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74ls244 Data Sheet
74ls244 Data Sheet
DATA SHEET
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 3.0 ns. TYPICAL SYMBOL tPHL/tPLH PARAMETER propagation delay 1An to 1Yn; 2An to 2Yn input capacitance output capacitance power dissipation capacitance CL = 50 pF; f = 1 MHz; notes 1 and 2 CONDITIONS AHC CL = 15 pF; VCC = 5 V VI = VCC or GND 3.5 AHCT 5.0 ns UNIT
3.5 4.0 10
3.5 4.0 12
pF pF pF
Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL VCC2 fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC.
1999 Sep 28
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
DESCRIPTION output enable input (active LOW) data inputs bus outputs ground (0 V) data inputs data outputs output enable input (active LOW) DC supply voltage
PACKAGES NORTH AMERICA PINS 74AHC244D 74AHC244PW DH 74AHCT244D 7AHCT244PW DH 20 20 20 20 PACKAGE SO TSSOP SO TSSOP MATERIAL plastic plastic plastic plastic CODE SOT163-1 SOT360-1 SOT163-1 SOT360-1
1999 Sep 28
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
handbook, halfpage
1OE 1 1A0 2 2Y0 3 1A1 4 2Y1 5 1A2 6 2Y2 7 1A3 8 2Y3 9 GND 10
MNA162
244
handbook, halfpage
1A0
1Y0
18
4
handbook, halfpage
1A1
1Y1
16
2 4 6 8
19
EN 9 7 5 3
MNA169
17
2A0
2Y0
11 13 15 17
15
2A1
2Y1
13
2A2
2Y2
11 19
2A3 2OE
2Y3
MNA170
1999 Sep 28
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
74AHC SYMBOL VCC VI VO Tamb PARAMETER DC supply voltage input voltage output voltage operating ambient temperature range see DC and AC characteristics per device VCC = 5 V 0.5 V CONDITIONS MIN. 2.0 0 0 40 40 TYP. MAX. MIN. 5.0 +25 +25 5.5 5.5 VCC +85 4.5 0 0 40
74AHCT UNIT TYP. MAX. 5.0 +25 +25 5.5 5.5 VCC +85 V V V C
+125 40 100 20
+125 C 20 ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC VI IIK IOK IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO packages: above 70 C the value of PD derates linearly with 8 mW/K. For TSSOP packages: above 60 C the value of PD derates linearly with 5.5 mW/K. PARAMETER DC supply voltage input voltage range DC input diode current DC output diode current DC VCC or GND current storage temperature range power dissipation per package for temperature range: 40 to +125 C; note 2 VI < 0.5 V; note 1 VO < 0.5 V or VO > VCC + 0.5 V; note 1 CONDITIONS MIN. MAX. UNIT 0.5 0.5 65 +7.0 +7.0 20 20 25 75 500 V V mA mA mA mA mW
+150 C
1999 Sep 28
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
74AHC family Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH HIGH-level input voltage VCC (V) 2.0 3.0 5.5 VIL LOW-level input voltage 2.0 3.0 5.5 VOH HIGH-level output voltage; all outputs HIGH-level output voltage VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 4.0 mA VI = VIH or VIL; IO = 8.0 mA VOL LOW-level output voltage; all outputs LOW-level output voltage VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 4 mA VI = VIH or VIL; IO = 8 mA II IOZ ICC CI input leakage current 3-state output OFF current quiescent supply current input capacitance VI = VCC or GND 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 5.5 MIN. 1.5 2.1 1.9 2.9 4.4 2.0 3.0 4.5 25 TYP. 0.5 0.9 1.65 0.1 0.1 0.1 0.36 0.36 0.1 Tamb (C) 40 to +85 0.5 0.9 1.65 40 to +125 UNIT 0.5 0.9 1.65 V V V
MAX. MIN. MAX. MIN. MAX. 1.5 2.1 1.9 2.9 4.4 1.5 2.1 1.9 2.9 4.4 V
3.85
3.85
3.85
2.58 3.94 0 0 0 3
0.25 4.0 10
10.0 A 80 10 A pF
1999 Sep 28
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
74AHCT family Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output VI = VIH or VIL; voltage; all outputs IO = 50 A HIGH-level output voltage VOL VI = VIH or VIL; IO = 8.0 mA VCC (V) 4.5 25 0.8 0.1 0.36 0.1 Tamb (C) 40 to +85 0.8 0.1 0.44 1.0 2.5 40 to +125 UNIT 0.8
MIN. TYP. MAX. MIN. MAX. MIN. MAX. 2.0 4.4 3.8 2.0 4.4 V V V V V V A
4.5 to 5.5 2.0 4.5 to 5.5 4.5 4.5 4.5 4.5 5.5 4.4
3.94 0
LOW-level output VI = VIH or VIL; voltage; all outputs IO = 50 A LOW-level output voltage VI = VIH or VIL; IO = 8 mA VI = VIH or VIL
II IOZ
VI = VIH or VIL; 5.5 VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 VI = VCC or GND; 5.5 IO = 0 VI = VCC 2.1 V other inputs at VCC or GND; IO = 0
0.25
10.0 A
ICC ICC
quiescent supply current additional quiescent supply current per input pin input capacitance
4.0 1.35
40 1.5
80 1.5
A mA
4.5 to 5.5
CI
10
10
10
pF
1999 Sep 28
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
ns ns ns ns ns ns
VCC = 4.5 to 5.5 V; note 2 tPHL/tPLH tPZL/tPZH tPLZ/tPHZ tPHL/tPLH tPZL/tPZH tPLZ/tPHZ Notes 1. Typical values at VCC = 3.3 V. 2. Typical values at VCC = 5.0 V. propagation delay nAn to nYn propagation delay nOE to nYn propagation delay nOE to nYn propagation delay nAn to nYn propagation delay nOE to nYn propagation delay nOE to nYn see Figs 4 and 6 15 pF see Figs 5 and 6 see Figs 4 and 6 50 pF see Figs 5 and 6 3.4 4.0 4.8 5.0 5.5 7.0 5.5 7.3 7.2 7.5 9.3 9.2 1.0 1.0 1.0 1.0 1.0 1.0 6.5 8.5 8.5 8.5 10.5 10.5 1.0 1.0 1.0 1.0 1.0 1.0 7.0 9.5 9.0 9.5 12.0 11.5 ns ns ns ns ns ns
1999 Sep 28
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
ns ns ns ns ns ns
handbook, halfpage VI
VM
VM
tPHL
VM
VM
MNA171
1999 Sep 28
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
VI nOE INPUT GND tPLZ OUTPUT LOW-to-OFF OFF-to-LOW VCC VM VOL tPHZ VOH OUTPUT HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled
MNA172
VM
tPZL
VO
1000
S1
1999 Sep 28
10
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
SOT163-1
A X
c y HE v M A
Z 20 11
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
1999 Sep 28
11
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
c y HE v M A
20
11
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
10
w M detail X
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 6.6 6.4 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC MO-153AC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-06-16 95-02-04
1999 Sep 28
12
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Sep 28
13
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
Suitability of surface mount IC packages for wave and reow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable REFLOW(1)
1999 Sep 28
14
Philips Semiconductors
Product specication
74AHC244; 74AHCT244
1999 Sep 28
15
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
245002/03/pp16
Sep 28