Datasheet PDF

www.ti.
com
1
2
3
4
8
7
6
5
COMP
VFB
I
SENSE
R
T
/C
T
V
REF
V
CC
OUTPUT
GND
D (SOIC) OR P (PDIP) PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
COMP
NC
VFB
NC
I
SENSE
NC
R
T
/C
T
V
REF
NC
V
CC
VC
OUTPUT
GND
POWER GROUND
D (SOIC) PACKAGE
(TOP VIEW)
NC No internal connection
www.ti.com
www.ti.com
Internal
Bias
V
REF
Good
Logic
OSC
Error
Amplifier
PWM
Latch
Current-
Sense
Comparator
34 V NOM
V
CC
GND
R
T
/C
T
VFB
COMP
I
SENSE
7
5
4
2
1
3
8
6
V
REF
OUTPUT
+
UVLO
EN
2R
R 1 V
S
R
T
+
5-V V
REF
2.5 V
www.ti.com
www.ti.com
www.ti.com
www.ti.com
www.ti.com
-20
0
20
40
60
80
100
1 . E +0 1 1 . E +0 2 1 . E +0 3 1 . E +0 4 1 . E +0 5 1 . E +0 6 1 . E +0 7
f Frequency Hz
A
V
O
L
O
p
e
n
-
L
o
o
p
V
o
l
t
a
g
e
G
a
i
n
d
B
-100
-50
0
50
100
150
200
P
h
a
s
e
M
a
r
g
i
n
d
e
g
V
CC
= 15 V
R
L
= 100 kX
T
A
= 25C
Phase
Gain
k
10 100 1k 10k 100k 1M 10M
0
5
10
15
20
25
0 5 10 15 20 25 30 35 40
V
CC
Supply Voltage V
I
C
C
S
u
p
p
l
y
C
u
r
r
e
n
t
m
A
T
L
2
8
4
5
T
L
2
8
4
2
0
0.2
0.4
0.6
0.8
1
1.2
0 1 2 3 4 5 6 7 8
V
O
Error Amplifier Output Voltage V
V
t
h
C
u
r
r
e
n
t
-
S
e
n
s
e
I
n
p
u
t
T
h
r
e
s
h
o
l
d
V
V
IN
= 15 V
T
A
= 125C
T
A
= 25C
T
A
= -55C
7.4
7.6
7.8
8
8.2
8.4
8.6
8.8
9
9.2
-55 -35 -15 5 25 45 65 85 105 125 145
T
A
Temperature C
I
d
i
s
h
a
r
g
e
O
s
c
i
l
l
a
t
o
r
D
i
s
c
h
a
r
g
e
C
u
r
r
e
n
t
m
A
V
IN
= 15 V
V
OSC
= 2 V
www.ti.com
-60
-50
-40
-30
-20
-10
0
0 20 40 60 80 100 120 140 160
I
src
Source Current mA
R
e
f
e
r
e
n
c
e
V
o
l
t
a
g
e
D
e
l
t
a
m
V
T
A
= -40C
T
A
= 25C
T
A
= 125C
4.8
4.85
4.9
4.95
5
5.05
5.1
5.15
5.2
-55 -30 -5 20 45 70 95 120 145
T
A
Temperature C
V
r
e
f
R
e
f
e
r
e
n
c
e
V
o
l
t
a
g
e
V
40
60
80
100
120
140
160
180
-55 -30 -5 20 45 70 95 120 145
T
A
Temperature C
I
S
C
S
h
o
r
t
-
C
i
r
c
u
i
t
C
u
r
r
e
n
t
m
A
V
IN
= 15 V
0
1
2
3
4
5
6
7
8
9
10
0 100 200 300 400 500 600 700 800
I
O
Output Load Current mA
S
i
n
k
S
a
t
u
r
a
t
i
o
n
V
o
l
t
a
g
e
V
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
Source Saturation
Sink Saturation
T
A
= 25C
T
A
= -55C
T
A
= -55C
T
A
= 25C
www.ti.com
40
50
60
70
80
90
100
0.1 1 10
R
T
Timing Resistor k
D
m
a
x
M
a
x
i
m
u
m
D
u
t
y
C
y
c
l
e
%
V
CC
= 15 V
C
T
= 3.3 nF
T
A
= 25C
k
www.ti.com
Z
i
Z
f
VFB
COMP
2.5 V
0.5 mA
Error
Amplifier
+
R
S
C
f
R
f
Error
Amplifier
2R
R 1 V
Current-Sense
Comparator
I
S
(see Note A)
+
I
SENSE
COMP
GND
C
T
R
T
V
REF
R
T
/C
T
GND
www.ti.com
TIMING RESISTANCE
vs
FREQUENCY
100 1k 10k 100k 1M

f Frequency Hz
R
T

T
i
m
i
n
g

R
e
s
i
s
t
a
n
c
e

k
100
40
10
4
1
V
CC
= 15 V
T
A
= 25C
C
T
= 22 nF
C
T
= 47 nF
C
T
= 100 nF
C
T
= 10 nF
C
T
= 4.7 nF
C
T
= 22 nF
C
T
= 1 nF
DEAD TIME
vs
TIMING CAPACITANCE
s
100 40 10 4 0
C
T
Timing Capacitance nF
100
40
10
4
1
0.4
0.1
D
e
a
d

T
i
m
e

V
CC
= 15 V
R
T
5 k
T
A
= 25C
2N2222
4.7 k
1-k
Error Amplifier Adjust
4.7 k
5 k
I
SENSE
Adjust
R
T
100 k
V
CC
0.1 F
0.1 F
REF
V
CC
OUTPUT
GND
1 k, 1 W
A
C
T
TL284xB
TL384xB
I
SENSE
V
REF
R
T
/C
T
VFB
COMP
OUTPUT
GND
www.ti.com
330
1 k
500
To Current-Sense
Resistor
Shutdown
Shutdown
COMP
V
REF
I
SENSE
R
T
0.1 F
C
T
R1
R2
I
SENSE
R
SENSE
C
V
REF
R
T
/C
T
I
SENSE
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
TL2842BD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TL2842BDG4-8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
TL2842BDR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
TL2842BDRG4-8 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
TL2842BP ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL2842BPE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS)
no Sb/Br)
TL2843BD-8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
TL2843BDG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br)
no Sb/Br)
no Sb/Br)
TL2843BDR-8 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
TL2843BDRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br)
no Sb/Br)
(RoHS)
TL2843BPG4 ACTIVE PDIP P 8 TBD Call TI Call TI
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
PACKAGE OPTION ADDENDUM
www.ti.com 6-Dec-2006
Addendum-Page 1
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
(3)
(RoHS)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
Addendum-Page 2
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
(3)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 3
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
MECHANICAL DATA
MPDI001A JANUARY 1995 REVISED JUNE 1999
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE
8
4
0.015 (0,38)
Gage Plane
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
MAX
0.430 (10,92)
4040082/D 05/98
0.200 (5,08) MAX
0.125 (3,18) MIN
5
0.355 (9,02)
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.400 (10,60)
1
0.015 (0,38)
0.021 (0,53)
Seating Plane
M 0.010 (0,25)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TIs terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated

Datasheet PDF

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Datasheet PDF

Uploaded by

Copyright:

Available Formats

www.ti.

100 1k 10k 100k 1M

You might also like