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Bonding-4

chemistry
3-step etch& rinse
• Etch- 35% H3PO4
• Primer- HEMA, polyalkenoic acid polymer,
water
• Bonding- bis-GMA, HEMA, tertiary amines,
photoinitiator
2-step etch & rinse
• Etching – phosphric acid
• Bonding- dimethacrylates, HEMA,
polyalkenoic acid polymer, 5-nm silane-treated
colloidal silica, ethanol, water, photoinitiator
Two-step self-etching
• Self-etching primer- acrylic ether phosphoric
acid, bisacrylamide, water, camphoroquinone,
stabilizers
• Bonding bis-GMA, GDMA, HEMA, fumed silica,
CQ, , tertiary amine, stabilizers
One step
• Part-I- ethanol, Na benzoate, sulfinate
• Part-II- HEMA, BPDM, GPDM, bis GMA
One step
• UDMA, 4- META, glutaraldehyde, acetone,
water, photoinitiators,stabilizers

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