Howisapcbmade? What Determines Impedance ?

How is a PCB Made ?
What determines impedance ?
www.polarinstruments.com
Manufacturing Processes
Manufacturing Processes for a Multi-layer PCB
Tracks under solder mask

The following presentation
covers the main processes Via hole
during the production of
a multi-layer PCB.
The diagrams which follow SMD Pad

represent a section through
a 6 layer PCB, as indicated
in red.
Section through PCB
2
Typical Layer Construction - 6 Layer PCB
Copper Laminate
Layer 1 (Outer) FOIL
PRE-PREG Impedance Considerations

Layer 2 (Inner)
INNER LAYER
Layer 3 (Inner) • Layer build / stackup is one of
PRE-PREG the most important aspects of
Layer 4 (Inner) controlled impedance
INNER LAYER
Layer 5 (Inner)
PRE-PREG
• Many combinations of
material thickness can be
Layer 6 (Outer) FOIL used.
• PCB Fabricators
manufacturing techniques
vary
3
Drilling of Bonded Panel
Copper Laminate Drilled Hole
Layer 1
Layer 2
Impedance Considerations
• Press temperature and
Layer 3 pressure have an effect on
the flatness and hence
Layer 4 impedance. This should be
checked prior to drilling
Layer 5
• Drilling itself does not effect
impedance
Layer 6
4
Electroless Copper Process

Addition of Copper to all Exposed Surfaces
Copper Drilled Hole
Layer 1
Layer 2
• Electroless copper effects
Layer 3 copper thickness on outer
layers (T)
Layer 4
• Sometimes other solutions
are used containing carbon
Layer 5
etc
Layer 6
5
Laminating and Imaging of External Layers
UV sensitive film is laminated over top and bottom

surfaces of PCB
It is then exposed and developed, leaving an
exposed image of the PCB pattern
Layer 1
Layer 2
• Does not effect impedance
Layer 3
Layer 4
Layer 5
Layer 6
Copper
6
Electro-plating Process 1
Additional Copper to all Exposed Surfaces
Laminated Film Plate Additional Copper
Layer 1
Layer 2
• Electro-plating increases the
Layer 3 copper thickness on outer
layers (T)
Layer 4
• This will always be variations
in the amount of copper
Layer 5
added.
Layer 6 • This finished copper

thickness should be used in
structure calculations
7
Add Tin over Exposed Copper Areas
Tin Plating
Laminated Film Additional Copper
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
8
Remove Laminated Film
Laminated Film Removed Tin Plating
Layer 1
Layer 2
Layer 3
Layer 4
Layer 5
Layer 6
9
Etch Process - Remove Exposed Copper
Copper Removed Tin Plating
Layer 1
Layer 2
• The etch process produces
Layer 3 an ‘etch back’ or undercut of
the tracks. This can be
Layer 4 specified by the W / W1
parameters
• This means that tracks will
Layer 5
end up approximately
0,025 mm (0.001”) thinner
Layer 6 than the original design.
10
Tin Strip - Remove Tin Plating
Tin Plating Removed
Layer 1
Layer 2
• The Removal of Tin will
Layer 3 slightly reduce the copper
thickness (T) on the outer
Layer 4 layers
Layer 5
Layer 6
11
PCB is now complete except for

surface finishes and panel routing
Tracks Via Hole SMD Pad
Layer 1
Layer 6
Tracks
12
Solder Mask Application

- Curtain Coated Method
Apply Liquid Photo-imageable Resist, then Dry

Layer 1
• Some PCB Fabricators chose
to check the impedance
before the solder mask is
Layer 6
added
• Structures can be checked in
Normal and Coated mode
• Thickness of solder mask
should be specified using H1
13
Solder Mask Application

Image, Develop and Cure
UV Image, Develop and Cure

Layer 1
Layer 6
14
Surface Finish Process
Apply Solder to Exposed Copper Areas

Layer 1
• Surface Finish (Tin / Lead /
Gold / Silver) is usually only
added to pads
Layer 6
• If board has no solder mask
the thickness of finish should
be added to T.
15
Component Notation
SCL2 9624
R34
R34
IC3
IC3
16
Routing (includes second stage drilling)
• Controlled Impedance
coupons are routed from the
panel
• Good controls are necessary
to ensure that coupons can
be matched to manufacturing
panels
17
Process finished PCB and coupon for

testing
panel
• Controls are necessary to
ensure that coupons can be
matched to manufacturing
panels this should be
performed on trial panels
prior to production ramp up.
18
Why as a designer do you need to

discuss your design with your PCB fabricator?
PCB manufacture is a process, it uses Impedance Considerations

materials which are not “Ideal”
• Glass Er 6
• Resin Er 3 (FR4)
FR4 for example is a glass resin mix made • Resin Er < 3 (High
of two substances with differing electrical performance laminates)
properties.
PCB Manufacturers need to make small

adjustments to designs to maximise yields
19
Why as a designer do you need to

discuss your design with your PCB fabricator?
Process varies from one fabricator to Impedance Considerations

another.
• Supplier variations
Press pressures temperatures may vary
Pre preg and Core may vary from one

Supplier to another.
20
Process finished PCB and coupon for

testing
panel
• Controls are necessary to
ensure that coupons can be
matched to manufacturing
panels this should be
performed on trial panels
prior to production ramp up.
21
Design & test tools for controlled impedance & Signal integrity
PCB Faultfinding systems & software
Your contacts at Polar:
USA: Richard Smith (800) 328 0817

UK / Europe: Neil Chamberlain +44 23 9226 9113
Asia / Pacific: Amit Bhardwaj +65 6873 7470
©2003 Polar Instruments

For more information
please visit:
www.polarinstruments.co
m
Your contacts at Polar:
USA: Richard Smith (800) 328 0817

UK / Europe: Neil Chamberlain +44 23 9226 9113
Asia / Pacific: Amit Bhardwaj +65 6873 7470
©2003 Polar Instruments

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How is a PCB Made ?

What determines impedance ?

Manufacturing Processes for a Multi-layer PCB

Tracks under solder mask

The diagrams which follow SMD Pad

Section through PCB

Typical Layer Construction - 6 Layer PCB

Layer 1 (Outer) FOIL

PRE-PREG Impedance Considerations

Drilling of Bonded Panel

Copper Laminate Drilled Hole

Electroless Copper Process

Copper Drilled Hole

Laminating and Imaging of External Layers

UV sensitive film is laminated over top and bottom

Laminated Film Plate Additional Copper

Layer 6 • This finished copper

Laminated Film Removed Tin Plating

Etch Process - Remove Exposed Copper

Copper Removed Tin Plating

Tin Strip - Remove Tin Plating

Tin Plating Removed

PCB is now complete except for

Tracks Via Hole SMD Pad

Solder Mask Application

Apply Liquid Photo-imageable Resist, then Dry

Solder Mask Application

UV Image, Develop and Cure

Surface Finish Process

Apply Solder to Exposed Copper Areas

Routing (includes second stage drilling)

Process finished PCB and coupon for

Why as a designer do you need to

PCB manufacture is a process, it uses Impedance Considerations

PCB Manufacturers need to make small

Why as a designer do you need to

Process varies from one fabricator to Impedance Considerations

Pre preg and Core may vary from one

Process finished PCB and coupon for

USA: Richard Smith (800) 328 0817

©2003 Polar Instruments

USA: Richard Smith (800) 328 0817

©2003 Polar Instruments

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