Xiaomi Mi3: Quad-Band Gsm/Edge Td-Scdma/Td-Hsdpa/Td-Hsupa (1800-1920 / 2010-2025 MHZ) (Bands 34 & 39) Sample Report

Xiaomi MI3
Quad-Band GSM/EDGE
TD-SCDMA/TD-HSDPA/TD-HSUPA
(1800-1920 / 2010-2025 MHz) (Bands 34 & 39)
Sample Report
Product Description
The Xiaomi MI3 smartphone features a 5-in. IPS TFT-LCD
display with FHD (1920 x 1080) resolution, 16M colors, and
a capacitive touchscreen with anti-glare overlay. It runs the
Android 4.2.1 Jelly Bean operating system with Xiaomis
proprietary MIUI (Me You I) user interface on a 1.8 GHz
quad-core NVIDIA Tegra 4 processor with 2 GB RAM. It
also features 16 GB of internal memory (no microSD slot for
additional storage) and two cameras. The rear-facing 13 MP
BSI (Sony Exmor RS) CMOS camera has autofocus, dualLED flash, HDR, and 1080p HD video capability. Theres also
a front-facing 2 MP webcam. Connectivity is provided by dualband WiFi 802.11a/b/g/n (2.4 GHz & 5 GHz), WiFi Mobile
Hotspot, WiFi Direct, WiFi Display, Bluetooth 4.0, microUSB 2.0,
NFC, DLNA, FM radio, and GPS/GLONASS. Sensors include
a 6-axis MEMS gyroscope & accelerometer, 3-axis electronic
compass, ambient light/proximity sensor, and pressure sensor.
The Xiaomi MI3 is powered by a 3.8 V, 3050 mAh Li-polymer
battery. (Battery life is unknown.)
Learn more...
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses
are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes
that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any
information in this document, and shall bear no liability whatsoever for the use of the information.
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2014, TechInsights
Deep Dive Teardown
Deep Dive Teardown

Xiaomi MI3 Sample Report
Product Description
Integrated Circuit Metrics
Product Type
Smartphone
IC Die Count**
63
Brand
Xiaomi
IC Package Count**
52
Product Name & Model #
MI3
Official Release Date
10/15/2013
Weight (grams)
146.2
Retail Price
$327.00
Product Dimensions (mm)
144 x 73.6 x 8.1
Total Manufacturing Cost*
$187.45
Electronics Cost**
$135.54
Cost Metrics
Product Features
Operating System
Communications
Connectivity
Android 4.2.1 "Jelly Bean" w/ MIUI User Interface
Manufacturing Cost Breakdown

$73.68
39.3%
$12.94
6.9%
$6.92
3.7%
$5.00
2.7%
$1.64
0.9%
$6.06
3.2%
Display/Touchscreen Subsystem
$55.41
29.6%
Rear Camera Subsystem
$12.56
6.7%
Front Camera Subsystem
$4.10
2.2%
Non-Electronic Parts
$6.87
3.7%
Final Assembly & Test
$2.27
1.2%
$187.45
100.0%
Integrated Circuits
Quad-Band GSM/EDGE; TD-SCDMA/TD-HSDPA/TD-HSUPA Modules, Discretes & Connectors

(1880-1920/2010-2025 MHz) (Bands 34 & 39)
Substrates
WiFi 802.11a/b/g/n (2.4 GHz & 5 GHz), WiFi Mobile
Component Insertion
Hotspot, WiFi Direct, WiFi Display, Bluetooth 4.0,
Card Test
microUSB 2.0, NFC, DLNA, FM, GPS/GLONASS
Battery Subsystem
Battery Life
Use Time: N/A

Standby Time: N/A
Processor
1.8 GHz Quad-Core NVIDIA Tegra 4

(ARM Cortex-A15) w/ 2 GB RAM
Interface
Capacitive Touchscreen
Storage
Internal: 16 GB; External: N/A
Sensors
6-Axis MEMS Gyroscope & Accelerometer, 3-Axis

Electronic Compass, Ambient Light / Proximity Sensor,
Pressure Sensor
Total
*Excluding Supporting Materials' Cost
**Including Subsystems
Key Subsystems
Front Page
Battery
3.8 V, 3050 mAh, Li-polymer
Display/Touchscreen
5.0" TFT-LCD; 1920 x 1080 Pixels; 16,777,216 Colors; Cover Glass w/ Integrated Touchscreen
Rear Camera
Front Camera
13 MP BSI CMOS (Sony Exmor RS), Autofocus, Dual-LED Flash, HDR, 1080p HD Video
2 MP BSI CMOS
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Component Arrangement
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Overview & Discussion
Deep Dive Teardown

DIPL
NFC Antenna
GPS Antenna
25 - Infineon
#BGA725L6
GNSS LNA
11 - Renesas
#uPG2185T6R
GaAs SPDT Switch
4 - Broadcom
#BCM43341
WiFi 802.11a/b/g/n / Bluetooth / FM Radio / NFC
16 - Broadcom
#BCM4752
GNSS Receiver
28 - STMicroelectronics
#ST33xxxx
Secure Microcontroller w/ Flash
TD-SCDMA 2000 MHz Rx
TD-SCDMA 1900 MHz Rx
GSM 1800/1900 MHz Rx

GSM 1900 MHz Rx
GSM 1800 MHz Rx
GSM 900 MHz Rx
GSM 850/900 MHz Rx

GSM 850 MHz Rx
TD-SCDMA 1900/2000 MHz Rx
15 - RF Micro Devices
#RF9812
Quad-Band GSM / TD-SCDMA Bands 34 & 39 Power Amplifier,
Antenna Switch
GSM 1800/1900 MHz Tx & TD-SCDMA 1900/2000 MHz Tx
WiFi/Bluetooth Antenna
GSM 850/900 MHz Tx
Main Antenna
To Tegra 4
14 - Spreadtrum
#SR3500
GSM / TD-SCDMA RF Transceiver
5 - Spreadtrum
#SC8803G5
GSM / TD-SCDMA Baseband Processor & PMU
6 - Micron
#MT46H32M16LFBF-5
Mobile LPDDR SDRAM Memory - 64 MB
Estimated block diagram based on observation of this specific product implementation, manufacturers
data sheets where available, and best engineering judgment. Certain details of the interface circuitry
are not reflected in this block diagram. Partitioning and connectivity are speculative.
Page 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Page 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Front Camera
Rear Camera
41 - Unknown
#Unknown
2 MP BSI CMOS Image Sensor
39 - Sony
#IMX135
Strobe
Flash
24 - Texas Instruments
#INA231
Current / Power Monitor
USB
20 - Intersil
#ISL98607
TFT-LCD Power Supply
7 - Maxim
#MAX77665A
Power Management
#TPS65913
Power Management
#LM3533
Backlight LED Driver
23 - Fairchild Semiconductor
#FSA3031
Dual USB 2.0 Switch w/ MHL
42 - Renesas SP Drivers
#R63311A
TFT-LCD Display Driver
37 - ON Semiconductor
#NCT218
Temperature Sensor
43 - Atmel
#MXT540S
540-Channel Capacitive Touchscreen Controller
26 - Bosch Sensortec
#BMP180
Digital Barometric Pressure Sensor
From BCM4752
38 - Intersil
#ISL29147 ?
Ambient Light / Proximity Sensor, IR Emitter LED
1 - NVIDIA
#Tegra 4
Quad-Core Applications Processor + GPU
To BCM43341
To SC8803G5
9 - AKM Semiconductor
#AK8963C
3-Axis Electronic Compass
Headset
Front Microphone
Rear Microphone
8 - Invensense
#MPU-6050
6-Axis MEMS
Gyroscope & Accelerometer
19 - Audience
#eS325
Voice Processor
17 - Cirrus Logic
#CS42L73
Audio CODEC
2 - SK Hynix
#H9CCNNNBPTMLBR-NTM
Multichip Memory - 2 GB LPDDR3 SDRAM
Earpiece
Vibrator
#TPA2015D1
2 W Class-D Audio Amplifier
#DRV2604
Haptic Driver
13 - SanDisk
#SDIN8DE4-16G
Multichip Memory - 16 GB MLC NAND Flash,
Memory Controller (eMMC)
SI
M
Speaker
44 - Mitsumi
#MM3210
Battery Protection
Estimated block diagram based on observation of this specific product implementation, manufacturers
data sheets where available, and best engineering judgment. Certain details of the interface circuitry
are not reflected in this block diagram. Partitioning and connectivity are speculative.
Page 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Page 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Total Estimated
Cost of Supporting Materials: $2.54
Packaging
$0.27
Documentation
$0.04
SIM Eject Tool

$0.03
AC Adapter
$1.85
USB Cable
$0.35
Supporting Materials
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Label
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Supporting Materials
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Label
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Touchscreen
microUSB
Ambient Light/
Proximity Sensor
Earpiece
Front Camera
Notification
LEDs
Speaker
Lock/Power Key
Front
Microphone
Top
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Volume
Bottom
Backlights
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Flash LED
Rear Camera
SIM Tray Slot

Rear Microphone
3.5 mm Jack
Top
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Bottom
Backlights
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Top
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Bottom
Backlights
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Step 1
Step 2
Step 3
Major Components
Teardown
Step 4
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Step 1
Step 2
Step 3
Major Components
Teardown
Step 4
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Step 1
Step 2
Step 3
Major Components
Teardown
Step 4
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Step 1
Step 2
Step 3
Major Components
Teardown
Step 4
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Main
Antenna Element
Length
55 mm
Width
10.5 mm
Height
4.5 mm
Main Antenna
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
GPS Antenna
Teardown
Antenna
NFC Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

WiFi/Bluetooth
Antenna Element
Length
17.5 mm
Width
10.9 mm
Height
2.9 mm
Main Antenna
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
GPS Antenna
Teardown
Antenna
NFC Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

GPS
Antenna Element
Length
17.6 mm
Width
13.4 mm
Height
3.9 mm
Main Antenna
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
GPS Antenna
Teardown
Antenna
NFC Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

NFC
Antenna Element
Length
73.6 mm
Width
48.8 mm
Height
0.2 mm
Main Antenna
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
GPS Antenna
Teardown
Antenna
NFC Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Battery Pack
Battery
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Estimated Cost
Camera
Display/Touchscreen
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Battery Pack
Pack Brand
Pack Part Number
Pack Voltage
Cell Type
Pack Rating (mAHrs)
Pack Size (mm)
Vol. Energy Density (mWHrs/cc)
Pack Weight (grams)
Wt. Energy Density (mWHrs/g)
Cell Brand
Cell(s)
Electronic Parts
Non-electronic Parts
Estimated Costs
Assembly
Test
Gross Margin
Estimated Pack Price
Samsung
BM31
3.8
Lithium Polymer
3050
72.7 x 64.7 x 4.3
573.0
47.4
244.5
Samsung SDI
$3.19
$0.60
$0.22
$0.18
$0.05
$1.82
$6.06
Grid = 1 cm
44 - Mitsumi
#MM3210
Battery Protection
Grid = 1 cm
Battery Pack
Battery
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Estimated Cost
Camera
Display/Touchscreen
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Front Camera
Brand
Part Number
Subsystem Size (mm)
Camera Size (mm)
Subsystem Weight (grams)
Camera Weight (grams)
Type
Resolution
Optical Size
Lens Elements
Optical Zoom
Electronic Parts
Estimated Costs
Assembly
Test
Gross Margin
Unknown
12P1BF261
6 x 6 x 3.3
6 x 6 x 3.3
0.1
0.1
CMOS
2 MP
1/6
4
1
$1.48
$1.04
$0.21
$0.15
$1.23
Estimated Module Price
$4.10
41 - Unknown
#Unknown
Front
Battery
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Rear
Camera
Display/Touchscreen
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Rear Camera
Brand
Part Number
Subsystem Size (mm)
Camera Size (mm)
Subsystem Weight (grams)
Camera Weight (grams)
Type
Resolution
Optical Size
Lens Elements
Optical Zoom
Electronic Parts
Estimated Costs
Assembly
Test
Gross Margin
Sony
5118665288
8.5 x 8.5 x 5.3
8.5 x 8.5 x 5.3
0.7
0.7
CMOS
13 MP
1/3
5
1
$5.64
$1.47
$0.27
$0.15
$5.02
$12.56
39 - Sony
#IMX135
40 - Analog Devices
#Unknown
Autofocus VCM Motor Driver
Front
Battery
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Rear
Camera
Display/Touchscreen
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

42 - Renesas SP Drivers
#R63311A
Grid = 1 cm
Display
Battery
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Touchscreen
Camera
Estimated Cost
Display/Touchscreen
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

The Touchscreen circuitry is directly

integrated into the Cover Glass.
43 - Atmel
#MXT540S
540-Channel Capacitive
Touchscreen Controller
Grid = 1 cm
Display
Battery
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Touchscreen
Camera
Estimated Cost
Display/Touchscreen
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Display/Touchscreen
Brand
Part Number
Module Dimensions
Weight (grams)
Panel Metrics
Estimated Costs
View Size (mm)

Type
Colors
Rows / Columns
Backlighting Scheme
Panel(s)
Electronic Parts
Circuit Assembly
Final Assembly
Test
Gross Margin
Sharp
LS050T1SX06
141.5 x 68 x 2.85
33.50
110.6901 x 62.26318
TFT w/Chip-in-Glass
16777216
1920 / 1080
12 White LEDs
$7.49
$26.32
$0.33
$2.46
$0.18
$0.35
$18.29
Display
Battery
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Touchscreen
Camera
$55.41
Estimated Cost
Display/Touchscreen
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Earpiece
Front
Camera
Notification
LEDs
Rear Camera
GND
GND
Vibrator
Button Flex
GND
Grid = 1 cm
Side 1
Front Page
Product Overview
Block Diagram
Side 1 IC Identification
Product Packaging
Side 1 X-Ray & Die Photos
Exterior Features
Major Components
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

9 - AKM Semiconductor
#AK8963C
#TPS65913
Power Management
#FSA8108
Audio Jack Detection & Switch
#M24256
Serial EEPROM Memory - 32 KB
4 - Broadcom
#BCM43341
WiFi 802.11a/b/g/n / Bluetooth
/ FM Radio / NFC
5 - Spreadtrum
#SC8803G5
GSM / TD-SCDMA Baseband
Processor & PMU (2-Die Pkg.)
11 - Renesas
#uPG2185T6R
GaAs SPDT Switch
8 - Invensense
#MPU-6050
6-Axis MEMS Gyroscope
& Accelerometer
2 - SK Hynix
#H9CCNNNBPTMLBR-NTM
Multichip Memory - 2 GB
LPDDR3 SDRAM (4-Die Pkg.)
6 - Micron
#MT46H32M16LFBF-5
64 MB LP DDR SDRAM
7 - Maxim
#MAX77665A
Power Management
1 - NVIDIA
#Tegra 4
Grid = 1 cm
Page 1
Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Page 2
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

#CSPEMI202AG
2-Channel EMI Filter w/ ESD Protection
#TPS22913
Load Switch
36 - Ricoh
#RP114K281D
300 mA / 2.8 V LDO Regulator
46 - Ricoh
#RP114K121D
33 - Intersil
#ISL54062
Dual SPDT w/ Click &
Pop Elimination Switch
47 - Ricoh
#RP114Kx
300 mA LDO Regulator
#FSA2269TS
Dual SPDT Analog Switch
#NCT218
Temperature Sensor
#EMIF02-SPK03F2
#NC7WZ04
Dual Inverter
#FPF1504
Load Switch
#TXS0102
2-Bit Voltage Level Translator
Grid = 1 cm
Page 1
Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Page 2
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

2 - SK Hynix
#H9CCNNNBPTMLBR-NTM
Multichip Memory - 2 GB LPDDR3 SDRAM (4-Die Pkg.)
Pkg Size: 11.7 x 11 mm
2.1 - SK Hynix
#H53R4D23M
Mobile LPDDR3 SDRAM Memory - 512 MB
Die Size: 8.8 x 8.5 mm
Image 1
Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Image 2
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

5 - Spreadtrum
#SC8803G5
GSM / TD-SCDMA Baseband Processor & PMU (2-Die Pkg.)
Pkg Size: 8.55 x 8.34 mm
5.1 - Spreadtrum
#Unknown
Digital Baseband Processor
5.2 - Spreadtrum
#Unknown
Analog Baseband Processor & PMU
Image 1
Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Image 2
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

SIM
Touchscreen
Flash LEDs
Sensor Flex
WiFi/Bluetooth
Antenna
GPS Antenna
USB Flex
Main Antenna
Coax Cable
Battery
NFC Antenna
Display
Grid = 1 cm
Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

17 - Cirrus Logic
#CS42L73
Audio CODEC
26 - Bosch Sensortec
#BMP180
Digital Barometric Pressure
Sensor (2-Die Pkg.)
#TPA2015D1
25 - Infineon
#BGA725L6
GNSS LNA
#TLV71718P
16 - Broadcom
#BCM4752
GNSS Receiver
49 - Ricoh
#RP114K111D
14 - Spreadtrum
#SR3500
19 - Audience
#eS325
Voice Processor
#NC7SV32
2-Input OR Gate
#ST33xxxx
#RF9812
Quad-Band GSM / TD-SCDMA
Bands 34 & 39 Power Amplifier,
Antenna Switch (3-Die Pkg.)
#LM3533
#FSA3031
#DRV2604
Haptic Driver
#INA231
20 - Intersil
#ISL98607
#TPS22913
Load Switch
13 - SanDisk
#SDIN8DE4-16G
Multichip Memory - 16 GB MLC NAND Flash,
Memory Controller (eMMC) (5-Die Pkg.)
Grid = 1 cm
Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

13 - SanDisk
#SDIN8DE4-16G
Multichip Memory - 16 GB MLC NAND Flash, Memory Controller (eMMC) (5-Die Pkg.)
13.1 - SanDisk
#EGK0 32G
MLC NAND Flash Memory - 4 GB
13.2 - SanDisk
#PHOENIXC2EMP6
Memory Controller
Image 1
Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Image 2
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

#RF9812
Quad-Band GSM / TD-SCDMA Bands 34 & 39 Power Amplifier, Antenna Switch (3-Die Pkg.)
15.2 - RF Micro Devices

#M2D981239
Antenna Switch

#M1D981203
RF Power Amplifier

#M3D9812-12
Power Amplifier Controller
Image 1
Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Image 2
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

Side 1
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Side 2
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Cross-Section
Costs and Metrics
Deep Dive Teardown

Grid = 1 cm
Main Board
Grid = 1 cm
Main Antenna
Coax Cable
Main Antenna
Backlight
LEDs for
Touch Keys
Front MEMS
Microphone
microUSB
Speaker
USB Flex
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Sensor Flex
Button Flex
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

38 - Intersil
#ISL29147 ?
Ambient Light / Proximity
Sensor, IR Emitter LED
3.5 mm Jack
Main Board
Rear MEMS Microphone
Grid = 1 cm
Grid = 1 cm
USB Flex
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Sensor Flex
Button Flex
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Main Board
Volume
Lock/Power Key
Grid = 1 cm
Grid = 1 cm
USB Flex
Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Sensor Flex
Button Flex
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Substrates
Assembly
Name
Button Flex
Main Board
Sensor Flex
USB Flex
Manufacturer
Core Material
Multi-Fineline Electronix
Unimicron Technologies
Polyimide
FR4
Polyimide
Polyimide
Substrates
Product Overview
Block Diagram
Subsystem ICs
Electronic Costs Breakdown
Product Packaging
Layers
2 Layer flex w/vias

10 Layer buildup FR4 / HF
2 Layer flex w/vias
4 Layer flex w/vias
Integrated Circuits
Electronic Assembly Metrics

Front Page
Mfg. Technology
Exterior Features
Min.
Trace
Pitch
(mm)
Area
(cm)
2
10
2
4
2.0
27.1
2.2
14.8
Min.
Trace
Width
(mm)
0.26
0.15
0.20
0.26
0.10
0.05
0.10
0.08
Modules
Vendor IC Cost Distribution

Major Components
ThruVia
Land Dia
(mm)
ThruVia
Hole Dia
(mm)
0.47
0.17
0.45
0.44
0.15
0.14
BlindVia
Land Dia
(mm)
0.26
Active Discretes
Non-Electronic Cost Estimate
Teardown
Antenna
BlindVia
Hole Dia
(mm)
Thickness
(mm)
0.13
Passive Discretes
Final Assy Labor & Test Cost
Subsystems
Main Board
Other Substrates
Routing
Density
0.1
0.8
0.1
0.2
30.0
86.4
37.1
13.5
Estimated
Costs
$
$
$
$
0.32
2.52
0.36
3.72
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Package Info
Location
Pkg Ref. #
Pkg
Qty
Brand Name
1
2
3
4
1
1
1
1
NVIDIA
SK Hynix
Texas Instruments
Broadcom
Spreadtrum
6
7
8
9
10
11
12
1
1
1
1
1
1
1
Micron
Maxim
Invensense
AKM Semiconductor
STMicroelectronics
Renesas
Fairchild Semiconductor
13
SanDisk
14
Spreadtrum
15
RF Micro Devices
16
17
18
19
20
21
22
23
24
25
1
1
1
1
1
1
1
1
1
1
Broadcom
Cirrus Logic
Texas Instruments
Audience
Intersil
Texas Instruments
Texas Instruments
Texas Instruments
Infineon
26
Bosch Sensortec
27
28
29
1
1
1
Texas Instruments
STMicroelectronics
Main Board, Side 1
30
31
32
33
34
35
36
37
1
1
1
1
2
1
1
1
Texas Instruments
Intersil
STMicroelectronics
ON Semiconductor
Ricoh
ON Semiconductor
Sensor Flex, Side 1
38
Intersil
Main Board, Side 1
45
46
47
48
2
1
1
1
Texas Instruments
Ricoh
Ricoh
Main Board, Side 2
49
50
1
1
Ricoh
Texas Instruments
Main Board, Side 1
Main Board, Side 2
Totals
Part Number
Estimated Costs
Die Info
Pkg Description
Form
Pin Count
Length
(mm)
BGA
BGA Stacked 4 (UF)
Flip Chip, Solder
Flip Chip, Solder
797
253
169
141
14.00
11.70
5.90
5.60
MCP - 2 Chips
345
8.55
8.34
0.80
BGA
Flip Chip, Solder
QFN
Flip Chip, Solder
Flip Chip, Solder
DFN
Flip Chip, Solder
60
100
24
14
8
6
12
9.00
4.50
4.00
1.60
1.30
1.00
1.60
8.00
4.50
4.00
1.60
1.30
1.00
1.20
0.75
0.60
0.90
0.70
0.60
0.80
0.80
BGA Stacked 5
153
12.90
11.60
1.00
BGA
65
5.00
5.00
0.90
MCP - 3 Chips
22
6.60
5.30
1.05
Flip Chip, Solder

Flip Chip, Solder
Flip Chip, Solder
BGA
Flip Chip, Solder
Flip Chip, Solder
Flip Chip, Solder
QFN
Flip Chip, Solder
DFN
30
64
16
36
20
9
4
12
12
6
2.40
3.50
2.00
3.00
2.10
1.50
0.90
1.80
1.60
1.10
2.00
3.50
2.00
3.00
1.80
1.50
0.90
1.80
1.40
0.70
0.60
0.60
0.60
0.90
0.70
0.60
0.60
0.80
0.70
0.60
3.80
3.60
0.90
20
8
6
2.00
4.00
1.00
1.80
4.00
1.00
8
4
10
10
5
5
4
8
1.30
1.00
1.80
1.80
1.30
1.40
1.00
1.70
DFN
Flip Chip, Solder

DFN
DFN
DFN
4
4
4
6
4
4
Tegra 4
H9CCNNNBPTMLBR-NTM
TPS65913
BCM43341

Multichip Memory - 2 GB LPDDR3 SDRAM
Power Management
SC8803G5
GSM / TD-SCDMA Baseband Processor & PMU
MT46H32M16LFBF-5
MAX77665A
MPU-6050
AK8963C
M24256
uPG2185T6R
FSA8108

Power Management
6-Axis MEMS Gyroscope & Accelerometer
GaAs SPDT Switch
SDIN8DE4-16G
Multichip Memory - 16 GB MLC NAND Flash, Memory Controller (eMMC)
SR3500
RF9812
Quad-Band GSM / TD-SCDMA Bands 34 & 39 Power Amplifier, Antenna Switch
BCM4752
CS42L73
TPA2015D1
eS325
ISL98607
DRV2604
TPS22913
FSA3031
INA231
BGA725L6
GNSS Receiver
Audio CODEC
Voice Processor
Haptic Driver
Load Switch
GNSS LNA
BMP180
Digital Barometric Pressure Sensor
MCP - 2 Chips
LM3533
ST33xxxx
NC7SV32

2-Input OR Gate
Flip Chip, Solder

DFN
DFN
TXS0102
FPF1504
FSA2269TS
ISL54062
EMIF02-SPK03F2
CSPEMI202AG
RP114K281D
NCT218

Load Switch
Dual SPDT w/ Click & Pop Elimination Switch
Temperature Sensor
DFN
Flip Chip, Solder
QFN
QFN
Flip Chip, Solder
Flip Chip, Solder
DFN
Flip Chip, Solder
ISL29147 ?
Ambient Light / Proximity Sensor, IR Emitter LED
TPS22913
RP114K121D
RP114Kx
NC7WZ04
Load Switch
Dual Inverter
RP114K111D
TLV71718P

DFN
DFN
46
Width
(mm)
Height
(mm)
14.00
11.00
5.70
4.60
1.00
0.80
0.80
0.40
Part Number
Description
Width
(mm)
Die Ref #
Die Qty
1.1
2.1
3.1
4.1
5.1
5.2
6.1
7.1
8.1
9.1
10.1
11.1
12.1
1
4
1
1
1
1
1
1
1
1
1
1
1
NVIDIA
SK Hynix
Texas Instruments
Broadcom
Spreadtrum
Spreadtrum
Micron
Maxim
Invensense
AKM Semiconductor
STMicroelectronics
Renesas
Tegra 4
H53R4D23M
TWL6035B2
BCM43341
Unknown
Unknown
Unknown
PR93B-2
MANTIS-B10
4164
M24256KB
G2185
FSA8108

Mobile LPDDR3 SDRAM Memory - 512 MB
Power Management
Digital Baseband Processor
Analog Baseband Processor & PMU
Power Management
6-Axis MEMS Gyroscope & Accelerometer
GaAs SPDT Switch
9.60
8.80
5.90
5.60
3.60
3.80
5.60
4.50
2.80
1.60
1.30
0.50
1.60
9.34
8.50
5.70
4.60
3.60
2.70
5.12
4.50
2.80
1.60
1.30
0.35
1.20
$ 27.070
$ 2.560
$ 2.230
$ 4.310
$ 3.260
$ 1.840
$ 0.810
$ 4.510
$ 2.150
$ 0.340
$ 0.140
$ 0.060
$ 0.150
$ 27.070
$ 10.240
$ 2.230
$ 4.310
$ 3.260
$ 1.840
$ 0.810
$ 4.510
$ 2.150
$ 0.340
$ 0.140
$ 0.060
$ 0.150
0.90
0.60
0.60
13.1
13.2
14.1
15.1
15.2
15.3
16.1
17.1
18.1
19.1
20.1
21.1
22.1
23.1
24.1
25.1
26.1
26.2
27.1
28.1
29.1
4
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
SanDisk
SanDisk
Spreadtrum
RF Micro Devices
RF Micro Devices
RF Micro Devices
Broadcom
Cirrus Logic
Texas Instruments
Audience
Intersil
Texas Instruments
Texas Instruments
Texas Instruments
Infineon
Bosch Sensortec
Bosch Sensortec
Texas Instruments
STMicroelectronics
EGK0 32G
PHOENIXC2EMP6
SR3500BA
M3D9812-12
M2D981239
M1D981203
BCM4752
42L73 CLI1551B0
TPA2015D1
AUD202
54136-01
DRV2604
TPSBPS 22913B0
FSA3031Z
5409
T1549A
CMD173
7170
LM3533
K8C0A
SP00X
MLC NAND Flash Memory - 4 GB

Memory Controller
Power Amplifier Controller
Antenna Switch
RF Power Amplifier
GNSS Receiver
Audio CODEC
Voice Processor
Haptic Driver
Load Switch
GNSS LNA
Pressure Sensor
Signal Processor
2-Input OR Gate
8.20
3.46
3.00
1.33
1.34
0.94
2.40
3.50
2.00
2.00
2.10
1.50
0.90
0.95
1.60
0.90
1.20
1.40
2.00
3.48
0.55
7.80
2.42
3.00
1.25
1.35
0.89
2.00
3.50
2.00
1.93
1.80
1.50
0.90
0.95
1.40
0.50
1.10
1.00
1.80
2.64
0.30
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
2.040
0.570
1.120
0.150
0.470
0.220
0.680
0.850
0.290
0.590
0.270
0.170
0.080
0.110
0.170
0.080
0.120
0.120
0.260
0.640
0.040
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
$
8.160
0.570
1.120
0.150
0.470
0.220
0.680
0.850
0.290
0.590
0.270
0.170
0.080
0.110
0.170
0.080
0.120
0.120
0.260
0.640
0.040
1.00
1.00
1.30
1.30
0.90
0.90
1.00
1.30
0.70
0.60
0.50
0.50
0.60
0.50
0.80
0.60
30.1
31.1
32.1
33.1
34.1
35.1
36.1
37.1
1
1
1
1
1
1
1
1
Texas Instruments
Intersil
STMicroelectronics
ON Semiconductor
Ricoh
ON Semiconductor
T0102A0
FPF1504A
FSA2269Z
MTA53682
3
EMI202
L235-004
SE

Load Switch
Dual SPDT w/ Click & Pop Elimination Switch
Temperature Sensor
1.00
1.00
1.20
1.20
1.30
1.40
0.60
1.70
0.40
1.00
0.80
0.80
0.90
0.90
0.50
1.30
$
$
$
$
$
$
$
$
0.060
0.090
0.090
0.090
0.100
0.110
0.040
0.150
$
$
$
$
$
$
$
$
0.060
0.090
0.090
0.090
0.200
0.110
0.040
0.150
4.00
2.40
1.00
38.1
Intersil
ISL29147 ?
Ambient Light / Proximity Sensor
1.50
0.80
0.250
0.250
0.90
1.00
1.00
1.01
0.90
1.00
1.00
0.99
0.60
0.61
0.60
0.56
45.1
46.1
47.1
48.1
1
1
1
1
Texas Instruments
Ricoh
Ricoh
TPSBPS 22913B0
L235-004
L235-004
WZ04X
Load Switch
Dual Inverter
0.90
0.57
0.57
0.41
0.90
0.48
0.48
0.37
$
$
$
$
0.080
0.030
0.030
0.040
$
$
$
$
0.160
0.030
0.030
0.040
1.01
0.98
1.01
0.97
0.67
0.42
49.1
50.1
1
1
Ricoh
Texas Instruments
L235-004
TLV717P

0.57
0.64
0.48
0.64
$
$
0.030
0.040
$
$
0.030
0.040
2516
Brand Name
Length
(mm)
Each
57
Total
$73.68
(UF) = Underfilled
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Note: The ICs listed below are for reference only.

Their costs are integrated into the cost of the individual subsystems.
Package Info
Location
Pkg Ref. #
Pkg
Qty
Rear Camera: Rear Camera Flex
39
40
1
1
Brand Name
Part Number
IMX135
Unknown

Unknown
Unknown
Front Camera: Front Camera Flex
41
Display/Touchscreen: Display Flex
42
Display/Touchscreen: Touchscreen Flex
43
Atmel
MXT540S
Battery Pack: Battery Flex
44
Mitsumi
MM3210
Totals
Renesas SP Drivers R63311A
Form
Pin Count
Length
(mm)
Width
(mm)
Height
(mm)
Die Ref #
Die Qty
COB
Flip Chip, Solder
77
6
6.91
1.20
5.29
0.85
0.20
0.40
39.1
40.1
1
1
Sony
Analog Devices
IMX135
Unknown

Pkg Description
Sony
Analog Devices
Estimated
Costs
Die Info
Brand Name
Part Number
Description
Length
(mm)
Width
(mm)
6.00
1.20
4.35
0.85
$ 4.330 $ 4.330
$ 0.100 $ 0.100
$ 1.100 $ 1.100
Each
Total
COB
36
4.67
3.82
0.30
41.1
Unknown
Unknown
3.93
3.15
Flip Chip, Adhesive
2008
29.80
0.85
0.30
42.1
Renesas SP Drivers
R63311A
29.80
0.85
$ 1.620 $ 1.620
BGA
72
6.00
6.00
0.80
43.1
Atmel
AT359C8
5.10
5.00
$ 1.940 $ 1.940
Battery Protection
DFN
1.60
1.50
0.80
44.1
Mitsumi
Unknown
Battery Protection
0.99
0.70
$ 0.070 $ 0.070
2205
$9.16
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Estimated
Costs
Package
Location
Qty
Brand Name
Description
Pin
Count
Length
(mm)
Width
(mm)
Each
Total
Main Board, Side 1
1
1
1
1
1
1
1
1
1
TXC
Kyocera
Kyocera
Miyazaki Epson
AAC Acoustic Ltd
KDS
Unknown
Unknown
Unknown
8Q Series
ST2012SB
CX2520DB
FC-135
AAC130910F2
DSA321SCA
Unknown
Unknown
Unknown
Crystal: Ceramic
Crystal: Ceramic
Crystal: Ceramic
Crystal: Ceramic
Speaker: Earpiece
Oscillator: TCXO
Vibrator: Vibrator
Shielding: Small
Filter: Diplexer
4
2
4
2
2
4
2
1
6
1.60
2.00
2.50
3.20
13.20
3.17
8.00
7.10
1.80
1.20
1.20
2.00
1.50
6.00
2.47
8.00
5.00
1.20
$
$
$
$
$
$
$
$
$
0.200
0.200
0.200
0.200
0.330
0.620
0.380
0.020
0.060
$
$
$
$
$
$
$
$
$
0.200
0.200
0.200
0.200
0.330
0.620
0.380
0.020
0.060
Main Board, Side 2
1
2
1
1
4
1
1
Murata
TDK-EPC
Murata
Murata
Unknown
Unknown
Kyocera
SAWEN1G84CV0F00
B8401
SAWEN881MCX0F00
SAWFD1G90CA0F0A
Unknown
Unknown
KT2016
Filter: Dual SAW - GSM 1800/1900 Rx

Filter: SAW - GPS/GLONASS
Filter: Dual SAW - GSM 850/900 Rx
Filter: Dual SAW - TD-SCDMA 1900/2000 Rx
Shielding: Small
Antenna: NFC w/ Ferrite Sheet
Oscillator: TCXO for GPS
10
4
10
10
1
2
4
1.80
1.40
1.80
1.50
20.00
77.80
2.00
1.35
1.10
1.35
1.10
20.00
55.10
1.70
$
$
$
$
$
$
$
0.110
0.070
0.110
0.110
0.020
0.450
0.620
$
$
$
$
$
$
$
0.110
0.140
0.110
0.110
0.080
0.450
0.620
USB Flex, Side 1
1
1
Knowles
Unknown
SPK0415HM4H-B
Unknown
Microphone: MEMS
Speaker: Speaker
8
2
4.00
19.00
3.00
13.50
$ 0.270 $ 0.270
$ 0.360 $ 0.360
Sensor Flex, Side 2
Knowles
SPK0415HM4H-B
Microphone: MEMS
4.00
3.00
$ 0.270 $ 0.270
Button Flex, Side 1
Unknown
Unknown
Key Pad: Assembly
40.80
5.90
$ 0.070 $ 0.070
TOTALS
24
99
Substrates
Integrated Circuits

Front Page
Part Number
Product Overview
Block Diagram
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
Active Discretes
Teardown
Antenna
$4.80
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Package
Location
Qty
Functional Description
Form
Top Marking
Pin Count
Length
(mm)
Width
(mm)
Each
Total
Main Board, Side 1
1
21
2
1
16
2
1
2
1
1
Small Active
Small Active
Small Active
Small Active
Small Active
Small Active
Small Active
Small Active
Small Active
Small Active
MOSFET
Diode, SMT
Transistor, Small
Transistor, Small
Diode, SMT
Diode, SMT
Diode, SMT
Diode, SMT
LED, Multi-Color
Dual Transistor
A95H
jS
E23
TF 3
A4
D
65
None
None
D6
7
2
3
3
2
2
2
2
4
6
2.00
2.00
1.20
1.60
0.66
0.66
0.66
0.66
1.65
1.56
2.00
1.20
0.80
0.80
0.30
0.30
0.30
0.30
1.50
1.17
$0.090
$0.015
$0.030
$0.030
$0.015
$0.015
$0.015
$0.015
$0.090
$0.030
$0.090
$0.313
$0.060
$0.030
$0.238
$0.030
$0.015
$0.030
$0.090
$0.030
Main Board, Side 2
1
33
2
1
1
2
6
Small Active
Small Active
Small Active
Small Active
Small Active
Small Active
Small Active
Diode, SMT
Diode, SMT
Diode, SMT
Diode, SMT
Diode, SMT
LED, Flash
Diode, SMT
9A
A4
A3
B2
T
none
jS
2
2
2
2
2
2
2
0.66
0.66
0.66
1.10
1.00
2.00
2.00
0.30
0.30
0.30
0.75
0.70
1.70
1.20
$0.015
$0.015
$0.015
$0.015
$0.015
$0.250
$0.015
$0.015
$0.492
$0.030
$0.015
$0.015
$0.500
$0.089
USB Flex, Side 1
4
1
1
1
Small Active
Small Active
Small Active
Small Active
Diode, SMT
Diode, SMT
Diode, SMT
Diode, SMT
A1
43
9A
m6
2
2
2
2
0.66
0.66
0.66
0.66
0.30
0.30
0.30
0.30
$0.015
$0.015
$0.015
$0.015
$0.060
$0.015
$0.015
$0.015
USB Flex, Side 2
Small Active
LED, Single
None
2.00
1.10
$0.050
$0.100
TOTALS
103
220
Substrates
Integrated Circuits

Front Page
Estimated Costs
Product Overview
Block Diagram
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
$2.29
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Estimated
Costs
Package
Location
Qty
Functional Description
Form
Each
Total
Main Board, Side 1
3
2
7
9
362
Small Passive
Small Passive
Coil
Small Passive
Small Passive
Cap, Res, Ferrite Array

SMT, Small
Coil, Inductor
Cap, Res, Ferrite
10
6
2
2
2
$0.007
$0.007
$0.050
$0.008
$0.004
$0.022
$0.015
$0.350
$0.072
$1.448
Main Board, Side 2
2
2
2
21
235
Small Passive
Small Passive
Coil
Small Passive
Small Passive

SMT, Small
Coil, Inductor
Cap, Res, Ferrite
10
6
2
2
2
$0.007
$0.007
$0.050
$0.008
$0.004
$0.015
$0.015
$0.100
$0.168
$0.940
USB Flex, Side 1
4
15
Small Passive
Small Passive
Coil, Inductor
Cap, Res, Ferrite
2
2
$0.008
$0.004
$0.032
$0.060
Sensor Flex, Side 1
Small Passive
Cap, Res, Ferrite
$0.004
$0.024
TOTALS
670
Substrates
Product Overview
Block Diagram
1396
Integrated Circuits

Front Page
Pin Count
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
$3.26
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Estimated
Costs
Package
Location
Qty
Pin
Count
Length
(mm)
Width
(mm)
Each
Total
Button Flex, Side 1
Bd to Bd: Main Board
14
3.30
1.20
$0.090
$0.090
Main Board, Side 1
1
1
3
1
Bd to Bd: Rear Camera

Bd to Bd: Front Camera
Connector: Spring - Formed, GND
Bd to Bd: Button Flex
34
20
1
10
8.90
6.00
3.20
4.20
2.20
2.20
1.20
1.60
$0.190
$0.120
$0.030
$0.070
$0.190
$0.120
$0.090
$0.070
Main Board, Side 2
1
1
2
1
1
2
1
1
2
1
1
1
1
1
Connector: External Test Antenna, Main

Socket: SIM
Connector: Spring - Formed, GPS Antenna
Bd to Bd: Touchscreen
Bd to Bd: Sensor Flex
Connector: Spring - Formed, WiFi/Bluetooth Antenna
Connector: External Test Antenna, WiFi/Bluetooth
Bd to Bd: USB Flex
Connector: Spring - Formed, NFC Antenna
Connector: External Test Antenna, GPS
Connector: Antenna Coax, Main
Cable: Coax, Main Antenna
Bd to Bd: Battery
Bd to Bd: Display
2
6
1
10
20
1
2
24
1
3
2
2
4
34
2.70
28.00
3.10
4.10
6.40
3.00
2.70
7.30
3.00
2.70
1.70
85.00
3.90
9.00
2.70
19.00
1.10
1.70
2.20
1.10
2.70
2.20
1.10
2.70
1.70
0.80
2.40
2.20
$0.070
$0.230
$0.030
$0.070
$0.120
$0.030
$0.070
$0.140
$0.030
$0.070
$0.040
$0.140
$0.040
$0.190
$0.070
$0.230
$0.060
$0.070
$0.120
$0.060
$0.070
$0.140
$0.060
$0.070
$0.040
$0.140
$0.040
$0.190
Sensor Flex, Side 1
24
5.30
1.60
$0.140
$0.140
Sensor Flex, Side 2
Jack: Headphone
12.20
7.20
$0.150
$0.150
USB Flex, Side 1
1
3
1
Connector: Micro USB

Connector: Spring - Formed, Main Antenna
Connector: Antenna Coax, Main
5
1
2
8.60
3.30
1.80
6.10
1.25
1.80
$0.100
$0.030
$0.040
$0.100
$0.090
$0.040
USB Flex, Side 2
28
6.30
1.50
$0.160
$0.160
32
TOTALS
Substrates
Product Overview
Block Diagram
Subsystem ICs
Product Packaging
$2.60
264
Integrated Circuits

Front Page
Form
Exterior Features
Modules

Major Components
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

385.38
21.8
299.1
109.2
92.3
74.0
Assembly Weight
(grams)
32
30.0
86.4
37.1
13.5
Avg. Pin Count
66.7
Routing Density
(cm of routing per sq.cm of
substrate)
4.0
271.0
4.4
59.2
338.6
3.6
25.6
6.3
7.2
4.0
46.8
Connection Density
(Connections/sq.cm)
System Totals
2
10
2
4
18
2
2
2
4
4
14
Component Density
(Components/sq.cm)
Battery Pack: Battery Flex

Display/Touchscreen: Display Flex
Display/Touchscreen: Touchscreen Flex
Rear Camera: Rear Camera Flex
Front Camera: Front Camera Flex
2.0
27.1
2.2
14.8
46.1
1.8
12.8
3.2
1.8
1.0
20.6
Number of
Connections
Button Flex
Main Board
Sensor Flex
USB Flex
Number of
Components
Main Electronics
Main Electronics
Main Electronics
Main Electronics
Main Electronics Totals
Subsystem Electronics
Subsystem Electronics Totals
Circuit Area
(sq.cm)
Assembly Name
Metal Layers
General Area
Substrate Area
(sq.cm)
Electronic Assembly Metrics by Assembly
2
827
10
36
875
12
35
7
11
9
74
20
4313
58
104
4495
34
2112
171
137
74
2528
1.0
30.5
4.6
2.4
19.0
6.6
2.7
2.2
6.1
9.0
3.6
10.0
159.2
26.4
7.0
97.5
18.7
164.7
54.3
76.1
74.0
122.8
10.0
5.2
5.8
2.9
5.1
2.8
60.3
24.4
12.5
8.2
34.2
0.10
14.20
0.20
1.60
16.10
0.30
0.50
0.10
0.10
0.10
1.10
949
7023
14.2
105.3
7.4
17.20
NOTE: Occasional inconsistencies in totals may be present due to rounding error.

Page 1
Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Page 2
Subsystem ICs
Product Packaging
Exterior Features
Page 3
Modules

Major Components
Page 4
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Main Electronics
Main Electronics
Main Electronics
Main Electronics
Button Flex
Main Board
Sensor Flex
USB Flex
Battery Pack
Display/Touchscreen
Front Camera
Rear Camera
System Totals
Card Test
Insertion
Substrates
Connector Components
Passive Components
Small Active
Components
Integrated Circuits
Assembly Name
Total
General Area
Modular & Odd Form

Components
Electronics Costs by Assembly
$
$
$
$
$
$
$
$
$
$
0.68
92.44
1.46
5.60
100.18
0.76
27.00
1.70
5.89
35.36
$
$
$
$
$
$
$
$
$
$
73.43
0.25
73.68
0.07
3.56
1.10
4.43
9.16
$
$
$
$
$
$
$
$
$
$
0.07
3.83
0.27
0.63
4.80
19.16
0.60
19.76
$
$
$
$
$
$
$
$
$
$
2.08
0.20
2.29
0.09
0.62
0.71
$
$
$
$
$
$
$
$
$
$
3.14
0.02
0.09
3.26
0.06
0.10
0.03
0.03
0.22
$
$
$
$
$
$
$
$
$
$
0.09
1.83
0.29
0.39
2.60
0.09
0.30
0.14
0.21
0.74
$
$
$
$
$
$
$
$
$
$
0.32
2.52
0.36
3.72
6.92
0.29
2.59
0.21
0.37
3.46
$
$
$
$
$
$
$
$
$
$
0.04
4.64
0.08
0.24
5.00
0.11
0.33
0.08
0.10
0.61
$
$
$
$
$
$
$
$
$
$
0.16
0.97
0.18
0.33
1.64
0.05
0.35
0.15
0.15
0.70
135.54
82.84
24.56
2.99
3.48
3.34
10.38
5.62
2.34

Page 1
Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Page 2
Subsystem ICs
Product Packaging
Exterior Features
Page 3
Modules

Major Components
Page 4
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Passive Components
Passive Component
Connections
Connectors
Connector Connections
Subsystem IOs
Opportunities
System Totals
Small Active Component

Connections
Battery Pack
Display/Touchscreen
Front Camera
Rear Camera
Small Active Components
Button Flex
Main Board
Sensor Flex
USB Flex
Modular/Odd Form
Component Connections
Main Electronics
Main Electronics
Main Electronics
Main Electronics
Modular/Odd Form
Components
Assembly Name
IC Connections
General Area
IC Package Count
Counts by Assembly
0
45
1
0
46
1
2
1
2
6
0
2508
8
0
2516
6
2080
36
83
2205
1
20
1
2
24
0
1
0
1
2
6
75
8
10
99
0
77
0
2
79
0
94
0
9
103
1
13
0
0
14
0
202
0
18
220
8
26
0
0
34
0
645
6
19
670
7
24
7
7
45
0
1346
12
38
1396
14
48
14
14
90
1
23
2
6
32
3
2
1
1
7
14
182
30
38
264
6
52
24
38
120
0
0
0
0
0
4
48
24
38
114
22
5140
68
140
5370
50
2373
107
186
2716
52
4721
26
178
117
254
715
1486
39
384
114
8086

Page 1
Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Page 2
Subsystem ICs
Product Packaging
Exterior Features
Page 3
Modules

Major Components
Page 4
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

875.6
1.2
876.8
0.7
50.8
12.4
27.1
91.0
Battery Pack
Display/Touchscreen
Front Camera
Rear Camera
System Totals
63
52
4721
967.8
0.32
0.01
Non-Volatile Memory
(KBytes)
2508
8
2516
6
2080
36
83
2205
Volatile Memory
(KBytes)
45
1
46
1
2
1
2
6
Package Connections
per sq.cm of Package Area
Main Board
Sensor Flex
Die Area/Package Area Ratio
Die Area
(sq.mm)
Main Electronics
Main Electronics
Subsystems
Subsystems
Subsystems
Subsystems
Package Area
(sq.mm)
Number of Package Connections
56
1
57
1
2
1
2
6
Assembly Name
Substrate Tiling Density

(die area / substrate area)
IC Package Count
General Area
IC Die Count
IC Metrics
878.2
9.6
887.8
2.4
61.3
17.8
37.6
119.1
1.00
0.13
0.99
0.29
0.83
0.69
0.72
0.76
285.6
83.3
283.4
2.5
33.9
2.0
2.2
1850.8
2162688
0
2162688
0
0
0
0
0
16777248
0
16777248
0
0
0
0
0
1007.0
0.96
468.8
2162688
16777248

Page 1
Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Page 2
Subsystem ICs
Product Packaging
Exterior Features
Page 3
Modules

Major Components
Page 4
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Estimated Cost
of Electronics
(Includes Subsystem Electronics)
$135.54
Passive Components
3%
Connector Components
2%
Small Active Components

2%
Insertion
4%
Substrates
8%
Modular & Odd Components

18%
Card Test
2%
Integrated Circuits
61%

Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Pkg. Brand
NVIDIA
SK Hynix
SanDisk
Spreadtrum
Broadcom
Maxim
Cost
* Includes Subsystem Vendors & Associated Costs
$27.07
$10.24
$8.73
$6.22
$4.99
$4.51
Other
Sony
Texas Instruments
Invensense
Atmel
Renesas SP Drivers
Unknown
STMicroelectronics
Cirrus Logic
RF Micro Devices
Micron
Intersil
Audience
AKM Semiconductor
ON Semiconductor
Bosch Sensortec
Ricoh
Analog Devices
Infineon
Mitsumi
Renesas
$4.33
$3.46
$2.15
$1.94
$1.62
$1.10
$0.98
$0.85
$0.84
$0.81
$0.61
$0.59
$0.52
$0.34
$0.26
$0.24
$0.13
$0.10
$0.08
$0.07
$0.06
Spreadtrum
8%
SanDisk
11%
SK Hynix
12%
Broadcom
6%
Maxim
5%
Other
25%
NVIDIA
33%

Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Subsystem
Part ID
No.
Enclosures
1
2
3
4
5
8
10
1
1
1
1
1
2
1
Miscellaneous
6
7
11
12
13
14
15
16
17
18
19
20
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
45
46
47
48
49
50
1
1
3
1
1
1
1
1
1
2
1
2
1
1
1
15
1
5
1
1
1
3
1
1
1
2
1
1
1
1
1
1
1
2
1
1
1
1
1
1
Total
Qty
Description
Dimensions (mm)
Cast + Co-Molded + Tapped + Painted + Pulls

Molded + Pulls + Printed
Molded + Pulls + Painted
Molded + Pulls + Painted
Stamped + Co-Molded
Molded + Painted
Molded
Magnesium + Plastic
Plastic
Plastic
PC
Metal + Plastic
Plastic
Rubber
144 x 70
144 x 73
70.5 x 17.5
70.7 x 50.8
27.5 x 26.8
Microphone Boot
Proximity Sensor Boot
Moisture Sensor
Display Sticky Tape
Foam under Display
Insulation Foil under Display
Earpiece Screen
Earpiece Foam Seal
Front Microphone Fabric Screen
Rubber Bumper
Processor Insulation Foil
USB Flex Conductive Fabric
USB Sticky Tape
Vibrator Foam
NFC Antenna Sticky Tape
Screws
Headset Jack Sticky Tape
Foam Bumpers on Antenna Carrier
Rear Cover Insulation Foil
Main Board Insulation Foil
Thermal Pad
Connector Foam Bumper
Conductive Fabric
Notification LEDs Window
Earpiece Seal
Conductive Fabric - Earpiece
Insulation Tape
Insulation Foil
Rear Microphone Fabric Screen
Vibrator Sticky Tape
Rear Camera Window
Main Board Label
Flash Window
Conductive Fabric
Insulation Foil
NFC Antenna Connector Sticky Tape
Insulation Foil on Main Board
Rear Microphone Fabric Screen
Speaker-Front Microphone Fabric Screen
Speaker Foam Seal
Molded
Molded
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Stamped
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Machined
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Molded
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Molded + Polished
Die-Cut + Printed
Molded
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Die-Cut
Rubber
Rubber
Paper + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Metal
Plastic + Adhesive
Plastic + Adhesive
Rubber + Adhesive
Plastic + Adhesive
Metal + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Metal
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Rubber + Adhesive
Plastic + Adhesive
Metal + Adhesive
Plastic
Rubber + Adhesive
Metal + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic
Plastic + Adhesive
Plastic
Metal + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
Plastic + Adhesive
8x
5.4 x 3.4
3.4 x 3.4
139 x 68
110 x 65
100 x 52
12 x 4
12 x 4
2.7 x 2.7
5x4
13.8 x 13.8
x
x
x
x
x
7.1
6.9
5.8
5.7
3.2
x
48 x 4 x 0.3
4x2
x 0.2
x 0.2
x 0.2
x 0.4
x 0.2
x 0.4
x 0.2
x 0.2
x 0.5
x 0.2
x
9 x 4.6 x 0.2
3.8 x 3.8 x 0.3
69 x 56 x 0.2
3x2x1
12.2 x 7.4 x 0.2
9 x 5 x 0.3
65 x 55 x 0.2
55 x 34 x 0.2
13.8 x 13.8 x 0.3
6.4 x 4 x 0.3
9.5 x 4.5 x 0.2
3.9 x 3.9 x 0.3
11.8 x 5.6 x 0.2
5.6 x 1.5 x 0.2
6.2 x 3.4 x 0.2
14.2 x 11.8 x 0.2
3.9 x 2.5 x 0.2
3.8 x 3.8 x 0.2
9 x 8.5 x 0.4
13.8 x 10.8 x 0.2
8.2 x 3.7 x 1
x
6.7 x 3.9 x 0.2
12 x 6 x 0.2
6.8 x 3.4 x 0.2
5 x 5 x 0.2
33 x 4 x 0.2
14 x 4 x 0.2
74
Integrated Circuits

Product Overview
Material
Main Chassis
Rear Cover
Speaker Housing & Main Antenna Support
WiFi/Bluetooth & GPS Antenna Support
SIM Card Tray
Key
Keys Carrier
Substrates
Front Page
Fabrication Process
Block Diagram
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
Active Discretes
Teardown
Antenna
Weight Est'd Cost

Est'd
(grams)
Each
Extended Cost
17.00
11.70
2.80
4.10
0.60
0.10
0.10
3.380
1.000
0.450
0.920
0.100
0.020
0.020
3.380
1.000
0.450
0.920
0.100
0.040
0.020
0.01
0.01
0.30
1.00
1.00
1.00
0.10
0.10
0.10
0.20
0.10
0.00
0.10
0.10
0.10
1.50
0.10
0.50
0.50
0.10
1.00
0.30
0.10
0.10
0.10
0.20
0.10
0.10
0.10
0.10
0.30
0.10
0.10
0.00
0.10
0.10
0.10
0.10
0.10
0.10
0.010
0.010
0.010
0.030
0.060
0.040
0.030
0.010
0.010
0.010
0.010
0.030
0.010
0.010
0.030
0.010
0.010
0.010
0.030
0.030
0.030
0.010
0.010
0.010
0.010
0.010
0.010
0.010
0.010
0.010
0.030
0.040
0.020
0.010
0.010
0.010
0.010
0.010
0.010
0.010
0.010
0.010
0.030
0.030
0.060
0.040
0.030
0.010
0.010
0.020
0.010
0.060
0.010
0.010
0.030
0.150
0.010
0.050
0.030
0.030
0.030
0.030
0.010
0.010
0.010
0.020
0.010
0.010
0.010
0.010
0.030
0.040
0.020
0.020
0.010
0.010
0.010
0.010
0.010
0.010
Estimated Cost
Passive Discretes
Subsystems
Main Board
Other Substrates
$6.87
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Made in
Number of parts
Est'd number of steps
Est'd time (seconds)
China
98
353
1341
$
$
Est'd final assembly cost

Est'd final test cost
Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
1.02
1.25
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

Note: An additional $2.54 estimated for accessories and

supporting materials
Estimated Cost Totals

Main Electronic Assemblies
Battery Pack
Display/Touchscreen
Rear Camera
Front Camera
100.18
6.06
55.41
12.56
4.10
6.87
2.27
$
$
$
$
$
$
$
Total
Cost Total Notes:

Estimated final assembly cost includes labor only.
Total cost does not include Non-recurring, R&D, G&A,
IP licensing fees/royalties, software, sales &
marketing, distribution.
Assumes fully scaled production.
$ 187.45
4%
Front Camera
2%

1%
Rear Camera
7%
Display/Touchscreen
30%
Main Electronic Assemblies

53%
Battery Pack
3%
Substrates
Integrated Circuits

Front Page
Product Overview
Block Diagram
Subsystem ICs
Product Packaging
Exterior Features
Modules

Major Components
Active Discretes
Teardown
Antenna
Passive Discretes
Subsystems
Main Board
Other Substrates
Connectors
Cost Summary
Costs and Metrics
Deep Dive Teardown

COST ESTIMATION PROCESS

Overview and Discussion
Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component
markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and
other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the
output of the model across product families and over time.
TechInsights philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have
developed an estimation process that, while necessarily lacking an insiders knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in
high-volume production environments. We do not claim that the model will produce the right answer for your firms environment. However, TechInsights does give customers a key analytical tool
with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own
component cost estimates where they have better information based on inside knowledge.
Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM).
Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number,
estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per
wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables
which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected
cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these
sources.
Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their
estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume
costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor
rate assumption for the country of origin, we then calculate final assembly cost.
The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics
assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product
packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate.
We believe our cost estimates generally fall within 15 percent of the right answer, which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights
cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of
approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.
Please feel free to contact us at support@techinsights.com with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.
Cost Estimation Process

Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Metrics
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics
Deep Dive Teardown

Metrics
Overview and Discussion

In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor
storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density.
Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their
definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of
complexity between dissimilar product types. Data fall into two categories; either raw measured data or ratios of these measured data sets.
Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes
packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major
cost driver for most systems we examine.
Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board projected area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This
metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been
seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging
technologies. High density circuit boards are also often a supporting technology.
Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.
Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection
observed (solder joints, adhesive interconnect, or connector terminal interfaces).
Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for
failure. A high opportunity count means more complex and riskier electronics assembly.
Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the average terminal complexity of the components
and often provide a signature of integration level and/or digital-ness of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog
circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.
Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to
the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily
achieved than comparable silicon tiling of high pincount logic.
Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling
Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can
pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of
placement, number of placements, and engineering of part clearances.
Routing Density (heuristic estimate) = 3*(Average Pin Count)*Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the
interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of
wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.
Cost Estimation Process

Front Page
Product Overview
Block Diagram
Product Packaging
Exterior Features
Major Components
Metrics
Teardown
Antenna
Subsystems
Main Board
Other Substrates
Costs and Metrics

Xiaomi Mi3: Quad-Band Gsm/Edge Td-Scdma/Td-Hsdpa/Td-Hsupa (1800-1920 / 2010-2025 MHZ) (Bands 34 & 39) Sample Report

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Xiaomi MI3

Deep Dive Teardown

Deep Dive Teardown

Integrated Circuit Metrics

Product Name & Model #

Official Release Date

Product Dimensions (mm)

144 x 73.6 x 8.1

Total Manufacturing Cost*

Android 4.2.1 "Jelly Bean" w/ MIUI User Interface

Manufacturing Cost Breakdown

Rear Camera Subsystem

Front Camera Subsystem

Final Assembly & Test

Quad-Band GSM/EDGE; TD-SCDMA/TD-HSDPA/TD-HSUPA Modules, Discretes & Connectors

Use Time: N/A

1.8 GHz Quad-Core NVIDIA Tegra 4

Internal: 16 GB; External: N/A

6-Axis MEMS Gyroscope & Accelerometer, 3-Axis

3.8 V, 3050 mAh, Li-polymer

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

TD-SCDMA 2000 MHz Rx

TD-SCDMA 1900 MHz Rx

GSM 1800/1900 MHz Rx

GSM 1800 MHz Rx

GSM 900 MHz Rx

GSM 850/900 MHz Rx

TD-SCDMA 1900/2000 MHz Rx

GSM 1800/1900 MHz Tx & TD-SCDMA 1900/2000 MHz Tx

GSM 850/900 MHz Tx

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

SIM Eject Tool

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

SIM Tray Slot

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

Costs and Metrics

Overview & Discussion

Deep Dive Teardown

Costs and Metrics

Overview & Discussion