KALASALINGAM UNIVERSITY, ANAND NAGAR, KRISHNANKOIL Course plan Name of the staff : M.Pethuraj, Assistant.

Prof/Mech Subject : MEC322 Modern Manufacturing Systems (Major Elective) Semester and branch : VI semester /MECH all sections Pre-requisite : Basic Idea in manufacturing Objectives : To understand the concepts & Design of modern manufacturing systems. Learning outcome and end use : Students can design simple manufacturing systems.
TEXT BOOK Serope Kalpakjain, And Steven R Schmid, Manufacturing Engineering And Technology, Pearson Education, Fourth Edition, 2002. REFERENCE BOOKS 1. Benjamin W Niebel, Alan B Draper, Richard A Wysk, Modern Manufacturing Process Engineering, Mc Graw Hill, International edition, 1989. 2. Hajra Choudhruy, S. K., Bose, S. K., Elements of Work Shop Technology, Vol II,1995. 3. Machine tools, Media Promoters and Publishers ( P) Ltd., Bombay, 10th Edition, 2000. 4. HMT, Production Technology, Tata McGraw-Hill, New Delhi, 1996.

2. WEB RESOURCES: http://www.mpif.org/apmi/doc4.htm

www.ucs.louisiana.edu/~snd7483/MCHE365/17.ppt

http://www.azom.com/article.aspx?ArticleID=132 http://www.metalpowder.com/index.asp?action=manufacturing_basics www.me.gatech.edu/jonathan.colton/me4210/powder.pdf home.iitk.ac.in/.../Introduction%20to%20metallurgy/twentyone.ppt www.eng.utoledo.edu/mime/faculty_staff/.../MProcesses_Notes_15.ppt http://me.emu.edu.tr/me364/lecnotes.html

3. LESSON PLAN: Topic Reference Topic Name No. Books UNIT I POWDER METALURGY 1. Processing of powder metals, ceramics, glass R1,R2,R3&R4 and super conductors-introduction 2. Production of metal powders R1,R2,R3&R4 3. 4. 5. 6. Compaction of metal powders R1,R2,R3&R4

No. of Periods 1 1 1 1 1

Cumulative Hours 1 2 3 4 5 6

Sintering-secondary and finishing R1,R2,R3&R4 operations-. Design considerations of powder metallurgy R1,R2,R3&R4 Process capabilities

Page 1 of 4

7. 8. 9.

Shaping ceramics Forming and shaping of glass Design consideration for ceramics and glass

R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4

1 1 1 1

7 8 9 10

10. Metal injection moulding

UNIT II CNC MACHINES AND ROBOTICS

11. Numerical control and robotics - background of numerical control. 12. Motion control- point to point and contouring

R1,R2,R3&R4 R1,R2,R3&R4

1 1 1 1 1 1 1 1 1 1

11 12 13 14 15 16 17 18 19 20

13. Linear interpolation and circular interpolation R1,R2,R3&R4 contouring control 14. Positioning system - absolute and incremental R1,R2,R3&R4 15. Control loops - open and closed loop control 16. Cartesian coordinate conventions - left and right hand-programming 17. Numerically controlled machines R1,R2,R3&R4 R1,R2,R3&R4

18. G and M codes - basic concepts of robotics - R1,R2,R3&R4 programming of robots 19. Initial robot specification R1,R2,R3&R4 20. Introduction to rapid prototyping
UNIT III SUPER CONDUCTORS

R1,R2,R3&R4

21. Processing of superconductors-forming and shaping plastics and composite materials introduction 22. Extrusion 23. Injection moulding 24. Blow moulding 25. Casting 26. Processing of reinforced plastics 27. Processing metal-matrix composites 28. Processing ceramic composites Page 2 of 4

R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4

1 1 1 1 1 1 1

21 22 23 24 25 26 27 28

R1,R2,R3&R4

29. Design considerations 30. Economics of forging and shaping plastics

UNIT IV ADVANCED MACHINING

R1,R2,R3&R4 R1,R2,R3&R4

1 1 1 1 1 1 1

29 30 31 32 33 34 35 36

31. Advanced machining processes and nanofabrication introduction 32. Chemical machining 33. Electrochemical machining 34. Electrical discharge machining 35. Wire EDM 36. Laser beam machining 37. Water jet machining 38. Abrasive jet machining 39. Nano fabrication -micro machining 40. The economics of advanced machining processes.
UNIT V MICRO ELECTRIC DEVICES

R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4

1 1 1 1 1 1 1 1

37 38 39 40 41 42 43 44 45

41. Fabrication of microelectronic devices introduction 42. Semiconductors and silicon 43. Crystal growing and wafer preparation 44. Film deposition-oxidation 45. Lithography - etching 46. Diffusion and ion implantation, 47. Metallization and testing 48. Bonding and packaging 49. Yield and reliability 50. Printed circuit boards.

R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4

1 1

46 47 48 49 50

R1,R2,R3&R4 R1,R2,R3&R4 R1,R2,R3&R4

1 1 1

Page 3 of 4

51. Unit I Revision 52. Unit II Revision 53. Unit III Revision 54. Unit IV Revision4 55. Unit V Revision 4. PORTIONS FOR SESSIONAL EXAMS: Sl.No 1 2 3 Test No. I Sessional test II Sessional test End Semester Test topics 1 to 16 17 to 34 1 to 50

2 2 2 2 2

52 54 56 58 60

5. ASSIGNMENT 1. Visit an Industry and submit the report on modern machines and their processes. 2. CNC Milling programming, interfacing and its applications. 3. CNC Machining centre programming.

Course Coordinator (V. Janakiraman)

H.O.D/Mechanical Engg. (Dr. S. Rajakarunakaran)

Page 4 of 4