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LP24B Chassis
LP24B Chassis
LED LCD TV
SERVICE MANUAL
CHASSIS : LP24B
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS . ............................................................................................. 2
SERVICING PRECAUTIONS..................................................................... 4
SPECIFICATION........................................................................................ 6
ADJUSTMENT INSTRUCTION................................................................. 9
TROUBLESHOOTING GUIDE................................................................. 13
BLOCK DIAGRAM................................................................................... 16
Copyright © LG Electronics. Inc. All rights reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS
Copyright © LG Electronics. Inc. All rights reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service 2. After removing an electrical assembly equipped with ES
manual and its supplements and addenda, read and follow the devices, place the assembly on a conductive surface such as
SAFETY PRECAUTIONS on page 3 of this publication. aluminum foil, to prevent electrostatic charge buildup or expo-
NOTE: If unforeseen circumstances create conflict between the sure of the assembly.
following servicing precautions and any of the safety precautions 3. Use only a grounded-tip soldering iron to solder or unsolder ES
on page 3 of this publication, always follow the safety precautions. devices.
Remember: Safety First. 4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as “anti-static” can generate
General Servicing Precautions electrical charges sufficient to damage ES devices.
1. Always unplug the receiver AC power cord from the AC power 5. Do not use freon-propelled chemicals. These can generate
source before; electrical charges sufficient to damage ES devices.
a. Removing or reinstalling any component, circuit board mod- 6. Do not remove a replacement ES device from its protective
ule or any other receiver assembly. package until immediately before you are ready to install it.
b. Disconnecting or reconnecting any receiver electrical plug or (Most replacement ES devices are packaged with leads electri-
other electrical connection. cally shorted together by conductive foam, aluminum foil or
c. Connecting a test substitute in parallel with an electrolytic comparable conductive material).
capacitor in the receiver. 7. Immediately before removing the protective material from the
CAUTION: A wrong part substitution or incorrect polarity leads of a replacement ES device, touch the protective material
installation of electrolytic capacitors may result in an explo- to the chassis or circuit assembly into which the device will be
sion hazard. installed.
2. Test high voltage only by measuring it with an appropriate CAUTION: Be sure no power is applied to the chassis or circuit,
high voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged replace-
Do not test high voltage by "drawing an arc". ment ES devices. (Otherwise harmless motion such as the
3. Do not spray chemicals on or near this receiver or any of its brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity suf-
4. Unless specified otherwise in this service manual, clean ficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10 % (by volume) Acetone and 90 % 1. Use a grounded-tip, low-wattage soldering iron and appropriate
(by volume) isopropyl alcohol (90 % - 99 % strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500 °F to 600 °F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500 °F to 600 °F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500 °F to 600 °F)
Some semiconductor (solid-state) devices can be damaged eas- b. First, hold the soldering iron tip and solder the strand against
ily by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors component lead and the printed circuit foil, and hold it there
and semiconductor “chip” components. The following techniques only until the solder flows onto and around both the compo-
should be used to help reduce the incidence of component dam- nent lead and the foil.
age caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. Alter- splashed solder with a small wire-bristle brush.
natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten-
tial shock reasons prior to applying power to the unit under test.
Copyright © LG Electronics. Inc. All rights reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement 3. Solder the connections.
Some chassis circuit boards have slotted holes (oblong) through CAUTION: Maintain original spacing between the replaced
which the IC leads are inserted and then bent flat against the cir- component and adjacent components and the circuit board to
cuit foil. When holes are the slotted type, the following technique prevent excessive component temperatures.
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique Circuit Board Foil Repair
as outlined in paragraphs 5 and 6 above. Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
Removal board causing the foil to separate from or "lift-off" the board. The
1. Desolder and straighten each IC lead in one operation by following guidelines and procedures should be followed whenever
gently prying up on the lead with the soldering iron tip as the this condition is encountered.
solder melts.
2. Draw away the melted solder with an anti-static suction-type At IC Connections
solder removal device (or with solder braid) before removing To repair a defective copper pattern at IC connections use the
the IC. following procedure to install a jumper wire on the copper pattern
Replacement side of the circuit board. (Use this technique only on IC connec-
1. Carefully insert the replacement IC in the circuit board. tions).
2. Carefully bend each IC lead against the circuit foil pad and
solder it. 1. Carefully remove the damaged copper pattern with a sharp
3. Clean the soldered areas with a small wire-bristle brush. knife. (Remove only as much copper as absolutely necessary).
(It is not necessary to reapply acrylic coating to the areas). 2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
"Small-Signal" Discrete Transistor 3. Bend a small "U" in one end of a small gauge jumper wire and
Removal/Replacement carefully crimp it around the IC pin. Solder the IC connection.
1. Remove the defective transistor by clipping its leads as close 4. Route the jumper wire along the path of the out-away copper
as possible to the component body. pattern and let it overlap the previously scraped end of the
2. Bend into a "U" shape the end of each of three leads remaining good copper pattern. Solder the overlapped area and clip off
on the circuit board. any excess jumper wire.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding At Other Connections
leads extending from the circuit board and crimp the "U" with Use the following technique to repair the defective copper pattern
long nose pliers to insure metal to metal contact then solder at connections other than IC Pins. This technique involves the
each connection. installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement 1. Remove the defective copper pattern with a sharp knife.
1. Heat and remove all solder from around the transistor leads. Remove at least 1/4 inch of copper, to ensure that a hazardous
2. Remove the heat sink mounting screw (if so equipped). condition will not exist if the jumper wire opens.
3. Carefully remove the transistor from the heat sink of the circuit 2. Trace along the copper pattern from both sides of the pattern
board. break and locate the nearest component that is directly con-
4. Insert new transistor in the circuit board. nected to the affected copper pattern.
5. Solder each transistor lead, and clip off excess lead. 3. Connect insulated 20-gauge jumper wire from the lead of the
6. Replace heat sink. nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Diode Removal/Replacement Carefully crimp and solder the connections.
1. Remove defective diode by clipping its leads as close as pos- CAUTION: Be sure the insulated jumper wire is dressed so the
sible to diode body. it does not touch components or sharp edges.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Copyright © LG Electronics. Inc. All rights reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
Copyright © LG Electronics. Inc. All rights reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Component Video Input (Y, PB, PR)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed
1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.47 59.94 27.000 SDTV 480P
5. 720*480 31.50 60.00 27.027 SDTV 480P
6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45.00 60.00 74.250 HDTV 720P
9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11. 1920*1080 33.72 59.94 74.176 HDTV 1080I
12. 1920*1080 33.75 60.00 74.25 HDTV 1080I
13. 1920*1080 56.25 50 148.5 HDTV 1080P
14. 1920*1080 67.432 59.94 148.350 HDTV 1080P
15. 1920*1080 67.5 60.00 148.5 HDTV 1080P
6. HDMI Input
6.1. PC Mode
* Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable
Copyright © LG Electronics. Inc. All rights reserved. -7- LGE Internal Use Only
Only for training and service purposes
6.2. DTV Mode
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out but display.
3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4. 720*480 31.47 59.94 27 SDTV 480P
5. 720*480 31.5 60.00 27.027 SDTV 480P
6. 720*576 31.25 50.00 27 SDTV 576P
7. 1280*720 44.96 59.94 74.176 HDTV 720P
8. 1280*720 45 60.00 74.25 HDTV 720P
9. 1280*720 37.5 50.00 74.25 HDTV 720P
10. 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50.00 148.5 HDTV 1080P
14 1920*1080 67.432 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
16 1920*1080 27 24.00 74.25 HDTV 1080P
17 1920*1080 33.75 30.00 74.25 HDTV 1080P
18 1920*1080 26.97 23.97 74.25 HDTV 1080P
19 1920*1080 33.716 29.976 74.25 HDTV 1080P
Copyright © LG Electronics. Inc. All rights reserved. -8- LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range 3) Click the “Config.” button and Change speed
I2C Speed setting : 350Khz~400Khz
This specification sheet is applied to all of the LED LCD TV
with LP24B chassis.
G
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100-220 V,
50/60Hz. 4) Read and write bin file
(5) The standard signal level is approved in 65 dBµV ± 1 dBµV. Click “(1)Read” tab, and then load download file(XXXX.
(6) The receiver must be operated for over 5 minutes prior to bin) by clicking “Read”.
the adjustment when module is in the circumstance of
above 15 °C.
► In case of keeping module is in the circumstance of 0
°C, it should be placed in the circumstance of above 15
°C for 2 hours.
► In case of keeping module is in the circumstance of
below -20 °C, it should be placed in the circumstance of
above 15 °C for 3 hours.
3. PCB assembly adjustment method 5) Click “(2)Auto” tab and set as below
3.1. Mstar Main S/W program download 6) Click “(3)Run”.
3.1.1. Using D/L Jig 7) After downloading, you can see the “(4)Pass” message.
(1) Preliminary steps
1) Connect the download jig to D-sub(JK201) Jack.
Copyright © LG Electronics. Inc. All rights reserved. -9- LGE Internal Use Only
Only for training and service purposes
3) Press OK key then Message will be changed as below. 3.4. ADC Calibration
3.4.1. ADC Calibration-Component
(Using External pattern)
* Required Equipments
■ Remote controller for adjustment
■ MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
4) Plug off and on TV set, then you can see downloading 3.4.2. Process
process. (1) Change the Input to Component mode.
(2) Input the Component 480P@60 Hz 100% color Bar Y Pb
Pr signal into Component. (MSPG-925F Model: 212/
Pattern: 65)
5) Then, Plug off and on TV set again, and Download is G
finished
(1) Profile : Must be changed the option value because being 3.4.3. Confirmation
different with some setting value depend on module (1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
maker, inch and market 0x00 0x02 instruction
(2) Equipment : adjustment remote control. (2) We confirm whether “0x77 (offset), 0x78 (gain)” address of
(3) Adjustment method EEPROM “0xBE” is “0xAA” or not.
- T he input methods are same as other chassis. (Use (3) If “0x77”, “0x78” address of EEPROM “0xBE” isn’t “0xAA”,
IN-START key on the Adjust Remote control.) we adjust once more
(If not changed the option, the input menu can differ the (4) W e can confirm the ADC values from “0x56~0x5B”
model spec.) addresses in a page “0xBE”
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.
*Caution: Don’t Press “IN-STOP” key after completing the
3.4.4. EEPROM Address
function inspection. EEPROM Address
* Caution: D on’t connect HDMI cable when downloading the
EDID. If the cables are connected, Downloading of EEPROM Sub Address 0XBE
edid could be failed. Red Gain 0X59
Green Gain 0X5A
3.3. EDID data Blue Gain 0X5B
- EDID D/L method: The EDID data is automatically saved.
■ HD MODEL Red Offset 0x56
0 1 2 3 4 5 6 7 8 9 A B C D E F Green Offset 0X57
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
Blue Offset 0X58
10 01 16 01 03 80 A0 5A 78 0A F3 30 A4 54 46 96 26
20 0F 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 A6
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A
Copyright © LG Electronics. Inc. All rights reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
3.5. Check SW Version 4.2. Adjustment of White Balance.
3.5.1 Method ■ P urpose: Adjust the color temperature to reduce the
(1) Push In-star key on Adjust remote-controller. deviation of the module color temperature.
(2) SW Version check ■ Principle: To adjust the white balance without the saturation,
Check “Main : Vx.xx” : Fix the one of R/G/B gain to C0 and decrease the others.
■ Adjustment mode : Three modes - Cool / Medium / Warm
(Medium data is automatically calibrated by the Cool data)
Copyright © LG Electronics. Inc. All rights reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
4.3. Adjustment of White Balance 3) 22” Lamp (CMI & THTF)
(for Manual adjustment) (Small size inch’s color coordinate is different from
■ C olor analyzer(CA100+, CA210) should be used in the others, So use below table)
calibrated ch by CS-1000 Color coordinate
■ Operate the zero-calibration of the CA100+ or CA-210, then Mode Temp ∆uv
x y
stick sensor to the module when adjusting. Cool 0.280 ± 0.002 0.283 ± 0.002 9,300 K 0.000
■ For manual adjustment, it is also possible by the following
Medium 0.290 ± 0.002 0.295 ± 0.002 8,000 K 0.000
sequence.
1) Select white pattern of heat-run by pressing “POWER Warm 0.308 ± 0.002 0.319 ± 0.002 6,500 K 0.000
ON” key on remote control for adjustment then operate
heat run longer than 5 minutes. (If not executed this 4) W/B table in process of time which must be applied for
step, the condition for W/B may be different.) LGD edge LED module” (Target color coordinate is
2) Push “Exit” key. different by aging time)
3) Change to the AV mode by remote control. CA210 : CH 14, Test signal : Inner pattern (85IRE)
4) Input external pattern (85% white pattern) Cool Medium Warm
Aging time
5) Push the ADJ key two times (entering White Balance X y x y x y
(Min)
mode) → Enter “0413” (Password) 269 273 285 293 313 329
6) Stick the sensor to the center of the screen and select 0-2 Minutes 279 288 295 308 319 338
each items (Red/Green/Blue Gain and Offset) using 3-5 Minutes 278 286 294 306 318 336
▲/▼(CH +/-) key on R/C..
6-9 Minutes 277 285 293 305 317 335
7) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.
8) Adjust three modes all (Cool / Medium / Warm) : Fix the 10-19 Minutes 276 283 292 303 316 333
one of R/G/B gain and change the others 20-35 Minutes 274 280 290 300 314 330
9) When adjustment is completed, Exit adjustment mode 36-49 Minutes 272 277 288 297 312 327
using EXIT key on R/C. 50-79 Minutes 271 275 287 295 311 325
80-149 Minutes 270 274 286 294 310 324
* CASE More than 150 Minutes 269 273 285 293 313 329
First adjust the coordinate far away from the target value(x, y).
1) x, y > target To check the Coordinates of White Balance, you have to
i) Decrease the R, G. measure at the below conditions.
2) x, y < target Picture Mode : Vivid(User)
i) First decrease the B gain, Dynamic Contrast : Off , Dynamic Colour : Off
ii) Decrease the one of the others. (If you miss the upper condition, the coordinates of W/B
3) x > target , y < target can be lower than the spec.)
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
Copyright © LG Electronics. Inc. All rights reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
TROUBLE SHOOTING
No power
(LED indicator off)
: [A] Process (for non-adapter models)
Pass
Pass Pass
Fail
Check LED Assy Change LED Assy
Pass
No power
(LED indicator off)
: [A-1] Process (for adapter models)
Pass
Pass Pass
Fail
Check LED Assy Change LED Assy
Pass
Copyright © LG Electronics. Inc. All rights reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
No Raster : [B] Process
Pass
Pass
Pass
Fail
Check PANEL_VCC of LVDS wafer Check Output of Q720
Pass
Fail
Check LVDS Cable Change LVDS Cable
Pass
Pass
Pass
Check the Input/Output Fail Re-soldering or
Of JK203 Change the defect part
Fail
Check The Input/Output Re-soldering or
Pass
Of JK101 Change the defect part
Fail Pass
Check the Input/Output Re-soldering or
Of IC501 Change the defect part
Repeat [A]/[A-1], & [B] Process
Pass
Copyright © LG Electronics. Inc. All rights reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
No Raster On AV Video Signal No Signal On TV(RF) Signal
Pass Pass
Pass Pass
Fail Fail
Check The Input/Output Re-soldering or Check The Input/Output Re-soldering or
Of JK101 Change the defect part Of TU401 Change the defect part
Pass Pass
Fail Fail
Check the Input/Output Re-soldering or Check the Input/Output Re-soldering or
Of IC501 Change the defect part Of IC501 Change the defect part
Pass Pass
Repeat [A]/[A-1], & [B] Process Repeat [A]/[A-1], & [B] Process
No Sound
Fail
Check The Input Source Change The Source Input
Pass
Pass
Fail
Check The Speaker Change Speaker
Pass
Copyright © LG Electronics. Inc. All rights reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
Copyright ©
POWER BOARD Module
21
19
2 3 4 17 9~12 P706 24 18 22 20 P600 P400
IR
KEY2
KEY1
Output
P Dim
A Dim
Inv. ON
Sub_SCL
Sub_SDA
Error Out
Led_PWR
P_24V
E16 A11 C12 B12 XXX B9 C11 B11 H16 F16 C10
C15
IC705
P_ST 3.5V
IC502 SPI_CLK USB_5V
P_12V
C16 SPI_DI LDO
Serial Flash
B15 SPI_CZ IR/KEY
2Mbytes
B16 SPI_DO USB_DN
A13
USB_DP
JK202
IC503 B13
IC705 T6
IC709 MST7833LNT
MP1497 Main_6.8V To USB
T3
IC704
IF_N
IF_P
- 16 -
R3
10 11
IC701 Main_1.2V
T4 4
MP20051 RF_AGC
N11 6 Tuner SDA
Main_3.3V
N10 7 Tuner SCL
Q710 IC702 Main_2.5V T8
BLOCK DIAGRAM
R9
2.5V REG
Audio L-Out
Audio R-Out
P8 H2
R8 P9 T9 D10D11 D1 D3 K1 H3 J1 N2 P1 R2 T2
B+
I2S_MCLK 5
S_AMP_24V 7 I2S_WS
32 33 D-SUB HDMI OP-AMP A_OUT_12V TUNER
Pr In
17
Pb In
(( 47 NTP7500 Out
LPF IC704
48 Audio_SDA LDO
54 20 21
LPF IC301 Audio_SCL
53
(( JK101 P_6.8V
P301
400
910
810
521
540
900
120
123
LV1
530
122
* Set + Stand
500
200
A10
501
* Stand Base
A9
+ Body
510
A4
A21
A2
300
Copyright © LG Electronics. Inc. All rights reserved. - 17 - LGE Internal Use Only
Only for training and service purposes
EAX64671103
LP24B
2N3904S 2N3904S
Q103-*1 B Q104-*1 B
C C
JK101
PPJ243-01 For China For China
E E
6B [RD1]E-LUG 2N3904S 2N3904S
Q105-*1 B Q106-*1 B
C C
4B E E
POP
MUTE_AOUT
NOISE
[RD1]CONTACT Q103
RT1C3904-T112
POP
MUTE_AOUT
NOISE
Q105
RT1C3904-T112
6G [RD3]E-LUG
5G [RD3]C-SPRING R116
10K READY
COMMON_RIN
D105 R112 R120
30V 220K 12K C105
560pF
50V
4G [RD3]CONTACT
5F [WH2]C-SPRING R115
10K READY
COMMON_LIN
D104 R111 R119
C106
30V 220K 12K 560pF
50V
5E [RD2]C-SPRING
R107
COMP_PR
7E [RD2]E-LUG-S ZD100
SD05 75
5D [BL]C-SPRING
R108
COMP_PB
4C ZD101
[GN]CONTACT SD05 75
5C [GN]C-SPRING
COMMON_VIN
ZD102 R109
SD05 75
6C [GN]E-LUG
V-OUT Buffer(DEBUG)
P_12V
DEBUG
RT1C3904-T112
Q102
C B R106
E 47 MNT_VOUT
DEBUG DEBUG
JP108 R101
75 E
DEBUG
R103 2N3904S
220 Q102-*1 B
C
For China
Copyright © 2012 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
EAX64671103
LP24B
HDMI_5V_DET
A2
A1
D230
KDS184S
6 RED_GND
C
SHIELD
GND_2 R236
1 11 20
10K
RED 19 HPD R235 R237
4.7K 10K
18 +5V_POWER R232 R233
GREEN_GND 10K 10K
7 17 DDC/CEC_GND
DDC_DATA
2 12 C210
DSUB_SDA 16 SDA DDC_SDA
GREEN ZD210
30V
33pF
READY 15 SCL DDC_SCL
14 NC HDMI_ARC
8 BLUE_GND
READY
13 CEC CEC R238
H_SYNC 0
3 13 12 CLK- HDMI_CK-
BLUE 11 CLK_SHIELD
CLK+
9 NC 10 HDMI_CK+
9
DATA0-
HDMI_D0- CEC R234
100
CEC_C
V_SYNC DATA0_SHIELD
4 14 8
DATA0+
GND_1 7
DATA1-
HDMI_D0+
10 SYNC_GND 6
DATA1_SHIELD
HDMI_D1-
5
DDC_CLOCK
5 15 C211
DSUB_SCL 4
DATA1+
HDMI_D1+
DDC_GND
ZD211
33pF
READY 3 DATA2- HDMI_D2-
30V DATA2_SHIELD
2
DATA2+
1 HDMI_D2+
16 SHILED
JK203
USB(SIDE) +5V_USB
Close to SIDE_USB
L220 R220
C220 C221 120-ohm 0 READY
10uF 100uF D220 C
10V 16V
3AU04S-305-ZC-(LG)
JK202 AC A
IC202
1
AP2191SG-13
USB DOWN STREAM
USB_DN READY
NC GND R222
8 1 510
3
USB_DP READY
READY READY OUT_2 IN_1 L221
7 2
ZD220 ZD221
30V 30V +3.3V_M 120OHM
4
READY
Copyright © 2012 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
EAX64671103
LP24B
+3.3V_M SW_RESET
R306 C307
10K 1000pF
50V
SPK_L+
50V
L309 D301
SOUND_VCC 1N4148W R316 R318
22000pF
BLM18PG121SN1D L303
100V 12 12 R320
C312
10.0uH C329
I2S_MCLKR360 100 OPT 0.1uF
C321 50V 4.7K
390pF L304
50V C327
10.0uH 0.47uF
OUT1A_2
OUT1A_1
PVDD1_3
PVDD1_2
PVDD1_1
C316
0.1uF
C317
10uF
50V
SPEAKER_L
VDD_IO
GND_IO
/RESET
PGND1A
C308 C341 C322 C330
10uF 50V 35V 390pF 0.1uF R321
CLK_I
BST1A
0.1uF D302 50V 50V
10V
[EP]
1N4148W R317 R319 4.7K
16V 100V 12 12
OPT
AD
SPK_L-
OPT
OPT C302 C306
C303 C305 10uF 0.1uF
4.7uF 0.1uF 10V 16V
16V 16V
48
47
46
45
44
43
42
41
40
39
38
37
C304
1000pF
C301 50V
100pF R307 AGND_PLL 1 36 OUT1B_2
50V 3.3K
AVDD_PLL 2 35 OUT1B_1
JP304
THERMAL
DVDD_PLL 3 49 34 PGND1B C320
SPK_L+ SPK_L+
22000pF 4
JP303
LF 4 33 BST1B 50V
SPK_L-
IC301 SPK_L- 3
DGND_PLL 5 32 VDR1 JP301
SPK_R+
OPT
GND_1 VCC_5 SPK_R+
C310
10uF
10V
C311
0.1uF
6 NTP-7500L 31 JP302
SPK_R-
2
READY
C314 C313
R328 R329 33pF 33pF
4.7K 4.7K 50V 50V SPK_R+
SCL
/FAULT
MONITOR0
MONITOR1
MONITOR2
BST2B
PGND2B
OUT2B_1
OUT2B_2
PVDD2_1
PVDD2_2
PVDD2_3
SOUND_VCC D303 R324 R326
+3.3V_M 1N4148W 12 12 L305
100V 10.0uH C336 R330
OPT
C342 0.1uF 4.7K
390pF L306 C339 50V
50V 0.47uF
+3.5V_ST
C333 C360
10.0uH 50V
SPEAKER_R
0.1uF 10uF C337
390pF
50V 35V D304 50V C331 R331
C324 1N4148W R325 R327 0.1uF 4.7K
22000pF 100V 12 12 50V
OPT
R338 50V
10K R315 SPK_R-
C 100 C318
R340 B 1000pF
HW_RESET Q302 50V
10K MMBT3904(NXP)
E
C350
0.1uF
16V Q350
MMBT3904(NXP)
C
E
B R351 1K 1 OUT1 OUT4 14
C351 R352 10K
MNT_LOUT 6800pF
50V
R350
4.7K C352 33pF 50V 2 INPUT1- INPUT4- 13
R353
6.8K
MNT_L_AMP
R354 5.6K 3 INPUT1+ INPUT4+ 12
P_12V
4 VCC GND 11
C353
0.01uF
50V
MNT_R_AMP
R355 5.6K 5 INPUT2+ INPUT3+ 10
C354 33pF 50V
P_12V
R356 10K 6 INPUT2- INPUT3- 9
C355 R357
0.1uF 6.8K
16V Q351
MMBT3904(NXP)
C
E
B R358 1K 7 OUT2 OUT3 8
MNT_ROUT
R359 C356
4.7K 6800pF
50V
Copyright © 2012 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
EAX64671103
LP24B
IF IR
TU401
TDTK-G703D
Soft/T
R420
100
SUB_SCL Soft/T
10P_S/T
P400
12P_TACT
P401
15P_S/T
P402
R421
100 12507WR-10L 12507WR-12L 12507WR-15L
NC_1 SUB_SDA
Soft/T Soft/T
1 ZD420
5.6V
ZD421
5.6V
10P_S/T
R418
0
S/T_SCL NC NC
+3.5V_ST 1 1 1
NC_2 10P_S/T
2 R422 R423
L422
R419
0
S/T_SDL
2
NC
2
NC
2
10K 10K
120-ohm
NC_3 KEY1
L423 GND GND GND
3 KEY2 READY READY
120-ohm 3 3 3
C420 C421 Non_Adapter Non_Adapter
0.1uF 0.1uF
RF_AGC C422
470pF
50V
C423
470pF
50V
KEY1
4
KEY1
4
KEY1
4
4 R401
100 RF_AGC
READY READY
5V_TUNER C401 C400 KEY2 KEY2 KEY2
B+[+5V] Near the pin
0.1uF
16V
0.1uF
16V +3.3V_M +3.3V_M 5 5 5
5 +3.5V_ST
6 C405
R404
47
TUNER_SDA
+3.5V_ST 0.1uF
16V
1000pF
50V GND GND GND
47pF
7 7 7
50V R424
SCL 4.7K
7 C406
R405
47 TUNER_SCL LED
R426
10P_S/T
R415
LED_R
8
NC
8
NC
8
47pF 10K C426 0
50V 100pF
NC_4 50V
READY IR IR IR
8 9 9 9
READY ZD422
R406 5.6V
0
NC_5 IR
L426 GND
10
GND
10
GND
10
9 READY
C427
0.1uF
120-ohm READY
C428
47pF
READY 50V
R407 50V
0 11 NC NC
AIF+ 11 11
10 IF_P .
LED NC
12 12
AIF-
11 IF_N 13 GND
13
.
S/T_SCL
14
12
S/T_SDL
15
SHIELD 16
Copyright © 2012 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
+3.3V_M +3.3V_M +3.3V_M
EAX64671103 R560
HD_Non_Mirror
4.7K R561
FHD_8Bit
4.7K R562
HD_Non_Mirror
4.7K R563
HD_Mirror
4.7K R658
Ready
4.7K R659
Ready
4.7K *H/W OPTION
MODEL_OPT1 MODEL_OPT2
R561-*1 4.7K
LP24B R560-*1 4.7K
HD_Mirror FHD_10Bit
R562-*1
FHD_8BIT
4.7K R563-*1
FHD_10BIT
4.7K
HD_Non_Mirror
HD_Mirror
LOW
LOW
LOW
HIGH
MSTAR Vcc
MODEL_OPT3 FHD_8BIT HIGH LOW
FHD_10BIT HIGH HIGH
MODEL_OPT2
ST 1.26V
MODEL_OPT1 L500
+1.2V_VDDC VDDC
120-ohm
C501 C502 C503 C504 C505 C506 C500
10uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
DDR 2.5V
L501
VDDC AVDD_DDR AVDD_25 AVDD_ST33 AVDD_PLL +2.5V_M AVDD_DDR
120-ohm
C507 C508 C509 C510 C511
10uF 0.1uF 0.1uF 0.1uF 0.1uF
L502
AVDD_25
H10
H11
J10
J11
K10
K11
A12
F13
G13
E13
M11
M10
120-ohm
C512 C513
G1
G2
G3
P4
R4
R5
T5
P6
P7
R7
T7
H9
J9
K9
N6
L8
L7
K8
K7
J8
J7
H8
H7
G8
D9
N5
H6
K6
J6
M5
J5
L5
K5
M6
L6
J4
K4
H4
0.1uF 0.1uF AVDD 2.5V
GND_3
GND_4
GND_5
GND_17
GND_20
GND_21
GND_23
GND_18
GND_19
GND_22
GND_24
GND_7
GND_8
GND_9
GND_10
GND_11
GND_12
GND_13
GND_14
GND_15
GND_1
GND_2
GND_6
GND_16
VDDC_7
VDDC_6
VDDC_5
VDDC_4
VDDC_3
VDDC_2
VDDC_1
AVDD_1P2
AVDD_DDR_3
AVDD_DDR_1
AVDD_DDR_2
AVDD_DDR_5
AVDD_DDR_4
NC_3
AVDD_25
AVDD_REF
AVDD_AU25
AVDD_AU33
AVDD_PLL
AVDD_MOD_2
AVDD_MOD_1
AVDD_MOD_4
AVDD_MOD_3
AVDD_33
AVDD_DMPLL
AVDD_DVI
L503
120-ohm
ST 3.3V
R508
+3.5V_ST AVDD_ST33
3.3
D6 R509 C514 C515 C516 C517 C518 C547 C548
CEC_C CEC 10uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
D5 AVDD_DDR 3.3
HOTPLUGD
C7
RXCKN_D READY
B7 1%
RXCKP_D R502 L504
C6 K13 1.2K 120-ohm
RX0N_D MVREF AVDD_PLL
B6 D7 READY
RX0P_D NC_1 1% C545
A6 L4 C521 R503 10uF
0.1uF 1.2K
RX1N_D NC_2
C5
RX1P_D
C4 D13
DDCDD_DA GND_EFUSE
A5 C13
RX2N_D TESTPIN
B5 R504
B4
RX2P_D
DDCDD_CK SAR2/GPIO73
C10
0
R505
LED
EEPROM(64K)
D4 C11 R506 100 IC503
HPD HOTPLUGA SAR1/GPIO74 KEY1
A3 B11 R507 100
AT24C64D-SSHM-T +3.5V_ST
HDMI_CK- RXCKN_A SAR0/GPIO75 KEY2
A2 B15 100
HDMI_CK+ RXCKP_A SPI_CZ SPI_CZ A0 VCC
B3 B16 1 8
HDMI_D0- RX0N_A SPI_DO SPI_DO
B2 C16 C572
HDMI_D0+ RX0P_A SPI_DI SPI_DI A1 WP 0.01uF
B1 C15 2 7
50V R576 R577
HDMI_D1- RX1N_A SPI_CK SPI_CLK 4.7K 4.7K
C3 A2 SCL
HDMI_D1+ RX1P_A
DDC_SDA
D3
DDCDA_DA USB1_DP
B13
3 6
R578
EEP_SCL
USB_DP
C1 A13 GND SDA 22
HDMI_D2- RX2N_A USB1_DM
HDMI_D2+
C2 A14
USB_DN 4 5
C573 C574 R579
EEP_SDA
RX2P_A USB0_DP 33pF
D1 A15 33pF
READY
22
DDC_SCL DDCDA_CK USB0_DM READY
D2 R564
HDMI_ARC ARC 4.7K
E4 D11 +3.5V_ST
HSYNC0 DDCA_DA DSUB_SDA
E3 D10 R511 22
BIN0P DDCA_CK R513 DSUB_SCL R565
R552 C539 E2 B9 R512 22 100 4.7K
SOGIN0 IRIN IR
68 0.047uF F3
F2
GIN0P
GIN0M
IC501 HWRESET
A9
HW_RESET
COMP_PB
R557 C544
0.047uF
F1
F4
RIN0P
VSYNC0
LGE7833 PWM0/GPIO26
PWM1/GPIO25
B12
C12
PWM_DIM R514
A_DIM
SERIAL FLASH(2MB)
+3.5V_ST IC502-*1
W25Q16BVSSIG(TRAY)
33 H3 D12 R558 100 FLASH_WP R515 1K
R556 C543 BIN1P GPIO66
COMMON_VIN 33 1000pF H2 A11 1K SPI_MACRONIX CS
1 8
VCC
GPIO28/TTL_LHSYNC/RLV0P
GPIO27/TTL_LVSYNC/RLV0N
M3
GPIO20/TCON20/VGH_EVEN
GPIO14/TCON14/SCAN_BLK
AUL3 RL_ON C
GPIO21/TCON21/VGH_ODD
N3 R580
GPIO30/TTL_LCK/RLV1P
GPIO29/TTL_LDE/RLV1N
LVBCKP/TTL_R0/RLV5P
LVBCKN/TTL_R1/RLV5N
GPIO19/TCON19/GCLK6
GPIO18/TCON18/GLKC5
GPIO17/TCON17/GLKC4
GPIO13/TCON13/LEDON
GPIO10/TCON10/OTP_N
N4 33K
LVA4P/TTL_B0/LLV6P
LVA4N/TTL_B1/LLV6N
LVA3P/TTL_B2/LLV5P
LVA3N/TTL_B3/LLV5N
LVA2P/TTL_B6/LLV3P
LVA2N/TTL_B7/LLV3N
LVA1P/TTL_G0/LLV2P
LVA1N/TTL_G1/LLV2N
LVA0P/TTL_G2/LLV1P
LVA0N/TTL_G3/LLV1N
LVB4P/TTL_G4/LLV0P
LVB4N/TTL_G5/LLV0N
LVB3P/TTL_G6/RLV6P
LVB3N/TTL_G7/RLV6N
LVB2P/TTL_R2/RLV4P
LVB2N/TTL_R3/RLV4N
LVB1P/TTL_R4/RLV3P
LVB1N/TTL_R5/RLV3N
LVB0P/TTL_R6/RLV2P
LVB0N/TTL_R7/RLV2N
GPIO16/TCON16/WPWM
GPIO11/TCON11/HCON
C
GPIO12/TCON12/DPM
GPIO9/TCON9/OTP_P
GPIO4/TCON4/GCLK3
GPIO3/TCON3/GCLK2
GPIO2/TCON2/GCLK1
B Q581-*1
220K
GPIO6/TCON6/FLK
GPIO5/TCON5/SOE
GPIO1/TCON1/VST
GPIO0/TCON0/POL
E
XOUT
NC_4
VIFM
VIFP
R581 0
P_24V
XIN
READY KDS181
D582 R587
R582 0 R584 1K 150
P_12V
T3
R3
P5
R6
T6
T4
P10
R10
P11
R11
T11
P12
T12
R12
P13
R13
P14
R14
T14
T15
R15
R16
P15
P16
N14
N15
M14
M15
M16
L16
K14
K16
L15
K15
G16
F15
F14
E14
D14
D16
D15
G15
F16
H16
L14
J16
H15
J15
E16
J14
H14
E15
N10
N11
N12
N13
D581
KDS181
R585 R586
11K 1% 5.1K C582 C582-*1
R559 READY 47uF 47uF
0 25V
R545 25V
1M C530-*1 LIFE_1000H LIFE_2000H
C527 120pF C526
0.1uF 50V 0.1uF 22LV2130-TD Must be applied 2000H
50V 50V R541 R532 R531 REASON : CAP LIFE for CST TEST
10K R540 100 100
For NTSC R542 10K R527 R526
X501 R543 RL_ON 100
51 C530 51 R529 R528 100
220pF C523 R539
50V 0.1uF 100 R530 100 100
L505 C522
24MHz 0.022uF 100
READY For PAL 120-ohm
C529 C528 C525 READY 16V
33pF 33pF 390pF C524
L521 390pF R534 C580 R591
100NH +3.3V_M R533 10K +3.5V_ST HW_RESET
10K 4.7uF 10V 100
RXECK+
RXECK-
RXOCK+
RXOCK-
RXE0-
RXE1+
RXE1-
RXE2+
RXE2-
RXE3+
RXE3-
RXE4+
RXE4-
RXO0+
RXO0-
RXO1+
RXO1-
RXO2+
RXO2-
RXO3+
RXO3-
RXO4+
RXO4-
KDS181
TUNER_SDA
MODEL_OPT3
EEP_SCL
EEP_SDA
RL_ON
RXE0+
RXE0-
RXE1+
RXE1-
RXE3+
RXE3-
RXO3-
RXO4+
RXO4-
RXECK-
RXE2+
RXE4+
RXE4-
RXO0+
RXO0-
RXO1+
RXO1-
RXO3+
RXECK+
RXOCK-
RXE2-
RXOCK+
RXO2+
RXO2-
IF_N
IF_P
Copyright © 2012 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
EAX64671103
LP24B
PANEL_VCC
P602
WAFER_FHD_51P
P600 FF10001-30 L620
FI-RE51S-HF-J-R1500 WAFER_HD_19_22 120-ohm
HD_19_22
Copyright © 2012 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
EAX64671103 [Pinmap for EEFL]
LP24B FROM LIPS & POWER B/D
PIN LIPS CMI(PSU) AUO(PSU) IPS(PSU) LGD(PSU)
RL_ON P_24V_ADAPTER 18(12) INV_ON INV_ON INV_ON INV_ON INV_ON ** 3.5V_ST -> 1.26V VDDC
+3.5V_ST Q701 RL_ON2
2SC3052
L704 20(13) VBR-A NC NC NC VBR-A +3.5V_ST V0 = 0.8*(1+(R2/R1)) +1.2V_VDDC
P_24V SOUND_VCC
C
120-ohm
ADAPTER IC701
RL_ON NON_ADAPTER MP20051 OUT:1.27V
R701
RL_ON NORMAL_EXPEPT_32 NORMAL_32 L703 R708 22(14) PWM_DIM PWM_DIM PWM_DIM PWM_DIM PWM_DIM [EP]GND
4.7K
B
THERMAL
R702 C PWR ON 1 24V
2
RL_ON
1
23 GND NC NC NC NC IN_1 OUT_2
9
10K 24V 24V 7 2 R742
B Q702 3 2 4
RL_ON C740 1
2SC3052 22_LAMP GND GND
5 3 6 10uF
R700 GND GND 10V NC FB
E 0 7 4 8 +3.3V_M R1
6 3 READY
3.5V 9 10 3.5V
5
ADAPTER_NON_LED_DRIVER 1% C742 C746
3.5V 11 12 3.5V NON_LED_DRIVER R744 R740 10uF 10uF
+3.5V_ST R2
+3.5V_ST
GND 13
6
7 14 GND
R712
100 R714 [Pinmap for Edge LED] 10K EN
5 4
GND
1% 2.74K 6.3V 6.3V
GND GND/V-sync
POWER_18_INV_CTL 1K R741
NON_ADAPTER 15 8 16 R710 INV_CTL_26INCH 4.7K
100 C741
L701
12V 17 9 18 INV ON R715 PIN LPB CMI(PSU) AUO(PSU) IPS(PSU) LGD(PSU) 0.1uF
12V A.DIM 10K 16V
19 10 20
C701 C702 120-ohm 12V P.DIM1 C NON_LED_DRIVER
100uF 0.1uF 21 22 R711 R716
16V 16V GND/P.DIM2
11
POWER_24_INV_CTL
P_12V Q703
POWER_16_GND
NON_ADAPTER
0
0.1uF 20(13)
R706
NC NC NC NC NC
47uF
25V
50V
NON_ADAPTER
P703
SMAW200-H24S2
R720 0 R718
** 3.3V_M -> 2.5V_M
10K 22(14) PWM_DIM PWM_DIM PWM_DIM PWM_DIM PWM_DIM
POWER_24_GND A_DIM
ADAPTER POWER_18_A_DIM
JK700 R707
+3.3V_M IC702
0 R721 0 C709 AP2114H-2.5TRG1 +2.5V_M
JPD003N-M432-4F P_24V_ADAPTER POWER_22_A_DIM 2.2uF 24(11) ERR_OUT ERR_OUT ERR_OUT ERR_OUT ERR_OUT
24V
VIN 3 2 VOUT
R722 0
POWER_20_A_DIM C743 C744
23 NC NC NC NC NC 10uF 0.1uF 1 R743
R723 0 10V 16V GND 1
SW C712
0.1uF POWER_20_PWM_DIM C745
50V R724 0 R729 1K 10uF
GND ADAPTER PWM_DIM 6.3V
POWER_22_PWM_DIM
R725 0
POWER_24_PWM_DIM
R730
6.2K
[Power for EEFL] [Power for LED]
R726 0
ADAPTER_NON_LED_DRIVER PWM_DIM_26INCH
ADAPTER_NON_LED_DRIVER
LGD OS LGD OS
P705
SM14B-SRSS-TB
R727 0
PWM_DIM_LED_DRIVER
+24V_LED_driver LED_DRIVER 32" ’11 PSU 32"
24V
1 ’11 PSU
2
24V
ADAPTER_NON_LED_DRIVER
C713 C714 R732 100
37" ’1O LIPS ’11 PSU 37" ** +3.5V_ST -> 3.3V_M D
Q710-*1
0.1uF 0.01uF ERROR_OUT G
50V 50V POWER_20_ERROR_OUT AO3435
24V
3 ADAPTER_NON_LED_DRIVER R733 100 42" ’1O LIPS ’11 PSU 42" ’11 LPB ’11 PSU +3.5V_ST S AOS
8
GND
+24V_AMP * Option block : ADAPTER
+24V_LED Driver
22K 4.7uF
16V
P_24V AO3407A Vgs : 10.8V(24V input)
9
GND
AO3407A Vgs : 8.3V(15V input) P_24V * Option block : ADAPTER
R749
GND C720 C721 R751 ADAPTER 2.2K
10
0.1uF 2.2uF 22K Q734 L730
50V 50V S AO3407A MLB-201209-0120P-N2 +24V_LED_driver C
ERROR_OUT
SOUND_VCC R747
11
ERROR_OUT_26INCH G C727 10K B Q711
R755
INV_ON
R752 C726
2.2uF
50V
22K POWER_SW 2SC3052
12 INV_CTL_26INCH 27K L731 3.3uH S
D CPI2520NHL3R3ME 2520 0.1uF Q732
50V AO3407A E
NC R753 C G
13 10K R757
POWER_SW B Q731 27K
C722 C723 C724 D
PWM_DIM MMBT3904(NXP) C725
14
PWM_DIM_26INCH 0.01uF 3.3uF 0.01uF 68uF C
50V R756
E 50V 50V 35V
15 R759 READY 10K B AO3407A Vgs : 10.8V
RL_ON2 Q733
0
GND
READY MMBT3904(NXP) C728
Close to AMP IC E 0.01uF
50V
+3.5V_ST * Option block : ADAPTER *12V -> PANEL_5V (OPTION) ** Switch Panel-Vcc
R782
100K 0CZZB00110A : 22uF 20% 10V X7R 3216 V0 = 0.8*(1+(R1/R2)) +5V_PANEL P_12V
EAE58111001 : 22uF 20% 16V X5R 3216 NR8040T3R6N +5V_PANEL
Switching noise reducing [MPS recommend] C733
EAE62281601 : 22uF 20% 10V X5R 2012 L782 PANEL_VCC
0.1uF 50V
PANEL_5V PANEL_5V PANEL_12V Q720
L760 L761
IC707 +3.5V_ST IC706 C794
3.6uH
R1 C797
READY
C799 C798
120-ohm 120-ohm AO3407A
Closed IC706 10uF
D
EP_GND MP4460DQ-LF-Z 1uF 10uF 0.1uF
R781
P_12V MP1497DJ R790
10V
22 L780 Placed on SMD-TOP 25V 30K 10V 16V READY
close to pin 3.6uH C793 C761
P_24V BST SW_1 0.01uF R794 1% 0.1uF R765 R766 R767
10 1
33 16V 4.7K 4.7K 4.7K
SS FB C760
THERMAL
G
NR8040T3R6N 33K
D730 R2
11
INPUT
C778
0.1uF
**12V->TUNER 5V V0 = 0.8*(1+(R1/R2))
3 IN
50V
AZ1117BH-ADJTRE1
3
* Option block : ADAPTER
5V_LDO_BCD
NR8040T3R6N
OUT:6.8V
AP1117EG-13
5V_LDO_DIODE
IC704-*1
ADJ/GND
+12V/+15V L771
OUTPUT
IC704
2
1
ADJ/GND 1
P_12V 330
OUT 2
0 $0.37
3
C787
3
R1 C779
ADJ/GND
0.1uF
IC705-*1
6 3
OUTPUT
GND BST 50V
IC705
5V_LDO_DIODE
4 5 R777
2
1
R2
R799 Q730
10K
R796 GND BG 0
6.8K 5 4 R776
R795 C773 +3.3V_M R775 330
ADJ/GND 1
4 5
1% G D_1
2
1% 3 6
0.1uF 110
120K S_3 D_2
16V +5V_USB
R797
OUT
2 7
S_2 D_3
1.6K
1 8
1% S_1 D_4
SI4124DY-T1-GE3(VISHAY)
READY
C781 C782
close to IC1009 0.1uF 100uF
16V 16V
Copyright © 2012 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes
EAX64671103
LP24B
TN_module_LED_DRIVER_CIRCUIT
D801
L801 PDS5100H-13
+24V_LED_driver 33uH
R810
5.1
C801 C802 R814
C803 C804 READY C807 C808 C809
2.2uF 2.2uF 560K
0.1uF 0.1uF C805 R811 2.2uF 10uF 2.2uF
50V 50V 50V 50V 1/10W
+3.3V_M 1000pF 3.3 D 100V 100V 100V
50V 1/10W
READY 5%
Q801
close to IC100 G AP18T10GH
3.3K -> 1K (threshold voltage up)
must be modifed S
R812
R803 3K OVP setting
+3.5V_ST 1K 1/8W
R815 R815-*1
R813 C806
13K 11K
R800 WLED_ENABLE 0.1 1000pF
1/10W 5% 1/10W 5%
10K C 1% 50V
R802 R804
READY 22_CMI_EDGE 21.5_AUO_LGD_EDGE
INV_ON 10K B
6.8K
Q800 READY
R120 : 6.8K --> 3K
R801 MMBT3904(NXP) E R121 : 0.03 --> 0.1 must be modifed
10K R816
READY
2010.06.30 HWSON wafer modify & resister add
4.7
[EP]PGND/LEDGND
1/10W
C810
0.1uF
50V
close to IC100
NDRV
PGND
C819
VCC
DRV
1uF
CS
2010.06.30. hwson 10V
C104 : 10uF --> 2.2nF for thermal Issue
C106 : 0.68uF --> 0.33uF
20
19
18
17
16
R113/R114
R111 : 470 --> 390 IN 1 15 OUT4
R817 Operating Freq.
WLED_ENABLE 100 2010.02.07 for PQ/19V_LED EN THERMAL
OUT3
F=7.35x10^9/RT 2 21 14
1/10W COMP IC800 LEDGND P800
3 13
R818 C811 R828 MAX16814 12507WR-06L
100pF R819 RT 4 12 OUT2
100K 50V 390 16K 1% FLT OUT1
1/10W 5 11
1/10W 10 1
6
7
8
9
C812 R820
2200pF
OVP
SETI
RSDT
SGND
DIM
C813 2
50V 0.33uF 51K 1%
50V READY C815 C816 C817 C818
1000pF 1000pF 1000pF 1000pF 3
R821 R822 50V 50V 50V 50V
R821-*1 R821-*2
R825 47K 51K
100 27K 59K 4
1/10W 1/10W
ERROR_OUT 1/10W 1/16W 1%
R826 1/10W 1% 5%
10K READY AUO_TN AUO_TN 1% CMI_TN ESD protection solution
5
LGD_TN
1/10W
R824
READY 10K R822-*2
R822-*1 6
59K
1/8W 27K
1/16W 1%
R823 1/10W 7
CMI_TN
7.5K 1%
1/8W LGD_TN
R827
100
PWM_DIM_LED_DRIVER
1/10W
C814
100pF
50V
34V_Typ
AUO_18.5_HD AUO_18.5 560Kohm 16Kohm 44.28V 18.5 AUO 30 34 36
60mA_Typ 36V_Max
47Kohm 51Kohm 61.35mA
63mA_Max 52.8V_Typ
AUO_21.5_FHD AUO_21.5 560Kohm 11Kohm 63.85V 21.5 AUO 48 52.8 57.6
57.6V_Max
Copyright © 2012 LG Electronics. Inc. All rights reserved. LGE Internal Use Only
Only for training and service purposes