Professional Documents
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Compute-Optimized
Leadership x86 CPU GPU Architecture Adaptive Acceleration
~$135B TAM
6 | AMD Strategic Acquisition of Xilinx | February 14, 2022 AMD 2023 Internal Estimates
R&D Scale to Accelerate Innovation
• Leadership roadmaps
$1.0B $3.8B • Best-in-class 2.5/3D die stacking
Xilinx and packaging technology
$2.8B • Revolutionary chiplet and
interconnect technology
• Leading AI engines and
domain-specific architectures
• Best-of-breed software platforms
AMD
AMD Xilinx Combined
Industry-leading CPUs, Leadership process, Meeting the compute demands Open source software
GPUs, FPGAs and packaging, chiplet, 3D and of next-generation applications co-designed with hardware,
adaptive SoCs interconnect technology across dynamic and evolving and optimized for performance
markets, such as 5G cellular, across heterogenous solutions
Well-aligned design methodology,
data center, automotive and
foundry process and IP
industrial
Leverage strong AMD relationships and Utilize Xilinx comms expertise and Enable differentiated solutions for
AMD EPYC™ processor momentum deep relationships Xilinx’s broad customer base and
Offer leadership AI, Drive adoption of AMD distribution platform with expanded
SmartNIC and workload-specific EPYC™ processors in wired and portfolio of CPUs, GPUs, FPGAs and
accelerator solutions wireless infrastructure Adaptive SoCs