properties are due to a change in its internal structure. If you look at the wire after
bending, it will look the same as before; however, its structure has been changed at the microscopic scale. The structure at the
microscopic scale is known as the microstructure. If we can understand what has changed microscopically, we can begin to
discover ways to control the material’s properties.
The relationships between structure, composition, processing and property/performance can be illustrated using the materials
science and engineering tetrahedron presented in Figure 2. Let’s look at ―sheet steels‖ used in the manufacture of car chassis
(Figure 2). Steels, as you may know, have been used in manufacturing for more than a hundred years, but they probably existed in a
crude form during the Iron Age, thousands of years ago. In the manufacture of automobile chassis, a material is needed that
possesses extremely high strength but is formed easily into aerodynamic contours. Another consideration is fuel efficiency, so the
sheet steel must also be thin and lightweight. The sheet steels also should be able to absorb significant amounts of energy in the
event of a crash, thereby increasing vehicle safety. These are somewhat contradictory requirements.
Figure 2: Application of the tetrahedron of materials science and engineering to sheet steels for automotive chassis. [Note
that the composition, microstructure, and synthesis/processing are all interconnected and affect the performance-to-cost
ratio]
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ensures that upon solidification, the atoms of crystalline solids will position themselves in a repetitive three-dimensional pattern so
that each atom is bonded to its nearest-neighbour atoms. All metals, many ceramics materials, and certain polymers form crystalline
structures under normal solidification conditions.
On the other hand, non-crystalline or amorphous solids have random distribution of atoms or molecules, and long-range order of
atoms is absent. Any order found in the arrangement of atoms is said to be short-range order. Apart from a slight change
(decrease) in density, there is no practical structural change in the liquid as compared to the solid form of an amorphous material.
They are therefore described as super-cooled liquids. Examples include glasses and plastics.
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Figure 4: Arrangement of atoms in (a) FCC, (b) HCP and (c) BCC structures
Figure 5: The three principal types of structure in which metallic elements crystallize
Table 2 shows examples of the unit cells or crystal structures found in metals. Details of derivation are given in lectures (class).
Note that a is the lattice parameter (length of a side of the unit cell) and r is atomic radius (radius of spheres occupying the lattice
points). The atomic packing factor is defined as:
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Table 2: Unit cell structures for metals and the packing economy of atoms
Unit Cell Examples Total number of Relationship Atomic Packing Factor (APF)
atoms between a and r
Simple Cubic (SC) No Metal
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Crystallographic planes are specified by three Miller indices as (hkl) in all crytal systems except in the hexagonal system. The
indices of three faces of the cubic unit cell are shown in Figure 7.
Any two planes parallel to each other are equivalent and have identical indices. The procedures for determining the h, k and l index
numbers is as follows:
i. The intercepts of the plane for each axis is determined. [NB: if the plane passes through the selected origin, either another
parallel plane must be constructed within the unit cell or a new origin must be established at the corner of another unit
cell].
ii. The reciprocals of the numbers (integers) are taken. For example, if the intercepts are 1, ½, and ∞, the reciprocals will be
1, 2 and 0. [Note: a plane that parallels an axis may be considered to have an infinite intercept and, therefore, a zero index].
iii. Where necessary, these reciprocals are reduced or changed to the set of smallest integers by multiplication or division by a
common factor. In the case of 1, 2 and 0 obtained above; there is no need for reduction.
iv. Finally, the integer indices, not separated by commas, are enclosed within parenthesis thus, (120). The (120) plane and
some other planes are shown in Figure 8.
An intercept on the negative side of the origin is indicated by a bar or minus sign positioned over the appropriate index, e.g. plane
( ̅ ) is also shown in Figure 8. One interesting and unique characteristic of cubic crystals is that planes and directions having the
same indices are perpendicular to one another. Verify this by comparing Figures 7 and 8.
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For example, the linear density of the direction [110] in the FCC is:
expressed in atoms per nm.
In the FCC,
( )
expressed in atoms per square nm.
√ √
For a unit cell, this will be multiplied by n, the total number of atoms occupying the cell. The density of an element based on the
knowledge of unit cell structure is therefore total mass of the atoms in the unit cell divided by the volume of the unit cell. That is:
⁄
In the case of a metal whose crystal structure is FCC, the cell volume Vc, the atomic packing factor APF and density ρ can be
determined as follows:
In the FCC unit cell shown above, the atoms touch one another across a face-diagonal the length of which is 4R. Since the unit cell
is a cube, its volume is a3 where a is the cell edge length.
From the right triangle on the face, application of the Pythagorean principle results to:
( )
So that,
√
The unit cell volume is therefore,
( √ ) √
The APF is defined as the fraction of solid sphere volume in a unit cell, that is:
Since there are four atoms per FCC unit cell [explanation given in class], the total FCC atom (or sphere) volume is:
Therefore;
√ √
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For example, copper has an atomic radius of 0.128 nm, an FCC crystal structure, and an atomic mass of 63.5 g/mol. its theoretical
density can be determined as follows:
Since the crystal structure is FCC, n, the number of atoms per unit cell, is 4. Furthermore, the atomic mass is given as 63.5 g/mol.
The unit cell volume for FCC was determined above as √ as where R, the atomic radius, is 0.128 nm.
Substitution for the various parameters into the density equation yields:
√ ( )
( ) √ ( )
NB: The literature (handbook) value for the density of copper is 8.94 g/cm3, which is in very close agreement with the above result.
Figures 10 to 12 show the geometrical arrangements in the FCC, BCC and HCP which can be used as aid in computing APF, LD,
PD and theoretical density. Note that for the HCP (Fig. 12a,c); the total number of atoms is: number in upper hexagonal plane
[ ] + number in lower hexagonal plane [ ] + number in the centres of the hexagonal planes [ ] + number
of interstitial atoms [3] = 1+1+1+3 = 6 atoms per HCP unit cell.
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(c)
Figure 12: Geometrical arrangement in the HCP
Table 3 also gives data on the crystal structures and atomic radii of some metals.
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Defects include:
Point defects such as vacant atomic sites (or simply vacancies) and interstitial atoms (or simply interstitials), where an atom
sits in an interstice rather than a normal lattice site; and substitutions.
Line defects such as dislocations – edge and screw dislocations.
Surface or Planar defects and Grain boundary defects such as stacking faults and twin boundaries
Volume defects such as voids, gas bubbles and cavities
Figure 13 shows some examples of defects in crystals.
[(a) vacancy – interstitial, (b) dislocation, (c) stacking fault, and (d) void]
One can compute the number of point defects at equilibrium concentration at a certain temperature using the Arrhenius equation
thus
[ ]
Where is number of imperfections or point defects, is number of atomic sites or lattice sites per mole, k is Boltzmann’s
constant, is free energy required to form the defect and T is absolute temperature. The free energy is typically of order l eV
[1 electron volt = J]. In terms of eV,
The above equation shows that the equilibrium number of vacancies for a given quantity of material depends on and increases with
temperature. The number of point defects in a material may be reduced by slowly cooling the sample.
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i. Atomic size factor: - This rule specifies that a substitutional solid solution will form between elements A and B only when
the difference in atomic radii between the two atom types is less than about ±15%.
ii. Crystal structure factor: - This stipulates that for appreciable solid solubility to occur between A and B, the crystal
structure [e.g. BCC, FCC, and HCP] for metals of both atom types must be the same.
iii. Electronegativity factor: - This rule states that an intermetallic compound will form instead of a substitutional solid
solution if the difference in electronegativities of A and B is wide. That is, one element should not be electropositive and
the other electronegative.
iv. Valency factor: - Other factors being equal, the solvent metal will tend to dissolve atoms of the solute if the solute is a
metal of higher or same valency. That is, the solute must not have a valency less than that of the solvent.
A classic example of substitutional solid solution is found for alloys of copper and nickel, two of which are completely soluble in
one another at all proportions. They are said to exhibit unlimited or complete solid solubility.
In the case of interstitial solid solutions, impurity atoms [which must be smaller in size compared to the solvent atoms] fill the voids
or interstices among the host atoms. There is therefore a limitation of solubility to the extent to which interstices or voids are
available in the lattice of the host metal and the extent impurity atoms can fit into these voids. In steels and cast irons for example,
carbon atoms are found in the interstitial sites between iron atoms.
Ore Mineral is a naturally occurring homogeneous inorganic substance of definite chemical composition and with certain
characteristic physical properties; e.g. galena (PbS), chalcopyrite (CuFeS 2). They are those minerals that contain the valuable metals
in an ore; e.g. PbS, CuFeS2 , ZnS…etc. Sulfide ores are ores that contain sulfides, e.g. non-ferrous ore minerals such as PbS,
CuFeS2, and ZnS…etc. Oxide or Oxidized ores contain oxide, carbonate, sulfate, hydroxide or silicate ore minerals; e.g. Fe2O3,
PbCO3, FeCO3, PbSO4, Zn2(OH)2.SiO3, etc.
Gangue minerals are the valueless minerals found in ores, e.g. waste wall rock broken with ore. In a typical Pb – Zn ore, we have:
galena (PbS-ore mineral), sphalerite (ZnS-ore mineral) and quartz (SiO -gangue mineral).
2
Iron ores: Ore minerals of iron are hematite (Fe2O3), magnetite (Fe3O4), limonite (Fe2O3.xH2O) and siderite (FeCO3). Magnetite is
a magnetic mineral. Hematite is the most important ore mineral of iron and it is weakly magnetic. Since siderite and limonite are ore
minerals lower in grade than others, they are not so desirable in iron ores. Pyrite (FeS2) may be used after roasting as pyrite cinder
(iron oxide ash) for the production of iron. Most iron ores contain large amounts of the iron ore mineral and relatively small
amounts of gangue. Most of the direct-smelting ores contain about 50 % Fe, although ores with as low as 25–30 % Fe are smelted
after concentration.
Aluminum ores: Ore minerals of aluminium include bauxite {found in form of gibbsite (Al2O3.3H2O), diaspore (Al2O3.H2O), or
boehmite (Al2O3.H2O)}, corundum (Al2O3), kaolinite (Al2O3.2SiO2.2H2O), etc. The only commercial ore of aluminum is bauxite.
Bauxite is a rock containing the hydrated oxides of aluminum; gibbsite, diaspore and boehmite. Bauxites contain 55–61 % Al2O3,
10–30 % H2O (chemically combined water), 1–25 % Fe2O3, 1–3% TiO2 and 1–12 % SiO2. Bauxites with low SiO2 are desirable.
Following the mining, mineral processing and pretreatment of minerals, their extraction is accomplished by application of
chemical metallurgy in one of the three areas of extractive metallurgy: pyrometallurgy, hydrometallurgy or electrometallurgy.
The extraction of metals from their ores is a reduction reaction.
Pyrometallurgy: Pyrometallurgy deals with chemical reactions at high temperatures. These are reactions that take place at
temperatures from 100°C up to 3000°C or more. Pyrometallurgy or fire metallurgy is the most important of the extraction
processes and it is the oldest division of metallurgy. Practically all iron and steel, lead, and tin, most copper, and a small
proportion of zinc, etc. are won from their ores and concentrates by pyrometallurgical methods. Examples of pyrometallurgical
reactions include:
2FeO + C → 2Fe + CO and FeO + CO → 2Fe + CO
2 2
Hydrometallurgy: Hydrometallurgy is concerned with the leaching of ores, concentrates and calcines with aqueous solutions
to dissolve and recover the valuable metals. It is the separation of a soluble substance from an insoluble by means of a solvent.
The solvent is either water or an aqueous solution. Uranium is extracted usually via hydrometallurgy. In most cases,
electrometallurgy takes off from where hydrometallurgy stops. For example, leaching (a hydrometallurgical step) is necessary
to concentrate bauxite to alumina before electro-winning of aluminium. The refining of bauxite to alumina is done using the r
Bayer’s process.
Electrometallurgy: Electrometallurgy deals with metallurgical processes that require electric current for chemical reduction. It
involves electrolysis or electrorefining and electrowinning as shown.
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The basis for the understanding of the heat treatment of steels is the Fe–C (or better Fe–Fe3C) phase diagram (Figures 14 and
15).The dividing point between ―steels‖ and ―cast irons‖ is 2. % C, where the eutectic reaction becomes possible. For steels, we
concentrate on the eutectoid portion of the diagram (Figure …) in which the solubility lines and the eutectoid isotherm are specially
identified. The A3 shows the temperature at which ferrite starts to form on cooling; the Acm shows the temperature at which
cementite starts to form; and the A1 is the eutectoid temperature.
The temperature [at constant pressure] at which a change in crystal structure, phase or physical properties occurs is called critical or
transformation temperature. The horizontal line at the eutectoid temperature, conventionally labeled A1, is termed the lower critical
temperature [and corresponds with the eutectoid temperature], below which, under equilibrium conditions, all austenite will have
transformed into ferrite and cementite phases. The phase boundaries denoted as A3 and Acm represent the upper critical
temperature lines for hypoeutectoid and hypereutectoid steels, respectively. For temperatures and compositions above these
boundaries, only the austenite phase will prevail. The critical points are also called arrest points i.e. thermal arrest points.
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In fact, the symbol A as used in A1, A3 and Acm stands for arrest. A2 is the Curie temperature for iron, which is 768oC (1414oF).
Pure iron becomes nonmagnetic between 768 and 910 oC even though the crystal structure remains BCC α-Fe (ferrite) and it was
mistakenly called β-Fe until X-ray studies revealed that the crystal structure is still BCC. Again, cementite (Fe3C) changes from
ferromagnetic to paramagnetic at its curie temperature of approximately 483K [210 or 410 ]. This corresponds to the A0 critical
line as shown in Figure 14.
Almost all of the heat treatments of steel are directed toward producing the mixture of ferrite and cementite that gives the proper
combination of properties.
Figure 15: An expanded version of the eutectoid portion of the Fe–Fe3C diagram
Four simple heat treatments known as process annealing, full annealing, normalizing, and spheroidizing are commonly used for
steels (Figure 16) in order to either (1) eliminate the effects of cold work, (2) control dispersion strengthening, or (3) improve
machinability. Figure 16 and 17 are schematic illustrations of normalizing, annealing and spheroidizing heat treatments for steels.
Figure 16: Schematic summary of the simple heat treatments for (a) hypoeutectoid steels and (b) hypereutectoid steels.
Figure 17: The iron–iron carbide phase diagram in the vicinity of the eutectoid, indicating heat-treating temperature ranges
for plain carbon steels.
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SURFACE HARDENING
This is a heat-treatment process that includes a wide variety of techniques, used to improve the wear resistance of parts without
affecting the softer, tough interior of the part (Figure 18). This combination of hard surface and resistance to breakage upon impact
is useful in parts such as a cam or ring gear that must have a very hard surface to resist wear, along with a tough interior to resist the
impact that occurs during operation. In the so-called case hardening technique, surface hardening is archived though carburizing,
nitriding, carbonitriding or cyaniding.
The surface hardening of steel has an advantage over through hardening because less expensive low-carbon and medium-carbon
steels can be surface hardened without the problems of distortion and cracking associated with the through hardening of thick
sections.
Notice that its outer surface layer was selectively hardened by a high-temperature heat treatment during which carbon from the
surrounding atmosphere diffused into the surface. The ―case‖ appears as the dark outer rim of that segment of the gear that has been
sectioned. This increase in the carbon content raises the surface hardness, which in turn leads to an improvement of wear resistance
of the gear. In addition, residual compressive stresses are introduced within the case region; these give rise to an enhancement of the
gear’s resistance to failure by fatigue while in service. Case-hardened steel gears are used in automobile transmissions.
REFERENCES
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Company
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