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24AA256/24LC256/24FC256: 256K I C Cmos Serial Eeprom
24AA256/24LC256/24FC256: 256K I C Cmos Serial Eeprom
DS21203M-page 1
24AA256/24LC256/24FC256
Device Selection Table
Features
Low-power CMOS technology:
- Maximum write current 3 mA at 5.5V
- Maximum read current 400 A at 5.5V
- Standby current 100 nA typical at 5.5V
2-wire serial interface bus, I
2
C
compatible
Cascadable for up to eight devices
Self-timed erase/write cycle
64-byte Page Write mode available
5 ms max. write cycle time
Hardware write-protect for entire array
Output slope control to eliminate ground bounce
Schmitt Trigger inputs for noise suppression
1,000,000 erase/write cycles
Electrostatic discharge protection > 4000V
Data retention > 200 years
8-pin PDIP, SOIC, TSSOP, MSOP and DFN
packages, 14-lead TSSOP package
Standard and Pb-free finishes available
Temperature ranges:
Description
The Microchip Technology Inc. 24AA256/24LC256/
24FC256 (24XX256*) is a 32K x 8 (256 Kbit) Serial
Electrically Erasable PROM, capable of operation
across a broad voltage range (1.8V to 5.5V). It has
been developed for advanced, low-power applications
such as personal communications or data acquisition.
This device also has a page write capability of up to 64
bytes of data. This device is capable of both random
and sequential reads up to the 256K boundary.
Functional address lines allow up to eight devices on
the same bus, for up to 2 Mbit address space. This
device is available in the standard 8-pin plastic DIP,
SOIC, TSSOP, MSOP, DFN and 14-lead TSSOP
packages.
Block Diagram
Package Types
*24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices.
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
24AA256 1.8-5.5V 400 kHz
(1)
I
24LC256 2.5-5.5V 400 kHz I, E
24FC256 1.8-5.5V 1 MHz
(2)
I
Note 1: 100 kHz for VCC < 2.5V.
2: 400 kHz for VCC < 2.5V.
- Industrial (I): -40C to +85C
- Automotive (E): -40C to +125C
HV Generator
EEPROM
Array
Page Latches
YDEC
XDEC
Sense Amp.
R/W Control
Memory
Control
Logic
I/O
Control
Logic
I/O
A0 A1A2
SDA
SCL
VCC
VSS
WP
A0
A1
A2
VSS
VCC
WP
SCL
SDA
1
2
3
4
8
7
6
5
2
4
X
X
2
5
6
PDIP/SOIC TSSOP/MSOP *
A0
A1
A2
VSS
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
TSSOP
2
4
X
X
2
5
6
DFN
A0
A1
A2
VSS
WP
SCL
SDA
2
4
X
X
2
5
6
5
6
7
8
4
3
2
1 VCC
NC
A0
A1
NC
A2
VSS
NC
NC
VCC
WP
NC
SCL
SDA
NC
2
4
X
X
2
5
6
1
2
3
4
14
13
12
11
5 10
6 9
7 8
Note: * Pins A0 and A1 are no connects for the MSOP package only.
256K I
2
C
100
400
400
1000
kHz 1.8V VCC < 2.5V
2.5V VCC 5.5V
1.8V VCC < 2.5V 24FC256
2.5V VCC 5.5V 24FC256
2 THIGH Clock high time 4000
600
600
500
1000
300
300
ns 1.8V VCC < 2.5V
2.5V VCC 5.5V
1.8V VCC 5.5V 24FC256
5 TF SDA and SCL fall time
(Note 1)
300
100
ns All except, 24FC256
1.8V VCC 5.5V 24FC256
6 THD:STA Start condition hold time 4000
600
600
250
3500
900
900
400
ns 1.8 V VCC < 2.5V
2.5 V VCC 5.5V
1.8V VCC < 2.5V 24FC256
2.5 V VCC 5.5V 24FC256
14 TBUF Bus free time: Time the bus
must be free before a new
transmission can start
4700
1300
1300
500
E
eB
c
E1
n
D
1
2
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 8 8
Pitch
p
.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c .008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top 5 10 15 5 10 15
Mold Draft Angle Bottom 5 10 15 5 10 15
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010 (0.254mm) per side.
Significant Characteristic
2004 Microchip Technology Inc. DS21203M-page 15
24AA256/24LC256/24FC256
8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)
Foot Angle 0 4 8 0 4 8
15 12 0 15 12 0 Mold Draft Angle Bottom
15 12 0 15 12 0 Mold Draft Angle Top
0.51 0.42 0.33 .020 .017 .013 B Lead Width
0.25 0.23 0.20 .010 .009 .008 c Lead Thickness
0.76 0.62 0.48 .030 .025 .019 L Foot Length
0.51 0.38 0.25 .020 .015 .010 h Chamfer Distance
5.00 4.90 4.80 .197 .193 .189 D Overall Length
3.99 3.91 3.71 .157 .154 .146 E1 Molded Package Width
6.20 6.02 5.79 .244 .237 .228 E Overall Width
0.25 0.18 0.10 .010 .007 .004 A1 Standoff
1.55 1.42 1.32 .061 .056 .052 A2 Molded Package Thickness
1.75 1.55 1.35 .069 .061 .053 A Overall Height
1.27 .050
p
Pitch
8 8 n Number of Pins
MAX NOM MIN MAX NOM MIN Dimension Limits
MILLIMETERS INCHES* Units
2
1
D
n
p
B
E
E1
h
L
c
45
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Significant Characteristic
24AA256/24LC256/24FC256
DS21203M-page 16 2004 Microchip Technology Inc.
8-Lead Plastic Small Outline (SM) Medium, 208 mil (SOIC)
Foot Angle 0 4 8 0 4 8
15 12 0 15 12 0 Mold Draft Angle Bottom
15 12 0 15 12 0 Mold Draft Angle Top
0.51 0.43 0.36 .020 .017 .014 B Lead Width
0.25 0.23 0.20 .010 .009 .008 c Lead Thickness
0.76 0.64 0.51 .030 .025 .020 L Foot Length
5.33 5.21 5.13 .210 .205 .202 D Overall Length
5.38 5.28 5.11 .212 .208 .201 E1 Molded Package Width
8.26 7.95 7.62 .325 .313 .300 E Overall Width
0.25 0.13 0.05 .010 .005 .002 A1 Standoff
1.98 .078 A2 Molded Package Thickness
2.03 .080 A Overall Height
1.27 .050
p
Pitch
8 8 n Number of Pins
MAX NOM MIN MAX NOM MIN Dimension Limits
MILLIMETERS INCHES* Units
A2
A
A1
L
c
2
1
D
n
p
B
E
E1
.070 .075
.069 .074
1.78
1.75
1.97
1.88
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010 (0.254mm) per side.
Drawing No. C04-056
Significant Characteristic
2004 Microchip Technology Inc. DS21203M-page 17
24AA256/24LC256/24FC256
8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)
10 5 0 10 5 0 Mold Draft Angle Bottom
10 5 0 10 5 0 Mold Draft Angle Top
0.30 0.25 0.19 .012 .010 .007 B Lead Width
0.20 0.15 0.09 .008 .006 .004 c Lead Thickness
0.70 0.60 0.50 .028 .024 .020 L Foot Length
3.10 3.00 2.90 .122 .118 .114 D Molded Package Length
4.50 4.40 4.30 .177 .173 .169 E1 Molded Package Width
6.50 6.38 6.25 .256 .251 .246 E Overall Width
0.15 0.10 0.05 .006 .004 .002 A1 Standoff
0.95 0.90 0.85 .037 .035 .033 A2 Molded Package Thickness
1.10 .043 A Overall Height
0.65 .026
p
Pitch
8 8 n Number of Pins
MAX NOM MIN MAX NOM MIN Dimension Limits
MILLIMETERS* INCHES Units
A2
A
A1
L
c
1
2
D
n
p
B
E
E1
Foot Angle 0 4 8 0 4 8
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005 (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
Significant Characteristic
24AA256/24LC256/24FC256
DS21203M-page 18 2004 Microchip Technology Inc.
14-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)
8 4 0 8 4 0 Foot Angle
10 5 0 10 5 0 Mold Draft Angle Bottom
10 5 0 10 5 0 Mold Draft Angle Top
0.30 0.25 0.19 .012 .010 .007 B Lead Width
0.20 0.15 0.09 .008 .006 .004 c Lead Thickness
0.70 0.60 0.50 .028 .024 .020 L Foot Length
5.10 5.00 4.90 .201 .197 .193 D Molded Package Length
4.50 4.40 4.30 .177 .173 .169 E1 Molded Package Width
6.50 6.38 6.25 .256 .251 .246 E Overall Width
0.15 0.10 0.05 .006 .004 .002 A1 Standoff
0.95 0.90 0.85 .037 .035 .033 A2 Molded Package Thickness
1.10 .043 A Overall Height
0.65 .026
p
Pitch
14 14 n Number of Pins
MAX NOM MIN MAX NOM MIN Dimension Limits
MILLIMETERS* INCHES Units
L
2
1
D
n
B
p
E1
E
A2 A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005 (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
Significant Characteristic
2004 Microchip Technology Inc. DS21203M-page 19
24AA256/24LC256/24FC256
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
(F)
A2
E1
E
p
B
n 1
2
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REF F Footprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
c
B
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0
0.23
0.40
8
MILLIMETERS*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN MAX NOM
1.10
0.80
0.15
0.95
MAX
8
- -
-
15 5 -
15 5 -
JEDEC Equivalent: MO-187
0 - 8
5
5 -
-
15
15
- -
- -
24AA256/24LC256/24FC256
DS21203M-page 20 2004 Microchip Technology Inc.
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
NOM
.050 BSC
INCHES
.194 BSC
.184 BSC
.226 BSC
.236 BSC
.008 REF.
D Overall Width
JEDEC equivalent: pending
Notes:
Drawing No. C04-113
Molded Package Width
Lead Width
*Controlling Parameter
Mold Draft Angle Top
Tie Bar Width
Lead Length
R
B
L
D1
.014
.020
Dimension Limits
Molded Package Thickness
Pitch
Overall Height
Overall Length
Molded Package Length
Base Thickness
Standoff
Number of Pins
A3
E1
E
A2
A1
A
.000
Units
n
p
MIN
TOP VIEW
1 2
A2
A
5.99 BSC
.019
12
.030
.014
.016
.024
0.35
0.50
.356
0.40
0.60
5.74 BSC
12
0.47
0.75
MILLIMETERS*
.039
.002
.031 .026
.0004
.033
0.00
8
MAX MIN
1.27 BSC
0.20 REF.
4.92 BSC
4.67 BSC
0.85
0.01
0.65 0.80
0.05
1.00
MAX NOM
8
BOTTOM VIEW
n
E
E1
PIN 1
p
B
Exposed Pad Length E2
Exposed Pad Width D2 .085 .091 .097 2.16 2.31 2.46
.152 .158 .163 3.85 4.00 4.15
EXPOSED
METAL
PADS
D2
E2
A1
A3
L
ID
D1 D
R
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010 (0.254mm) per side.
2004 Microchip Technology Inc. DS21203M-page 21
24AA256/24LC256/24FC256
APPENDIX A: REVISION HISTORY
Revision L
Corrections to Section 1.0, Electrical Characteristics.
Revision M
Added 1.8V 400 kHz option for 24FC256.
24AA256/24LC256/24FC256
DS21203M-page 22 2004 Microchip Technology Inc.
NOTES:
2004 Microchip Technology Inc. DS21203M-page 23
24AA256/24LC256/24FC256
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web site.
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape
or Microsoft