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NC
NC
NC
NC
20 19 18 17 16
NC 1 15 VGG
APPLICATIONS
NC 2 14 NC
y 5G MIMO and Back Haul Radio Systems
y Satellite Communications NC 3 13 NC
6 7 8 9 10
RF-IN
NC
NC
NC
NC
PRODUCT OVERVIEW
AVA-183MP+ is a GaAs pHEMT MMIC wideband distributed amplifier operating from 0.05 to 18 GHz. The amplifier provides
16.5 dB of Gain, +24 dBm P1dB, and +31 dBm OIP3, and 1.8 dB Noise Figure typical performance while operating from an +8V
supply with 160mA current consumption. The AVA-183MP+ offers a leading combination of wide bandwidth, low noise figure,
high linearity, and output power resulting in a 50Ω matched high dynamic range amplifier. The AVA-183MP+ performance
characteristics are ideal for use in wideband Defense Systems and Test and Measurement Equipment. The amplifier is housed
in an industry standard 4x4mm QFN-style package.
KEY FEATURES
Features Advantages
Internally matched to 50Ω, this eliminates the need for external matching components making the device easy to
Good Input and Output Return Loss
integrate.
Small footprint saves space in dense layouts while providing low inductance, repeatable transitions, and excellent
4x4mm 20-Lead QFN-style package
thermal contact to the PCB.
REV. OR
ECO-017253
AVA-183MP+
MCL NY
230324
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MMIC SURFACE MOUNT
ELECTRICAL SPECIFICATIONS1 AT +25°C, VDD= +8V, IDD = 160mA, UNLESS NOTED OTHERWISE
Parameter Condition (GHz) Min. Typ. Max. Units
15 15.5 16.3
18 15.2 16.3
0.05 11.4
5 20.0
0.05 14.3
5 20.0
15 20.0
18 19.3
0.05 +25.8
5 +24.2
15 +24.4
18 +24.4
0.05 +32.7
5 +32.2
Output Third-Order Intercept Point
10 +31.1 dBm
(POUT = 0dBm/Tone)
15 +29.3
18 +27.4
0.05 7.0
5 1.5
15 2.8
18 3.6
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MMIC SURFACE MOUNT
All data taken was at nominal conditions VDD = +8V and IDD = 160 mA unless noted otherwise. For over temperature data, IDD
isNote:
adjusted to was
All data taken 160at nominal
mA atconditions
each Vtemperature
DD = +8V, IDD = 160specified.
mA, and VGG =For
-1.3Vover current
unless noted data,
otherwise. VDDtemperature
For over is set todata,
+8V and
IDD is VGGtois
adjusted 160adjusted until each
mA at each temperature
specified current level is achieved.specified. For over temperature data, IDD is adjusted to 160 mA at each voltage specified.
GAIN (dB)
18 18
17 17
16 16
15 15
14 14
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz) FREQUENCY (GHz)
INPUT RETURN LOSS vs. TEMPERATURE, INPUT RETURN LOSS vs. DEVICE CURRENT,
PIN = -25 dBm PIN = -25 dBm, TEMPERATURE = +25°C
-5 -5
INPUT RETURN LOSS (dB)
-10 -10
-15 -15
-20 -20
-25 -25
-45°C 150mA
+25°C 160mA
-30 -30
+85°C 170mA
-35 -35
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz) FREQUENCY (GHz)
OUTPUT RETURN LOSS vs. TEMPERATURE, OUTPUT RETURN LOSS vs. DEVICE CURRENT,
PIN = -25 dBm PIN = -25 dBm, TEMPERATURE = +25°C
-5 -5
-45°C 150mA
OUTPUT RETURN LOSS (dB)
-20 -20
-25 -25
-30 -30
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz) FREQUENCY (GHz)
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MMIC SURFACE MOUNT
ISOLATION (dB)
50 50
40 40
30 30
20 20
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz) FREQUENCY (GHz)
35 35
30 30
25 25
20 20
15 15
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz) FREQUENCY (GHz)
P1dB (dBm)
23 23
22 22
21 21
20 20
19 19
18 18
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz) FREQUENCY (GHz)
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MMIC SURFACE MOUNT
4 4
3 3
2 2
1 1
0 0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz) FREQUENCY (GHz)
-0.010
(dB/°C)
-0.020
-0.030
-45°C to +85°C
-0.040
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz)
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MMIC SURFACE MOUNT
6
ABSOLUTE MAXIMUM RATINGS
Parameter Ratings
Input Power (CW), VDD = +8V, IDD = 160mA +21 dBm (Continuous)
THERMAL RESISTANCE
Parameter Ratings
ESD RATING
Class Voltage Range Reference Standard
MSL RATING
Moisture Sensitivity: MSL3 in accordance with IPC/JEDEC J-STD-020E/JEDEC J-STD-033C
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MMIC SURFACE MOUNT
NC
NC
NC
6 7 8 9 10
RF-IN
NC
NC
NC
NC
C5 Caution: Permanent damage to the device will occur if the Power ON and Power
OFF Sequences are not followed.
R1
Power ON Sequence:
L1 1) Set VGG = -2V. Apply VGG.
15
RF-IN C3 C4 RF-OUT 2) Set VDD = +8V. Apply VDD.
7 19
DUT 3) Increase VGG to obtain desired IDD as shown in specification table.
4) Apply RF Signal.
1-6, 8-14,
16-18, 20, Power OFF Sequence:
& Paddle 1) Turn off RF Signal.
2) Adjust VGG down to -2V.
TB-AVA-183MPC+ 3) Turn off VDD.
4) Turn off VGG.
Figure 2. DUT soldered on Mini-Circuits Characterization
Test Board: TB-AVA-183MPC+
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MMIC SURFACE MOUNT
PRODUCT MARKING
black body
index over pin 1 MCL
183MP model family designation
Marking may contain other features or characters for internal lot control
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MMIC SURFACE MOUNT
Data
Case Style DG1847-1. QFN-style package, exposed paddle, Lead Finish: PPF
TB-AVA-183MPC+
Evaluation Board
Gerber File
Product Handling The use of no-clean solder is recommended. This package cannot be subjected to aqueous wash.
NOTES
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights
and benefits contained therein. For a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/terms/viewterm.html
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