ADVANCED MATERIALS FOR

ENERGY CONVERSION SOLID CELLS

INTERCONNECTS
INTERCONNECTS
Interconnects provide an electrical connection
between oxygen electrode of one individual
cell to the fuel electrode of the adjacent cell in
a SOC stack, and ensure a physical barrier
between the reducing atmosphere and the
oxidizing atmospheres .

Requirements
• High electrical conductivity with area-specific resistance (ASR) less than 0.1 Ωcm2
• Structural and chemical stability at operating temperature in both oxidizing and
reducing atmospheres during its service lifetime i.e., >40,000 h
• Excellent gas tightness or imperviousness for oxygen and hydrogen, in order to
provide a barrier for direct combustion between oxidant and fuel during operation
• Matching CTE with electrodes materials that assists in minimizing the thermal
stresses developed during initiation and close-down of SOFC device
• Chemical inertness towards adjoining components
• Resistance towards oxidation, sulfidation and carbon cementation
• Moderate mechanical strength as well as high resistance to creep is required to
avoid fracture when stresses are generated during operation since interconnect
materials have to bear the load of a stack.
• Low cost and ease of fabrication and shaping
CERAMIC INTERCONNECT MATERIALS
Ceramic interconnects are developed from semiconductor oxides which not only
possess fair stability in air, but also retain good compatibility with other SOFC
component materials.

Most commonly used ceramics as interconnects are

lanthanum chromite (LaCrO3)
based materials which are among most stable perovskite-type oxides. They
possess melting point greater than 2327ºC, and are stable even in low PO2 ~10-16
atm at 1000ºC.
 METALLIC INTERCONNECTS FOR
SOCS
• Better manufacturability
• Lower cost
• Improved mechanical strength
• Higher electrical and thermal conductivity

Potential metallic interconnects typically form a continuous layer of alumina

(Al2O3) or chromia (Cr2O3) oxide scales to provide oxidation resistance under
SOFC operating conditions

In this context, Cr-forming alloys are preferred as interconnects due to the

insulating nature of Al2O3 scales.
METALLIC INTERCONNECT MATERIALS
Fe-Cr-based alloys exhibit higher ductility, better workability and lower cost as
compared to Cr-based alloys.
Ni-Cr-based alloys exhibit excellent oxidation resistance and electrical conductive
oxide scales; however, the application of these alloys for SOFCs interconnect is
hindered by their unacceptable high TEC values

Ferritic steels are most preferred as interconnect

materials due to:
• Their bcc structure, which has the CTE values
(11.0–12.5 ˣ10-6/K) similar to other SOFC
components (10.5–12.5 ˣ10-6/K)
• High ductility
• Good workability
• Ease of processing
• Lower cost of fabrication
METALLIC INTERCONNECT MATERIALS
METALLIC INTERCONNECT MATERIALS
CHROMIA SCALE VOLATILITY
AND CELL POISONING

Crofer 22 APU

Mn as a residual component or an additive can form a scale with a (Mn,Cr)3O4

spinel top layer that helps minimize Cr volatility.
 SEALING CORROSION
In anode-supported and electrolyte-supported SOFC, glass sealants are used
to ensure the gas tightness between the cell and the ICs in the stacks.

Bariumcalciumaluminosilicate (BCAS)-based glasses

To tune the glass properties, minor quantities of elements like Pb, V, B, Mg are
added.

Their presence might cause the acceleration of corrosion kinetics at the glass/steel
interface.
MECHANICAL STRESS
 PROTECTIVE COATINGS
Effective and low-cost protective coatings have been developed to reduce oxide
growth kinetics, increase oxide scale conductivity, improve oxide scale-to-metal
adhesion and inhibit Cr migration from the Cr2O3 -rich subscales to the oxide
surface.
Wet powder spray

Atmospheric Plasma
Spray

Fe-doped MnCo2O4
(MCF)