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2021 H3C HSE Training

UniServer G5 Product Series


CONTENTS 1. Digital Industry Development and Market Overview…
2. Product Overview
3. Management Software Overview
4. G5 Innovation Overview
5. Successful Case Study

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Digital Industry Development
and Market Overview
Digital Economy Trend 2015-2024

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Computing Resource Consumption

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Achievement for H3C Server
2020 Global X86 Server market share Detailed YOY growth rate

In 2020, vendor revenue in the x86 server market increased by New H3C's revenue was US$3.139 billion
3.2% year-on-year, reaching US$82.59 billion (approximately (approximately RMB 20.4 billion), an
RMB 537.5 billion). Shipments increased 1.8% year-on-year to increase of 12.1% year-on-year; its market
11.8 million units. share increased by 0.3% to 3.9%.

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Product Overview
Brand-new CPU is on the way
2019 2020 2021
2nd gen intel Xeon 3rd gen intel Xeon 3rd gen intel Xeon

scalable processors scalable processors scalable processors

CASCADE LAKE-SP Cooper lake-SP ICE lake-SP

PURLEY PLATFORM CEDAR ISLAND PLAT FO RM W HIT LEY PLAT FO RM


1 T O 8 SOCKET S 4 AND 8 SOCKET S 1 TO 2 SOCKETS

4 TO 28 CORES 8 TO 28 CORES 8 TO 38 CORES


70W TO 205W TDP 120W TO 250W TDP 105W TO 270W TDP
60+ S K Us Available Targeting ~12 SKUs Targeting ~40+ SKUs

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New Features for the Brand-new CPU
• 10nm+ process technology
• 2-socket Whitley platform
• Incorporates Sunny Cove core
• Brings scalable and balanced architecture for increased
Throughput and per-core performance across all workloads
In the datacenter

Huge Performance Increase

General-purpose computing applications get 83% more machine


performance gains than G3
• Improved INT performance 50%
• Improved Float performance 52%
• Memory bandwidth increase 60%
• Memory capacity increase 166%
• PCIE Bandwidth increase 100%

Heterogeneous accelerator card –XG310


• up to 120 simultaneous game session in flawless

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Intel 3rd Gen Xeon Processor Naming Rules

Integrations and Optimizations


(when applicable for 3rd Gen Intel Xeon Scalable processors only)

• H = Cooper Lake 4/8-socket with 6x UPI


• L = 4.5TB/Socket memory tier for Cooper Lake SKUs
• N = NFV Optimized
• T = High Tcase
• U = Single Socket
• V = SaaS optimized SKU for orchestration efficiency
targeting high density, lower power VM environment
(70% CPU utilization)
• P = IaaS optimized SKU for orchestration efficiency
SKU Level Processor SKU targeting higher frequency for VM Markets (70% CPU
• 9, 8 = Platinum • (ex. 20, 34…) utilization)
• 6, 5 = Gold • Y = Speed Select Technology – Performance Profile
• 4 = Silver Processor Generation
• 1 = 1st Gen (Skylake) • S = max SGX enclave size SKUs (512GB)
• 3 = Bronze
• 2 = 2nd Gen (Cascade Lake & Cascade Lake-R) • Q = Liquid cooling (Temperature Inlet to cold plate =
• 3 = 3rd Gen (Cooper Lake and Ice Lake) 40°C, ICX TTV ψca (case-to-fluid inlet resistance) =
0.06°C/W)
• M = Media Processing Optimized

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PCIe 4.0 era-to eliminate I/O bottleneck
Boost device full potential
PCIe 4.0

Read Bandwidth
PCIe 3.0
NVME Perf
2X IO Bandwidth
linear increase by numbers

1 2 3 4 5 6
NVMe Drives

PCIe 4.0
PCIe 3.0

Networking Perf 0 100 200 300 400


2X Bandwidth
Doubled Bandwidth
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H3C Servers & Storage
R2000 G3 Series R6000 G3 Series R8000 G3 Series G5 Servers X10000 Storage
Large Enterprise Mid-Large Enterprise Large Enterprise
Growth Enterprise Large Enterprise

R4700 G5

R6700 G3 X10516 G3
R2900 G3

R4900 G5
R8900 G3

R2700 G3 X10529 G3
R6900 G3 R4950 G5(AMD)
R4000 G3 Series R5000 Series Blade G3 Servers
Mid-Large Enterprise DL/ML/AI Mid-Large Enterprise
X10536 G3
Virtualization Distributed
Computing Storage, AI R6900 G5
B5700 G3

R5300 G5 B5800 G3 B5700 G5(Blade) X10326 G3


R4900 G3

B7800 G3
R4700 G3

R5500 G5

R4300 G3
B16000
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R4700 G5
Positioning Main Features Merits
R4700 G5 SFF CTO 1U 2 Socket Rack server for Ice-Lake CPU cores Support 4 x T4 GPU
R4700 G5 LFF CTO high-density computing 3200MT/s memory Support 12 x NVMe Drives*
scenarios Flexible PCIe 4.0 IO scalability chassis intrusion detection
Comprehensive security design

Modern Data Center Constraint Space Scenario Large-scale Cluster Computing Low-latency Application

VIRTUALIZATI PRIVATE DATA SCIENTIFIC FINANCE


CLOUD CLOUD HPC TRADING
ON CLOUD ANALYSIS RESEARCH APPLICATION
COMPUTING COMPUTING SYSTEM

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R4700 G5 VS R4700 G3

R4700 G3 R4700 G5
2 x 3rd generation Intel® Xeon® Scalable series
2 × Intel® Xeon® Scalable processors
(each processor up to 40 cores and maximum 270W power
(Up to 28 cores and maximum 205 W power consumption)
consumption)
24 × DDR4 DIMMs 3.0 TB maximum
32 x DDR4 DIMM slots , maximum 12.0 TB
Up to 2933 MT/s data transfer rate,support RDIMM or
Up to 3200 MT/s data transfer rate,support RDIMM or LRDIMM
LRDIMM
1 x mLOM adapter,support NCSI 1 x OCP 3.0 slot,support NCSI

Up to Front 4LFF bays, Rear 2SFF bays* Up to Front 4LFF bays, Rear 2SFF bays
Up to Front 10SFF bays, Rear 2SFF bays* Up to Front 10SFF bays, Rear 2SFF bays
Front SAS/SATA HDD/SSD/NMVe Drives, maximum 8 x U.2 Front SAS/SATA HDD/SSD/NMVe Drives, maximum 8 x U.2
NVMe Drives NVMe Drives

2 x single-slot wide GPU modules 4 x single-slot wide GPU modules


2 x PCIe 3.0 standard slots 4 x PCIe 4.0 standard slots

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R4900 G5
Positioning Main Features Merits
2U 2 Socket Rack Server meet R4900 G5 SFF CTO Ice-Lake CPU cores Support 41 x hard drives*
the expansion requirements of R4900 G5 LFF CTO 3200MT/s memory Support 28 x NVMe
data center Flexible PCIe 4.0 IO scalability Support 14 x PCI-E 4.0
Comprehensive security design Support 2 x OCP 3.0

Modern Data Center Enterprise Cluster Computing& HCI/NFV Heterogeneous


Core Application Virtualization Computing Architecture Computing

VMWARE ANDROID
BIG DATA VSAN CLOUD
ANALYTICS AI MICROSOFT GAMING
CLOUD
COMPUTING
OA ERP/CRM HPC INFERENCING INTEL SELECT AZURE STACK
DISTRIBUTED SOLUTIONS HCI VIDEO
COMPUTING FOR NFVI SOLUTION

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H3C R4900 G5 VS R4900 G3

R4900 G3 R4900 G5
2 x 3rd generation Intel® Xeon® Scalable series
2 × Intel® Xeon® Scalable processors
(each processor up to 40 cores and maximum 270W power
(Up to 28 cores and maximum 205 W power consumption)
consumption)
24 × DDR4 DIMMs 3.0 TB maximum
32 x DDR4 DIMM slots , maximum 12.0 TB
Up to 2933 MT/s data transfer rate,support RDIMM or
Up to 3200 MT/s data transfer rate,support RDIMM or LRDIMM
LRDIMM
1 x mLOM adapter,support NCSI 2 x OCP 3.0 slot,support NCSI
Up to front 12LFF bays, internal 4LFF bays , Rear 4LFF+4SFF
bays*
Front 12LFF + rear 4LFF and 4SFF or front 25SFF + rear
Up to front 25SFF bays, internal 8SFF bays , Rear 4LFF+4SFF
2LFF and 4SFF(supports SAS/SATA HDD/SSD, front and
bays*
inside NVMe drives, and up to 24 front NVMe drives)
Front/Internal SAS/SATA HDD/SSD/NVMe Drives, maximum 28 x
U.2 NVMe Drives
8 x single-slot wide or 3 x double-slot GPU modules 14 x single-slot wide or 4 x double-slot GPU modules
10 x PCIe 3.0 standard slots 14 x PCIe 4.0 standard slots
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R6900 G5
Positioning Main Features Merits
4U 4 Socket Rack server
equipped with exciting features
Cooper-Lake CPU cores
3200MTs memory
H3C UniServer Modular design
50 SFF hard drives
to boost mission-critical
workloads
Flexible PCIe 3.0 IO scalability R6900 G5 Chassis 18 full height PCI-E 3.0
Comprehensive security design

Database Enterprise Cluster Computing& HCI/NFV HPC and AI


Core Application Virtualization Computing Architecture

PRIVATE OIL
ORACLE CLOUD EXPLORATIO
MS SQL
BILLING/CLEA N
MYSQL PROPRIETAR BUSINESS MEMORY DATA DEEP
MIDDLEWARE RING/PAYME
Y CLOUD CLUSTER DATABASE ANALYSIS LEARNING
NT SCIENTIFIC
COLUMNAR
COMPUTING
DATABASE

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R4950 G5
Positioning Main Features Merits
2U 2 Socket Rack Server ROME CPU cores 31 x Drives
R4950 G5 SFF CTO
powered by AMD EPYC 3200MT/s memory 24 x NVMe R4950 G5 LFF CTO
Processors bring Flexible PCIe 4.0 IO scalability 10 x PCI-E 4.0
extraordinary ROI Comprehensive security design 2 x OCP 3.0

Modern Data Distributed Memory Computing AI Application


Center Scenario

SOFTWARE MEDIA
CLOUD VIRTUALIZATI DATA
COMPUTING ON
DEFINED
ANALYSIS
PROCESSIN ASR NLP
STORAGE G

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AMD EPYC™ 7002 Rome Features

Balanced architecture for best performance

64 128 8 4TB
Max
48, 32, 24, 16, 12, PCIe® 3/4
Memory Channel Memory
8 cores Lanes

Leading Performance Highest I/O Capacity Facilitate data exchange Ultra–large Memory
bottleneck

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AMD EPYC™ 7002 Series Overview

Computing Performance
2X AMD “Zen2” x86 cores 8 core 8 core 8 core 8 core
~4X TFLOPS
(Max 64 cores/128 threads) + L3 + L3 + L3 + L3 ~2X Perf(SPECCPU2017)
Max 4X shared L3 cache
(256MB)
I/O – chip integration
2X L3 cache per core
(shared 16MB cache per 4 128 lane PCIe® 3 & 4*
cores) Arm − for PCIe, SATA,
DDR4 MEM PCIe3/4 controller interconnection
security
Reducing access latency CTL SATA3 CTL unit
processor − Max 32 SATA or NVMe
(NUMA optimized) device
TDP : 120W-280W

Memory Security
8 ch DDR4 (withECC) 8 core 8 core 8 core 8 core Secure Subsystem
Max 3200 MHz* + L3 + L3 + L3 + L3
HW root of trust
RDIMM, LRDIMM
Advanced security feature
2x DIMM per channel
4TB MEM per CPU

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Management Software Overview
H3C Management Tools
Intelligent operation and maintenance platform
Meet the requirements for unified monitoring and management of integrated
infrastructure such as networks, server, storage, databases
U-Center

Fast, smart and scalable toolset


Meet the batch management needs of the server's full life cycle

FIST

Out-of-band management system


Meet the full life cycle management needs of a single server

HDM

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HDM Features
Function Descrption HXX DXX IXX RD Progress
wireless connection of HDM through an external USB In
WIFI Module support support NA
WIFI module development

User permission permissions can be fully customized support support NA Release

In
Security trusted Silicon Root:Protect; Detect; Recover support support NA
development
wo-factor authentication; Realize the security
enhancement of the server HDM based on the In
Security support support NA
hardware dynamic cipher (OTP Key). development

AD support Active Directory support support support Release

new Dashboard,optimized page layout,page reload In


GUI support support support
speed less than 3S development

Server USB flash offline diagnosis and firmware upgrade support NA NA Partial release

Intel ACD/C script features,Collection and analysis of


In
maintenance fault information. The clarification rate of faulty parts is NA NA NA
development
77%
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FIST/iFIST Features
Function Descrption RD Progress

iFIST boot speed G5 blade achieve iFIST fast boot(3 mins) In development

FIST with multiple


Support multiple sessions and deployment In development
user accounts

Support online upgrade、offline upgrade、customized repo


REPO Release
package
VMWare vCenter/Vrealize, Microsoft System Center
3rd API for monitoring In development
supportZabbix plugin
Logic optimization, functional rectification, front-end
FIST GUI upgrade framework optimization and rectification, improve user In development
experience, and post-maintainability
塑合特性support rack server,clone installation,TOR switch
Composer 2.0 In development
management

Mobile App IOS and Android for remote monitoring and maintanence Release

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G5 Innovation Overview
H3C UniServer G5 New innovation

Performance Architecture Improved Smart


Upgrade Upgrade Management Manufacturing
- Intel® Ice Lake Xeon - Smart security Bezel - Two-factor authorization - 100% automated
SP processors - Internal flat cabling - 1U slot 2.5inch production
- AMD EPYC™ 7003 - Tool-free installation touchable screen - Reduce human error by
Series Processors and maintenance - FIST batch installation 87%
- H3C XG310 GPU - 35% increase in quality
- Unique air baffle kit and maintenance
- Reduce delivery time by
40%
For detailed information, please contact your sales representative

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H3C UniServer R4900 G5 Layout

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H3C UniServer R4950 G5 Layout

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Improved Server Design

 Brand-new PI design for disk tray


 Clear drive indicator by backend light pipe
 AURORA RED

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HDM USB management port

 Front easy access


 WIFI module directly connected to HDM
 OCP Debug card
 HDM U disk tool for offline diagnosis

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LCD touchable i-module

 3.5inch large screen design


 firmware online upgrade
 Touchable menu
 system status display
 setting of the system
 1SFF slot position

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H3C R4900 G5 Superior details

Unique air baffle 8 rubber nail to fix the High quality cable Clear system 10 grades Fan
to lift cooling fan, enable better materials reducing numbering indicator rotating speed
of spare parts
efficiency up to shock absorption and Electromagnetic avoiding wrong Flexible cooling
40% by separation during fan interference operations strategy for
Distributed Air rotating different zones
tunnel

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H3C R4900 G5 Superior details 2

1 • Smart Security Panel

• Unique flat cable • Tool-free installation and maintenance


2 3
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H3C R4900 G5 internal expansion part
4LFF mid-board

4GPU

8SFF mid-board
Enhanced Server Security

Silicon Root of Trust 2 factor authentication

Password

verificati
HDM
on code

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Successful Case Study
2021 Server Sale Check List

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Thank You

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