Q1 2024

Winbond Code Storage

Flash Memory Roadmap

1
Flash Memory Portfolio of Industrial Product

2024Q1-a Winbond Confidential 2

Flash Memory Portfolio of Industrial Product

2024Q1-a Winbond Confidential 3

Flash Memory Portfolio of Industrial Product

2024Q1-a Winbond Confidential 4

Flash Technology Roadmap

2024Q1-a Winbond Confidential 5

Spi Interface Solution

Winbond Confidential 6
3V SpiFlash® Roadmap

2024Q1-a Winbond Confidential 7

3V SpiFlash® Roadmap

2024Q1-a Winbond Confidential 8

1.8V SpiFlash® Roadmap

2024Q1-a Winbond Confidential 9

1.8V SpiFlash® Roadmap

2024Q1-a Winbond Confidential 10

1.2V SpiFlash® Roadmap

2024Q1-a Winbond Confidential 11

RPMC SpiFlash® Roadmap

2024Q1-a Winbond Confidential 12

QspiNAND Flash Memory Roadmap

2024Q1-a Winbond Confidential 13

Octal Interface Solution

Winbond Confidential 14
Octal NOR Flash Family Roadmap

2024Q1-a Winbond Confidential 15

OctalNAND Flash Family Roadmap

2024Q1-a Winbond Confidential 16

SLC NAND, SpiStack® Flash
Multi-Chip Solution

Winbond Confidential 17
SLC NAND Flash Memory Roadmap

2024Q1-a Winbond Confidential 18

SpiStack® Flash Family Roadmap

2024Q1-a Winbond Confidential 19

SLC NAND+LPDDR2 MCP Roadmap

2024Q1-a Winbond Confidential 20

Packaging Options,
Part Number Decoder &
Ordering Information
Winbond Confidential 21
SpiFlash® Memory Package Guide (128Mb to 2Gb)
Package SOP8 SOP8 SOP16 WSON8 WSON8 USON8 USON8 XSON8 BGA24 BGA24 WLCSP

Density Dimension 150mil 208mil 300mil 6×5mm 8×6mm 2×3mm 4×3mm 4×4mm 8×6mm 8×6mm

Height 1.75mm 2.16mm 2.64mm 0.8mm 0.8mm 0.6mm 0.6mm 0.45mm 1.2mm 1.2mm 0.47mm

Order Code (SN) (SS) (SF) (ZP) (ZE) (UX) (UU) (XG) (TC=4x6) (TB=5x5) (BY)

W25Q02RV • • •
2Gb W25Q02JV •
W25Q02NW •
W25Q01RV • • •
1Gb W25Q01JV • • •
W25Q01NW • • •
W25Q51RV • • •
W25Q512JV • • •
W25Q512NW • • • •
512Mb W25M512JV • • •
W25M512JW • • •
W25R512JV • •
W25R512NW • •
W25Q256JV • • •
W25R256JV • •
256Mb
W25Q256JW • • • • •
W25R256JW 〇 • •
W25Q128JV • • • • 〇 〇 •
W25R128JV • • 〇
128Mb
W25Q128JW • • • • 〇 •
W25R128JW • • 〇

2024Q1-a Winbond Confidential • Standard Package 〇 Special Order Package 22

SpiFlash® Memory Package Guide (8Mb to 64Mb)

Package SOP8 SOP8 SOP16 WSON8 WSON8 USON8 XSON8 USON8 XSON8 BGA24 BGA24 WLCSP

Density Dimension 150mil 208mil 300mil 6×5mm 8×6mm 2×3mm 2x3mm 4×3mm 4×4mm 8×6mm 8×6mm

Height 1.75mm 2.16mm 2.64mm 0.8mm 0.8mm 0.6mm 0.4mm 0.6mm 0.45mm 1.2mm 1.2mm 0.33/0.47mm

Order Code (SN) (SS) (SF) (ZP) (ZE) (UX) (XH) (UU) (XG) (TC=4x6) (TB=5x5) (BY)

W25R64JV •
W25Q64JV • • • • • 〇 〇
64Mb W25Q64JW • • 〇 • • • •
W25R64JW • 〇
W25Q64NE • 〇 • •
W25Q32RV 〇 • 〇 • •
32Mb W25Q32JV 〇 • • 〇 • • 〇 〇
W25Q32JW 〇 • • • • 〇 〇 •
W25Q16RV 〇 • 〇 • •
W25Q16JV 〇 • • 〇 • • 〇
16Mb
W25Q16JL 〇 • • 〇
W25Q16JW 〇 • • • • •
W25Q80RV 〇 • 〇 • • •
8Mb W25Q80DV/DL 〇 • 〇 〇 〇
W25Q80EW • 〇 〇 〇 〇

• Standard Package 〇 Special Order Package

2024Q1-a Winbond Confidential 23

SpiFlash® Memory (2Mb to 4Mb) & Octal NOR Package Guide

Package SOP8 SOP8 SOP16 WSON8 WSON8 USON8 XSON8 USON8 XSON8 BGA24 BGA24 WLCSP

Density Dimension 150mil 208mil 300mil 6×5mm 8×6mm 2×3mm 2x3mm 4×3mm 4×4mm 8×6mm 8×6mm

Height 1.75mm 2.16mm 2.64mm 0.8mm 0.8mm 0.6mm 0.4mm 0.6mm 0.45mm 1.2mm 1.2mm 0.33/0.47mm

Order Code (SN) (SS) (SF) (ZP) (ZE) (UX) (XH) (UU) (XG) (TC=4x6) (TB=5x5) (BY)

SpiFlash®
W25Q40RV • • 〇 〇 • 〇
4Mb W25Q40CL • 〇 〇
W25Q40EW • • 〇 〇 • 〇
W25Q20RV • • 〇 〇 • 〇
2Mb W25Q20CL • 〇
W25Q20EW • 〇 〇

Octal NOR
2Gb W35T02NW 〇 •
1Gb W35T01NW 〇 •
512Mb W35T51NW 〇 •
256Mb W35T25NW 〇 •
128Mb W35T12NW 〇 •

• Standard Package 〇 Special Order Package

2024Q1-a Winbond Confidential 24

SLC NAND Package Guide (1Gb to 8Gb)

Package SOP8 SOP8 SOP16 TSOP48 WSON8 WSON8 USON8 USON8 XSON8 BGA24 BGA24 VFBGA-48 VFBGA-63 WLCSP

Density Dimension 150mil 208mil 300mil 12x20mm 6×5mm 8×6mm 2×3mm 4×3mm 2×3mm 8×6mm 8×6mm 8x6.5mm 9x11mm
Height 1.75mm 2.16mm 2.64mm 1.2mm 0.8mm 0.8mm 0.6mm 0.6mm 0.4mm 1.2mm 1.2mm 1mm 1mm 0.47mm

Order Code (SN) (SS) (SF) (S) (ZP) (ZE) (UX) (UU) (XG) (TC=4x6) (TB=5x5) (D) (B) (BY)

ONFI NAND
W29N08GV • •
8Gb
W29N08GZ • •

W29N04GV • •

4Gb W29N04GW/Z • •

W29N04KZ • •

W29N02GV • •

W29N02KV • 〇 •
2Gb
W29N02KZ • 〇 •

W29N02GW/Z • •

W29N01HV • • •
1Gb
W29N01HW/Z • • •

• Standard Package 〇 Special Order Package

2024Q1-a Winbond Confidential 25

QspiNAND & OctalNAND Flash Package Guide (512Mb to 4Gb)
Package SOP8 SOP8 SOP16 TSOP48 XSON8 USON8 USON8 WSON8 WSON8 BGA24 BGA24 VFBGA-48 VFBGA-63 WLCSP

Density Dimension 150mil 208mil 300mil 12x20mm 3x2mm 3x2mm 3x4mm 6x5mm 8x6mm 8×6mm 8×6mm 8x6.5mm 9x11mm
Height 1.75mm 2.16mm 2.64mm 1.2mm 0.4mm 0.6mm 0.6mm 0.8mm 0.8mm 1.2mm 1.2mm 1mm 1mm 0.47mm

Order Code (SN) (SS) (SF) (S) (XH) (UX) (UU) (ZP) (ZE) (TC=4x6) (TB=5x5) (D) (B) (BY)

QspiNAND
W25N04KW • •
4Gb
W25N04KV • •

W25N02KW • •

2Gb W25N02KV • •

W25N02JW • •

W25N01KV • •

W25N01GV • •

1Gb W25N01KW • •

W25N01GW • •

W25N01JW • •

W25N512GV • • •
512Mb
W25N512GW • • •

OctalNAND
4Gb W35N04JW •

2Gb W35N02JW •

1Gb W35N01JW •

• Standard Package 〇 Special Order Package

2024Q1-a Winbond Confidential 26

SpiFlash® Packages

2024Q1-a Winbond Confidential 27

QspiNAND & SLC NAND Flash Packages

2024Q1-a Winbond Confidential 28

Serial NOR Ordering Information

W 25Q 32 J V SS I Q
1 Winbond Standard Product 4 Product Version 7 Temperature Range
W: Winbond 90nm: C, D, E… I: Industrial (-40C to +85C)
58nm: F, J, N, R J: Industrial Plus (-40C to +105C)
45nm: P A: Automotive 2 (-40C to +105C)
2 Product Family B: Automotive 3 (-40C to +85C)
5 Voltage
25X: 4KB Sector, Dual Output S: Automotive 1 (-40C to +125C)
25Q: 4KB Sector, Dual/Quad I/O V: 3V E: 1.2V
25R: RPMC(Quad) L: 2.5V D: 1.14V to 1.6V 8 Options
25H: Safety W: 1.8V
G: General
25M: SpiStack
6 Packages P: General + OTP Feature
Q: General + QE Enabled
SN: SO8 (SOIC) 150mil
M: DTR
SV: VSOP (Thin SOIC) 150mil
3 Density SS(S): SO8 (SOIC) 208mil
512Kb: 05 32Mb: 32 SF(F): SO16 (SOIC) 300mil
1Mb: 10 64Mb: 64 ZE(E): WSON8 8x6x0.8mm
2Mb: 20/21 128Mb: 128/12 ZP(P): WSON8 6x5x0.8mm
4Mb: 40/41 256Mb: 256/25 ZH: SON8 8x6x1.0mm
8Mb: 80 512Mb: 512/51 UX: USON8 2x3x0.6mm
16Mb: 16 1Gb: 01 UZ: USON8 4x4x0.6mm
2Gb: 02 UU: USON8 4x3x0.6mm
XG: XSON8 4x4x0.5mm
XH: XSON8 2x3x0.4mm
TB(B): TFBGA24 (5x5-1 ball array)
TC(C): TFBGA24 (6x4 ball array)
BY(Y): WLCSP

2024Q1-a Winbond Confidential 29

QspiNAND Flash

W 25N 01 G V ZE A G
1 Winbond Standard Product 4 Product Version 7 Temperature Range
W: Winbond G: 46nm 1st generation I: Industrial (-40C to +85C)
K: 32nm 1st generation J: Industrial Plus (-40C to +105C)
J: 46nm 2nd generation A: Automotive 2 (-40C to +105C)
K: Automotive 2 Plus (-40C to +115C)
2 Product Family
25N: QspiNAND 8 Boot Options
5 Voltage & Bus Width
25M: SpiStack
V: 3V (2.7V~3.6V) G: Buffer Read Mode as default
W: 1.8V (1.7V~1.95V) (BUF=1 as default)
R: Supports Buffer Read Mode only
3 Density (BUF=1 locked)
6 Packages T: Continuous Read Mode as default
512: 512Mb ZE(E): WSON8 8x6x0.8mm (BUF=0 as default)
01: 1Gb ZP(P): WSON8 6x5x0.8mm U: Sequential Read Mode as default
02: 2Gb TB(B): TFBGA24 (5x5-1 ball array) (BUF=0, ECC_E=0)
04: 4Gb C: Continuous Read Mode as default (BUF=0)
with linear address
F: Buffer Mode as default (BUF=1) with linear
address

2024Q1-a Winbond Confidential 30

Octal NOR Flash Ordering Information

W 35T 01 N W TB I E
1 Winbond Standard Product
W: Winbond
2 Product Family
4 Product Version 7 Temperature Range
N: 58nm I: Industrial (-40C to +85C)
P: 45nm J: Industrial Plus (-40C to +105C)
A: Automotive 2 (-40C to +105C)
5 Voltage & Bus Width S: Automotive 1 (-40C to +125C)

35T: Octal NOR W: 1.8V (1.7V~1.95V) 8 Boot Options

E: Extend SPI mode. Default SDR with single I/O.
3 Density 6 Packages Can switch to octal I/O & DDR by register setting.
F: Fixed Octal mode. Default DDR with octal I/O.
25: 256Mb TB: TFBGA24 (5x5-1 ball array)
Can not switch to single I/O & SDR.
51: 512Mb SF: SOP16(300mil)
01: 1Gb
02: 2Gb

2024Q1-a Winbond Confidential 31

OctalNAND Flash Ordering Information

W 35N 01 J W TB I G
1 Winbond Standard Product
W: Winbond
2 Product Family
4 Product Version
J: 46nm 2nd generation
5 Voltage & Bus Width
7 Temperature Range
I: Industrial (-40C to +85C)
J: Industrial Plus (-40C to +105C)
A: Automotive 2 (-40C to +105C)
K: Automotive 2 Plus (-40C to +115C)

35N: OctalNAND W: 1.8V (1.7V~1.95V) 8 Boot Options

G: Buffer Read Mode as default
3 Density 6 Packages (BUF=1 as default)
T: Continuous Read Mode as default
01: 1Gb TB: TFBGA24 (5x5-1 ball array)
(BUF=0 as default)
02: 2Gb C: Continuous Read Mode (T) with linear address
04: 4Gb F: Buffer mode (G) with linear address

2024Q1-a Winbond Confidential 32

SLC NAND Ordering Information

W 29N 02 G V S I A A
1 Winbond Standard Product 4 Product Version 7 Temperature Range
W: Winbond G, H: 46nm I: Industrial (-40C to +85C)
K: 32nm J: Industrial Plus (-40C to +105C)
A: Automotive 2 (-40C to +105C)
K: Automotive 2 Plus (-40C to +115C)
2 Product Family
29N: ONFI compatible NAND 5 Voltage & Bus Width 8 Options 1
V: 3V (2.7V~3.6V) & x8 OTP and LOCK feature
W: 1.8V (1.7V~1.95V) & x16 A: Legacy OTP(3v)
Z: 1.8V (1.7V~1.95V) & x8 B: Legacy OTP(1.8V)
3 Density D: ONFI OTP + LOCK
N: No OTP/lock/cache
01: 1Gb 6 Packages
02: 2Gb
S: TSOPI 48 pin(12x20) 9 Options 2
04: 4Gb
B: VFBGA 63 (9x11x1.0mm)
08: 8Gb Compatibility
D: VFBGA-48 6.5x8mm
A: 1 bit ECC
Y: WLCSP
E: 2KB Page, 8 bit ECC
F: 2KB Page, 4 bit ECC
G: 4KB Page, 8 bit ECC
H: 4KB Page, 4 bit ECC

2024Q1-a Winbond Confidential 33

SLC NAND MCP Ordering Information

W 71 NW 1 0 H M 3 F W
1 Winbond Standard Product 4 Product Density 7 RAM Density
W: Winbond 1: 1Gb 5: 512Mb E: 512Mb LPDDR2 W: -40C to +85C
2: 2Gb 8: 8Gb F: 1Gb LPDDR2
4: 4Gb J: 2Gb LPDDR2
M: 1Gb LPDDR2
2 Product Family 5 NAND Config
71: MCP Product 0: 2KB page X8 I/O 8 RAM Option
1: 2KB page X16 I/O Information
2: 4KB page X8 I/O WEC
3: 4KB page X16 I/O 1: x16 I/O
3 Voltage 6 Flash Generation 3: x32 I/O

NW: 1.8V ONFI NAND Flash G, H: 46nm 9 Package Type

K: 32nm
F: 162 Balls VFBGA 8x10.5x1.0

2024Q1-a Winbond Confidential 34

Winbond Flash Product Grades
Industrial Industrial Automotive Automotive Automotive
Category
Plus Grade 2 Grade 2 Plus Grade 1

NOR Flash PN Example W25Q256JVFIQ W25Q256JVFJQ W25Q256JVFAQ W25Q256JVFSQ

NAND Flash PN Example W25N01GVZEIG W25N01GVZEJG W25N01GVZEAG W25N01GVZEKG

Temperature Range -40°C~85°C -40°C~105°C -40°C~105°C -40°C~115°C -40°C~125°C

DPPM Level < 100 < 100 <10 (Target=0) <10 (Target=0) <10 (Target=0)

FA 1st Response 1 to 3 days 1 to 3 days 24 hours 24 hours 24 hours

FA Initial Report 2 to 3 days 2 to 3 days 1 to 2 days 1 to 2 days 1 to 2 days

FA Final Report 10 to 14 days 10 to 14 days 5 to 8 days 5 to 8 days 5 to 8 days

Quarterly Quarterly Quarterly

Reliability Monitor Quarterly Quarterly
& EFR by lot & EFR by lot & EFR by lot

PPAP & PSW NA NA up to Level 3 up to Level 3 up to Level 3

PCN 90 days 90 days 90 days 90 days 90 days

Typical Life Time 2+ years 3+ years 5+ years 5+ years 5+ years

EOL 6 mons to buy 6 mons to buy 12 mons to buy 12 mons to buy 12 mons to buy
(Last buy + Last Ship) + 6 mons to ship + 6 mons to ship + 12 mons to ship + 12 mons to ship + 12 mons to ship

Qualification JEDEC 85°C JEDEC 85°C AEC-Q100 105°C AEC-Q100 105°C AEC-Q100 125°C

Cpk ≥ 1.33 ≥ 1.33 ≥ 1.67 ≥ 1.67 ≥ 1.67

1)
Note Industrial Plus products follow Industrial Qualification Report; but Industrial Plus
shipped products are tested screened to 105°C.
2)
Automotive Grade 2 Plus products follow Automotive Grade 2 Qualification report,
but Automotive Grade 2 Plus shipped products are test screened to 115°C.
2024Q1-a Winbond Confidential 3)
4)
EFR by lot or other reliability monitoring test 35
Contact Winbond for Automotive Grade Flash roadmaps.
Thank You
Website www.winbond.com
E-mail mkt_online@winbond.com

36
Flash Focus for Automotive
Category 4Mb 8Mb 16Mb 32Mb 64Mb 128Mb 256Mb 512Mb 1Gb 2Gb 4Gb

CLUSTER/CONFIG. SpiNOR

Octal NOR

OctalNAND
CLUSTER/HYBRID
QspiNAND

SpiNOR

SpiNOR
CLUSTER/ENTRY
SpiNOR

SpiNOR

ADAS/FRONT QspiNAND

OctalNAND

ADAS/SURROUND SpiNOR

SpiNOR
V2X
QspiNAND

TELEMATICS ONFI NAND

GATEWAY SpiNOR

BMS SpiNOR

• General Purpose • Built-in ECC Engine

2024Q1-a Winbond Confidential 37