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J.O. Hinze Turbulence PDF
J.O. Hinze Turbulence PDF
COMPONENTS
Kulvir K Dhinsa, Chris J Bailey, Koulis A Pericleous
Centre for Numerical Modelling and Process Analysis
University of Greenwich,
Old Royal Naval College
Greenwich, London, SE10 9LS, UK
Phone: +44(0)20-8331 8141
Fax: +44(0)20-8331 8665
Email: k.k.dhinsa@gre.ac.uk
ABSTRACT
This paper will discuss Computational Fluid Dynamics (CFD)
results from an investigation into the accuracy of several
turbulence models to predict air cooling for electronic
packages and systems. Also new transitional turbulence
models will be proposed with emphasis on hybrid techniques
that use the k model at an appropriate distance away from
the wall and suitable models, with wall functions, near wall
regions. A major proportion of heat emitted from electronic
packages can be extracted by air cooling. This flow of air
throughout an electronic system and the heat extracted is
highly dependent on the nature of turbulence present in the
flow. The use of CFD for such investigations is fast becoming
a powerful and almost essential tool for the design,
development and optimization of engineering applications.
However turbulence models remain a key issue when tackling
such flow phenomena. The reliability of CFD analysis
depends heavily on the turbulence model employed together
with the wall functions implemented. In order to resolve the
abrupt fluctuations experienced by the turbulent energy and
other parameters located at near wall regions and shear layers
a particularly fine computational mesh is necessary which
inevitably increases the computer storage and run-time
requirements. The PHYSICA Finite Volume code was used
for this investigation. With the exception of the k and
k models which are available as standard within
PHYSICA, all other turbulence models mentioned were
implemented via the source code by the authors. The LVEL,
LVEL CAP, Wolfshtein, k , k , SST and k / kl
models are described and compared with experimental data.
KEY WORDS: Thermal Management, Heat Transfer, Low
Reynolds Number (Transitional) Flows, Flow Separation and
Reattachment.
NOMENCLATURE
a1
C1
C2
C
CDk
D
E
G
i
k
k~
L
l
l
p
Re
S
S
t
u
u, v, w
u+
y*
y+
Greek symbols
revised LVEL model constant, 0.01
diffusion coefficient
general variable
487
INTRODUCTION
The electronics industry is now developing at a rapid rate and
with it the problems associated with the cooling of electronic
packages is becoming increasing complex.
The electronics packaging design community is now
commonly using CFD to thermally characterize the
performance of electronic packages and systems. These
simulation tools solve both fluid flow and temperature
throughout the system. For fluid flow the classical Navier
Stokes equations are solved, with suitable turbulence models,
to accurately capture the flow around a package.
Flow characterization within electronic products is represented
by the relationship between the turbulent phenomena and the
flow structures within the wake of an electronic package. The
association between the flow structure and the generation of
heat encourages the flow to separate and recirculate locally
between each board-mounted package. The consequence of
these features has the potential to cause the electronic product
to malfunction due to the temperature exceeding some
operational or reliability limit.
Extensive documentation has been published which
characterizes the flow structures present when studying fluid
flow around a surface mounted cubical obstacle, whether
referring to a single or matrix array of obstacles. The
interested reader is referred to the works of Meinders and
Hanjali [1], who concentrate on low Reynolds number flow.
Also the work of Martinuzzi and Tropea [2] and Hussein and
Martinuzzi [3] who consider higher Reynolds number flow
phenomena.
In duct flows, if the Reynolds number (Re) is below 1000 the
flow is said to be laminar; hence the viscous forces dominate.
Above Re = 4000 the inertia forces dominate over the viscous
forces and flow perturbations grow, leading to turbulence.
The range between the two limits is termed the transitional
region. This is the region of most relevance to the electronics
packaging community.
The uncertainty of mathematically modelling turbulence is
reflected in the large variety of models available. These range
from Prandtls zero-equation mixing length model [4] to more
complex higher order models. At present the vast majority of
CFD calculations for this application area use Launder and
Spaldings k model [5], which is optimized for high
Reynolds number flows. For the purpose of this investigation
CFD results will also be shown for the low Reynolds number
implementation of the Wilcox k model [6, 7], Menters
SST model [8], which combines k and k , and a
newly formulated two-layer hybrid k / kl turbulence model
for the prediction of flow around a heated package.
It has now become a priority for electronic cooling CFD
predictions to recognize the areas of low Reynolds number
488
MATHEMATICAL MODELS
This section will outline the formulation of all the turbulence
models used in this investigation subject to the general
conservation equation of the quantity . All simulations in
this investigation have been constrained to steady state
conditions therefore allowing the transient term to be ignored
from equation (1), and all subsequent equations.
( )
+ div ( u ) = div ( grad ( )) + S
t
(1)
Continuity
xMomentum
S
0
yMomentum
zMomentum
Energy
p
x
p
+ 2
(2)
(3)
(4)
L = D
= min y + , ln (E y + ) , = 0.435
d y+
v+ =
d u+
(6)
(7)
+ S Mx
+ S My
+ S Mz
z
p div u + + S i
489
k
t
+ div ( u k ) = div l +
grad k +
k
vt
(9)
vt G
34
C k
l
32
(10)
(11)
vt = C k l
14
12
0.263 y
, l = L 1 exp 0.016 y
l = L 1 exp
(12)
+ div ( u k ) = div l +
grad k +
(16)
k
vt
vt G * k
t
+ div ( u ) = div l +
grad +
(17)
vt
G 2
vt
grad k +
+ div ( u k ) = div l +
t
k
( k )
(13)
( )
vt G
t
+ div ( u ) = div l +
C1 v t G
C 2
grad +
vt
[(
(14)
grad k grad
(19)
+ div ( u ) = S 2
t = C
[(
~ * k + div +
+ div ( u k ) = P
k t grad k
k
l
(18)
(15)
490
k 500v l
, 2
F 1 = tanh min max *
L L
4 2 k
,
2
CD k L
(20)
CD k = max 2 2
grad k grad , 10 10
(21)
a1 k
max (a1 , S F 2 )
(22)
2 k 500v
max * , 2 l
tanh
=
F2
L L
(23)
To prevent the build-up of turbulence in the stagnation regions
a production limiter is used
Pk = t
U j
P~ k = min P k ,10. * k
xj xj
xi
U i U i
(24)
The model constants are calculated using the F1 blending
function
= F 1 1 + (1 F 1) 2
(25)
1 = 5 9, 2 = 0.44, 1 = 3 40,
2 = 0.0828,
MODEL CONFIGURATION
Fluid flow and heat transfer CFD predictions around a single
cube mounted on the base of a low Reynolds number
enclosure are compared against Meinders experimental data.
The numerical analysis has been undertaken using the finite
volume CFD code PHYSICA [27], a multi-physics code
developed at the University of Greenwich.
The test channel has dimensions (1215 x 61 x 600)mm and
uses an inlet velocity of 4.47m/s resulting in a low Reynolds
number of approximately 4440 based on the cube height. The
cube of size H = 15mm is mounted x/H = 50 downstream of
the inlet boundary on the centreline allowing the use of a
symmetry boundary condition in the z-direction.
The test channel base plate is constructed from phenolformaldehyde which is 10mm in thickness and has a thermal
conductivity of 0.33W/mK. The structure of the cube can be
decomposed into two materials; the core of the cube
measuring 12mm is constructed from copper which is kept at a
constant temperature of 75C. The second material is an
epoxy resin which encapsulates the copper and has a uniform
thickness of 1.5mm.
The base of the cube does not have an epoxy layer attached
therefore resulting in the overall dimensional structure of the
cube measuring (15 x 13.5 x 15)mm, a schematic of which is
shown in Figure 2.
The model divides the test geometry into two regions; the
allocation of the division is determined by using a critical
Reynolds number. Region A solves the standard k model
equations; Region B on the other hand switches to the k l
model and solves an appropriate set of equations which
represent the turbulent dissipation rate. The k l model also
employs the use of wall functions and damping functions to
make this model economical in terms of run-time. To bridge
the gap between the two turbulence models a matching
technique has been used.
The main advantage of such a hybrid model is that it is
computationally cheap in terms of the mesh requirement
491
Outflow
y
Copper Core
75C
x
Flow
Epoxy Layer
1.5mm
B) Bound vortex.
Arc-shaped
vortex
D) Side vortex.
Horseshoe
vortex
Side vortex
recirculation tube
492
CONCLUSIONS
The major contributor to electronic malfunction is the
presence of the flow recirculations discussed in this
investigation. As the recirculation vortices develop they
encapsulate heat from a package and restrict further heat being
extracted and removed from the system.
From the results presented in this paper it can be concluded
that the standard high Reynolds number k turbulence
model struggles to accurately predict real world phenomena
even for simplistic cases. Other models investigated give
better results, but no clear winner at present emerges.
Although velocity data around the cube itself where not available at
the time of writing
493
ACKNOWLEDGMENT
This research, undertaken at the University of Greenwich, is
financially supported by the Engineering and Physical
Sciences Research Council (EPSRC) through the PRIME
Faraday organization as an Industrial Case Award. The
authors would also like to acknowledge helpful discussions
with Flomerics Ltd. relating to this application field.
REFERENCES
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Heat Transfer in Turbulent Flow over a Wall-Mounted Matrix
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Developed Channel Flow, Journal of Fluid Engineering, vol.
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[3]. H. J. Hussein and R. J. Martinuzzi, Energy Balance for
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494