ELECTROPLATING

Experiment No. 4

NAME: Cosido, Vladimer Jary T. DATE: 10/23/2023

COURSE, YEAR &SECTION: BSCE-1 M17 INSTRUCTOR: Engr. CJ Villarba

ABSTRACT

This experimental investigation pursued four key objectives related to redox reactions and
electroplating: distinguishing between oxidation and reduction processes, determining the
oxidation states of elements, identifying electron transfer, and characterizing elements as reduced
or oxidized, alongside defining the roles of reducing and oxidizing agents. Metal samples, such
as a key, concrete nail, and coin, were electroplated with copper using a 0.1 M copper sulfate
solution. At the anode, copper atoms underwent oxidation, transforming into copper (II) ions,
which dissolved into the electrolyte. Simultaneously, electrons were released in the oxidation
process, flowing from the anode to the cathode. The copper ions in the copper sulfate solution
experienced reduction through an electric current from a battery, resulting in a thin copper layer
forming on the plated objects.

Furthermore, the experiment introduced a quantitative approach by measuring the flow of

electrons through the electrolytic cell, which allowed for the calculation of the produced metal
amount. The study employed fundamental electrochemical equations and Faraday's constant to
establish a direct relationship between the electric charge, deposition time, and the molar mass
of the plating metal. The results indicated an increase in the mass of the plated object, providing
insights into the efficiency of the electroplating process. In conclusion, this research successfully
achieved its objectives, deepening the understanding of redox reactions and enabling a
quantitative assessment of electroplating efficiency, emphasizing the importance of controlled
electron transfer in the electroplating process.
INTRODUCTION

Electroplating, a fundamental electrochemical process, finds its roots in the pursuit of enhancing
the properties of various materials and objects, be it for improved aesthetics, increased durability,
or enhanced corrosion resistance (Johnson, 2022). This section serves to illuminate the
motivations and contexts that underpin the study of electroplating while providing a backdrop of
relevant research and established principles.

The fascination with electroplating stems from the desire to manipulate the surface properties of
objects to meet specific requirements. This practice dates back to the early 19th century when
Luigi Brugnatelli successfully plated silver onto a surface using electrical current (Bellis, 2019).
Electroplating, at its core, is a process wherein a metal coating is deposited onto a conductive
surface through a series of redox reactions in an electrolyte solution. The metal to be plated acts
as the cathode, while an anode, typically made of the plating metal or an inert material, completes
the electrochemical cell (Lou & Huang, 2006).

In the contemporary context, electroplating continues to be an essential technique in various

industries, including automotive, electronics, aerospace, and even jewelry making. Its versatility
stems from the ability to precisely control the thickness and composition of the deposited metal
layer. This, in turn, endows the plated objects with desired attributes, whether it's enhancing the
luster of jewelry, improving the resistance of components to corrosion, or even ensuring optimal
electrical conductivity. Such applications have rendered electroplating a topic of enduring
interest (Stringent Datalytics, 2023)

In this study, we seek to delve deeper into the intricacies of electroplating, differentiating between
oxidation and reduction reactions, determining oxidation numbers of the involved elements, and
identifying the electron transfer processes. Through a comprehensive exploration, our central
questions revolve around elucidating the fundamental mechanisms of electroplating, dissecting
the role of different elements, and quantifying the efficiency of this electrochemical process. The
subsequent sections will detail our experiment, hypotheses, and research questions, aiming to
unravel the mysteries behind this electroplating phenomenon while contributing to the ongoing
body of knowledge in this field.

EXPERIMENTAL (Materials and Methods)

In this experimental investigation, we aimed to explore the electroplating process in detail and
quantify the deposition of copper onto various metal substrates. To achieve this, we employed a
series of scientific procedures that allowed us to carefully study the electroplating phenomenon.
The materials used in the experiment included a 0.1 M copper sulfate solution, 0.5 M
hydrochloric acid, distilled water, sandpaper for surface preparation, and metal samples to be
plated, consisting of a key, concrete nail, and a piso coin. Additionally, we utilized three copper
plates, 100-mL beakers (three in total), two alligator clips for electrical connections, a 9V dry
cell as the power source, a stirring rod for mixing solutions, and an electronic balance for precise
measurements.

Our experiment followed a systematic set of steps. Firstly, the metal samples to be plated were
thoroughly cleaned using steel wool to ensure a clean and uniform surface, and their initial masses
were carefully recorded. Subsequently, we established an electrochemical cell by connecting the
metal to be plated (the cathode) to the negative electrode of the 9V dry cell using an alligator
clip. Simultaneously, another alligator clip connected a copper plate (the anode) to the positive
electrode of the dry cell. Both the metal to be plated and the copper plate were then placed into
one of the 100-mL beakers.

The electroplating process was initiated by immersing the metal samples in a 0.1 M copper sulfate
solution, allowing the process to proceed for a specific time, typically 2 minutes. After this
period, the metal to be plated and the copper plate were removed from the solution. The plated
metal samples were subsequently weighed, and their final masses were recorded. The mass of
copper deposited onto the metal samples was calculated by subtracting their initial mass from the
final mass. This process was repeated for each metal sample to be plated, ensuring comprehensive
data collection.

In this experiment, metal samples like key, concrete nail, and coin are to be plated with copper
though a 0.1 M copper sulfate solution. At the anode, copper atoms are oxidized into copper (II)
ions, allowing them to dissolve into the electrolyte.

𝑪𝒖(𝒔) → 𝑪𝒖𝟐+
(𝒂𝒒) + 𝟐𝒆 − (oxidation half-reaction equation)

The electrons released in the oxidation process then flow from the anode to the cathode. The
copper ions in the copper sulfate solution are reduced by the electric current from the battery to
form a thin layer of copper on the object to be plated.

𝑪𝒖𝟐+
(𝒂𝒒) + 𝟐𝒆−→ 𝑪𝒖(𝒔) (reduction half-reaction equation)

According to Michael Faraday's Law of Electrolysis, "the amount of electrical charge introduced
to the non spontaneous system is proportional to the chemical change produced and that a
quantity of electricity produces a corresponding amount of substance being electrolyzed".

If the amount of electrons flowing through an electrolytic cell could be measured, the amount
of metal produced could also be calculated. The amount of electrons flowing through the cell is
computed using the equation:

𝑸 𝑰𝒕
𝒏= =
𝑭 𝑭
where n is the number of moles of electrons flowing through solution, Q is the amount of charge
passing through the solution (in coulombs or ampere-seconds), I represent the amount of current
(in amperes), t is the deposition time (in seconds), and F is the Faraday's constant (96,485
coulombs per mole of electrons).

𝒎𝒐𝒍𝒆 𝒐𝒇 𝒑𝒍𝒂𝒕𝒊𝒏𝒈 𝒎𝒆𝒕𝒂𝒍

𝒎 = 𝒏(𝑴𝑴)
𝒎𝒐𝒍𝒆 𝒐𝒇 𝒆− 𝒕𝒓𝒂𝒏𝒔𝒇𝒆𝒓𝒓𝒆𝒅

The equations above can be combined, forming the equation:

The amount of metal produced is then calculated using the equation: where MM is the molar
mass of the plating metal (in grams per mole of plating metal). The ratio of mole of plating metal
to mole of electrons transferred is based on the balanced reduction half-reaction equation.

𝑰𝒕 𝒎𝒐𝒍𝒆 𝒐𝒇 𝒑𝒍𝒂𝒕𝒊𝒏𝒈 𝒎𝒆𝒕𝒂𝒍

𝒎= (𝑴𝑴)
𝑭 𝒎𝒐𝒍𝒆 𝒐𝒇 𝒆− 𝒕𝒓𝒂𝒏𝒔𝒇𝒆𝒓𝒓𝒆𝒅
This equation allowed us to quantify the amount of copper that was successfully electroplated
onto each metal substrate, shedding light on the efficiency and effectiveness of the electroplating
process. In the subsequent stages of data analysis, appropriate statistical tests were conducted to
further examine and interpret the experimental results, enhancing our understanding of the
electroplating process.

RESULT

Trial No. Object Mass Mass Mass of copper Mass of Percentage

to be before after deposited copper Difference
plated plating plating (experimental) deposited
(theoretical)
1 Key 5.68 g 5.70 g 0.02 g 0.03 33.33%

2 Nail 4.68 g 4.70 g 0.02 g 0.04 50%

3 Coin 6.0 g 6.02 g 0.02 g 0.03 33.33%

Table 1. Summary of Results

The mass before plating is 5.68 g, the mass after plating is 5.70 g, the mass of copper deposited
(experimental) is 0.02 g, the mass of copper deposited (theoretical) is 0.03 g, and the percentage
difference is 33.33% for the first object to be plated (key). The mass before plating is 4.68 g, the
mass after plating is 4.70 g, the mass of copper deposited (experimental) is 0.02 g, the mass of
copper deposited (theoretical) is 0.04 g, and the percentage difference is 50% for the second
object that was coated (nail). For the third object that was plated (a coin), the mass before plating
was 6.0 g, the mass after plating was 6.02 g, the mass of copper that was deposited (in an
experiment) was 0.02 g, the quantity that was deposited (in a theoretical calculation) was 0.03 g,
and the percentage difference was 33.33%.

DISCUSSION

The experimental investigation into electroplating yielded several important findings that shed
light on the electrochemical process and the deposition of copper onto different metal substrates.
The discussion section outlines the significant observations, the relevance of these results to our
initial hypotheses, and the theoretical implications for broader scientific understanding.

First and foremost, the experiment demonstrated that electroplating successfully allowed for the
deposition of copper onto the metal samples, as evidenced by the observed changes in the mass
of the plated objects. Specifically, the weight of the metal samples increased like the key (from
5.68 g to 5.70 g), indicating the addition of a copper layer, thus validating the effectiveness of
the electroplating process.

The results revealed a consistent pattern in the deposition of copper across the different metal
substrates. This pattern aligns with our expectations and establishes electrochemical principles,
where copper ions are reduced at the cathode (the metal to be plated) while copper atoms are
oxidized at the anode (the copper plate). The experiment's outcomes conform to our hypotheses,
further highlighting the fundamental principles of redox reactions involved in electroplating.

While the results were generally in agreement with our expectations, there are variations due to
factors such as surface irregularities, variations in the contact between the metal samples and the
copper plates, and the exact timing of the electroplating process. These factors could introduce
minor inconsistencies in the deposition of copper.
The theoretical implications of these findings extend beyond the specifics of electroplating and
can be applied to broader scientific contexts. The study reinforces the importance of controlling
electroplating parameters, which is crucial not only for precise manufacturing but also for fields
such as corrosion protection, electronics, and even environmental considerations where efficient
metal deposition is essential. Furthermore, these results emphasize the universality of redox
reactions and their role in various electrochemical processes. To explore any contradictions or
exceptions in the future, additional research might focus on the influence of factors such as
temperature, concentration of the electrolyte, and surface preparation methods on the
electroplating efficiency. Such investigations could further refine our understanding of the
electroplating process and its potential applications in diverse fields.

CONCLUSION

In conclusion, this experimental investigation accomplished its primary objectives focused on

understanding redox reactions and the electroplating process. The study effectively distinguished
between oxidation and reduction reactions, determined the oxidation states of elements, identified
electron transfer processes, and characterized elements as either reduced or oxidized, while
defining the roles of reducing and oxidizing agents. Through the electroplating of metal samples
including a key, concrete nail, and coin with copper using a 0.1 M copper sulfate solution, the
experiment revealed the underlying mechanisms involved. At the anode, copper atoms underwent
oxidation, converting into copper (II) ions that dissolved into the electrolyte, while
simultaneously, electrons were released, flowing from the anode to the cathode. The copper ions
in the copper sulfate solution were reduced through an electric current from a battery, resulting
in the deposition of a thin copper layer on the plated objects. This research not only achieved its
objectives but also contributed to a deeper comprehension of redox reactions and allowed for a
quantitative assessment of electroplating efficiency, emphasizing the crucial role of controlled
electron transfer in the electroplating process.

REFERENCES

Johnson, M. (2022). Electroplating. https://study.com/academy/lesson/electroplating-process-

princples-uses.html

Bellis, M. (2019). The History of Electroplating. https://www.thoughtco.com/history-of-

electroplating-1991599

Lou H. & Huang Y. (2006). Electroplating.

https://www.in.gov/idem/ctap/files/ctap_lou_2006_electroplating.pdf

Stringent Datalytics (2023). Shining the Spotlight on the Booming Electroplating Market:
Uncovering the Key Trends, Growth Opportunities, and Future Prospects.
https://www.linkedin.com/pulse/shining-spotlight-booming-electroplating-market-uncovering