VTS Sputter Roll Coater

VTSs Sputter Roll Coater

Introduction

VTSs Web/Roll Systems for the Converting Industry are individually

designed to meet each customers specific requirements.
The system presented in this brochure allows the user to develop
a process using state-of-the-art components and then go into
production.
VTSs multi-process high vacuum Web/Roll Coating system is designed
to coat Polyimide Film, Mylar, foil and other thin plastic or metallic
materials
stored in continuous roll form.
Typical process stations within the high vacuum chamber can include
sputter sources, electron beam guns, thermal sources, substrate heat,
ion beam sources and Plasma Process Bar.

AWC-550 Sputter Roll Coater

Product Information

Technology
By AWC-550, metals will be deposited to one side of the film to form a multi- layer at high rate.
Ion beam source is equipped with gas inlet
system for argon and reactive gases.
Equipment Technique
Multi-Chamber-System consisting of chambers for
winding, pretreatment, coating, intermediate pumping
One coating drum to cool the film during
the coating process
Cooling/heating equipment for coating drum
Pump equipment for short pump down with
turbomolecular pumps
Pre-treatment by Ion beam source
Up to four standard DC magnetrons for
metallic sputter processes
Electronically controlled winding system with 3 driving motors
Technical Data
Substrate
Film
Speed
Roll
diameter

Width
Material

up to 550
Plastic
filmmm
(PET, PI, etc.)

200

Thickness
25 to
0.1 380mm
to 5 M/min
max.

Linear Ion Beam Source

Product Information

VTSs Linear Ion Beam Source Features / Benefits

No Filaments or Grids
70

Reactive gas compatible - I.e.100% oxygen Low temperature

60

Size Free

Operates at Magnetron Pressures(0.1-5mTorr)

Current Density (m A/Cm

)

Truly production Worthy-low maintenance,

no consumables, low cost

50
40

No need for multiple power supplies-hence easy integration

30

High Energy

20

High Current Density

Stability of Beam Uniformity

120 sccm
80 sccm
40 sccm

10
0
0

10

20

30

40

50

60

70

Probe Position (Cm)

Current Density Distribution Profile

DC magnetrons Sputter Source

Product Information

Truly production Worthy-low maintenance, no

consumables, low cost
Low temperature

2.0
1.8

C u T h ic kn e s
s (/min

VTSs Linear Sputter Source Features / Benefits

2.2

Operates at Magnetron Pressures(0.8- 5mTorr)

1.6
1.4
1.2
1.0
0.8
0.6
0.4

Size Free

10

12

14

16

18

20

22

Power (Kw)

High Power compatible

Power vs Deposition Rate

3500

High Deposition Rate

3000

C u T h ickn e ss
(

Stability of Coating Uniformity

2500
2000
1500
1000
500
0
0

10

20

30

40

50

Position (Cm)

Position vs Deposition Profile

60

VTSs Technical Data for FCCL

Copper

Fine Pitch
Polyimide
Film

PRODUCTION PROCESS OF FCCL

Web coating

PI film

Pretreatment

Tie
layer

Deposition

ElectroPlating

Patterning

VTSs Technical Data for FCCL

Surface Modification of Polyimide film by ATECs Linear Ion Beam Source

90

90

Surface Energy ( mN/m )

80

W etting angle( )

70
60
50
40

Gas A

30
20

Gas B

10
Gas C

0
0

16

10

10

17

18

10
2

Ion dose ( /cm )

Wetting angle of polyimide with various
Doses by irradiated at ions

Gas C
80

70

Gas B
60

Gas A

50

40

16

10

10

17

10

18

Ion Dose ( /cm )

Surface energy of polyimide with various
Doses by irradiated at ions

VTSs Technical Data for FCCL

Surface Modification of Polyimide by ATECs Linear Ion Beam Source

0.9

Gas C

0.8

80

0.7
60

Adhesion strength ( kg/cm)

Wetting angle (

40

20

High Current Density

0

16

10

10
2

17

Gas B

0.6

Low Current Density

10

18

0.5

Gas A

0.4
0.3
0.2
0.1
0.0

Ion Dose (/cm )

Wetting angle of polyimide with different ion

current by irradiated at ions

Adhesion strength with different gases

by irradiated at ions

VTSs Technical Data for FCCL

XPS Data of modified polyimide film by Ion Beam Source

Schematic drawing of the polymeric repeat unit

of PMDAODA.

Binding Energy (eV)

XPS spectra of O 1s, N 1s, and C 1s from as-received

PMDA-ODA polyimide after peak deconvolution

Binding Energy (eV)

XPS spectra of O 1s, N 1s, and C 1s from PMDA-ODA

polyimide after irradiation by linear ion beam source.

VTSs Technical Data for FCCL

SAM Data of modified polyimide film by Ion Beam Source

Raw Film

By Gas A + C

By Gas A

By Gas C

VTSs Technical Data for FCCL

Surface Modification of Polyimide film by Ion Source

0.8

0.7

0.6

0.5

High Current Density

Low Current Density

0.4

Peel Strength (Kgf/C m )

Peel Strength (Kgf/Cm)

0.8

0.7

Gas C
Gas A

0.6

0.5

0.4

0.3

0.3

0.2

0.2
1E16

1E17
2

Ion Doses (Dose/Cm )

Peel strength with various doses by

irradiated at ions

1E16

1E17
2

Ion Doses (Dose/Cm )

Peel strength with various

doses
by irradiated at ions

VTSs Technical Data for FCCL

Curing Test (150, 168h)

Cu Thickness vs Peel Strength

0.35

1.2

f/ )

0.25

Peel Strength (

Peel Strength (Kgf/Cm )

0.30

0.20

0.15

0.10

1.0
0.8
0.6
0.4
0.2

0.05
1E16

1E17
2

Ion Doses (Dose/Cm )

Peel strength with various doses by

irradiated at ions

0.0
0

10

Cu Thickness (

12

14

16

18

20

VTSs Technical Data for FCCL

Chemical Test
Peel Strength

1 .2
1
2
3
4

S tr e s s ( k g f /c m )

1 .0 5

Test Condition
Sample Width : 3

0 .7 5

0 .6

0 .4 5

Sample Position : MD C

Mean : 0.80 kgf/cm

0 .3

0 .1 5

PI Thickness
: 38

:9
Cu Thickness

0
0

20

1.05

S tr e s s ( k g f /c m )

1
2
3

0 .3

0.6

0 .1 5

0.45

0
0

40

60

80

Stro ke (m m )

1 00

1 20

Mean : 0. 78 kgf/cm
20

40

60
80
Stroke (m m )

Test
ByHCL
Gas
C

kgf/cm

By Gas A + C
KOH Test

1
2
3

0 .6

0.75

20

15 0

0 .7 5

0 .4 5

1 40

0 .9

0.9

1 20

1 .0 5

Peel Strength

Mean : 0.79

100

Peel Strength

1.2

0.15

60
80
Stro ke (m m )

1 .2

Peeling Speed : 50 / min

0.3

40

Normal Temperature

Peeling mode : vertical(90)

S tr e s s ( k g f /c m )

0 .9

1 40

15 0

10 0

1 20

1 40

15 0

Conclusion
VTSs Web/Roll Systems : State-of-the-art Equipment
VTSs Linear Ion Beam Source : High Current Density
Stability of Beam Uniformity
Size Free
VTSs Linear DC Magnetron Sputter Source : High Deposition Rate
Stability of Coating Uniformity

Size Free By Gas A

Surface Modification of Pl by Gas C Ion : High Surface Energy

Fast Surface Modification
High Peel Strength
Ion Source of High Current Density : High Surface Energy
High Peel Strength
Curing Test : 0.32 kgf/
Chemical Test : 0.78 kgf/
By Gas A + C

By Gas C