INJECTION MOLDING TRAINING

INJECTION MOLDING IN GENERAL

MATERIAL DRYING:
To remove moisture and air
If material not dried,or dried not
enough, there will be gas, air in part
such as gas mark, void mark
and silver mark
Sy nha:
kh m v kh

INJECTION PROCESS

MOLD
TEMPERATURE
CONTROLLER

MATERIAL DRYING

Nu nha khng c sy,hoc sy khng

s c kh gas, v hi nc trong sn phm v
sinh ra gas mark, void mark, v silver
mark

INJECTION PROCESS

Zero position

1> Mold closes. Screw begins moving

forward for injection
Khun ng. Screw bt u tin hnh phun
nha

Injection complete. Screw continues moving

2> forward for packing ( hold pressure)
Tim nha hon thnh. Screw tip tc di chuyn ti pha
trc hon thnh sn phm

3> Screw in full forward position. Packing

completes when gate freezes off
Filling (injection)
cushion

Screw v tr cui cng, sn phm hon thnh khi

gate ng li

Packing (hold)

Cooling continues. Screwback begins to charge

4> melt a head of screw tip for next shot
Cooling tip tc, Screw bt u np nha cho shot tip
theo

5> Cooling completes. Mold opens for part ejection

Cooling hon thnh. Khun m y sn phm
Charge + suck back

Injection
condition
Hold condition
Charge condition

ti: injection time

ti

tco
th

th: holding pressure time

trc
tpl

tc

Thus: trc > tpl

Vy th: trc > tpl

Open, eject,
close

trc: Remaining cooling time

tpl: plastillisation (charging) time

tco: cooling

tc: cycle time

ti: thi gian phun

th: thi gian gi
trc: thi gian duy tri lm lnh
tpl: thi gian np nha
tc: chu k my

tco: thi gian lm lnh

1. Injection

packing

- Fill up 90% cavity

injection

But if injection pressure so high

lead to overpack, jetting

- in y 90% cavity

Nhng nu p lc phun qu cao s

dn n overpack, jetting

2. Packing ( Holding)

- Fill completely cavity

- in y hon ton
cavity
(g)

(g)

Parts
weight

Holding
pressure time.
(s)
Gate seal time.

Parts
weight
Holding pressure

3. Plastillisation ( charging )

charging

3a. charging

Suck back

- Screw rotate for charging palastic, it move backward at the same time. The faster it rotates, the more it charges
- Back Pressure is to reduce Screw retract speed, it ensure palastic charged with high percentage

if Back Pressure so high, part can be burn but it is low then

part can be void mark, gas mark, or inconsistence
- Screw quay np nha ng thi li v pha sau, n quay cng nhanh th np
cng nhiu
-Back Pressure gim tc li ca Screw, n bo m nha c np vi t
l phn trm cao
Ch : nu Screw quay qu nhanh, sn phm c th b chy, gas mark, void mark
nu Back Pressure qu cao, sn phm c th b chy, nhng nu thp n c
th b void mark, khng n nh

mm/s

Retract speed

Note!: if Screw rotate so fast, part can be burn, gas mark, void
mark

Back pressure

kgf

Note!: set temperature T5 is lowest, then increase the

temparature gradually (T2>T3>T4), Nippo standard T1<T2
Improper settings may cause drooling at nozzle, and
degradation or colour change
T1 T2 T3 T4 T5

Ch !: Set nhit T5 l thp nht, ri tng nhit dn

dn( T2>T3>T4), tiu chun Nippo l T1<T2
Set nhit khng ng s dn ti nha c th b tro u
nozzle, sn phm b chy v i mu

3b. Suck back

- Suck back or decompression is after Screw plastillisate
completely then retract ( no rotate) to decompresse, prevent
material from drooling
- If Suck back is high, part can be void mark or sink mark
- suck back hoc decompression l sau khi Screw np nha hon thnh ri li li
(khng quay) gim p lc do nha b nn, v ngn KHNG cho nha tro ra ngoi
-Nu Suck back ln, sn phm c th b void mark hoc sink mark

MOLD TEMPERATURE
- Mold cooling accounts for more than
2/3 of total cycle time
-Mold cooling chim ti 2/3 tng s
cycle time

Proper
cooling

Poor cooling
Better Part
in shorter
time

Poor Part in
longer time

b
As illustrated, cavity temperature higher than
temperature coolant during production. Thus,
you should set it 10to 20lower than required
mold temperature
-Nhn vo hnh v ta thy nhit ca cavity cao hn
nhit ca ng nc, nh vy nn ci t n cao
hn t 10ti 20thp hn nhit khun yu cu

temperature

40

30

20

d
c

Time( s)