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DATA SHEET
book, halfpage
M3D186
BC556; BC557
PNP general purpose transistors
Product specification
Supersedes data of 1997 Mar 27
1999 Apr 15
Philips Semiconductors
Product specification
BC556; BC557
FEATURES
PINNING
PIN
DESCRIPTION
emitter
base
collector
handbook, halfpage1
2
3
2
1
MAM281
Fig.1
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCBO
VCEO
PARAMETER
collector-base voltage
CONDITIONS
MIN.
MAX.
UNIT
open emitter
BC556
80
BC557
50
BC556
65
BC557
45
collector-emitter voltage
open base
VEBO
emitter-base voltage
IC
100
mA
ICM
200
mA
IBM
200
mA
open collector
Ptot
500
mW
Tstg
storage temperature
65
+150
Tj
junction temperature
150
Tamb
65
+150
1999 Apr 15
Tamb 25 C
Philips Semiconductors
Product specification
BC556; BC557
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
CONDITIONS
note 1
VALUE
UNIT
250
K/W
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
ICBO
IE = 0; VCB = 30 V
15
nA
IE = 0; VCB = 30 V; Tj = 150 C
IEBO
IC = 0; VEB = 5 V
100
nA
hFE
DC current gain
IC = 2 mA; VCE = 5 V;
see Figs 2, 3 and 4
125
475
BC557
125
800
BC556A
125
250
BC556B; BC557B
220
475
BC556
420
800
IC = 10 mA; IB = 0.5 mA
60
300
mV
IC = 100 mA; IB = 5 mA
180
650
mV
BC557C
VCEsat
VBEsat
collector-emitter saturation
voltage
base-emitter saturation voltage
750
mV
930
mV
600
650
750
mV
VBE
base-emitter voltage
820
mV
Cc
collector capacitance
IE = ie = 0; VCB = 10 V; f = 1 MHz
pF
Ce
emitter capacitance
10
pF
fT
transition frequency
MHz
noise figure
IC = 200 A; VCE = 5 V; RS = 2 k;
f = 1 kHz; B = 200 Hz
10
dB
Notes
1. VBEsat decreases by about 1.7 mV/K with increasing temperature.
2. VBE decreases by about 2 mV/K with increasing temperature.
1999 Apr 15
Philips Semiconductors
Product specification
BC556; BC557
MBH726
300
hFE
200
VCE = 5 V
100
0
101
102
10
IC (mA)
103
BC556A.
MBH727
400
hFE
VCE = 5 V
300
200
100
0
102
101
10
BC556B; BC557B.
1999 Apr 15
102
IC (mA)
103
Philips Semiconductors
Product specification
BC556; BC557
MBH728
600
hFE
500
VCE = 5 V
400
300
200
100
0
102
101
10
BC557C.
1999 Apr 15
102
IC (mA)
103
Philips Semiconductors
Product specification
BC556; BC557
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
E
d
L
b
1
e1
3
b1
L1
2.5
5 mm
scale
b1
e1
L1(1)
mm
5.2
5.0
0.48
0.40
0.66
0.56
0.45
0.40
4.8
4.4
1.7
1.4
4.2
3.6
2.54
1.27
14.5
12.7
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
SOT54
1999 Apr 15
REFERENCES
IEC
JEDEC
EIAJ
TO-92
SC-43
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Philips Semiconductors
Product specification
BC556; BC557
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Apr 15
Internet: http://www.semiconductors.philips.com
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
115002/00/03/pp8