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Data Sheet: BC556 BC557
Data Sheet: BC556 BC557
DATA SHEET
dbook, halfpage
M3D186
BC556; BC557
PNP general purpose transistors
Product data sheet
Supersedes data of 1999 Apr 15
2004 Oct 11
NXP Semiconductors
BC556; BC557
FEATURES
PINNING
PIN
DESCRIPTION
emitter
base
collector
handbook, halfpage1
2
3
2
1
MAM281
Fig.1
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
BC556
SC-43A
DESCRIPTION
VERSION
SOT54
BC557
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VCBO
VCEO
PARAMETER
collector-base voltage
CONDITIONS
MIN.
MAX.
UNIT
open emitter
BC556
80
BC557
50
BC556
65
BC557
45
collector-emitter voltage
open base
VEBO
emitter-base voltage
IC
100
mA
ICM
200
mA
IBM
200
mA
Ptot
500
mW
Tstg
storage temperature
65
+150
Tj
junction temperature
150
Tamb
ambient temperature
65
+150
2004 Oct 11
open collector
Tamb 25 C
NXP Semiconductors
BC556; BC557
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
note 1
VALUE
UNIT
250
K/W
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tamb = 25 C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
collector-base cut-off current
CONDITIONS
MIN.
TYP.
MAX. UNIT
VCB = 30 V; IE = 0 A
15
nA
VCB = 30 V; IE = 0 A; Tj = 150 C
A
nA
IEBO
VEB = 5 V; IC = 0 V
100
hFE
DC current gain
IC = 2 mA; VCE = 5 V;
see Figs 2, 3 and 4
125
475
BC557
125
800
BC556A
125
250
BC556B; BC557B
220
475
BC557C
420
800
BC556
VCEsat
VBEsat
VBE
collector-emitter saturation
voltage
IC = 10 mA; IB = 0.5 mA
60
300
mV
IC = 100 mA; IB = 5 mA
180
650
mV
750
mV
930
mV
600
650
750
mV
820
mV
base-emitter voltage
Cc
collector capacitance
VCB = 10 V; IE = ie = 0 A; f = 1 MHz
pF
Ce
emitter capacitance
10
pF
fT
transition frequency
MHz
noise figure
VCE = 5 V; IC = 200 A; RS = 2 k;
f = 1 kHz; B = 200 Hz
10
dB
Notes
1. VBEsat decreases by about 1.7 mV/K with increasing temperature.
2. VBE decreases by about 2 mV/K with increasing temperature.
2004 Oct 11
NXP Semiconductors
BC556; BC557
MBH726
300
hFE
200
VCE = 5 V
100
0
101
10
102
IC (mA)
103
BC556A.
MBH727
400
hFE
VCE = 5 V
300
200
100
0
102
101
10
BC556B; BC557B.
2004 Oct 11
102
IC (mA)
103
NXP Semiconductors
BC556; BC557
MBH728
600
hFE
500
VCE = 5 V
400
300
200
100
0
102
101
10
BC557C.
2004 Oct 11
102
IC (mA)
103
NXP Semiconductors
BC556; BC557
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
E
d
L
b
1
e1
3
b1
L1
2.5
5 mm
scale
b1
mm
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
e
2.54
e1
L1(1)
1.27
14.5
12.7
2.5
max.
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
SOT54
2004 Oct 11
REFERENCES
IEC
JEDEC
JEITA
TO-92
SC-43A
EUROPEAN
PROJECTION
ISSUE DATE
04-06-28
04-11-16
NXP Semiconductors
BC556; BC557
PRODUCT
STATUS(2)
DEFINITION
Development
This document contains data from the objective specification for product
development.
Qualification
Production
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
DISCLAIMERS
General Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
2004 Oct 11
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
R75/04/pp8