Socket Types

LGA Socket
Commonly used by Intel®.
 Intel® Core™ Processors:
 Is a line of mid-to-high end consumer, workstation.
 The lineup of Core processors included the Intel Core i9, Intel Core i7, Intel
Core i5, and Intel Core i3.
 Intel® Pentium® Processors:
 Pentium processors are considered entry-level products that Intel rates as "two
stars“.
 Meaning that they are above the low-end Atom and Celeron series, but below
the faster Core i3, i5, i7, i9, and high-end Xeon series.
 Intel® Celeron® Processors:
 This computer microprocessor models were targeted for low-cost personal
computers.
 Performance is typically significantly lower when compared to similar CPUs
with higher-priced Intel CPU brands.
 Intel® Atom® Processors:
 Atom is mainly used in netbooks, nettops, embedded applications ranging
from health care to advanced robotics, and mobile Internet devices (MIDs).
 Intel® Xeon® Processors:
 Targeted at the non-consumer workstation, server, and embedded system
markets.
 This processors have some advanced features such as support for ECC
memory, higher core counts, support for larger amounts of RAM and larger
cache memory.
 LGA Socket Sizes
 Socket LGA 775:
 Socket LGA 775 (also called Socket T) is used by the Core 2
Duo/Quad processors.
 Socket LGA 1366:
 Socket LGA 1366 (also known as Socket B).
 Was introduced in November 2008 to support high-end Intel Core
i7-series processors.
 Socket LGA 1156
 Socket LGA 1156 (also known as Socket H).
 Was introduced in September 2009 and was designed to support
Intel Core ix-series processors.
 Socket LGA 1155:
 Socket LGA 1155 (also known as Socket H2).
 Was introduced in January 2011 to support Intel’s Sandy Bridge
(second-generation) Core ix-series processors.
 Socket LGA 2011:
 Introduced in November 2011 to support high-performance versions
of Intel’s Sandy Bridge (second-generation) Core i-series
processors.
 Now include Turbo Boost and overclocking.
 PGA Socket
 Athlon:
 The AMD Athlon processor launched on June 23, 1999.
 It launched at 500 MHz and was, on average, 10% faster than
the Pentium III at the same clock for Business applications,
and even faster (~20%) for gaming workloads.
 Phenom:
 Desktop processor line based on the K10 microarchitecture.
 Triple-core versions (codenamed Toliman) belong to the
Phenom 8000 series and quad cores (codenamed Agena) to the
AMD Phenom X4 9000 series. The first processor in the
family was released in 2007.
 A-Series Accelerated Processing Unit (APU):
 Llano for high-performance.
 Brazos for low-power.
 Designed to act as a central processing unit (CPU) and
graphics accelerator unit (GPU) on a single die.
 Zen:
 Zen is the codename for a computer processor
microarchitecture from AMD, and was first used with their
Ryzen series of CPUs in February 2017.
 PGA Socket Sizes

 Socket AM2+
 Is used by several AMD processors such as
Athlon 64 X2.
 Socket AM3
 AM3 was launched on February 9, 2009 as the
successor to Socket AM2+, alongside the initial
grouping of Phenom II processors designed for
it.
 Socket FM2+
 Socket used by the A-Series AMD processors
(AMD Accelerated Processing Unit (APU).
 Socket AM4:
 Also known as PGA 1331.
 Socket used by AMD's central processing units
(CPUs) built on the Zen, Zen+, and Excavator
microarchitectures.
Cooling solutions
 Heatsink
Cooling Solutions

 Heat Spreader
 It is the most basic heatsink.
 Simple flat piece of metal to improve heat dissipation.

 Passive Pinned or Finned Heatsinks

 Heat spreaders with structures on top of them to improve
the way how the heat dissipates.
 More expensive and they take up more space on the case
of the PC. Heat Spreader Passive Pinned Heatsink
 Heatsink
Cooling Solutions

 Actively Cooled heatsink

 Adding a fan to the top of the Passive Pinned Heatsinks
increases the performance of the Heatsink
 The most commons

 Heat Pipe or Vapor chamber

 Most effective heatsink
 It has a copper tubes containing liquid that is constantly changing
from liquid to gas to improve the way how the heat is dissipated.
Active cooled Heatsink Heat Pipe or Vapor chamber
Liquid Cooling Solutions

Pre-filled Liquid Cooling

 Cooling solution that already comes pre-filled
with a special solution to dissipate the heat
from your CPU.
 Uses a radiator, can be found on single fan and
dual fan configurations.
 Sizes of 120mm and 140mm.
Liquid Cooling Solutions

Custom Liquid Cooling

 More expensive.
 Customizable.
 Can use hard or soft tubes to archive the
configuration/distribution wanted.
 Can add water cooling to the PCIe graphics card
through adapters.
Processor
Characteristics
 32-bit vs 64-bit
Architecture

 The terms 32-bit and 64-bit refer to the way a

computer's processor (also called a CPU), handles
information. The 64-bit version of Windows handles
large amounts of random access memory (RAM)
more effectively than a 32-bit system.
 AMD was the first company that implemented the
64-bit architecture.
 32-bit architecture supports up to 4GB of RAM, in
contrast the 64-bit architecture supports from 1 TB
to 4 PB of RAM.
 Cores vs Threads

 Cores
 Threads
 A core is a processing unit which reads in instructions to perform
specific actions. 
 Helps improving performance making the system
 There are three Functions: Multitasking .
• Fetch: Read instruction from Memory
• Decode: Analyze Instruction.
• Execute: Perform instruction.
Processor Base Frequency
Clock Rate

 Refers to the frequency at which a chip like a central

processing unit (CPU), one core of a multi-core
processor, is running and is used as an indicator of
the processor's speed.
 It is measured in clock cycles per second or its
equivalent, the SI unit hertz (Hz).
 The clock rate of the first generation of computers
was measured in hertz or kilohertz (kHz), but in the
21st century the speed of modern CPUs is
commonly advertised in gigahertz (GHz).
CPU Cache

 Cache memory, also called CPU memory, is high-speed

static random access memory (SRAM) that a computer
microprocessor can access more quickly than it can
access regular random access memory (RAM).
 This memory is typically integrated directly into the CPU
chip.
 The purpose of cache memory is to store program
instructions and data that are used repeatedly in the
operation of programs or information that the CPU is
likely to need next.
 Initially, the memory cache was separate from the system
processor and not always included in the chipset. Early
PCs typically had from 16 KB to 128 KB of cache
memory.
 Hyper-Threading

 Hyper-Threading is a technology used by some Intel microprocessor s

that allows a single microprocessor to act like two separate processors
to the operating system and the application programs that use it.
 With Hyper-Threading, a microprocessor's "core" processor can execute
two (rather than one) concurrent streams (or threads) of instructions
sent by the operating system.
 Having two streams of execution units to work on allows more work to
be done by the processor during each clock cycle.
 C-States and P-State

 P-states
• Performance State.
• During the execution of code, the operating system
and CPU can optimize power consumption through
different P-states.
• Depending on the requirements, a CPU is operated at
different frequencies. P0 is the highest frequency (with
the highest voltage).
 C-states
• C-States are used to optimize or reduce power
consumption in idle mode (i. e. when no code is
executed).
Thermal Design Power (TDP)

 Thermal Design Power (TDP)

represents the average power, in
watts, the processor dissipates when
operating at Base Frequency with all
cores active under an Intel-defined,
high-complexity workload.
 When looking for a Cooling solution,
you will need to look for a solution
that can cool down the same
processor TDP or more.
 Thermal Management

 Tcase
• Is the temp measured from the Integrated heat  Tjunction Max
spreader, by a diode or thermometer close to the
CPU. This is usually the temp that is shown as
• Maximum temperature allowed for the
"CPU" in the bios health options, or in some processor before it starts the ThermTrip
monitoring programs. process

 Tjunction
• Is the maximum temperature allowed at the
 Thermal Trip (THERMTRIP)
processor die. • Process where the processor starts
• If this temperature is exceed it will be considered turning off mechanical and electrical
overheating. signals until it shuts completely off.
 Overclocking

 Overclocking in the context of computing devices refers to

making them "run faster" than originally intended.
 Any device that runs under a specific frequency can be
overclocked if it unlocked.
 This can be archived by changing the Voltage that is send to
the unit.
 This configuration should be performed from the BIOS/UEFI
or using a dedicated software and is recommended to use a
monitoring software to make sure your unit is stable.
 Overclocking can be dangerous if it is not performed
properly.
 Overclocking will avoid your warranty.
 Intel and AMD processors with a “K” at the end of the model
will mean that they are ”unlocked” to be overclocked.
Virtualization

 Virtualization refers to the act of creating a virtual (rather than

actual) version of something. Like the creation of a virtual
machine that acts like a real computer with an operating system.
 The host machine is the actual machine on which the
virtualization takes place.
 To be able to create virtual environments on a system the CPU
must support a virtualization technology.
 Virtualization Technologies:
• Intel® Virtualization Technology (Intel® VT).
• AMD-V™ Technology.