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PVT-Invariant Single-to-Differential Data Converter

with Minimum Skew and Duty-Ratio Distortion


Youn-Sik Park1,2, Sung-Wook Lee1, Bai-Sun Kong1 Kwang-Il Park2, Jeong-Don Ihm2, Joo-Sun Choi2,
Young-Hyun Jun2
1 2
School of Information and Communication Engineering, DRAM Design Team, Semiconductor Business,
Sungkyunkwan University, Samsung Electronics Co., Ltd.,
Suwon, Korea Hwasung, Korea
E-mail: parkave@samsung.com

Abstract— This paper proposes PVT-invariant single-to-


II. SINGLE -TO-DIFFERENTIAL DATA CONVERTERS
differential signal converter (SDC) applicable to the output
circuitry of high-speed DDR SDRAM. The proposed SDC A. Conventional SDCs
generates PVT-invariant differential-output sampling clock
using a phase interpolation technique and a symmetric Figure 1 shows the conventional single-to-differential
structure, and improves the aperture window of output data in signal converters (SDCs) that are used to generate fully
source synchronous DDR SDRAM. The proposed SDC was differential clocks (CKO and CKOB) from a single-phase
simulated using 1.8-V 80-nm DRAM technology. The clock (CKI). The inverter-typed SDC is shown in Figure 1-(a),
comparison result indicates that the differential clocks in which two inverter stages are arranged along the in-phase
generated by the proposed SDC achieve 80.6% reduction of path and three inverter stages are arranged along the out-of-
skew, 76.6% reduction of duty-cycle distortion, 61.7% of phase path [2]. To minimize the difference of the propagation
reduction of delay variation, and 8.5% reduction of maximum delays of two paths, different structures of inverters with
current for a given process, voltage, and temperature (PVT) different sizes were used, as shown in the figure. But, the
variations, as compared to conventional SDCs. The I/O interface inverter-typed SDC was not suitable for high-speed operation
of a source-synchronous DDR SDRAM designed using the because of slow transitions of middle node (X) in the in-phase
proposed SDC, which is operating at 1.0-Gbps/pin data rate has path, a large amount of short-circuit current in output driver
aperture window increased by 15.3% and ISI improved by stage, and a large sensitivity to PVT variations.
67.7% in comparison to conventional I/O interface.

I. INTRODUCTION
Source-synchronous DDR SDRAMs usually have a
conversion scheme to convert its internal parallel data into
serial output data by sampling the internal data at both the
rising and falling edges of a synchronization signal [1]. In an
I/O interface for source-synchronous DDR SDRAM operating
at more than 1.0 Gbps data rate, the timing margin for fetching
the data from SDRAM becomes narrow since the output has a
narrow aperture window. This narrowing is usually due to the G
skew and duty cycle distortion of the differential clock used G
by the interface. For solving this problem, the quality of (a) (b)
differential sampling clock affecting the duty cycle of data Figure 1. Conventional single-to-differential signal converters (SDCs) : (a)
output is very important. However, the operation of inverter-typed SDC, (b) transmission gate-typed SDC.
conventional single input-to-differential output converters is
very sensitive to variations on process, voltage, temperature To compensate these shortcomings, a transmission gate-
(PVT) [2], [3]. This paper proposes a novel single input-to- typed SDC was proposed [3]. As shown in Figure 1-(b), to
differential data converter (SDC) that is configured as a provide the same number of MOS gates on each path,
symmetric structure and employs a phase interpolation transmission gate was inserted on the in-phase path. To
technique for providing PVT variation-insensitive operation. compensate slow transitions of middle node (X) caused by the
insertion of transmission gate, a buffer that uses NMOS
transistor for pull-up and PMOS transistor for pull-down was

Youn-Sik Park studies on a scholarship from Samsung electronics Co., LTD.


This work was supported by Samsung electronics Co., LTD.

978-1-4244-1684-4/08/$25.00 ©2008 IEEE 1902


added. But, asymmetric structure here also resulted in signal skew and duty cycle distortion on the output. In case of the
skew and duty cycle distortion due to PVT variations. simulated waveforms of the proposed SDC shown Figure 3-
(c), middle nodes (X, Y) have full swing, reducing the signal
B. Proposed SDC skew and duty cycle distortion on output node.
The proposed single-to-differential signal converter (SDC)
shown in Figure 2 is configured as a fully symmetrical
structure and employs phase interpolation technique. The
proposed SDC receives single-phase input clock (CKI), and
generates in-phase and out-of-phase output clocks (CKO,
CKOB). The in-phase and out-of-phase paths of the proposed
SDC have the same structure to each other since the outputs of (a)
single-stage inverter and two-stage inverter in each path are
interpolated together.

(b)

(c)
Figure 3. Waveforms of SDCs: (a) conventional inverter-typed SDC, (b)
G conventional transmission gate-typed SDC, (c) the proposed SDC.
Figure 2. Proposed SDC.

When CKI transitions high, node X begins a pull-up


transition toward VDD-VTN by the NMOS transistor of buffer B.
After the input inverter delay, CKIB transitions low, and then,
the PMOS transistor of buffer A helps X to be pulled up to full
VDD. So, the waveform on X is the result of the interpolation
between waveforms of buffer A and B. At the same time, node
Y begins a pull-down transition toward VSS by the NMOS (a)
transistor of buffer C. After CKIB transitions low, the PMOS
transistor of buffer D helps Y to be pulled down to VSS+|VTP|.
So, the waveform on Y is the result of interpolation between
waveforms of buffer C and D. The same phase interpolation
occurs when CKI transitions low. During these transitions, the
signal slopes of X and Y are made to be symmetrical by the
cross-coupled inverters connected between these nodes [4].
Therefore, the proposed SDC can minimize the skew between (b)
differential clocks and duty-cycle distortion of each output
clock caused by PVT variation, resulting in improved
electrical characteristics.

C. Comparison Results
To verify the performance, the proposed SDC was
designed using 1.8-V 80-nm DRAM technology. HSPICE
simulation for the proposed and conventional SDCs was done (c)
with clock cycle time of 2.0ns at 35 process corners reflecting
the variations of voltage, process, temperature and input
clock slope. Figure 3 shows that the simulated waveforms of
middle node (X, Y) and output node (CKO, CKOB) of each
SDCs for the worst simulation corner (operating
voltage=1,1V, process parameter=slow, temperature= −10°C,
input clock slope=500ps). Figure 3-(a) and (b) show the
simulated waveforms of the conventional inverter-typed SDC (d)
and transmission gate-typed SDC, which shows partial swing Figure 4. Comparison of SDC characteristics: (a) signal skew, (b) signal
at middle nodes (X, Y). This behavior can increase signal duty, (c) propagetion delay, (d) average currnet consumption.

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Figure 4 shows the performance comparison of SDCs in Figure 5 shows the block diagram for the output interface
terms of signal skew, duty variation, delay variation, and the of a DDR SDRAM. It consists of a parallel-to-serial data
variation of average current for all possible conditions on converter to converter parallel data into serial data, a set of
voltage, process, temperature, and input clock slope. The latches to capture the serial data coming from the data
simulation results indicate that the proposed SDC provides a converter, and the proposed SDC to define the timing point of
reduced amount of skew and duty-cycle variation, and it has the latches. Figure 6 shows a simplified schematic diagram for
smaller propagation delay and average current consumption the parallel-to-serial data converter. It has two data converters:
than conventional SDCs. That is, the amount of skew was one for converting from 4 parallel LSB data to serial split data
reduced from 139ps to 27ps (80.6%), the duty variation was (Figure 6-(a)), and the other for converting from 4 parallel
decreased from 470ps to 110ps (76.6%), the variation of the MSB data to serial split-and-shifted data (Figure 6-(b)).
propagation delay was decreased from 379ps to 145ps Internal 8-bit parallel data are converted into these two groups
(61.7%), and the maximum average current consumption was of serial data by the sampling, hold, and shifting circuits
decreased from 0.47mA to 0.43mA (8.5%) in comparison to controlled by four local pulsed clocks (QCLK0~QCLK3), as
the conventional SDCs. shown in the figure.

III. APPLICATION
In general, a source-synchronous DDR SDRAM has its
internal data transferred in parallel, while they are transmitted
and received in series for external communication. So, a
parallel-to-serial data converter is required as I/O interface of
a DDR SDRAM.

G
Figure 7. Timing diagram of DDR SDRAM output circuitry using the
proposed SDC.
G
Figure 5. Block diagram of the DDR SDRAM output circuitry using the Figure 7 shows the timing diagram for 8-bit parallel-to-
proposed SDC.
serial data conversion. In this conversion, 8 parallel data are
sampled by four local pulsed clocks (QCLK0~QCLK3), and
are divided into the split data and the split-and-shifted data.
Then, they are converted into 8 serial data triggered at the
rising edges of differential clock generated by the proposed
SDC [5]. During the conversion, split data is transferred to
latch-A controlled by CKO that is generated by the proposed
SDC, and split-and-shifted data is transferred to latch-B
controlled by CKOB that is also generated by the proposed
(a)
SDC. The outputs of the latches are merged to generate 8-bit
of serial data having 1/2-clock pulse width by alternating
operations between latch-A and latch-B, and fed into the
output driver for driving DQ lines.
Layout picture of the I/O interface using the proposed
SDC for a source-synchronous DDR SDRAM is shown in
Figure 8. The parallel-to-serial data converters for generating
split data and split-and-shifted data are located symmetrically
at the top and bottom sides of the layout. The proposed SDC,
data output driver and other control logic are located in the
O‰PG middle of the layout picture.
Figure 6. Simplified schematic diagram of the parallel-to-serial data
converter: (a) conversion from 4 parallel data to serial split data, (b)
conversion from 4 parallel data to serial spit-and-shifted data.

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Figure 9 shows the simulated eye diagrams of the I/O
interface designed using the conventional and proposed SDCs.
The figure represents the amount of aperture window and
inter-symbol interference (ISI) due to PVT variations. The
aperture window was increased from 744ps to 858ps (15.3%)
and the ISI was decreased from 167ps to 54ps (67.7%) for
data rate of 1.0 Gbps/pin in comparison to the conventional
G SDCs.
Figure 8. Layout picture of I/O interface for a source-synchronous DDR
SDRAM using the proposed SDC.
IV. CONCLUSION
In this paper, single-to-differential signal converter (SDC)
using a phase interpolation technique and a symmetric
structure is proposed and implemented for source-synchronous
DDR SDRAM output circuitry. It is shown that the proposed
SDC minimizes the skew and duty-cycle distortion of
differential clock, and overcomes the narrowing phenomenon
of output data aperture window of source-synchronous DDR
SDRAM so as to be suitable to high-speed operation.
According to the simulation result with 1.8-V 80-nm DRAM
technology, the signal skew on the PVT variation of
(a) differential-output sampling clock was reduced from 139ps to
27ps, and the output data aperture window was improved from
744ps to 856ps for data rate of 1.0Gbps/pin.

REFERENCES
[1] Changsik Yoo. et al., “A 1.8-V 700-Mb/s/pin 512-Mb DDR-II SDRAM
With On-Die Termination and Off-Chip Driver Calibration”, 2004
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DRAM Interface with Digital Calibration of Equalization Skew and
Offset Coefficients”, 2005 IEEE International Solid-State Circuits
Conference, pp.520-521, February 2005.
[3] Bradley K. Davis, “Low-Skew Single-Ended to Differential
Converter”, 2006 US Patennt 7,119,602 B2, September 30, 2004 Filed.
[4] Bruno W. Garlepp. et al., “A Portable Digital DLL for High-Speed
CMOS Interface Circuits”, 1999 IEEE Journal of Solid-State Circuits,
vol.34, pp.632-644, May 1999.
[5] Meng-Tzer Wong. et al., “A 2.5Gbps CMOS Data Serializer”, 2002
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[6] Jan M. Rabaey, “Digital Integrated Circuits”, Prentice Hall, 2003.
(c)
[7] William J. Dally, “Digital Systems Engineerings”, Cambridge, 1998.
Figure 9. Comparison of I/O chnnel characteristics by SDCs: (a) using the
inverter-typed SDC, (b) using the transmission gate-typed SDC, (c) using the
proposed SDC.

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