MC34064, MC33064,

NCV33064
Undervoltage Sensing
Circuit
The MC34064 is an undervoltage sensing circuit specifically
designed for use as a reset controller in microprocessorbased
systems. It offers the designer an economical solution for low voltage
detection with a single external resistor. The MC34064 features a
trimmedinpackage bandgap reference, and a comparator with
precise thresholds and built-in hysteresis to prevent erratic reset
operation. The open collector reset output is capable of sinking in
excess of 10 mA, and operation is guaranteed down to 1.0 V input with
low standby current. The MC devices are packaged in 3pin TO-92,
micro size TSOP5, 8pin SOIC8 and Micro8t surface mount
packages. The NCV device is packaged in SOIC8 and TO92.
Applications include direct monitoring of the 5.0 V MPU/logic
power supply used in appliance, automotive, consumer and industrial
equipment.

http://onsemi.com

TrimmedInPackage Temperature Compensated Reference

Comparator Threshold of 4.6 V at 25C
Precise Comparator Thresholds Guaranteed Over Temperature
Comparator Hysteresis Prevents Erratic Reset
Reset Output Capable of Sinking in Excess of 10 mA
Internal Clamp Diode for Discharging Delay Capacitor
Guaranteed Reset Operation with 1.0 V Input
Low Standby Current
Economical TO92, TSOP5, SOIC8 and Micro8 Surface Mount
Packages
NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
PbFree Packages are Available

Micro8
DM SUFFIX
CASE 846A

TSOP5
SN SUFFIX
CASE 483

Features

SOIC8
D SUFFIX
CASE 751

Pin 1.
2.
3.
4.
5.

Ground
Input
Reset
NC
NC

TO92
P SUFFIX
CASE 29

12

3
STRAIGHT LEAD
BULK PACK

3
BENT LEAD
TAPE & REEL
AMMO PACK

Pin 1. Reset
2. Input
3. Ground

Input
Reset

PIN CONNECTIONS
Reset 1

8 N.C.

Input 2

7 N.C.

N.C. 3

6 N.C.

Ground 4

5 N.C.
(Top View)

1.2 Vref

ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.

GND

= Sink Only
Positive True Logic

DEVICE MARKING INFORMATION

See general marking information in the device marking
section on page 7 of this data sheet.

This device contains 21 active transistors.

Figure 1. Representative Block Diagram

Semiconductor Components Industries, LLC, 2008

August, 2008 Rev. 18

Publication Order Number:

MC34064/D

MC34064, MC33064, NCV33064

MAXIMUM RATINGS
Symbol

Value

Unit

Power Input Supply Voltage

Rating

Vin

1.0 to 10

Reset Output Voltage

VO

10

Reset Output Sink Current (Note 2)

ISink

Internally
Limited

mA

IF

100

mA

PD
RqJA

625
200

mW
C/W

PD
RqJA

625
200

mW
C/W

PD
RqJA

520
240

mW
C/W

Operating Junction Temperature

TJ

+150

Operating Ambient Temperature

MC34064
MC33064
NCV33064

TA

Storage Temperature Range

Tstg

Clamp Diode Forward Current, Reset to Input Pin (Note 2)

Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25C
Thermal Resistance, JunctiontoAir
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25C
Thermal Resistance, JunctiontoAir
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25C
Thermal Resistance, JunctiontoAir

0 to +70
40 to +85
40 to +125
65 to +150

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. ESD data available upon request.

ELECTRICAL CHARACTERISTICS (For typical values TA = 25C, for min/max values TA is the operating ambient temperature range
that applies [Notes 3 and 4] unless otherwise noted.)
Characteristics

Symbol

Min

Typ

Max

Unit

VIH
VIL
VH

4.5
4.5
0.01

4.61
4.59
0.02

4.7
4.7
0.05

0.46
0.15

1.0
0.4
0.1

10

27

60

mA

COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis

RESET OUTPUT
Output Sink Saturation
(Vin = 4.0 V, ISink = 8.0 mA)
(Vin = 4.0 V, ISink = 2.0 mA)
(Vin = 1.0 V, ISink = 0.1 mA)

VOL

Output Sink Current (Vin, Reset = 4.0 V)

ISink

Output Off-State Leakage (Vin, Reset = 5.0 V)

IOH

0.02

0.5

mA

Clamp Diode Forward Voltage, Reset to Input Pin (IF = 10 mA)

VF

0.6

0.9

1.2

Operating Input Voltage Range

Vin

1.0 to 6.5

Quiescent Input Current (Vin = 5.0 V)

Iin

390

500

mA

TOTAL DEVICE

2. Maximum package power dissipation limits must be observed.

3. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Thigh = +70C for MC34064
4. Tlow = 0C for MC34064
40C for MC33064
+85C for MC33064
40C for NCV33064
+125C for NCV33064
5. NCV prefix is for automotive and other applications requiring site and change control.

http://onsemi.com
2

MC34064, MC33064, NCV33064

10

5.0

8.0

VO , OUTPUT VOLTAGE (V)

VO , OUTPUT VOLTAGE (V)

RL = 10 k to Vin
TA = 25C

6.0
4.0
2.0
0

2.0

4.0
6.0
Vin, INPUT VOLTAGE (V)

8.0

RL = 10 k to Vin
TA = 25C

4.0
3.0
2.0
1.0
0

10

4.560

Figure 2. Reset Output Voltage versus

Input Voltage

4.600
Vin, INPUT VOLTAGE (V)

4.620

4.640

Figure 3. Reset Output Voltage versus

Input Voltage

1.0

4.630
RL = 10 k to Vin
4.620

Upper Threshold
High State Output

I in , INPUT CURRENT (mA)

V th, THRESHOLD VOLTAGE (V)

4.580

4.610
4.600
4.590
Lower Threshold
Low State Output

4.580
4.570
-55

-25

25

50

75

100

TA = +25C

0.8

-40C
0.6
+85C
0.4

TA = +25C
+85C

0.2
0

125

-40C

2.0

4.0

6.0

8.0

TA, AMBIENT TEMPERATURE (C)

Vin, INPUT VOLTAGE (V)

Figure 4. Comparator Threshold Voltage

versus Temperature

Figure 5. Input Current versus Input Voltage

2.0
Reset

V OL, OUTPUT SATURATION (V)

Vin = 4.0 V

TA = 25C

Vin = 5.0 V to 4.0 V

RL = 10 k
TA = 25C

90%

1.5
TA = 85C

Vin

TA = -40C

5.0 V -

1.0
4.0 V Vin

10k

5.0V
4.0V

0.5

Reset

10%
0

REF

10

20
30
ISink, SINK CURRENT (mA)

40
200 ns/DIV

Figure 6. Reset Output Saturation versus

Sink Current

Figure 7. Reset Delay Time

http://onsemi.com
3

10

MC34064, MC33064, NCV33064

I F , FORWARD CURRENT (mA)

80
Vin = 0 V
TA = 25C
60

40

20

0.4

0.8
1.2
VF, FORWARD VOLTAGE (V)

1.6

Figure 8. Clamp Diode Forward Current versus Voltage

Input

Reset

Power
Supply
-

Microprocessor
Circuit

CDLY

A time delayed reset can be accomplished with the

addition of CDLY. For systems with extremely fast
power supply rise times (<500 ns) it is recommended
that the RCDLY time constant be greater than 5.0 ms.
Vth(MPU) is the microprocessor reset input threshold.

1.2 Vref

GND

1
tDLY = RCDLY In

Vth(MPU)
1Vin

Figure 9. Low Voltage Microprocessor Reset

TEST DATA
VH
(mV)

RH
+

Iin

Input

RL

Power
Supply
-

Reset

Microprocessor
Circuit

+
1.2Vref

GND

VH

4.6 RH
+ 0.02
RL

DVth(lower) 340 RH x 10-6

Where:RH 150 W
Where:RL 1.5 W, 10 kW

20
51
40
81
71
112
100
164
190
327
276
480

Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been
simplified and does not account for the change of input current Iin as VCC crosses the comparator threshold
(Figure 4). An increase of the lower threshold DVth(lower) will be observed due to Iin which is typically 340 mA at
4.59V. The equations are accurate to 10% with RH less than 150 W and RL between 1.5 kW and 10 kW .

Figure 10. Low Voltage Microprocessor Reset with Additional Hysteresis

http://onsemi.com
4

DVth
(mV)

RH
(W)

RL
(kW)

0
3.4
6.8
6.8
10
10
16
16
34
34
51
51

0
10
20
20
30
30
47
47
100
100
150
150

0
1.5
4.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5
2.7
1.5

MC34064, MC33064, NCV33064

1.0k
+

Input

Power
Supply

Input

Reset

Reset

1.2Vref

1.2Vref

Solar
Cells

GND

GND

Figure 11. Voltage Monitor

Figure 12. Solar Powered Battery Charger

25mH
MPSW51A

Vin = 11.5
to 14.5V

+
470
22

680

VO = 5.0 V
IO = 50 mA

470
1N5819
1.2k

4.7k
330
Input

1N756

Conditions

Test

Reset
+

Results

Line Regulation

Vin = 11.5 V to 14.5 V, IO = 50 mA

35 mV

Load Regulation

Vin = 12.6 V, IO = 0 mA to 50 mA

12 mV

Output Ripple

Vin = 12.6 V, IO = 50 mA

60 mVpp

Efficiency

Vin = 12.6 V, IO = 50 mA

77%

1.2Vref
GND

Figure 13. Low Power Switching Regulator

VCC
RL
MTP3055EL

270
4.6V
Input
Reset
+
1.2Vref
GND

Overheating of the logic level power MOSFET due to insufficient gate voltage can be prevented with the above
circuit. When the input signal is below the 4.6 V threshold of the MC34064, its output grounds the gate of the L2
MOSFET.

Figure 14. MOSFET Low Voltage Gate Drive Protection

http://onsemi.com
5

MC34064, MC33064, NCV33064

ORDERING INFORMATION
Package

Shipping

MC34064D005

SOIC8

98 Units / Rail

MC34064D5G

SOIC8
(PbFree)

MC34064D5R2

SOIC8

Device

Operating Temperature Range

MC34064D5R2G

SOIC8
(PbFree)

MC34064DM5R2

Micro8

MC34064DM5R2G

TO92

MC34064P5G

TO92
(PbFree)

TA = 0C to +70C

TO92

MC34064P5RAG

2000 Units / Bag

2000 Units / Tape & Reel

TO92
(PbFree)

MC34064P5RP

TO92

MC34064P5RPG

2000 Units / Ammo Pack

TO92
(PbFree)

MC34064P5RM

TO92

MC34064P5RMG

TO92
(PbFree)

MC34064SN5T1

TSOP5

MC34064SN5T1G

3000 Units / Tape & Reel

TSOP5
(PbFree)

MC33064D005

SOIC8

MC33064D5G

SOIC8
(PbFree)

MC33064D5R2

SOIC8

MC33064D5R2G

SOIC8
(PbFree)

MC33064DM5R2

Micro8

MC33064DM5R2G

98 Units / Rail

2500 Units / Tape & Reel

4000 Units / Tape & Reel

Micro8
(PbFree)

MC33064P005
MC33064P5G

4000 Units / Tape & Reel

Micro8
(PbFree)

MC34064P005

MC34064P5RA

2500 Units/ Tape & Reel

TO92
TA = 40C to +85C

2000 Units / Bag

TO92
(PbFree)

MC33064P5RA

TO92

MC33064P5RAG

2000 Units / Tape & Reel

TO92
(PbFree)

MC33064P5RP

TO92

MC33064P5RPG

TO92
(PbFree)

MC33064SN5T1

TSOP5

MC33064SN5T1G

2000 Units / Ammo Pack

3000 Units / Tape & Reel

TSOP5
(PbFree)

For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33064: Tlow = 40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
change control.

http://onsemi.com
6

MC34064, MC33064, NCV33064

ORDERING INFORMATION
Device

Operating Temperature Range

Package

Shipping

SOIC8

2500 Units / Tape & Reel

NCV33064D5R2*
NCV33064D5R2G*

SOIC8
(PbFree)

NCV33064P5RA*

2000 Units / Tape & Reel

TO92

NCV33064P5RAG*

TO92
(PbFree)

TA = 40C to +125C

NCV33064P5RP*

2000 Units / Ammo Pack

TO92

NCV33064P5RPG*

TO92
(PbFree)

NCV33064DM5R2*

Micro8

NCV33064DM5R2G*

4000 Units / Tape & Reel

Micro8
(PbFree)

For information on tape and reel specifications, including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV33064: Tlow = 40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and
change control.

MARKING DIAGRAMS

SOIC8
D SUFFIX
CASE 751
8

8
V3064
ALYW5
G

3x064
ALYW5
G

TO92
P SUFFIX
CASE 29

Micro8
DM SUFFIX
CASE 846A
8
Ly50
AYW G
G

VI50
AYW G
G

TSOP5
SN SUFFIX
CASE 483
5

5
SRB AYW G
G

SSN AYW G
G

1
MC34064

x
y
A
L
Y
W, WW
G

MC33064

=
=
=
=
=
=
=

3 or 4
C or I
Assembly Location
Wafer Lot
Year
Work Week
PbFree Package

(Note: Microdot may be in either location)

http://onsemi.com
7

MC3x0
64P5
ALYWW G
G

NCV30
64P5
ALYWW G
G

2 3

2 3

MC34064, MC33064, NCV33064

PACKAGE DIMENSIONS
SOIC8
D SUFFIX
CASE 75107
ISSUE AJ
X

NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.

A
8

0.25 (0.010)

1
4

G
C

DIM
A
B
C
D
G
H
J
K
M
N
S

X 45 _

SEATING
PLANE

0.10 (0.004)
H

D
0.25 (0.010)

Z Y

SOLDERING FOOTPRINT*

1.52
0.060

7.0
0.275

4.0
0.155

0.6
0.024

1.270
0.050
SCALE 6:1

mm
inches

*For additional information on our PbFree strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com
8

MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20

INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244

MC34064, MC33064, NCV33064

PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A02
ISSUE G
D

HE

PIN 1 ID

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.

b 8 PL
0.08 (0.003)

T B

SEATING

T PLANE
0.038 (0.0015)

A
A1

MILLIMETERS
NOM
MAX

1.10
0.08
0.15
0.33
0.40
0.18
0.23
3.00
3.10
3.00
3.10
0.65 BSC
0.40
0.55
0.70
4.75
4.90
5.05

DIM
A
A1
b
c
D
E
e
L
HE

MIN

0.05
0.25
0.13
2.90
2.90

SOLDERING FOOTPRINT*
8X

1.04
0.041

0.38
0.015

3.20
0.126

6X

8X

4.24
0.167

0.65
0.0256

5.28
0.208

SCALE 8:1

mm
inches

*For additional information on our PbFree strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com
9

INCHES
NOM

0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.016
0.021
0.187
0.193
MIN

0.002
0.010
0.005
0.114
0.114

MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199

MC34064, MC33064, NCV33064

PACKAGE DIMENSIONS
TSOP5
SN SUFFIX
CASE 48302
ISSUE H

D 5X

NOTE 5
2X

0.10 T

2X

0.20 T

NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.

0.20 C A B
M
5
1

4
2

S
K
DETAIL Z

G
A

DIM
A
B
C
D
G
H
J
K
L
M
S

DETAIL Z

C
0.05

SEATING
PLANE

H
T

SOLDERING FOOTPRINT*
0.95
0.037

1.9
0.074

2.4
0.094
1.0
0.039
0.7
0.028

SCALE 10:1

mm
inches

*For additional information on our PbFree strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com
10

MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00

MC34064, MC33064, NCV33064

PACKAGE DIMENSIONS
TO92 (TO226)
P SUFFIX
CASE 2911
ISSUE AM
A

STRAIGHT LEAD
BULK PACK

R
P
L
SEATING
PLANE

X X

G
J

H
V

C
SECTION XX

NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.

DIM
A
B
C
D
G
H
J
K
L
N
P
R
V

INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.021
0.045
0.055
0.095
0.105
0.015
0.020
0.500
--0.250
--0.080
0.105
--0.100
0.115
--0.135
---

MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.407
0.533
1.15
1.39
2.42
2.66
0.39
0.50
12.70
--6.35
--2.04
2.66
--2.54
2.93
--3.43
---

BENT LEAD
TAPE & REEL
AMMO PACK

P
T
SEATING
PLANE

X X

J
V
1

C
N

SECTION XX

NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.

DIM
A
B
C
D
G
J
K
N
P
R
V

MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.40
0.54
2.40
2.80
0.39
0.50
12.70
--2.04
2.66
1.50
4.00
2.93
--3.43
---

Micro8 is a trademark of International Rectifier.

ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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MC34064/D