PROCESS TENDENCY CHART

HOLEFILL DEFECT DPM

PROCESS VARIABLES
LEVEL 1 LEVEL 2
SOLDER POT TEMPERATURE 260 270
DWELL TIME 4 Sec 5 Sec
PREHEAT TEMPERATURE 130 140
FLUX TYPE KESTER 979 ALPHA NR330
PALLET TYPE UNSHIELDED SHIELDED
BOARD SURFACE FINISH IMAG OSP

SECONDARY FACTORS
PREHEAT SOAK TIME LOW HIGH
HOLE CONNECTION TYPE TR PLANE CONN
NITROGEN ON OFF
TURBULENT WAVE ON OFF
CHIP WAVE ON OR OFF ON OFF
BACKPLATE HEIGHT LOW HIGH
MAIN WAVE PUMP SPEED LOW HIGH
Y CHART
PREFERRED PROCESS
WINDOW
THICKNESS OF COPPER
DISSOLVED

LEVEL 1 LEVEL 2
260 270 265±5°C
4 Sec 5 Sec 4.5±0.5 Sec
130 140 135±5°C
KESTER 979 ALPHA NR330 ALPHA NR330
UNSHIELDED SHIELDED UNSHIELDED
IMAG OSP APPLICATION DEPENDENT

DARY FACTORS
LOW HIGH MEDIUM
TR PLANE CONN DESIGN DEPENDENT
ON OFF ON
ON OFF ON
ON OFF OFF
LOW HIGH HIGH
LOW HIGH MEDIUM
 PROCESS DEPENDENCY CHAR FOR OSP FINISH BOARDS

THICKNESS OF COPPE
HOLEFILL DEFECT DPM
PROCESS VARIABLES DISSOLVED
LEVEL 1 LEVEL 2 LEVEL 1
SOLDER POT TEMPERATURE 260 270 260
DWELL TIME 4 Sec 5 Sec 4 Sec
TOPSIDE BOARD TEMPERATURE 130 140 130
FLUX TYPE KESTER 979 ALPHA NR330 KESTER 979
PALLET TYPE Unshielded Shielded Unshielded
 PREFERRED
NISH BOARDS PROCESS
WINDOW

HICKNESS OF COPPER
DISSOLVED
LEVEL 2
270 265±5
5 Sec 4.5±0.5 Sec
140 135±5°C
ALPHA NR330 ALPHA NR330
Shielded UNSHIELDED
 PROCESS TENDENCY CHART
PREFERRED
HOLEFILL DEFECT THICKNESS OF
DPM COPPER DISSOLVED PROCESS WINDOW
PROCESS VARIABLES LEVEL 1 LEVEL 2
LEVEL 1 LEVEL 2 LEVEL 1 LEVEL 2

SOLDER POT TEMPERATURE 260 270 265±5°C

DWELL TIME 4 Sec 5 Sec 4.5±0.5 Sec

PREHEAT TEMPERATURE 130 140 135±5°C

FLUX TYPE KESTER 979 ALPHA NR330 ALPHA NR330

PALLET TYPE UNSHIELDED SHIELDED UNSHIELDED

BOARD SURFACE FINISH IMAG OSP APPLICATION DEPENDENT

SECONDARY FACTORS
PREHEAT SOAK TIME LOW HIGH MEDIUM

HOLE CONNECTION TYPE TR PLANE CONN DESIGN DEPENDENT

NITROGEN ON OFF ON

TURBULENT WAVE ON OFF ON

CHIP WAVE ON OR OFF ON OFF OFF

BACKPLATE HEIGHT LOW HIGH HIGH

MAIN WAVE PUMP SPEED LOW HIGH MEDIUM