THIRD ANGLE PROJECTION REVISIONS REV] ECN No. DESCRIPTION. DATE | DR JAUTH SUGGESTED MOUNTING CONFIGURATION FOR KEEP—OUT ZONE, .030X.030, DQ1225 CASE STYLE INDER OF BOTTOM SIDE OF N/c FOR GROUND COMPONENT C8 ‘COPLANAR WAVEGUIDE: .021 TRACE WIDTH & .015 GAP, 2 PL. (SEE NOTE 2) PACKAGE OUTLINE TOP VIEW ‘COMPONENT | SIZE ‘SOLDER MASK (SM1) IMMERSION GOLD (0.025um~0.075um) ELECTROLESS NICKEL (3um—6um) Li COPPER: 0.5 OZ (0.7mll) SERA BASE: RO«350B (10mil) L2 COPPER: 0.5 07 (0.7mil) BASE: FR& (2.0mm) LB COPPER: 0.5 02 (0.7mil) ELECTROLESS NICKEL (3um=6um) IMMERSION GOLD (0.025um~0.075um) ‘SOLDER MASK (SM2) cr..08 [0402 Laz | 0402 mi __[ovoe emer .090"+.002” (2.3040.05]mm NOTES: 1. PCB IS MULTILAYER PCB, SEE STACK-UP DIAGRAM. 2. TRACE WIDTH & GAP PARAMETERS ARE SHOWN FOR ROGERS RO4350B WITH DIELECTRIC THICKNESS .010"+.001"; COPPER: 1/2 OZ. FOR OTHER MATERIALS TRACE WIDTH AND GAP MAY NEED TO BE MODIFIED. 3. CHIP COMPONENT FOOT PRINTS SHOWN FOR REFERENCE. FOR COMPONENT VALUES REFER TO TB-PMA3—14LN+ OR TB~TSS-14LN+. 4. COPPER LAYERS L2 & L3 OF THE PCB ARE CONTINUOUS GROUND PLANES. [| DENOTES PoB COPPER LAYOUT WITH sMoBC (SOLDER MASK OVER BARE COPPER) DENOTES COPPER LAND PATTERN FREE OF SOLDER MASK UNLESS OTHERWISE SPECIFIED] Tals [__DaTE ae cee eee ee [! Mini—Circuits sanrwis TRESS: [See |e wae Res PL, DQ1225, TB-PMA3(TSS)-14LN+ anc rere Se Ree R CRS RRERE REE wenn | A | 15542 98-PL-725 B [amerarowe ma omens |" 9BPL725 MF Bl [1 OF 1