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Ground Bounce in Digital VLSI Circuits: Payam Heydari, Member, IEEE, Massoud Pedram, Fellow, IEEE
Ground Bounce in Digital VLSI Circuits: Payam Heydari, Member, IEEE, Massoud Pedram, Fellow, IEEE
Abstract- This paper is concerned with the analysis and optimization of the ground bounce in digital CMOS circuits.
First, an analytical method for calculating the ground bounce
is presented. The proposed method relies on accurate models
of the short-channel MOS device and the chip-package interface parasitics. Next the effect of ground bounce on the propagation delay and the optimum tapering factor of a multistage buffer is discussed and a mathematical relationship for
total propagation delay in the presence of the ground bounce
is obtained. Effect of an on-chip decoupling capacitor on the
ground bounce waveform and circuit speed is analyzed next
and a closed form expression for the peak value of the differential-mode component of the ground bounce in terms of the
on-chip decoupling capacitor is provided. Finally a design
methodology for controlling the switching times of the output
drivers to minimize the ground bounce is presented.
VDD
1
Out1
CL1
Out2
CL2
Index Terms
Signal integrity, Noise, Ground bounce,
Tapered buffer, On-chip decoupling capacitor, Skew control.
I. INTRODUCTION
.
..
..
.. ..
.
..
I
----- = 5 mA/nsec
t
I
NL ----- = 0.8V
t
Out16
CL16
16
L = 10 nH
P. Heydari is with the Department of Electrical and Computer Engineering, University of California, Irvine, CA 92697-2625 USA.
M. Pedram is with the Department of Electrical Engineering Systems, University
of Southern California, Los Angeles, CA 90089 USA.
Rv
VDD
GND
Fig. 2. A layout schematic for the output drivers along with the
bonding wires, pads and package pins.
Rv
Lv
Vin:
Cv
rv
Vin Q
1
tr
rv
Rp Lp
Rb Lb
PWB GND
rG
Rp Lp
Rb
Lb
Cp
RG
Cb
Cb
Rp Lp
Rb Lb
Cp
Cb
Q4
rG
LG
RG
Cb
Rp Lp
Rb Lb
Cp
Cb
CL
Q6
rG
LG
Chip GND
Vin Q
5
CL
CG
CG
Cp
Cp
VDD
rv
Vin Q3
CL
Q2
Rb Lb
Lv
Cv
VDD
Rp Lp
PPGA
H-PBGA
TQFP
126-165
136-188
114-158
70-150
2.3-4.1
2.5-4.6
2.1-4.1
1-4
0.2-0.5
0.1-0.3
0.2-0.6
0.1-0.3
Pin/Land Rp (m)
20
20
90-97
Pin/Land Lp (nH)
4.5-7.0
4.5-7.0
4.0-6.0
3-5
Pin/Land Cp (pF)
0.1
0.1
0.02
0.1-0.3
VDD
....
0
tr
Vin,1
Vout,1
Rw Lw
Vin,N
Vout,N
Rw Lw
CL
CL
....
VDD
TABLE I
SUMMARY OF PACKAGE I/O LEAD ELECTRICAL PARASITICS
FOR DIFFERENT PACKAGES
Electrical Parameters
TH0
n,0
ox
Chip Gnd
PWB Gnd
Fig. 4. Circuit schematic of N output pad drivers.
the effect of PMOS currents is ignored [3], [6]. Fig. 7 demonstrates the input, output, and ground bounce waveform in a circuit consisting of a large off-chip inverter implemented in
0.25m CMOS process and a 4pF capacitive load.
VDD
Time=9.55e-09
.
Vin
2.09
vn
VDD
VDD
0
....
Vout,1
Rw Lw
Vin,1
Vin,N
Vout,N
Rw Lw
CL
Vtn
Region I: 0 t --------t
VDD r
1.5
Voltage
I III
1
Output: red
Ground_bounce: blue
L = 7nH, R = 0.6, CL=4pF
(a)
tr
Input : purple
VDD
VDD
.
N
2.5
2.5
II
V
VD D
tn
- tr t tr
Region II: --------
IV
Region III:
Region IV:
CL
rDS,1
....
....
rDS,M
tr t t s
t ts
0.561
500m
M
0
(b)
Fig. 5. N output drivers switch simultaneously and the remaining M drivers are quiet. (a) the actual circuit. (b) the simplified
circuit.
-500m
VDD
10n
Rw Lw
0
VDD
CL
tr
14n
Vout,1
Vin,1
12n
Time (lin) (TIME)
ID
1
DS
W- --------------------= n Cox ----------- V
- VGS Vtn V
L
2 DS
V
DS
1 + ------------
LEsat
(1)
LEsat (VGS Vtn )
where VDS, sat = ------------------------------------------ . From the aforementioned
LE sat + VGS Vtn
discussion, the NMOS transistor will enter the linear region when
the input voltage is VDD due to the presence of large off-chip
capacitive loads. The overdrive voltage is thus constant at VDD Vtn . As a result, the nonlinear relationship between the saturated
drift velocity, d,sat, and the drain-source saturation voltage,
VDS,sat, is evaluated at GS = VDD. This leads to the following simplified transistor equation that holds true for the output drivers:
ID
where
and
n (VGS Vtn)
VDS VDS, sat
= 1
W- (V V ) V V V
- C --- -2 n ox L DD tn DS DS DS, sat
d vn
--------dt 2
vn
R dv
VDD
- = R
--- --------+ ( --- ) -------n- + -----------
vn ( t )
VDD t
VDD-
-e
= ------------sin d t + 2 ------------
tr d
tr n2
L dt
LCgb
L tr
Vtn
-t
0 t --------VDD r
(3)
t
1 -----n- e sin ( d t + )
d
(4)
1
R
1
d- .
where = ------ , 2n = ------------, d = 2n 2 , = tan ----2L
LCgb
(2)
Vtn- t t t ):
2) Region II ( --------r
VDD r
If the overdrive voltage is larger than the NMOS threshold
voltage, Vtn, the NMOS transistor turns on and operates in its saturation region. The off-chip drivers drain current flowing
through the chip-package interface parasitics will generate the
ground bounce, vn. Utilizing the characteristic I-V equation of a
saturated NMOS transistor (Eq. (2)) and writing a simple KVL
for the drain current path consisting of NMOS transistor and the
RL circuit in the circuit shown in Fig. 6, leads us to the following
ODE:
1-
VDD R R VDD
dvn R + ---n
0 r (5)
- --- Vtn + --- ----------
+ --------------------- vn = -------- tr
L
d
L L tr
Vtn
Vtn
where = t ---------- t r and r = 1 ---------- t r .
VDD
VDD
Solving the above ODE for vn yields the following expression for the ground bounce in the interval ( Vtn VDD ) t r t t r in
terms of t:
p ( t t0 )
Us
v ( t )ep ( t t0 ) + -----(1 e
)
n
0
p
p ( t t0 )
U
+ -----2r- [ p (t t0 ) (1 e
)] u ( t t 0 )
t 0 t t r (6)
p
where:
1
R + ---VDD R
n
R VDD
Vtn -------------------- , U s= ---------- --- Vtn , Ur = --- --------- , t 0 = --------t .
p=
tr
L tr
L
VDD r
L
and with the following initial condition:
t
VDD t
VDD
- 1 --------n- e
sin ( d t + )
v n ( 0 )= ------------2
tr d- e sin d t + 2 ------------
d
t r n
Vtn
vn ( t )
A. Ramp input
During the low-to-high input transition the NMOS transistor
of the output driver experiences multiple region transitions.
Unlike what is commonly assumed, the ground bounce is not
zero for [ 0, ( Vtn VDD ) t r ] . Therefore we need to decompose the
interval [0 , tr] into two subintervals and obtain the ground
bounce waveform for each of these regions.
Vtn t ):
1) Region I ( 0 t -------VDD r
During this interval, the NMOS transistor operates in its
weak-inversion region. When the transistor is operating in its
weak inversion region the amount of drain current flowing
through the drain path is very small. Instead there is another current path from input to the ground network provided by the gate-
t = -------------
VDD
B. Constant input
For t > t r the input waveform reaches the supply voltage
VDD. The rate of change of drain current flowing through the
series RL circuit decreases, which causes the ground bounce to
decrease in time as well. The ground bounce analysis is performed on two distinct sub-intervals; t r t t s when the NMOS
transistor is still in the saturation region, and t t s when the transistor makes a transition to the linear operating region.
Rw
Vout
rDS
t r t ts
Note that during the design of the output drivers, their W/L
ratio is assumed to be large enough so that they can provide sufficient current for the off-chip load. This implies that rDS values of
off-chip drivers lie within the range of 20-80 . In practice,
( R + Rw + rDS ) < 2 ( L + L w ) C L and the ground bounce experiences a decaying oscillatory waveform over [t s , T 2 ] as also
shown in Fig. 7. Since in each cycle of the oscillation the electric
energy across the load capacitor converts to the electromagnetic
energy stored in the electromagnetic field across the inductor and
dissipated energy in the resistor, we have a complete fluctuation
around the steady-state which is zero volt in this case and the
ground bounce passes through a minimum undershoot. The current i satisfies the following second-order ODE:
R w + R + rDS di
1
d 2-i + -----------------------------t t s (10)
------ ----- + ---------- i = 0
dt LC L
L
dt 2
(7)
p ( t tr )
R
+ ---------------------- (VDD Vtn ) 1 e
u( t t r )
R + 1 n
t r t t s (8)
At t = ts the NMOS transistor experiences a transition in its
operating mode and enters the linear region. The drain-source
voltage of NMOS transistor at t = ts is equal to the saturated
drain-source voltage, VDS,sat . The equivalent circuit at t = ts is
demonstrated in Fig. 8.
vn ( t ) = vn ( tr ) e
Lw
Vout
CL
ID = n (VDD v n Vtn)
vn ( t r ) = vn ( tr )
Rw
i
vn(t)
CL
1) Region III ( t r t t s ):
Over the time interval t r t t s , the input is flat at VDD and
the NMOS transistor operates in the saturation. The corresponding ODE becomes:
1
-----
dvn R +
R
n v n = --- ( VDD Vtn )
+ -------------------L
L
dt
Lw
( t t )
s
v n ( t ) = ( Vc cos d ( t t s ) + Vs sin d ( t ts ) )e
t ts (11)
where
R w + rDS + R
2
2
2
2
1
- , n = -------------------------- = -----------------------------, d = n ,
( L + L w )CL
2( L + Lw )
R Ln2 R L
- I+ ----------------- I .
Vc= RI + LI , Vs =------------------------
d
d
Fig. 10 compares our analytical approach with the HSPICE
simulation for the three output drivers switching simultaneously
-
VDD -----n- (VDD Vtn ) ( ts t r ) -----n- vn ( t ) dt 1 + --------------------------R + jc L vn ( ts )
CL t
CL
Our simulation :
0.8
HSPICE:
0.6
0.4
0.2
0.2
The response of an inverter to a flattened ramp (CL=0.09pF)
2.6
0.4
0.5
1.5
Time (sec)
2.5
2.4
x 10
NMOS: Saturation
I PMOS: Linear
2.2
NMOS: Saturation
II PMOS: Saturation
NMOS: Saturation
PMOS: Cutoff
IV NMOS: Linear
PMOS: Cutoff
III
1.8
Voltages (lin)
1.6
IV
1.4
1.2
II
III
OPTIMIZATION
To drive large off-chip capacitances with a minimum of
propagation delay, it is necessary to use an output buffer consisting of a number of CMOS inverters with gradually increasing
driving capability as also indicated in Fig. 11 [14]. The tapering
factor u is the ratio between the gate aspect ratios of two consecutive inverters in the inverter chain.
VDD
R
.....
600m
400m
200m
4.98n
L
Rw
Lw
tPHL
tr / 2
5n
5.02n
5.04n
5.06n
5.08n
5.1n
5.12n
Time (lin) (TIME)
5.14n
5.16n
5.18n
5.2n
5.22n
Vout
CL
( W L)i
-----------------------= u ; for i = 1, ...., P
(W L) i 1
Fig. 11. A CMOS buffer consisting of a series of inverters with
gradually increasing driving capability. The chip-package inter-
According to Fig. 12 four different operating regions are distinguished in the time interval [ tr 2, t PHL ] . The regions of operations are summarized in Table II.
TABLE II
SUMMARY OF CMOS INVERTER OPERATING REGION
TRANSITIONS
Region I
Region II
Region III
Region IV
NMOS
Saturation
Saturation
Saturation
Linear
PMOS
Linear
Saturation
Cutoff
Cutoff
TABLE III
COMPARISON BETWEEN SIMULATED INVERTER DELAY
USING HSPICE (LEVEL 49, 0.25 PROCESS), AND THE
MODIFIED DELAY FORMULA PROPOSED IN [18], THE DELAY
FORMULA PROPOSED IN [17], AND EQ. (15). DELAYS ARE
GIVEN IN psec, AND TRANSISTOR SIZES ARE GIVEN IN m
tPHL
t i2( t ) dt
(12)
2V
1 1
= t PHL, 0 + t r0 --- --- ----p- 1 ---------T- +
4 2 n
V DD
tr (psec)
CL (pF)
(13)
where
HSPICE
Paper [18]
80
119.5
65.68
112.5
113.2
90
235.02
111.51
226.4
230.3
100
173.93
92.75
158.6
153.4
150
269.68
150.23
245.6
254.3
V T V DD
CL
1
1
---------------------------------------- ----- ------------------------------- ln -----------------------------
1 2V T V DD n 1 V T VDD
2 ( 1 2V T V DD ) n
200
330.8
185.5
318.1
325.0
250
428.4
242.92
414.2
420.2
n = rDS ( C L + Cdb, n )
where tPHL,0 represents the 50% propagation delay in the ideal
case of having an ideal step input and C db, n is the drain-bulk
junction capacitance. tr0 is the input rise-time of the single driver.
A similar delay expression is derived for the low-to-high transition of the output, except that in Eq. (13) p and n are replaced
by n and p , respectively, and vice versa:
2VT
1 1 n
t PLH = t PLH, 0 + t r0 --- --- ----- 1 ---------- +
(14)
4 2 p
VDD
where tPLH represents the propagation delay for the low-to-high
transition of the output. Finally the total propagation delay is:
t PLH + t PHL
t d = --------------------------(15)
2
300
485.57
236.13
477.3
474.3
400
506.87
308.2
478.6
497.2
500
305.64
294.95
297.3
295.3
500
10
577.13
361.13
548.9
570.1
VT = Vtn = Vtp
= 1--2-
1 VT VDD
1 + -------------------------------1 2VT VDD
tPHL, 0 =
From Table III one can see that Eq. (15) will provide a better
delay estimation for large capacitive loads. The reason for this is
that the simplified MOS I-V equations in (2) will become more
accurate for larger loads.
Having derived a closed-form expression for the inverter
delay, the propagation delay of a tapered buffer can be obtained
as explained by the next Lemma.
[ A + 1 ] 1
[ A + 1 ] 1
t p = u --------------------------------- t p0 + --------------------------------- t r0
A
(16)
1 1
where A = --- --- ----n- + ----p- and tp0 is the propagation delay of a
8 8 p n
minimum size inverter driving another minimum size inverter
when the input rise time is zero (i.e., the first term of Eq. (13)).
Proof: According to Eq. (13) for a single inverter the propagation delay can be thought as a linear combination of a term representing the delay for an input excitation with a zero valued rise
time and a term representing a linearly dependent function of the
rise time.
t d1 = t p0 + At r0
(L1.1)
(17)
t p0, GBN = t p0 + ----t r0
3.5
and the equation for the second inverter has a similar mathematical form:
(L1.2)
t d2 = ut p0 + At r1
2.5
t d2 = ( A + 1 )t d1
1.5
0.5
x=5
x=10
x=50
x=100
By combining equations (L1.1), (L1.2) and (L1.3) and eliminating the tp0 term from equation (L1.2) we obtain:
t p = t d1 ( A + 1 )
x 10
x=5,uop=e
Next, one must determine the rise time of the second inverter
in terms of the rise time of the first one. According to the
assumption made in Lemma 1, we can write:
(L1.3)
t r1 = t d1 + t r0
P 1
V DD
2 n + p
= L ----------------- ---------------------- .
2
V DD V T
where
10
Taper Factor
(L1.5)
Fig. 13. Propagation time vs. tapering factor for various values of
x
i= 0
i1
t p0 + ------------t r, i 1
x=5
x=10
x=50
x=100
10
Taper Factor
Fig. 14. The effect of ground bounce on the optimal tapering factor.
x 10
(L2.1)
10
Supply bounce
(a)
Voltages (lin)
Output
1
0
Ground bounce
5n
10n
15n
20n
Time (lin) (TIME)
25n
Supply bounce
4n
6n
8n
Time (lin) (TIME)
10n
12n
10n
12n
10n
12n
10n
12n
0
-2
0
2n
4n
6n
8n
Time (lin) (TIME)
(b)
Voltages (lin)
2n
30n
Voltages (lin)
Red : 0.1pF
Brown: 5pF
Green: 20pF
Output
-2
0
5n
10n
15n
20n
Time (lin) (TIME)
Ground bounce
25n
0
0
30n
2n
4n
6n
8n
Time (lin) (TIME)
3
2.5
2
1.5
0
2n
4n
6n
8n
Time (lin) (TIME)
supply
( vn ( t ) = vn
( t ) vn ( t) ), and smooths out the oscillations.
Fig. 16 shows the effective P/G noise of the same circuit with different values of decoupling capacitors. A large decoupling capacitor reduces the peak value of the effect P/G noise and causes the
effective P/G noise to become a sinusoidal waveform with a
period equal to half of the clock cycle time.
From Fig. 16 one concludes that the effective P/G noise can
be decomposed into a common-mode component and a differential-mode component. The output pad buffers consist of tapered
inverter chains to drive large off-chip capacitors with a short
transition time. As a result, the input to the last stage of the output buffer is driven by another predriver stage and the commonmode noise component, which appears on the P/G busses, also
shows up on the input line. This implies that the common-mode
component of bounces on supply and ground wires due to chippackage parasitics does not affect the circuit performance. In the
presence of a large on-chip decoupling capacitor, power and
ground fluctuations become in-phase signals and the differentialmode component will be filtered out. Therefore, the relevant
steps that should be taken to correctly compute the value of the
decoupling capacitors are:
Decompose the circuit into two distinct parts, one used for
the differential-mode component and the other used for the
common-mode component of P/G fluctuations.
Analyze the differential-mode circuit and compute the correct amount of on-chip decoupling capacitor.
11
Fig. 17 depicts the two circuits corresponding to commonmode and differential-mode fluctuations on P/G wires along with
the relevant values of voltages and currents shown in this figure.
L
AC Ground
+-V
2CD
Vin
+V
2CD
id /2
Vic/2
CD
L
A. Overdamped response
Vout
+
Vin -
Rw
CL
(a)
L
Lw
id /2
Lw
Vic/2
Rw
I=0
Vout
CL
(b)
B. Underdamped response
If c<n, c , the circuit shows a damped oscillatory transitions
in the interval [ 0, t r ]. A large decoupling capacitor will be able to
reduce the differential-mode of the effective P/G noise to negligible values. However, the noise waveform still experiences small
ringings because the chip-package interface parasitic resistance is
small.
Once again, the peak value of the ground bounce is obtained
approximately by solving Eq. (20) and setting t=tr which yields:
E1
2c E 1 t r
1
- ------------------ + ---------------------
v nd ( t r ) = -------- n,c d,c
n2, c
n4, c
c tr
E1 1
----- --------(22)
t r n,c sin ( d,c t r 2c ) E 0 sin ( d, c t r + c ) e
vnd
dvnd
t
d
- + n2, c vnd = E1 --- + E0
------------ + 2 c --------tr
dt
dt 2
0 t tr (20)
where
n R
c= 0.5 ---------- + ---
2CD L
n VDD
Rn
--- Vtn ; E 1 = ------------E0 = ---------- ---------- R
2LCD VDD .
L
2 CD t r
1+ Rn
2
- ;
n,c = -----------------2LC
D
12
output drivers are greater than this ratio, then we have to wrap
around and set the switching time of Tc d + 1 driver to the
switching time of the first driver and so on. As mentioned above
vn (t) experiences an undershoot, we must determine the time
when this undershoot occurs. Differentiating Eq. (11) with
respect to time variable t gives the time d at which the waveform
experiences an undershoot.
0.9
0.8
d = ts + t
0.7
0.6
1
where = tan -----d- . By introducing d seconds delay in
switching the second driver, the ground bounce will be reduced
by more than 60% as shown in Fig. 19. Tc d 1 drivers are
equally triggered by d seconds from each other. The rest of
drivers are triggered such that the Tc d + 1 st driver switches
simultaneously with the first driver. The Tc d + 2 nd driver
switches simultaneously with the second driver and so on. Fig.
19 depicts the skew control of three output drivers under the
assumption that the time constraint Tc = T/2 half of the clock
period.
10
10
10
Onchip decoupling capacitance (F)
3.5
i Tc
2.5
One way to further minimize the peak ground bounce amplitude is to delay the switching time of the output buffers, and
thereby prohibit all the buffers from switching simultaneously.
This is easily done by inserting a chain of buffers in the signal
path to the output drivers. Based on a special property of the
ground bouce waveform, one can propose an optimum skew time
for switching of output buffers under which the ground bounce is
attenuated up to 65% of its original value as described below.
As shown in section III.B.2 the ground bounce declines
toward zero as a damped oscillatory waveform and therefore it
experiences an undershoot. If the switching time of the next
driver is tuned to occur at exactly the same time that the ground
bounce passes through its undershoot point, then the peak value
of the ground bounce will be maximally attenuated. Suppose as
before that there are N+M output drivers. The problem can be
expressed as minimizing the ground bounce such that the total
skew time is less than a delay constraint, Tc.
min
vn ( t r )
(23)
s.t.
V tan V
s
c
1- tan 1 ----------------------------------- (24)
where t =
d
Vs + Vc tan
Amplitude (volts)
1.5
0.5
0.5
3
Time (sec)
6
9
x 10
1kN+M
i=1
13
VII. CONCLUSION
A detailed analysis and optimization of the off-chip ground
bounce using an accurate and simple chip-package interface circuit model was proposed. The effect of ground bounce on the
tapered buffer design was studied, and a mathematical analysis
was introduced. Next the effect of the on-chip decoupling capacitor was analytically investigated, and a method to find a closedform expression for the peak value of the differential-mode component of the ground bounce as a function of the decoupling
capacitor was proposed. Finally, a new skew control method for
ground bounce optimization was proposed. Experimental results
confirmed the effectiveness of this method in reducing the
ground bounce.
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