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An Introduction To Micro Electro Mechanical Systems (Mems)
An Introduction To Micro Electro Mechanical Systems (Mems)
ABSTRACT
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3.1.Materials
The variety of material s used in MEMS is
very broad. These rnaterials are used as substrate
material , where Silicon is by far the most
cornmon1y used. Exploration and deveIoprnent
of new techniques drive the research in the use
of new compounds, and thin films of silicon
nitrides, oxides, glass, organic polyrners and
sorne shape-rnemory alloys.
The control of the rnechanical properties
and its extensive use , rnake silicon and
polysilicon the rnaterials of preference in industry
(Petersen 1982). Figure 2 shows sorne silicon
ingots and the crystal structure of thi s element.
analyaia ayatem
3.2.Processes
Micrornachining processes are divided into
basic tools (well-established rnethods available
Property
Density (g/cm3)
Specific Heat (J/g* K)
Hole mobility (c m 2N *s)
Electron mobility
Relative permittivity (Eo)
Dielectric strength
(V/c mx10 6)
Melting temperature C
14
Si
2.4
0.7
400
1500
11.8
Si02
2.3
1.0
Si 3N 4
3.1
0.7
Quartz
2.65
0.787
3.8
3-5
1415
1700
AlN
3.26
0.71
3.75
SiC
3.2
0.8
40
1000
9.7
5-10
25-40
13
1800
1610
2830
2470
8.5
Patlerrri ng
OpIiealllthog:ral'hy
DoubJ."'de4 lithograplty
Substrate
Deposllion
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CVDILPCVDIPE:CVD
S>iI>-on _Ihod
: ~~~ bondinq
Sllicon fwlion bondinq
Et(:hing
Wot iaotrop1C:
Wot aniaouopie
Pluma
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ArNillCed Sensorl
SirrrJe Ac/ualo!s
Silr:je SelllOls
ArNanced Ac/uaas
SirrrJe SyIlOOlS
Boili1g
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2002).
IEEE DE B ARCELONA
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E=Eedriefield
"o = dieledrie pennittivity
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a=crefficientofe.>qlllNion
~T=~rire
Mlgnetie
wi'/l,
Piez<rledrie
1hY(tJ#f'
Shape-rmml)l alloys
y = Yoong'srmdu!us
B=mgretiefield
l'<l = rmgnetie JEnreability
E = Eedrie field
y = Y~'s mxiJlus
dn = piezoeledrie oorntari
OiticallenJlerlllUre
S.APPLICATIONS
Capacitive
Simple mechanical structure
Low Cost
Voltage drive
Requires circuitry
Low temperature dependence
Large dynamic range
Low power consumption
Electromagnetic
Structural complexity varies
Complex Packaging
Current drive
Simple control circuits
Low temperature dependence
Sensitivity a magnetic fields
Medium power consumption
16
Reslstlve element
(TeR - -o 2' , per el
Address
coJumn
-+--l-+--+- ~dreSS
Substrate
T1un reflecnng
metal layer
17
GLOSSARY
Chemical Vapor Deposition (CVD): A
process, based on the principIe of initiating a
chernical reaction in a vacuum chamber, resulting
in the deposition of a reacted species on a heated
substrate.
18
REFERENCES
[l]Banks, Da v id (1999 ).
"lntrod uction to
Microengineering." MEMS Micromachines and MST.
<http ://www.dbanks. demon.co .uk/ueng/> ( ov 3,
2003)
[2] Bustill o, James M ., Howe, Roger T. Muler, Richard
S . (1998 ). "Surface Mi c roma c hinin g fo r
Microelectromecanical Systems" . Proceedjngs IEEE
86, 8, 1552-1574.
[3] Cole, B. E., R. E. Higashi , and R. A. Wood . (1998).
"Mon o lithic
two -dimentional
Array s
of
Mi c romachined Mi c ros tru c ture s for In frared
App licati ons". Proceedi ngs mEE 86, 8, 1679- 1686.
[4] Co lo rado Univer iry (2003). Colorado University
MEMS web page. <http://mems.colorado.edu/> ( ov
3,2003)
[5] Hsu, Tai -Rai (2002). MEMS & Micosystem s. Design
and Manufacture. Mac Graw Hill Higher Education .
Boca Raton, FL.
[6]Maluf,
adim (2000 ). An Introduction to
Micromechanjcal System Engineering. MEMS Series,
Artech House. Norwood , MA.
[7]MEMS exc ha nge ( 2003 ).
About MEMS
technology .http ://www .mems-exchange.org/MEMS/
(Nov 3, 2003)
[8] Nayoga, J apan ( 1997). 10th International Workshop
0 11 MEMS. http ://www.cs.ari zona.ed u/japan/www/
atip/public/atip.reports.97 /atip97 .039r.htmJ (Nov 3,
2003 )
[9] Petersen, Kurt E. (1982). "S ilicon as a Mechanica l
material ". Proceedings IEEE 70, 5, 420-457.
[lO]Texas In strument (2001). White papers on DLM and
MEMS. http://www .dlp.com (Nov 3, 2003)
AUTORES
Studenl member of Ihe IEEE since 1998, Juan Pablo Saen z
joined lhe Cryogenic Eleclronics Group at San Francisco State
University infall2002, where he pursued a MS in Engineering.
As Graduate Research Assistanl he worked on microfabrication
processes set up, superconductor
- - - - - - , materials characterization and
device Layo ut , for MEMS
integ rati on wi th Cryoge ni c
devices.
His MS lhesis "SlUdy ofprocesses
and materials fo r MEMS
int eg rati o n with c ryogenic
devices," recently won the 18th
--- - Annual research competition in
Engineering and Computer Science al SFSU. Before joined th e
CEe Juan Pablo was par! ofth e Control and inlelligenr Systel11
Research group at the Universidad Nacional de Colombia.
where he got his BS in Eleclrical Engineering.
He is aUlhor with Camilo A . Cortes of the thesis "Design and
construction of a walking robot using nitinol wire and the
calculator HP 48GX as artificial inrelligence plaiform."