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Thermoelectric Effect PDF
Thermoelectric Effect PDF
T
I
M
Perfectly
Basic Relations
,
Reflecting Wall
n
Frequency
e
o
at T
t
h
Angular Frequency =2
l
Inside the Cavity
C
a
Wavelength
EM Wave In
g rm
Wavevector
magnitude k=2/
n
Equilibrium at
e
a
Wavevector
k=(k ,k
,k
Temperature T
k
h
G /T ) ion
c = lar rs= ck = c k + k + k
t
e
h
o
(k): Dispersion relation (linear)
v
g
i
S
n
r ct
o
y
energy in the cavity?
p ire How much
C
o
C D Ur=g2y hf (,T ) =
e
97
97
n
L = 9,2 ,..., n
,...
9
E
2.2 2 2r 2. 2 cal 2 (2dk/ 2L ) (2dk/ 2L ) (2dk/ 2L )hf (,T )
k =n o
i
r
2
L
F ct
dk
dk
dk
e
=
2
hf ( , T )
l
(2 / L ) (2 / L ) (2 / L )
Two
E polarization
x
2
x
2
z
n x =1 n y =1 n z =1
2
y
T
I
Energy density per
interval
M
hf ( , T )dk dk dk
,
n
u ( ) = hf ( ,e
T )D( ) o
2V
t
h
(
)
=
h
k
dk
,
4
l
h C 1
8
a
=
Plancks law
c
g
hm
n
exp r 1
2V
e
a
=
hf ( , T )4 d
k T n
h
G
8
c c
T
o
/
Intensity:
energy
flux per unit
i
r
U
a angle
r
t olsolid
= hf ( , T )
d
e
h
V
c
g t S dAnv cu( ) h
i
r
1
o
y
(
)
=
=
I
c
= hf ( , T )D( )d p
C
e
4
4 c
h
o
r
1
i
exp
y
C D rg
k
T
i
2hc
o
D()-density
of states
per
r
exp
t
F
whole
space
c
unit volume per unit
k T
e
Plancks
law
4
angular frequency
El interval
2V
U= 3
8
2 3
2 3
3 2
p
2
T
I
M
Q&
Wiens displacement law
,
n o
e
t
T = 2898 Kmh
l
C
a
g rm
n
e
a
h
n
G
T
o
/
Emissive Power
i
r
s
t ola er
h
g t S nv
i
Q& ( ) = AI ( )
r
o
y
c
p
C
1o
h
e
r
=A
i
y
4 c
C
h
g
r
1 D
exp
7 k T 9 7 ne
9
9
9
E
.
.
l
2 r 2 ca
Total
i
o
r
tT
Q& = F
Q& ( )d = c
A
e
l
E
2
max
2 2
10
10
10
10
5600 K
2800 K
1500 K
10
800 K
10
-1
4
6
WAVELENGTH (m)
10
T
I
M
,
Introduction to Thermoelectricity
n o
e
t
h
l
C
a
g rm
Gang Chen
n
e
a
h
G /T ion
Mechanical Engineering
lar Department
s
r
t
Massachusetts
Institute
of Technology
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
i
y
CURL: http://web.mit.edu/nanoengineering
g
D
r
7 97 ne
9
9
9
E
.
.
l
2 r 2 ca
i
o
r
F ct
e
l
E
WARREN M. ROHS
ENOW HEAT AND MASS TRANSFER LABORATORY, MIT
ROHSENOW
MIT
Seebeck Effect
T
I
Hot, M
n o
e
t
h
l
C
a
g rm
n
a
Conductor
1 he
G /T ion Conductor 2
lar rs
t
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
Cold
C D i rg y
7 97 ne
9
9
9
E
Voltage
.
.
l
2 r 2 ca
i
Seebeck effect: Discovered in 1821
o
r
Thomas
Johann
Seebeck
t
F
Temperature difference generates voltage
1770-1831 c
e
El
http://www.sil.si.edu/silpublications/dibner-library-lectures/scientific-discoveries/text-lecture.htm
Peltier Effect
T
I
M
,
Heatingnor Cooling
e to
h
l
C
a
g rm
n
e
a
h
G /T ion
r
Conductor
s
Conductor 2
1
a
r
t
l
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
C D i rg y
A
7 97 ne
9
9
9
E
.
.
Jean
Charles
Athanase
Peltier
l
2
2 ca
1785-1845 r
Peltier Effect: Discovered in 1834
i
o
An electrical current creates a cooling or
F ctr
heating effect at the junction depending
e
l
E
on the direction of current flow.
Thomson Effect
T
I
M q(x)
,
heat release/absorption
n o
e
t
h
l
C
a
m
T
T ng
r
e
a
h
n
G /T iocurrent
lar rs
t
e
h
o
v
g
i
S
n
r
t
Thomson
effect predicted, 1855
o
y
c
p ire
C
o
y
C
g
r
William 7
Thomson7 D
e
n
9
9
(Lord
Kelvin)
9
9
E
.
.
l
1824
1907
2 r 2 ca
i
o
r
F ct
e
l
E
cold
hot
http://www.sil.si.edu/silpublications/dibner-library-lectures/scientific-discoveries/text-lecture.htm
T
I
M
Current Flow in an Isothermal ,Conductor
n o
e
t
h
l
C
a
g rm
n
e
a
h
G /T ion Electrical
lar rs
Field [V/m]
t
e
h
o
v
g
i
S
n = / Electrical
r
t
Current Density Jye = enc
o
v
=
en
=
Resistivity [m]
p
C
e
o
r gy
i
C
D
Electron
Electron
Drift
r
Mobility
Electrical
e
7
7
Density
[1/m
]
Charge [C]
Velocity
[m/s]
[m /s.V]
n
Conductivity [1/m]
9
9
9
9
E
2. r 2. cal
q
i
Heat Flux
Fo ctr J q = qnv = e J e = J e
e
l
Peltier Coefficient [J/A]
E Heat Per Charge [J]
Peltier Effect
T
I
M
,
J,J n
e to
1
h
l
C
a
Q
Q
g
m
n er
a
G2 /Th ion
lar J , Jrs
t
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
Qir(Peltier)
=
( 12)J
o
y
C D rg
7 97 ne
9
9
9
E
.
.
Heating
l
2 r 2 ca and cooling at junctions
Reversible
with current direction
i
o
r
F ct
e
l
E
e
q1
q2
Seebeck Effect
T
I
M
Built-In Potential
,
n o
e
t
h
l
a
C
V
V
r
n
T
T
e
a
G /T ion
lar rs
t
Temp. Gradient
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
Charge
diffusion
under
a temperature gradient
i
y
C
g
D
r
7
Built-in potential
resisting
diffusion
e
7
n
9
9
9
9
E
l = -(V -V )/(T -T )
2. r 2.S = c-V/T
a
hot
cold
hot cold
i
o
F ctr
e
l
E S --- Seebeck Coefficient
cold
hot
cold
hot
Thomson Effect
T
I
M
,
heat release/absorption q(x)
n o
e
t
h
l
C
a
T
m
ng
T
a
e
G /T
ion
r
current
s
a
r
t
l
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
i
1
dq
dT
y
C
g
D
=
r
Thomson
Coefficient
7 97 ne
I dx dx
9
9
9
E
.
.
l
2 r 2 ca
i
o
r
t
F cRelations:
Kelvin
= ST; = T dS/ dT
e
l
E
cold
hot
M
,
n o
e
t
h
l
C
a
g rm
n
e
a
h
G /T ion
lar rs
t
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
C D i rg y
e
7
7
n
9
9
9
9
E
2. r 2. cal
i
o
r
F ct
e
l
E
WARREN M. ROHS
ENOW HEAT AND MASS TRANSFER LABORATORY, MIT
ROHSENOW
MIT
Thermoelectric Devices
T
I
M
,
n o
e
t
h
l
C
a
g rm
n
a
Ne
I
h
G /T ioPn
lar rs
t
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
C D i rg y
7 97 ne
9
9
9
E
.
.
l
2 r 2 ca
i
o
r
F ct
e
l
E
COLD SIDE
COLD SIDE
HOT SIDE
HOT SIDE
T
I
M
,
n o
e
t
h
l
C
a
g rm
n
e
a
h
n
G
T
o
Performance of Thermoelectric
Devices
/
i
r
s
t ola er
h
g t S nv
i
r
y ec Co
p
o
C Dir rgy
7 97 ne
9
9
9
E
.
.
l
2 r 2 ca
i
o
r
F ct
e
l
E
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT
T
I
Th
M
Fourier Law for heat conduction
,
n o
e
t
h
l
q =gCkTma
n er
a
h
n
G ] Thermal
Heat Flux [W/m
Conductivity
[W/m.K]
T
o
/
i
lar rs
t
e
h
o
v
g
L
i t S on heat conduction
yrOne-dimensional
Area A
c
p
C
e
o
r
C Di rgy Th Tc
7 97 Qne= Ak
= KT
9
9
9
E
.
.
L
l
2 r 2 ca
kA
i
o
r
F ct
Thermal Conductance : K =
Tc le
L
E
2
T
I
Ideal Devices
M
,
Q
T
n o
e
No Joule Heating,
t
h
l
C
No Heat Conduction
a
g rm
n
Qc = (
a
p-n)e
p
G /Th ion
n
Real Devices:
r
s
a
r
t
l
e
h
o
v
g
Joule
Heating
& Heat Conduction
i
S
n
r
t
o
y
c
p
2R/2 - K (T -T )
C
e
Q
=
(
-
)
I
o
r
c
p
n
h c
i
y
T
QC
g
D
r
e Resistance Thermal Conductance
7 97 Electrical
n
9
9
9
E
.
.
l
2 r 2 ca
L p p Ln n
k A
k A
R
=
+
i
+
K=
Fo ctr
Ap
An
L
L
e
l
E
c
WARREN M. ROHS
ENOW HEAT AND MASS TRANSFER LABORATORY, MIT
ROHSENOW
MIT
Refrigerator Performance
T
I
V = IR + ( S S )(TM
T )
Voltage Drop:
,
n o
e
t
Coefficient of Performance: h
l
C
a
1 2
g
m
S
S
IT
K
T
T
( H C) I R
n) C
r
Q C ( p an
2
e
=
=
G(Sp /STnh) I ( THioTnC ) + I2R
W
T Q
lar rs
t
e
h
T
o
v
g
+
1
ZT
i
S
n
r
T
T
t
o
y
=
c
Optimize Current:p
e
T TC
(
) 1 + ZT + 1
o
r
i
y
C D rg
T = 0.5(T +
T )
e
7
7
n
9
9
9
9
E
2
2. r 2. ca(Slp Sn )2
S
S
(
p
n)
Zi =
=
o
r
KR
L p p L k p A p k A
F ct
n n
n n
+
+
e
Ap
A n L p
L
n
El
Tc Qc
max
H
C
WARREN M. ROHS
ENOW HEAT AND MASS TRANSFER LABORATORY, MIT
ROHSENOW
MIT
Figure of Merit Z
T
I
M
,
L p p L k p A p k A n
KR =
+ n en
+ n n
o
t
Ap
h
A
L
L
n
p
n l
C
a
g rm
1/ 2
n
e
2
L n A p p k n
a
n
=
( KR )min = ( k pp + k n n ) Gwhen/Th
o
L piA n n k p
s
a
r
t
l
e
h
o
v
g
i
S
2
n
r
t
o
y
Sp Sn )
2
2
(
c
p
S
S
C
e 2 yFor a single material: Z = =
Zmax =
o
r
i
Ck pp + Dk n n ) rg
k
k
(
7 97 ne
9
9
9
E
.
.
l
pn a
pairs are used:
2 In a device,
2
r ric
o
(1)
F Areascoft each type of legs need to be optimized
e
(2) Two
types of legs should have comparable properties
l
E
(3) Current input to the device needs to be optimized
WARREN M. ROHS
ENOW HEAT AND MASS TRANSFER LABORATORY, MIT
ROHSENOW
MIT
Typical Number
T
I
M
,
n o
e
t
Bi2Te3-based materials ~300 C
Kh
l
a
g
m
r
n
Power
Factor:
S
=48 W/cm-K
S=220 V/K
e
a
h Z=3.2x10
n
Figure
1/K
G of/TMerit:
=10 Sm
o
i
r
ZT=1
k=1.5 W/mK
s
t ola er
h
g t S nv
i
r
Device Leg: p
1y
mm x 1cmm xC2omm
e y
o
r
i
C
g
D
3
r
L
2 10
e
7
7
R
0.02
=
=
=
n
9
9
1
5
6
A
9
9
10 l10E
.
.
2 r 2 ca
i
o
r
Legs
are
t electrically in series
F but thermally
c
in parallel
e
l
E
2
-1
-3
Two Tc
thermocouples
soldered into
drilled holes
T
I
M
,
n o
e
t
h
l
C
a
g rm
n
e
a
h
G /T ion
lar rs
t
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
C D i rg y
Match two leg size
7 97 ne
Minimize contact
9
9
9
E
resistance
2. r 2. cal
i
o
Optimize current
r
T = 100 C
F ct
e
l
E
An Example
120
100
80
60
40
20
One Th
thermocouple
soldered into
drilled holes
Experimental data
Theoretical prediction
Ceramics
plate for
electrical
insulation
4
6
8
10
WARREN
Current
(A) M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT
T
I
M
,
n o
e
t
h
l
C
a
g rm
n
e
a
h
G /T ion
lar rs
t
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
C D i rg y
e
7
7
n
9
9
9
9
E
2. r 2. cal
i
o
r
F ct
e
l
E
Differential Analysis
T
I
M
,
n o
e
t
h
O
l
a
d dT g C
dS dT
2
m
k
anJT er + J = 0
h dxon
/TdT
dx 2 dx G
i
r
s
t ola er
h
g t S nv
i
r
Thomson
Neglected Joule Heating
o
y ecEffect, Usually
p
C
o
r
i
y
C Boundary
g
D
r
Conditions
(Cooling):
e
7
7
n
9
9
9
9
E
dT
dT
l
2L . r 2. cx=0:
+ J = k
+ STc J
a
T given or q c = k
dx
dx
i
o
r
F ct
e
x El
c
ave
ave
ave
T
I
0.66
0.
0.6
M
,
Efficiency
n o
e
t
h
0.55
0.
0.5
l
C
a
T 1 + ZT 1
g
m
=
1
r
n
T
e
a
T 1 + ZT
+
0.4
h
G /T ion
T
r
s
a
r
t
T +T
l
0.3 o
e
h
T
=
v
g
i
S
n
r
2
t
o
y
c
p
C
TPV
0.2
e
o
r
i
y
Constant Properties
C D rg
7 97 ne 0.1
9
9
9
E
.
.
l
THERMOELECTRIC
IC
2 r 2 ca
POWERG
GENERATORS
i
o
0
1
2
3
4 5 6
F ctr
TEMPERATURERATIO(T /T )
e
l
E
ZT
CARNOTCYCLE
10
4T
4
THERMAL
POWER
PLANT
T
ALKALI METAL
THERMAL TO
ELECTR
RC
IC
IC
CELLS
THERMIO
IONIC
IC
GENERATORS
DIESE
IESELPPLA
LANT
STIR
IRLIN
ING
G
GENERATOR
1
AUTOMOTIV
IVE
ENGINES
0.5
0.5
hot
0
7 8 9 110
cold
WARREN M. ROHS
ENOW HEAT AND MASS TRANSFER LABORATORY, MIT
ROHSENOW
MIT
Thermoelectric Refrigeration
T
I
M
,
Coefficient of Performance
n oCYCLE
CARNOT
e
t
h
5
STIRLING
l
C
1 + ZT T / T
a
T
REFRIGERATORS
g
COP =
m
r
n
HOUSEHOLD
T T
1 + ZT + 1
e
a
&
n
G4 /Th REFRIGERATORS
AIR-CONDITIONERS
o
i
r
s
a
r
t
THERMOELECTRIC
l
e
h
3
o
REFRIGERATORS
v
g
i
S
n
r ct
o
y
STIRLING
ZT
p
C
e y2
CRYOCOOLERS
o
r
i
10
7
C D rg
24
1
e
7
7
0.5
n
9
9
1
9
9
E
.
.
2 r 2 ca l
i
o
r
F ct
0
1
1.2
1.4
1.6
1.8 2.0
e
l
TEMPERATURE RATIO (T /T )
E
ave
ave
COEFFICIENT OF PERFORMANCE
hot
cold
T
I
M
,
n o
e
t
h
l
C
a
g rm
n
e
a
h
G /T ion
Current and Potential
lar Applications
s
r
t
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
C D i rg y
7 97 ne
9
9
9
E
.
.
l
2 r 2 ca
i
o
r
F ct
e
l
E
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT
M
,
n o
e
t
h
l
C
a
g rm
n
e
a
h
G /T ion
lar rs
t
e
h
o
v
g
i
S
n
r
t
o
y
c
p
C
e
o
r
C D i rg y
e
7
7
n
9
9
9
9
E
froml Hi-Z
. Generators
.
2Power
2 ca
r
i
o
r
F ct
e
l
Coolers from Marlow Industries
E
Images removed due to copyright restrictions.
Please see http://www.hi-z.com/index.php
http://www.marlow.com/thermoelectric-modules/
WARREN M. ROHS
ENOW HEAT AND MASS TRANSFER LABORATORY, MIT
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http://thermoelectrics.caltech.edu/images/mhw-rtg.gif
http://globalte.com/pdf/teg_5120_spec.pdf
http://www.roachman.com/thermic/thermic1.jpg
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WARREN M. ROHS
ENOW HEAT AND MASS TRANSFER LABORATORY, MIT
ROHSENOW
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http://cache.gawkerassets.com/assets/images/12/2009/03/BMW_TEG.jpg
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