Zte ZXMP s385 Product Description

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ZXMP S385 V2.50

Product Description
ZXMP S385 V2.50 Product Description

Version
Date
Author
Approved By
Remarks
R0
2009-09-20
ZhangQiSheng
WangQiang,QinYong
Not open to the Third Party
R1
2010-05-20
LiXiongFei
WangQiang,QinYong
Not open to the Third Party
2011 ZTE Corporation. All rights reserved.

ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be
disclosed or used without the prior written permission of ZTE.
Due to update and improvement of ZTE products and technologies, information in this document
is subjected to change without notice.
ZTE Confidential Proprietary
TABLE OF CONTENTS
1
Overview ................................................................................................................... 1
2
2.1
2.2
2.3
2.4
2.5
2.6
Features .................................................................................................................... 2
Flexible networking & dispatching function raises profit-making ability and reduces
CAPEX ...................................................................................................................... 2
Superior scalability protects CAPEX and reduces OPEX .......................................... 2
Leading RPR function supports IP evolution and protects CAPEX ............................ 2
Powerful embedded WDM function saves fiber resource .......................................... 2
Flexible design facilitates network planning & optimization........................................ 2
Wide application, mature technology and high reliability............................................ 2
3
3.1
3.2
3.2.1
3.2.2
3.2.3
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
Functions.................................................................................................................. 4
Cross-connection and extension capabilities ............................................................. 4
Powerful Service Access Ability................................................................................. 4
Optical Interfaces ...................................................................................................... 4
Electrical Interfaces ................................................................................................... 5
Data Interfaces .......................................................................................................... 5
Integrated WDM Function .......................................................................................... 6
Complete Equipment Protection Ability...................................................................... 6
Perfect Network Protection Ability ............................................................................. 7
Reliable Timing Synchronization Processing ............................................................. 7
System control and communication ........................................................................... 8
Overhead Processing ................................................................................................ 8
Easy For Maintenance And Upgrade ....................................................................... 10
Alarm input/output ................................................................................................... 10
System power supply .............................................................................................. 10
Perfect EMC and Operation Safety ......................................................................... 11
4
4.1
4.1.1
4.1.2
4.2
4.3
System Architecture .............................................................................................. 12

Product Physical Structure ...................................................................................... 12
System architecture ................................................................................................. 12
System mapping structure ....................................................................................... 13
Hardware Architecture ............................................................................................. 14
Software Architecture .............................................................................................. 15
5
5.1
5.1.1
5.1.2
5.1.3
5.2
5.3
5.4
5.5
5.6
5.7
5.7.1
5.7.2
5.7.3
5.7.4
5.7.5
5.8
Technical Specifications ....................................................................................... 17

Physical Indices ....................................................................................................... 17
Subrack and cabinet appearance ............................................................................ 17
Subrack backplane .................................................................................................. 18
Fan plug-in box ........................................................................................................ 18
Appearance and dimensions ................................................................................... 19
System subrack and slot diagram ............................................................................ 21
System board list and description ............................................................................ 22
STM-N optical interfaces performance .................................................................... 26
PDH interfaces performance and indexes ............................................................... 27
Performance of data boards .................................................................................... 29
Performance of SEE ................................................................................................ 29
Performance of TGE2B ........................................................................................... 29
Performance of RSEB ............................................................................................. 31
Performance of AP18 ............................................................................................ 32
Performance of TGSA8 ......................................................................................... 33
Physical Performance of Ethernet ........................................................................... 33
II
5.8.1
5.8.2
5.9
5.10
5.11
5.12
5.13
5.14
5.14.1
5.14.2
5.14.3
5.14.4
5.14.5
5.14.6
5.15
Ethernet interface types and followed standard ....................................................... 33

GE interface types and followed standard ............................................................... 36
Performance of OAD ............................................................................................... 38
Performance of OBA ............................................................................................... 39
Performance of OPA ............................................................................................... 40
Performance of DCM ............................................................................................... 41
Error Performance ................................................................................................... 42
Jitter index at interfaces ........................................................................................... 42
Jitter and wander tolerance of PDH input interface.................................................. 42
Jitter and wander tolerance of SDH input interface.................................................. 44
Inherent output jitter of STM-N interface .................................................................. 46
Mapping jitter of PDH tributary................................................................................. 47
Combined Jitter ....................................................................................................... 47
Jitter transfer function of the regeneration relay....................................................... 48
Clock timing and synchronous characteristics ......................................................... 48
6
6.1
6.2
6.3
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.4
Environment Adaptability...................................................................................... 51
Power supply requirements ..................................................................................... 51
Grounding requirements .......................................................................................... 51
Environment requirements ...................................................................................... 52
Operation Environment ............................................................................................ 52
Environment for Storage .......................................................................................... 53
Cleanness requirements .......................................................................................... 54
Bearing Requirements of the Equipment Room....................................................... 54
Electronic Static Discharge (ESD) ........................................................................... 55
Safety requirements ................................................................................................ 57
Glossary ................................................................................................................. 60
III
FIGURES
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
ZXMP S385 functional block diagram ........................................................................ 12

Appearance of S385 Sub-rack................................................................................... 13
Multiplexing/mapping structure adopted by ZXMP S385 ........................................... 13
Functional relationships of the hardware platforms .................................................... 14
Hierarchical structure diagram of NM software .......................................................... 16
Subrack structure diagram......................................................................................... 17
Structure of fan box ................................................................................................... 18
Fan box structure....................................................................................................... 19
Board slot layout of sub-rack ..................................................................................... 22
The jitter and wander tolerance at E1 PDH input interface ........................................ 43
The jitter and wander tolerance at T1 PDH input interface ........................................ 43
The jitter tolerance of STM-N terminal multiplexer input interface.............................. 45
The input jitter tolerance of STM-N SDH regenerator ................................................ 46
The jitter transfer characteristics of a regeneration relay ........................................... 48
TABLES
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Table 9
Table 10
Table 11
Table 12
Table 13
Table 14
Table 15
Table 16
Table 17
Table 18
Table 19
Table 20
Table 21
Table 22
Table 23
Table 24
IV
Optical Interfaces Provided by ZXMP S385 ................................................................. 5

Electrical Interfaces Provided by ZXMP S385 ............................................................. 5
Ethernet services Provided by ZXMP S385 ................................................................. 6
Equipment level protection provided by ZXMP S385 ................................................... 7
Overhead-Byte Usage List........................................................................................... 9
Dimensions and weights of structural parts ............................................................... 19
ZXMP S385 own configuration .................................................................................. 20
ZXMP S385 is configured with other products ........................................................... 20
Boards/unit list (with power consumption) ................................................................. 22
Performance of the STM-1 optical interface............................................................... 26
Performance of the STM-4 optical interface............................................................... 26
Performance of the STM-16 optical interface............................................................. 26
Performance of the STM-64/OTU2 optical interface of ZXMP S385 .......................... 27
Performance of the PDH electrical interface .............................................................. 27
Input port permitted attenuation, frequency deviation and output port signal bit rate
tolerance.................................................................................................................... 28
Requirements for the input/output port reflection attenuation .................................... 28
Performance of TGE2B of ZXMP S385 ..................................................................... 30
Ethernet interface index ............................................................................................. 33
Transmission index of FE MMF optical interface ....................................................... 34
Receiver index of FE MMF optical interface .............................................................. 34
index of FE short distance SMF optical interface ....................................................... 35
receiver index of FE short distance optical interface .................................................. 35
Transmission index of FE long distance SMF optical interface .................................. 35
Receiver index of FE long distance optical interface ................................................. 36
Table 25
Table 26
Table 27
Table 28
Table 29
Table 30
Table 31
Table 32
Table 33
Table 34
Table 35
Table 36
Table 37
Table 38
Table 39
Table 40
Table 41
Table 42
Table 43
Table 44
Table 45
Table 46
Table 47
Table 48
Table 49
Table 50
Table 51
Table 52
Table 53
Table 54
Table 55
Table 56
Table 57
Table 58
Table 59
Table 60
Table 61
Table 62
Table 63
Table 64
Table 65
Table 66
Table 67
GE interface index ..................................................................................................... 36

Transmission index of GE MMF optical interface ....................................................... 36
Receiver index of GE MMF optical interface .............................................................. 37
Transmission index of GE short distance SMF optical interface ................................ 37
Receiver index of GE short distance optical interface ................................................ 37
Transmission index of FE long distance SMF optical interface .................................. 38
Receiver index of GE long distance optical interface ................................................. 38
Performance of OADD ............................................................................................... 39
Performance of OADC ............................................................................................... 39
Performance of OBA Module ..................................................................................... 40
Performance of OPA Module ..................................................................................... 40
Performance of the DCM ........................................................................................... 41
SDH system error performance ................................................................................. 42
The input jitter and wander tolerance of PDH interface.............................................. 43
The output jitter and wander tolerance of the PDH interface ..................................... 44
Input jitter and wander tolerance (UIP-P) of SDH ...................................................... 45
Input jitter and wander tolerance of the SDH ............................................................. 45
Input jitter tolerances of STM-N regenerators ............................................................ 46
STM-N interface inherent output jitter indexes of SDH .............................................. 46
STM-N network interface output jitter indexes of SDH ............................................... 47
Mapping jitter specifications....................................................................................... 47
Combined jitter .......................................................................................................... 47
Jitter transmission parameters of a regeneration relay .............................................. 48
The SEC Index list ..................................................................................................... 49
The wander limit value under constant temperature (MTIE) ...................................... 49
The wander limit value under temperature impact (MTIE) ......................................... 49
The wander limit value under constant temperature (TDEV) ..................................... 49
Climate requirement .................................................................................................. 52
Density requirements for chemical active substances ............................................... 52
Density requirements for mechanical active substances ........................................... 53
Requirements for mechanical stress.......................................................................... 53
Climate requirement .................................................................................................. 53
Requirements for mechanical stress.......................................................................... 54
Static discharge anti-interference .............................................................................. 55
RF electromagnetic radiated susceptibility ................................................................ 55
Electrical fast transient burst susceptibility at the DC power port ............................... 56
Electrical fast transient burst susceptibilities at the signal cable and control cable
ports .......................................................................................................................... 56
Surge susceptibility of DC power ............................................................................... 56
Surge susceptibility of the outdoor signal cable ......................................................... 56
Surge susceptibility of the indoor signal cable ........................................................... 56
Conductivity susceptibility of RF field......................................................................... 57
Conductive emission electromagnetic interference at the direct current port ............. 57
Radioactive emission electromagnetic interference ................................................... 57
Overview
ZXMP S385 is an optical transmission platform newly released by ZTE. ZXMP S385
targets the backbone or large capacity convergent layer of network which can satisfy
present and future network requirements. It is an ideal transmission system in
constructing broadband transmission networks.
ZXMP S385 provides rich service access functions and complete protection mechanism,
facilitating its wide applications.
ZXMP S385 adopts modular design, incorporating SDH, Ethernet, ATM, PDH and other
technologies. It can transmit voice and data services efficiently on the same platform.
This document is based on ZXMP S385 V2.50.
Features
2.1
Flexible networking & dispatching function raises

profit-making ability and reduces CAPEX
It has high-integration service interface boards to access a lot of PDH, SDH and data
services.
2.2
Superior scalability protects CAPEX and reduces

OPEX
ZXMP S385 can be constantly evolved and upgraded. The user will just add or replace
boards to expand the network capacity, which will reduce CAPEX of the expansion
project.It adapts itself to the characteristics of metro services to maximize the equipment
investment return of clients.
2.3
Leading RPR function supports IP evolution and

protects CAPEX
It has powerful data service processing function. It supports two rings working at the
same time, unicast/multicast/broadcat services and bandwidth statistical multiplexing. It
features high bandwidth utilization rate, fast service provision, service priority access
control and fair mechanism and high QOS. It supports the RPR multi-ring spanning in
the networking and avoids service termination & conversion to reduce faulty points.
2.4
Powerful embedded WDM function saves fiber

resource
It can add/drop wavelength-level optical signals.
2.5
Flexible design facilitates network planning &

optimization
The boards can be inserted into any slot and flexible design facilitates service
configuration, maintenance and network planning & optimization.
2.6
Wide application, mature technology and high

reliability
Due to mature technology and superior performance, ZXMP S385 is widely deployed in
major carriers and private networks as well as other countries and regions, e.g., Korea,
Pakistan, Morocco and Vietnam.
Functions
3.1
Cross-connection and extension capabilities

Cross Clock board (CSF/CSE/CSA) of ZXMP S385 provides the cross-connect function
and fulfill the straight-through, broadcast, add/drop, and cross-connection of services.
CSF board implements high-order and low-order cross-switching functions. CSF has a
space-division switching capacity of 1536 1536 VC4. In which, 256256 VC4s are
assigned to the time-division cross-connect service unit, the others are allocated to the
space-division cross-connect unit of the system.
CSE board implements high-order and low-order cross-switching functions. CSE has a
space-division switching capacity of 1152 1152 VC4. In which, 256256 VC4s are
assigned to the time-division cross-connect service unit, the others are allocated to the
space-division cross-connect unit of the system.
CSA board implements high-order and low-order cross-switching functions. CSA has a
space-division switching capacity of 256 256 VC4. In which, 3232 VC4s are assigned
to the time-division cross-connect service unit, the others are allocated to the spacedivision cross-connect unit of the system.
The equipment can supports maximum 14 service slots and access a large amount of
PDH, SDH and data services.
It can process 176-path ECC, and support the network topologies as linear, ring, hinge,
ring with chain, tangent ring and cross ring of STM-N levels meeting the complex
networking requirements thoroughly.
3.2
Powerful Service Access Ability

ZXMP S385 adopts modular structure, with its hardware including cross-connect card,
clock card, control card, service card and service interface card. The service access
capacity is shown in following table.
A single sub-rack of ZXMP S385 has 14 slots for service boards and 10 slots for
interface boards. The equipment can access a large amount of PDH, SDH and data
services at one time.
3.2.1
Optical Interfaces
ZXMP S385 provides five types of optical interfaces: OTU2, STM-64, STM-16, STM-4
and STM-1, as shown in Table 1 .
Table 1
Optical Interfaces Provided by ZXMP S385
Board Type
Rate (Mbit/s)
Board Integration
(channel/board)
Maximum Access Quantity
OTU2
10709.225
14
STM-64
9953.280
1/2
14/28
STM-16
2488.320
4/8
56/72
STM-4
622.080
1/2/4
56
STM-1
155.520
2/4/8/16
208
ZXMP S385 has the one-interface OTU2 optical line board to support AFEC or G.709
standard FEC function. By increasing the line rate, the board can correct the bit errors in
the line transmission. It may increase the receiving sensitivity by about 2dB or the OSNR
tolerance by 5-7dB, and work with OBA+OPA and Dispersion Compensation Module
(DCM) to implement the LH transmission without electrical regeneration.
ZXMP S385 also provides OTU2/STM-64/STM-16 colored interfaces comply with ITU-T
G.692 and ITU-T G.695, which can be connected to DWDM/CWDM directly without the
OTU board.
ZXMP S385 provides OTU2/STM-64/STM-16 DWDM wavelength interface with ITU-T
standard 50GHz grid in C-band.
3.2.2
Electrical Interfaces
ZXMP S385 provides STM-1 electrical interface and PDH electrical interfaces, as listed
in Table 2
Table 2
3.2.3
Electrical Interfaces Provided by ZXMP S385
Board Type
Rate (Mbit/s)
Board Integration
(channel/board)
Maximum Access Quantity
STM-1
155.520
4/8/16
208
E3
34.368
96
T3
44.736
96
E1
2.048
63
1260
T1
1.544
63
1260
Data Interfaces
There are several data boards in ZXMP S385 V2.50:SEE,TGE2B, RSEB, AP18 and
TGSA8, as shown in Table 3 .
SEE board provide 810M/100M+2GE Ethernet services which support L2 switching
function and EPS protection function.
TGE2B board provides 2GE adaptive Ethernet services.
RSEB board provides 810M/100M+2GE interfaces which employs the bandwidth of

SDH/MSTP ring network to provide the dual-ring topology and implement the ring
interconnection of RPR nodes.
FE Ethernet interfaces of each Ethernet board above can be optical or electrical. It
provides FE optical interface via ESFE8 and optical interface via OIS18 respectively.
10M/100M optical or electrical interfaces are available via replacing interface board.
AP18 board is mainly used to converge or aggregate ATM service to SDH transmission
network. It provides 8155 Mbit/s optical interfaces at the ATM side and 1622 Mbit/s
non-concatenation data flow at the system side.
TGSA8 board supports 8 user interfaces which adopt SFP optical module. The first 4
user interfaces may respectively offer GE or SAN service. SAN service includes 1G
Fiber Channel and 1G FICON services. The other 4 user interfaces may offer 4GE
services.
Table 3
3.3
Ethernet services Provided by ZXMP S385
Board Name Interface Type
Board
Integration
(channel/board)
Maximum Access
Capacity
SEE
810M/100 M +2GE
8+2
128+32
TGE2B
2GE
56
RSEB
810M/100 M +2GE
8+2
128+32
AP18
8155 Mbit/s
112
TGSA8
(4SAN+4GE) or 8GE
(4+4) or 8
(56+56) or 112
Integrated WDM Function

ZXMP S385 has OAD (Optical Add/Drop) board to add/drop or multiplex/demultiplex 4
fixed-wavelengths of optical signals.
OAD board consists of two types in all: OADD is for DWDM signals and OADC is for
CWDM signals.
ZXMP S385 optical line board has DWDM or CWDM optical interfaces, and OAD board
can add/drop DWDM or CWDM optical signals. Both of them work together to actualize
OAD interface function.
ZXMP S385 single sub-rack supports at most 56 channels of DWDM OAD interfaces or
56 channels of CWDM OAD interfaces. ZXMP S385 V2.50 extension sub-rack can
support at most 56 channels of DWDM OADM interfaces or 56 channels of CWDM
OADM interfaces.
3.4
Complete Equipment Protection Ability

Table 4 shows the equipment level protection of ZXMP S385.
Table 4
Equipment level protection provided by ZXMP S385
Items protected
Protection scheme
E1/T1 processing board
1:N (N9) tributary protection switching (TPS)
E3/T3 processing board
1:N (N4) TPS
STM-1 processing board(except

OEL116 board)
1:N (N4) TPS
FE board
1:N (N4) TPS
CSF/CSE/CSA(Cross-switch
and Synchronous-clock board)
1+1 hot backup
NCP/ENCP board
1+1 hot backup
48 V power interface board
1+1 hot backup
ZXMP S385 supports the co-existence of several different TPS protection.

ZXMP S385 adopts a dual-bus hierarchical design for service bus, overhead bus and
clock bus, which improves system reliability and stability.
3.5
Perfect Network Protection Ability

In terms of the network level protection, ZXMP S385 supports multiplex section
protection (MSP) ring, linear MSP, unidirectional path switched ring (UPSR), subnet
connection protection (SNCP) and logical subnet protection (LSNP), etc.
ZXMP S385 can implement all networking features recommended by ITU-T. It supports
the route reconstruction of Ethernet and IP, and meets IEEE802.3E.
3.6
Reliable Timing Synchronization Processing

The clock timing/synchronization unit is composed of Cross Clock board (CSF/CSE/CSA)
and SCI board. The unit completes system timing and network synchronization. It
implements the following functions:
Providing system clock signals and system frame header signals for all the units of
the SDH equipment.
Providing overhead bus clock and frame header
Providing the corresponding interface for upper-level controller to configure and

monitor the clock unit.
SCI board of ZXMP S385 provides four external reference clock output and four external
reference clock input. The interface type is 2Mbit/s or 2MHz.
SCI can be configured with four external 2.048M clock input references and 28 lines (or
tributary) 8K timing input references. Synchronization can select external clocks, line
clocks or E1/T1 tributary clocks.
The protection switching of clock reference sources bases on the alarm information and
clock synchronization status message (SSM) algorithm-based automatic switching.
ZXMP S385 provides E1 tributary re-timing function. It supports synchronous priority
switching based on the SSM algorithm, optimizes synchronous timing distribution of the
network, prevents the occurrence of timing loops and keeps network synchronization the
optimal status.
A software-controlled or a hardware phase lock circuit is used to implement four working
modes: a. Fast pull-in; b. Locked; c. Holdover; d. Free run.
3.7
System control and communication

The Net Control Processor (NCP) and Enhanced Net Control Processor (ENCP)
implement the system control and communication function, which includes sending the
configuration commands to all MCUs via S interface and collecting their performance
and alarm information.
With ENCP, the extension subrack can be accessed.
NM information intercommunicates between NEs via the ECC channel.
The order-wire board (OW) performs the order-wire function. It actualizes the
intercommunication of order-wire phones between NEs via E1 and E2 bytes. It employs
an independent CPU for order-wire and communicating with NCP processor via S
interface.
The Qx interface board is the communication interface between NE and subnet
management control center (SMCC). With Qx interface, NCP/ENCP can report to SMCC
the alarm and performance information of the NE and subnet and receive the commands
and configurations sent from SMCC to the NE and subnet. The f interface is the LMT
access interface of local NM, which is for the access management of portable PC.
The reset and ring trip are on the rack. Other interfaces are on QXI and SCI boards.
The NCP/ENCP boards monitor the fan plug-box of the NE. The power distribution unit
performs the over/under voltage monitoring of input voltage.
The alarm I/O: the NCP/ENCP boards offers 8-path external alarm switch quantity
interfaces, collects the alarm signal of NE and transmits it to the alarm box and the firstcabinet-in-a-row.
It offers 2-path switch quantity (UC) interface and may output 2-path switch quantity for
user.
3.8
Overhead Processing
The overhead process of ZXMP S385 is performed by NCP/ENCP board, OW board,
CSF/CSE/CSA board, optical line boards and ATM board.
ZXMP S385 supports overhead transparent transmission, i.e. low rate service signal and
overhead can transfer transparently in STM-16 frame. It greatly improves the network
construction flexibility, abates the tension of insufficient optical fiber resources, and
ensures the NM integrity and the NM information continuity.Overhead-Byte Usage List is
show in Table 5 .
Table 5
Overhead-Byte Usage List
Overhead
type
Overhead
name
ZXMP S385 application
A1, A2
Frame position indication for regeneration section,

A1:11110110,A2:00101000
J0
S385 may identify, set and transparent transmit J0

byte
Z0
Not applied
D1~D12
S385 may set DCC of D1~D3 or D1~D12, and support

the transparent transmission of D1~D12
E1, E2
S385 supports E1, E2 order wire telephone, as well as

E1, E2 transparent transmission.
F1
S385 provides F1 64kbps co-directional data interface,

and the transparent transmission of F1 byte
B1
Used for the error code monitor of regeneration

section
B2
Used for the error code monitor of MS
K1, K2
Used for the auto-protection switchover (APS)

command of MS
S1
b5~b8 used for synchronous status message
M1
Used for MS far-end difference indication
AU PTR
The rate adjustment on AU level
J1
Used for high-order path trace, able to be set
B3
Used for path error code monitoring
C2
Used for expressing the composition or maintenance

status of VC-3/VC-4/VC-4X, able to read and write
G1
Used for returning the status and performance of path

terminal to the path origin of VC3/VC4/VC4XC
F2, F3
Not applying
H4
Affording the general position indication to payload, as

well as the special payload Position (i.e. H4 may be
the multi-frame position indication of VC12 and VC2);
and performing VC3/VC4 virtual concatenation
K3
Not applied
N1
Not applied
V5
Providing the functions of error code test, signal mark

and channel status for VC1/VC2
J2
VC1, VC2 path trace byte, able to be set
N2
Not supported
RSOH/MSOH
AU pointer
POH
Overhead
type
3.9
Overhead
name
ZXMP S385 application
K4
Used for the virtual concatenation process of low-order

path
Easy For Maintenance And Upgrade

With the following functions, the system becomes more reliable, featuring good
maintainability and easy scalability:
3.10
It supports optical power monitoring functions.
It supports online loading and remote upgrading of card software (including FPGA
logic).
It provides the daily maintenance function. In case of a fault, it can quickly locate the
fault to the card level.
All cards provide the temperature monitoring function.
Pluggable optical module (SFP module, LC connector).
Alarm input/output
NCP/ENCP provides 8 external alarm Boolean value input interfaces and two control
output interface.
NCP/ENCP collects alarm indication signals from NEs and sends them to the alarm box
and the first cabinet of the line. There are four alarm output interfaces.
The system provides two user alarm output interfaces and level alarms. It shares a DB9
interface with F1 interface at the backplane side.
3.11
System power supply

ZXMP S385 equipment employs the dual-power system to access the -48V power in the
equipment room and distributes the -48V DC power in the power distribution box.
It adopts separate power supply mode. No power boards in the sub-rack, the -48V
power directly powers each board via the MB board through a DC/AC conversion
module.
Two lines of independent external -48V DC power supply, -48VGND and the system
protection GND are led from the connectors on the distribution frame and then
connected to the sub-rack power distribution board. The power distribution (PD) board
provides the equipment with the following functions such as -48V power switch,
distribution, isolation, EMI filtering, protection against lightening and surge, fan power
supply and control
10
3.12
Perfect EMC and Operation Safety

EMC, operation safety and fire/explosion protection of the equipment are fully
considered in the circuit board design.
11
System Architecture
4.1
Product Physical Structure
4.1.1
System architecture
ZXMP S385 functional block diagram is shown in Error! Reference source not found.
Figure 1
ZXMP S385 functional block diagram
ZXMP S385 SDH Based Multi-Service Node Equipment
SDH Equipment
(TM, ADM, REG)
ZXONM E300
EMS/SNMS
Security management
Maintenance
management
Performance
management
Fault
management
Configuration
management
System management
Sverice Acess
Platform
Power Support
Platform
Overhead Processing
Platform
Sverice Crossconnect Platform
Clock Processing
Platform
NE Control Platform
Hardware System
NE Management Software System
In terms of functional hierarchy, ZXMP S385 can be divided into hardware system and
network management (NM) software system, which are independent of each other and
work coordinately. The hardware system is the main body of the ZXMP S385. It can
work independently of the NM software system.
A standard "IEC cabinet + sub-rack" structure is used for ZXMP S385. Both the cabinet
and sub-rack unit are designed in the principle of front-facing installation and
maintenance to save equipment space and allow for back-to-back installation, frontfacing operations and maintenance. Appearance of S385 Sub-rack is show in Figure 2 .
12
Figure 2
4.1.2
Appearance of S385 Sub-rack
System mapping structure

ZXMP S385 adopts the latest mapping structure of ITU-T recommendation, as shown in
Figure 3.
Figure 3
Multiplexing/mapping structure adopted by ZXMP S385
STM-N
AUG
AU-4
VC-4
3
Pointer processing
TUG-3
TU-3
VC-3
C-3
44736kbit/s
34368kbit/s
C-12
2048kbit/s
C-11
1544kbit/s
TUG-2
3
Multiplexing
TU-12
VC-12
Alignment
Mapping
VC-11
Note:
In above mapping structure, ZXMP S385 V2.00 and above version supports E1/T1,
E3/T3, STM-1 (optical/electrical), STM-4, STM-16, STM-64 and Ethernet services. V2.20
13
and later versions support SAN service. The service enters STM-N via AU-4
multiplexing/mapping route instead of AU-3 multiplexing/mapping route.
T1 service supports VC11-TU12 mapping route.
4.2
Hardware Architecture
With the platform design concept, the ZXMP S385 hardware system consists of the NE
control platform, clock processing platform, service cross platform, overhead processing
platform, power supply support platform and service access platform.
By means of platform establishment, transplant and integration, ZXMP S385 forms
different functional units or boards, which are connected in a specific way to form the
SDH equipment with perfect functions and flexible configurations. ZXMP S385 can be
configured as a TM, ADM, or REG equipment, depending on the networking
requirements. Configurations of REG at rates of 2.5G and 10G are available in V2.00
and above version.
The relationships of all the platforms are shown in Figure 4
Figure 4
Functional relationships of the hardware platforms
Service access
platform
Service crossconnect platform
.
.
.
Clock processing
platform
.
.
.
.
.
.
Overhead
processing
platform
Power supply
support platform
Service access
platform
.
.
.
NE control
platform
NE control platform
As the interface between NE equipment and background NMS, the NE control
platform is the agent for other platforms to receive or report network management
information.
Power supply support platform

With the distributed power supply style, power supply modules installed in each
board provide power to corresponding boards.
14
Service access platform
This platform supports the access of SDH, PDH, Ethernet, ATM and SAN services.
It converts accessed services to corresponding formats, and then forwards them to
the service cross platform for aggregation and distribution.
4
Overhead processing platform

This platform provides orderwire voice channel and some auxiliary data digital
channels through section overhead (SOH) bytes while transmitting payloads.
Clock processing platform

As one of the core part of the hardware system, this platform provides the system
clock for all platforms in the equipment.
Service cross platform

This platform receives service signals and various information from service access
platform and overhead processing platform, and implements service orientation and
information aggregation/distribution/switching.
ZXMP S385 backplane uses the unified service bus, clock bus, overhead bus and
control bus, and adopts the star structure centered on cross and clock board.
4.3
Software Architecture
ZXMP S385 employs ZXONM E300 to manage and monitor the hardware system and
transmission network, and coordinate the work of the transmission network.
1
Brief introduction to NM structure

ZXONM E300 system adopts four-layered structure, including equipment layer, NE
layer, NE management layer and sub-network management layer. It can also
provide Corba interface for the network management layer. The hierarchical
structure of ZXONM E300 system is shown in Figure 5 .
15
Figure 5
Hierarchical structure diagram of NM software
NE management scope
ZXONM E300 features forward and backward compatibility, capable of managing all
SDH-based multi-service node equipments.
ZXONM E300 V3.19 supports management of ZXMP S385 V2.50 version.
Function introduction
It can perform NE-layer network management functions such as configuration
management, fault management, performance management, security management,
system management, and maintenance management. Please refer to relevant
documentation of ZXONM E300 for details of NMS.
16
Technical Specifications
5.1
Physical Indices
5.1.1
Subrack and cabinet appearance

The subrack adopts 19 high rack with dimension of 888.2mm (height) 482.6mm (width)
270mm (depth). It consists of side panels, beams and metal guide rails, with the
functions of heat dissipation and shielding. At the bottom of the subrack is a separate
fan plug-in box equipped with 3 independent fan module boxes, each fan module box
separately connects to fan backplane to facilitate maintenance. At the top of the subrack
a decoration door featuring decoration, ventilation and shielding functions can be
detached flexibly. ZXMP S385 Subrack structure diagram is show in Figure 6 .
Figure 6
Subrack structure diagram
1. Top outlet 2. Decoration door 3. Board area 4. Lower cabling area 5. Fan plug-in box
The subrack consists of four parts:
1
Backplane: the carrier for boards, connects ZXMP S385 to the connection interface
of external signals. The boards are connected to the buses via the board connection
sockets on the backplane.
17
Plug-in board area: it is dual-layer structure used to install ZXMP S385 boards.
Fan plug-in box: located at the bottom of the subrack, it provides forced air cooling
for the equipment to dissipate heat.
The rear part of ZXMP S385 is equipped with one left and one right mounting lugs which
are used to fix the equipment subracks in the cabinet. ZXMP S385 subrack adopts back
fixing installation mode, it can be fixed in the cabinet from the front without obstructing
cable layout, satisfying requirements for front-facing installation, front-facing
maintenance, against wall and back-to-back installation of equipment cabinet.
ZXMP S385 cabinet is 19 cabinet compliant with ETSI standards. It is made of excellent
steel plate and features good electromagnetic shielding and heat dissipation
performances.
5.1.2
Subrack backplane
ZXMP S385 backplane is fixed at the subrack, serving the carrier for connecting all the
boards. It is divided into upper and lower parts, in which, the upper part connects various
functional interface boards, and the lower part connects various functional boards. The
backplane contains service bus, overhead bus, clock bus, board-in-position bus,
connects all the boards, equipment and external signals via interfaces and sockets.
Backplane adopts unified arrangement of bus arrays of payload services, auxiliary
services, internal board-to-board communication and clock, thus ensures the equipment
to add boards with various types of interfaces according to customers requirements.
5.1.3
Fan plug-in box

The structure of the fan plug-in box of the ZXMP S385 is shown in Figure 7. Three
independent fan boxes are installed in the fan plug-in box, the structure of fan box is
shown in Figure 8. Each fan module is electrically connected to the fan backplane via
the socket at the back of the box. The fan box features independent locking function. It
has running and alarm indicators on the front panel.
Figure 7
Structure of fan box
1.Fan box mounting bracket 2. Fan box
18
Figure 8
Fan box structure
1. Fan box 2. Fan 3. Indicator 4. Button switch

The fan system of ZXMP S385 is the component for cooling and heat dissipation. Each
subrack contains a fan backplane and three independent fan units side by side. Each
fan unit is composed of a fan box, a fan and a FAN board. The FAN board is control by
ENCP and provides rotation-blocking signal for ENCP monitor. The FAN board controls
the fan operation if the FAN board loses contact with ENCP.
5.2
Appearance and dimensions

Dimensions and weight indexes of structural parts of ZXMP S385 are shown in Table 6
Table 6
Dimensions and weights of structural parts
Dimension (mm)
Weight
(kg)
2000 (height)600 (width)300 (depth)
70
80
90
ZXMP S385 sub-rack
888.2mm (height)482.6mm (width)270mm

(depth)
25
Power distribution
box
132.5 (height)482.6 (width)269.5 (depth)
Fan plug-in box
43.6mm (height)436mm (width)245mm

(depth)
--
Dustproof plug-in box
43.6mm (height)482.6mm (width)250 (depth)
Ventilation unit
43.6mm (height)482.6mm (width)250 (depth)
Upper cabling area
133 mm (height)482.6mm (width)250mm

(depth)
--
Cross-connect clock
board
(CSA/CSE/CSF)
PCB: 320 (height)210 (depth)2 (depth)

Front panel: 345.6 mm (height) 8 HP (width)
--
Structural part
ZXMP S385 cabinet
19
Structural part
Dimension (mm)
Weight
(kg)
Service interface
board and ENCP, OW
PCB: 277.8mm (height)160mm (depth)2mm

(width)
Front panel: None
--
Service board (lower

layer boards of subrack)
PCB: 320mm (height)210mm (depth)2mm

(width)
Front panel: 345.6 mm (height)5HP (width)
--
Note: The cabinet weight is the weight of an empty cabinet. 1HP=5.08 mm

ZXMP S385 offers cabinets with height of 2000mm, 2200mm and 2600mm. Subrack,
the core component, is installed in ZXMP S385 cabinet. A 2000mm-high cabinet can
accommodate only one subrack. A 2200mm- or 2600mm-high cabinet can
accommodate one or two subracks. Various functions of the equipment can be realized
via different configurations of subrack boards.
In accordance with current situation of transmission cabinet, overall structure layout can
be classified into 3 scenarios based on cabinet height, which are shown in Table
7 ,Table 8 .
Table 7
ZXMP S385 own configuration
Cabinet height
Power
distribution
box
Subrack
2.0m (with
effective height of
42U)
3U
20U+1U (subrack and cabling area+dustproof

plug-in box)
2.2m (with
effective height of
47U)
3U
20U+1U+1U+20U+1U (2 subracks and cabling

area+2 dustproof plug-in boxes+1 ventilation
unit)
2.6 m (with
effective height of
56U)
3U
20U+1U+1U+20U+1U (2 subracks and cabling

area+2 dustproof plug-in boxes+1 ventilation
unit)
Table 8
ZXMP S385 is configured with other products
Cabinet height
2.0m (with effective height

of 42U)

of 47U)
20
Power
distribution
box
Subrack
3U
ZXMP S385 (20U+2U)+ ZXMP S320

(4U+1U)
3U

(10U+3U)
3U

(4U+1U)
3U

(10U+3U)
Cabinet height

of 56U)
Power
distribution
box
Subrack
3U

(4U+1U)
3U

(10U+3U)
3U

(21U+2U)
3U

(23U+2U)
+1U,+2U,+3U in the table are space reserved for dustproof, ventilation and cabling.
5.3
System subrack and slot diagram

ZXMP S385 sub-rack includes board, fan plug-in box and dustproof unit.
Structure of sub-rack is shown in Figure 9.
The plug-in board area of ZXMP S385 is separated into 2 layers, where, the top layer is
for interface boards with 15 slots and the low layer is for functional boards with 16 slots.
The sub-rack bottom contains a 1U fan plug-in box that contains three fans working
independently.
21
Figure 9
5.4
Board slot layout of sub-rack
System board list and description

Common board name (code), applying rule and unit power consumption of ZXMP S385
are shown in Table 9 .The maximum input current of subrack is 16A.
Table 9
22
Boards/unit list (with power consumption)
Board
Board name and

configuring explanation
Power
Consum
ption in
Common
Temperat
ure (25 )
(W)
Max.
Power
Consum
ption
(45 ) (W)
Weight
(Kg)
NCP
Net Control Processor, 1 for standard

configuration, 2 able to practice 1+1
protection
4.8
0.44
ENCP
Enhanced Net Control Processor, 1

for standard configuration, 2 able to
practice 1+1 protection
9.6
9.9
0.46
OW
Order-wire
5.3
5.4
0.47
QxI
Qx interface 1 for standard

configuration
3.9
4.1
0.52
CSA
Cross-switch and Synchronous-clock

(256x256 VC4 high order with 32x32
VC4 low order)
27.4
28.2
1.14
Board
Board name and

Power
Consum
ption in
Common
Temperat
ure (25 )
(W)
CSF
Cross-switch and Synchronous-clock

(1440x1440 VC4 high order)
32.4
33.4
1.46
TCS64
Cross-switch with low-order
17.3
17.8
0.56
TCS128
36.5
37.6
0.95
TCS256
60.5
62.3
0.98
SCIB
B-type clock interface board (2Mbit/s)
3.9
4.0
0.51
SCIH
H-type clock interface board (2MHz)
4.4
4.5
0.61
OL64FE
C
Optical Line of out2, with L-64.2cIf, L64.2c

IIf or L-64.2pf. Supports FEC function
25
27.3
1.12
OL64
Optical Line of STM-64, with S-64.2b,

L-64.2cI, L-64.2cII, P1L1-2D2 or L64.2p.
28.8
31.2
0.95
OL64x2
STM-642 optical line board. Optical

module types configurable include S64.2b, L-64.2c1, L-64.2c2 and L64.2p. Refer to ECC information for
details.
31.9
34.3
1.12
OL16
Optical Line of STM-16, with S-16.1,

L-16.2, L-16.2JE, L-16.2U or L-16.2P
14.9
16.3
0.65
OL164
Optical Line of STM-164, with S16.1, L-16.2 or L-16.2U
23.6
28.3
1.30
OL168
STM-168 optical line board. Optical

module types configurable include S16.1, L-16.2, L-16.2u and L-16.2p.
Refer to ECC information for details.
33.5
38.2
1.43
OL42
Optical Line of STM-42
10.1
10.4
0.70
OL44
16.8
17.3
0.74
OL14
8.9
9.2
0.74
OL18
14.4
14.8
0.80
OEL116
Optical Line/Electrical Line Process of

STM-116
18.1
18.6
0.87
OEIS1x8
Optical /Electrical interface of STM18
6.4
6.4
0.38
LP14
Line Process of STM-14, used

together with electric interface
switchover board or bridge board
5.8
0.65
LP18
Line Process of STM-18, used

together with electric interface
switchover board or bridge board
5.8
0.68
Max.
Power
Consum
ption
(45 ) (W)
Weight
(Kg)
23
Board name and

Power
Consum
ption in
Common
Temperat
ure (25 )
(W)
Max.
Power
Consum
ption
(45 ) (W)
Weight
(Kg)
4-path STM-1 electric interface

switchover board, used for interface
slot
Before
switchove
r 0.5,
after
switchove
r 8.2
Before
switchove
r 0.6,
after
switchove
r 8.4
0.40
ESS18
Electrical Interface of STM-14
Before
switchove
r 0.5,
after
switchove
r 8.2
Before
switchove
r 0.6,
after
switchove
r 8.4
0.47
EP36
Electrical Process of E3/T36
12.5
12.9
0.71
ESE36
Electrical Interface Switching of

E3/T36
Before
switchove
r 0.5,
after
switchove
r 5.3
Before
switchove
r 0.6,
after
switchove
r 5.4
0.40
BIE3
Bridge Interface of STM1e/E3/T3/FE,used for the interface

slot corresponding to protection board
0.5
0.6
0.37
EPE163
(75)
Electrical Process of E163 (75)
19
19.6
0.81
EIE163(
75)
Electrical Interface of E163 (75)
0.5
0.6
0.36
ESE163
(75)

E163 (75)
Before
switchove
r 0.5,
after
switchove
r 21.6
Before
switchove
r 0.6,
after
switchove
r 22.2
Before
switcho
ver 0.6,
after
switcho
ver 8.4
EPE163
(120)
Electrical Process of E163 (120)
19
19.6
0.83
EPT163
(100)
Electrical Process of T163 (100)
15.4
15.8
0.81
EIT163
Electrical Interface of T163 (100)

or E163 (120)
0.5
0.6
0.35

T163 (100) or E163 (120)
Before
switchove
r 0.5,
after
switchove
r 21.1
Before
switchove
r 0.6,
after
switchove
r 21.8
0.54
Board
ESS14
EST163
24
Board
Board name and

Power
Consum
ption in
Common
Temperat
ure (25 )
(W)
BIE1
Bridge Interface of E1/T1
0.5
0.6
0.39
SEE
Enhanced Intelligent Ethernet

Processing Board(48:1),customer
side 8FE(optical or electrical)+2GE
26.4
27
0.75
RSEB
Embedded RPR Ethernet Processing

Board, customer side 8FE(optical or
electrical)+2GE
29.4
30.3
0.98
AP18
8155Mbit/s optical board at the ATM

side and 1622Mbit/s nonconcatenation data flow at the system
side.
24.1
24.9
0.85
TGE2B
GE transparent process board
19.1
19.7
0.73
TGSA8
SAN service processing board,

customer side 4SAN+4GE or
8GE
36.5
37.6
0.99
OIS18
Optical interface board cooperating

with Ethernet board RSEB
7.0
7.2
0.45
OEIFEx8
Optical /electric interface board

cooperating with SEE board
8.5
8.5
0.45
ESFE8
Ethernet electric board cooperating

with Ethernet board including
RSEB/SEE
0.6
0.7
0.38
OADD
Optical add/drop unit board for 4

channels of fixed wavelength DWDM
optical signals.
4.1
0.75
OADC
Optical add/drop unit board for 4

channels of fixed wavelength CWDM
optical signals.
3.5
3.6
0.75
FAN
Fan board
4.2
4.3
0.36
OBA12
Optical Booster Amplifier

board(12dBm) built-in
6.1
11.6
1.15
OBA14

board(14dBm), built-in
6.1
11.6
1.15
OBA17

6.1
11.6
1.15
OBA19

6.1
11.6
1.15
OPA32
Optical Pre-Amplifier(-32dBm), builtin
4.8
10.3
1.18
OPA38
Optical Pre-Amplifier(-38dBm), builtin
4.8
10.3
1.18
Max.
Power
Consum
ption
(45 ) (W)
Weight
(Kg)
25
5.5
STM-N optical interfaces performance

Performance of the OTU2/STM-64/16/4/1 optical interfaces is shown in Table 10 ,Table
11 ,Table 12 ,Table 13 .
Table 10
Performance of the STM-1 optical interface
Nominal bit rate
155520kbit/s
Classification code
S-1.1
L-1.1
L-1.2
Working wavelength (nm)
1310
1310
1550
Source type
MLM
SLM
SLM
Min transmitting optical power (dBm)
-15
-5
-5
Max transmitting optical power (dBm)
-8
Minimum extinction ratio (dB)
8.2
10
10
Poorest sensitivity (dBm)
-28
-34
-34
Minimum overload point (dBm)
-8
-10
-10
Transmitter at reference point S

G.957-compliant
Optical path between Point S and R

Receiver at reference point R
Table 11
Nominal bit rate
622080kbit/s
Classification code
S-4.1
L-4.1
L-4.2
1310
1310
1550
Source type
MLM
SLM
SLM
-15
-3
-3
-8
8.2
10
10
-28
-28
-28
-8
-8
-8

G.957-compliant
Table 12
26
Nominal bit rate
2488320kbit/s
Classification code
S16.1
L16.2
L16.2JE
L16.2P
L16.2U
1310
1550
1550
1550
1550
Source type
SLM
SLM
SLM
SLM
SLM
Nominal bit rate
2488320kbit/s
-5
-2
+2
-2
-2
8.2
8.2
8.2
8.2
8.2
-18
-28
-28
-28
-28
-9
-9
-9
-9

G.957-compliant
Table 13
Performance of the STM-64/OTU2 optical interface of ZXMP S385
Nominal bit rate
9953280kbit/s
10709225kbit/s
Classification code
S64.2b
L64.2c1
L64.2c2
P1L12D2
P1L1-2D2
1550
1550
1550
1550
1550
Source type
SLM
SLM
SLM
SLM
SLM
Min transmitting optical power

(dBm)
-1
-2
Max transmitting optical power

(dBm)
8.2
8.2
8.2
-14
-22
-22
-24
-24
-1
-9
-9
-7
-7

Optical path between Point S
and R
G.709compliant
G.691 or G.959.1-compliant
5.6
PDH interfaces performance and indexes

Performance of PDH electrical interfaces is shown as Table 14 .
Table 14
Performance of the PDH electrical interface
Type
1544
kbit/s
2048
kbit/s
34368
kbit/s
44736
kbit/s
155520
kbit/s
Code pattern
AMI or
B8ZS
HDB3
code
HDB3
code
B3ZS
code
CMI code
G.703complia
nt
G.703complia
nt
G.703complian
t
G.703complian
t
G.703compliant
Bit rate of signals at output

port
Attenuation tolerance at
input port
27
1544
kbit/s
Type
2048
kbit/s
34368
kbit/s
44736
kbit/s
155520
kbit/s
Frequency deviation
tolerance at input port
Anti-interference capability
of input port
Permitted input port attenuation, permitted frequency deviation and output port signal bit
rate tolerance are listed in the following Table 15 .
Table 15 Input port permitted attenuation, frequency deviation and output port signal bit rate
tolerance
Interface
rate
Permitted input port

frequency
deviation(regular
squared attenuation)
Permitted input port

frequency deviation
Output port rate

tolerance
1544kbit/s
--
Greater than 32ppm
Less than 32ppm
2048 kbit/s
0dB~6dB, 1024kHz
Greater than 50ppm
Less than 50ppm
34368
kbit/s
0dB~12dB, 17,184kHz
Greater than 20ppm
Less than 20ppm
44736
kbit/s
--
Greater than 20ppm
Less than 20ppm
155520
kbit/s
0dB~12.7dB, 78MHz
Greater than 20ppm
Less than 20ppm
Reflection attenuation at the input/output ports

For input/output port reflection attenuation index of various electronic ports of ZXMP
S385, please refer to Table 16 .
Table 16
Requirements for the input/output port reflection attenuation
Interface bit rate
2048Kbit/s input port
34368Kbit/s input port

155520Kbit/s input/output port
Test frequency
range
Reflection attenuation
(dB)
51.2kHz~102.4kHz
12
102.4kHz~2048kHz
18
2048kHz~3072kHz
14
860kHz~1720kHz
12
1720kHz~34368kHz
18
34368kHz~51550kHz
14
8MHz~240MHz
15
Anti-interference capability of the input port

The ratio of main signals to interference signals is 18dB.
28
Output port waveform

The output port
Recommendation.
waveform
complies
with
template
specified
in
G.703
Over-voltage protection of the input and output interfaces

The input and output interfaces must bear 10 continuous standard pulses (5 positive
and 5 negative) without being damaged. The rising time of a standard pulse is 1.2s,
the width is 50s and the voltage amplitude is 20V.
5.7
Performance of data boards

There are several data boards in ZXMP S385 V2.50:SEE, TGE2B, RSEB, AP18 and
TGSA8.
5.7.1
5.7.2
Performance of SEE
Providing 810M/100M+2GE interfaces.
Support 48VCG. VCG mapping mode may be VC-12-Xv/VC-3-Xv/VC-4-Xv. VCG

supports at most 1.25G bandwidth.
The total mapping bandwidth of SDH backplane is 1.25Gbps.
Support E-Line, E-Tree and E-LAN services.
Configure S-VLAN according to port or customer CE-VLAN.
Support Ethernet OAM to facilitate fault locating and performance inspection.
Support GFP RDI-CSF alarm.
Support Ethernet access rate control and DifferServ.
Support EPS protection.
Support port dispatching fairness of best-effort service.
Performance of TGE2B
TGE2B board provides 2GE adaptive Ethernet services.The performance is show as
Table 17 .
29
Table 17
Performance of TGE2B of ZXMP S385
Characteristics of Ethernet board
Explanation of board function
Property sort
Board name
TGE2B
Ethernet port characteristics
1000BASE-SX/LX
Connector
LC
QTY of board interface
Port work mode (rate, full duplex

and auto-negotiation)
Support
Optical module able to plug
Support
Ethernet port
Interface
mode
Front-outlet on panel
Remote download and upgrade
Support
Max. Port QTY at system SDH side (WAN port)
2
2.5G
Total backplane mapping bandwidth
Virtual
concatenation
VC3 Virtual concatenation
Support (The delay supported by

VC3 is 8ms. The board adopts
the V3-AU3-AUG mode and the
mapping is not made via VC4.
Some problems occur in the
interconnection with other
vendors equipment and in the
test. The interconnection and test
adopt VC4 instead of VC3. )
VC4 Virtual concatenation
Support (The delay tolerance

supported by VC4 is 8ms.)
Dynamic VCG bandwidth

increase/decrease, no
damage with service
Support (The dynamic service

bandwidth adjustment leads to
100ms loss. There is no problem
in the function and
interconnection.)
LCAS management functions

(enable, alarm, event report)
Support
Multi-path protection of VCG

level, protecting time <300ms
Support
Support GFP encapsulation,

satisfy ITU-T G.7041 standard
Support
support LAPS protocol, satisfy

ITU-T X.86 standard
Support
support PPP encapsulation

protocol
Support
Support Jumbo frame
Support (maximum 9600 byte)
LCAS protocol
Encapsulation
protocol
30
Support 16VC4 (Each VCG

supports at most 8VC4), or
48VC3 (Each VCG supports at
most 24VC3).
Characteristics of Ethernet board
Explanation of board function
Support the
flow control
based on port
Full duplex 802.3x PAUSE flow

control
Support port transparent
transmit, the service frame
format might be (Eth II, 802.3,
802.1QTAG)
Support. Support the transfer of

the port Link state to the opposite
end, and the Link State Transfer
technique (LST), which will
greatly reduce the switching time
of the router.
The transparent transmit

performance satisfies MSTP
recommendation, refer to
MSTP standard 6.2.1 for
details, key performance
parameters: package losing
rate, burst interval, transfer
rate, and delay
Support
The
intercommunic
ation of
different
products inside
company
VC4 level intercommunication
VC4-level intercommunicating
with EOS series boards, RPR
functional RSEB board
Ethernet
performance
Support Ethernet performance

monitor of port level
Support
Point-to-point
transparent
transmit
(private service
mode)
5.7.3
Performance of RSEB
RSEB maps Ethernet service to RPR, and performs the unique functions of RPR. It uses
the channel bandwidth resource of SDH/MSTP ring network to provide the dual-ring
topology required by RPR and implement the ring interconnection of RPR nodes.
RSEB provides user Ethernet interfaces as 8FE (optical/electrical) +2GE (optical). It
provides FE optical or electrical board by cooperating with OIS18 or ESFE interface
board respectively.
RSEB board provides two RPR ports and four EOS port at system side:
RPR at system side contains two RPR SPAN: RPR SPAN1 and RPR SPAN2 with
mapping methods of VC-4-Xv, VC-3-Xv, backplane bandwidth is 2.5G, capable of
constructing 1.25G RPR.
RPR board at system side provides four EOS ports with mapping method of VC-12Xv and a maximum bandwidth of 63VC12.
EOS system port can be used for RPR service cross-ring, or intercommunication with
EOS boards as SEE . It supports LCAS protocol.
RPR SPAN port and EOS system port share the 2.5 Gbit/s SDH processing bandwidth.
They support maximum 2.5 Gbit/s of RPR ring total bandwidth, and maximum 155 Mbit/s
31
of EOS bandwidth (RPR ring total bandwidth and EOS bandwidth cannot reach the
maximum values simultaneously).
RSEB board has the following functions:
5.7.4
Switching capacity: 5G, backplane bandwidth:2.5G;
Providing 8FE+2GE user Ethernet interfaces;
Compliant with IEEE802.17, support for two RPR SPAN, capable of forming 1.25G
bidirectional ring at most;
Support for interoperation of RPR ring and EOS chain, implementing conversion of
mapping granules;
Support for Bypass RPR MAC function, used as EOS transparent transmission
board to support transparent transmission of two GE+4 FEs;
EOS port supporting CSF OAM function, with point-to-point LST function available;
Support for IGMP Snooping broadcast protocol, support for IPTV application;
Support for LACP protocol, providing large-capacity dynamic link aggregation

function with protection;
Good service security isolation, support for Q in Q-based VLAN VPN;
Support for VC-12-Xv/VC-3-Xv/VC-4-Xv, LCAS and GFP.
Performance of AP18
AP18 board is mainly used to converge or aggregate ATM service data to SDH
transmission network. It provides 8155 Mbit/s optical interfaces at the ATM side to
perform functions as ATM layer processing and mapping from ATM cell to VC-4. It
provides 1622 Mbit/s non-concatenation data flow at the system side. With 622M
backplane bandwidth and 622Mbps cell switching capacity, it can select 1-4 VC-4
channels to transmit ATM services.
32
Backplane bandwidth: 622M, cell switching capacity: 622Mbps.
Supports four ATM service types as constant bit rate (CBR), realtime variable bit
rate (rt-VBR), non-realtime variable bit rate (nrt-VBR) and unspecific bit rate (UBR).
Supports VP/VC switching.
Support VP uni-directional/bidirectional 1+1 and 1:1, supports VPRing, VCRing

functions.
5.7.5
Support OAM function of ATM, supports VP protection switching, the switching

request can be alarms as VP-AIS (Virtual path-based alarm indication signal), LOS
(loss of signal), LOF (loss of frame), OOF (out of frame), LAIS (line alarm indication
signal), LCD (loss of cell delineation), and LOP (loss of pointer).
Supports ATM space, logic multicast, when performing ATM exchange, it can copy
one input ATM cell flow (VP, VC) to multiple output ATM links.
Performance of TGSA8
TGSA8 has SAN and GE transparent transmission interface. It supports 8 user
interfaces which adopt SFP optical module. The first 4 user interfaces may respectively
offer GE or SAN service. SAN service includes 1G Fiber Channel and 1G FICON
services. The other 4 user interfaces may offer 4GE services.
TGSAx8 provides 42.5G service bus at the system side. The total bandwidth is 10G.
Other characteristics of TGSAx8 are showed as follows:
Support GFP and comply with G.7041.
Support LOF, OOF, AU-AIS and AU-LOP alarm check.
Provide line-side and user-side loopback functions of user interface.
Support VC-3 and VC-4 mixed concatenation. Any VCG may be respectively
configured to VC-3 or VC-4 virtual concatenation. VC-3 supports VC-3-->TU-3->AU-4 mapping path.
Support LCAS protocol and complies with G.7042.
5.8
Physical Performance of Ethernet
5.8.1
Ethernet interface types and followed standard

Ethernet interface index is show in Table 18 .
Table 18
Ethernet interface index
Type
Rate (bps)
followed
standard
Interface type
interface
10BASE-T
10M
IEEE 802.3
Electronic
interface
RJ45,
category 3
UTP
100BASE-TX
100M
IEEE 802.3u
Electronic
interface
RJ45,
category 3
UTP
33
Type
Rate (bps)
followed
standard
Interface type
interface
100BASE-FX
100M
IEEE 802.3u
M-1.1/S-1.1/L-1.1
SFP-LC
All optical interface indices are described as following table.

1
FE MMF optical interface(M-1.1)

FE MMF optical interface(M-1.1)as show in Table 19 ,Table 20 .
Table 19
Transmission index of FE MMF optical interface
Item
62.5/125m MMF
Transmission unit type
MMF LD
Transmission distance
Interface
SFP-LC
Unit
KM
Wavelength (, range)
1270~1380
nm
Trise/Tfall (maximum;10%~90%)
ns
RMS spectrum width (maximum)
63
nm
Output optical power (maximum)
-14
dBm
Output optical power (minimum)
-20
dBm
Output optical power when the LD is

shut down (maximum)
-45
dBm
Extinction ratio (minimum)
10
dB
Table 20
Receiver index of FE MMF optical interface
Item
62.5/125m MMF
Unit
Wavelength(, range)
1270~1380
Nm
input optical power (maximum)
-14
dBm
Receiver sensitivity
-30
dBm
FE short distance SMF optical interface(S-1.1)

FE short distance SMF optical interface(S-1.1) as show in Table 21 ,Table 22
34
Table 21
index of FE short distance SMF optical interface
Item
10/125m SMF
SMF LD
15
Interface type
SFP-LC
Wavelength(, range)
1261~1360
nm
2.5
ns
RMS spectrum width(maximum)
7.7
nm
output optical power(maximum)
-8
dBm
output optical power(minimum)
-11.5
dBm

shut down(maximum)
-45
dBm
Extinction ratio(minimum)
dB
Table 22
Unit
KM
receiver index of FE short distance optical interface
Item
10/125m SMF
Unit
1261~1360
nm
Input optical power (maximum)
-8
dBm
-31
dBm
FE long distance SMF optical interface(L-1.1)

FE long distance SMF optical interface(L-1.1) as show in Table 23 ,Table 24 .
Table 23
Transmission index of FE long distance SMF optical interface
Item
10/125m SMF
SMF LD
40
Interface type
SFP-LC
Wavelength (,range)
1261~1360
nm
Trise/Tfall (maximum; 20%~80%)
2.5
ns
nm
dBm
-5
dBm

shut down(maximum)
-45
dBm
Extinction ratio (minimum)
10
dB
Unit
KM
35
Table 24
5.8.2
Receiver index of FE long distance optical interface
Item
10/125m SMF
Unit
Wavelength ( range)
1261~1360
Nm
-9
dBm
-34
dBm
GE interface types and followed standard

GE interface index is show in Table 25 .
Table 25
GE interface index
Type
Rate(bps)
followed
standard
Interface type
interface
1000BASE-SX
1000M
IEEE 802.3z
M-1.8
SFP-LC
1000BASE-FX
1000M
IEEE 802.3z
S-1.1 or L-1.2
SFP-LC
All optical interface indices are described as following table.

1
GE MMF optical interface(M-1.8)

GE MMF optical interface(M-1.8) as show in Table 26 ,Table 27 .
Table 26
36
Transmission index of GE MMF optical interface
Item
62.5/125m MMF
MMF LD
275
Interface
SFP-LC
Unit
m
830~860
nm
0.26
ns
0.85
nm
Output optical power(maximum)
-4
dBm
Output optical power(minimum)
-9.5
dBm

shut down(maximum)
-35
dBm
RIN(maximum)
-117
dB/Hz
dB
Table 27
Receiver index of GE MMF optical interface
Item
62.5/125m MMF
Unit
Wavelength(,range)
770~860
nm
input optical power(maximum)
dBm
-17
dBm
Minimum return loss
12
dB
Intensified receiving sensitivity

(maximum)
-12.5
dBm
GE short distance SMF optical interface(S-1.1)

GE short distance SMF optical interface(S-1.1) as show in Table 28 ,Table 29 .
Table 28
Transmission index of GE short distance SMF optical interface
Item
10/125m SMF
Unit
SMF LD
10
Interface type
SFP-LC
Wavelength(,range)
1270~1355
nm
0.26
ns
2.8
nm
KM
-3
dBm
-9.5
dBm
Output optical power when the LD is shut

down(maximum)
-35
dBm
dB
RIN(maximum)
-120
dB/Hz
Table 29
Receiver index of GE short distance optical interface
Item
10/125m SMF
unit
Wavelength ( ,range)
1270~1355
nm
-3
dBm
-20
dBm
Intensified receiving sensitivity

(maximum)
-14.4
dBm
GE long distance SMF optical interface(L-1.2)

GE long distance SMF optical interface(L-1.2)as show in Table 30 ,Table 31 .
37
Table 30
Item
10/125m SMF
SMF LD
80
Interface type
SFP-LC
Wavelength (,range)
1540~1570
nm
2.5
ns
0.16
nm
dBm
dBm
Output optical power when the LD is shut

down(maximum)
-45
dBm
dB
RIN(maximum)
-120
dB/Hz
Table 31
5.9
Transmission index of FE long distance SMF optical interface
Unit
Km
Receiver index of GE long distance optical interface
Item
10/125m SMF
Unit
Wavelength(,range)
1270~1600
nm
Input optical power(maximum)
dBm
-22
dBm
Intensified receiving sensitivity (maximum)
-14.5
dBm
Performance of OAD
OAD board consists of OADD and OADC.
OADD can add/drop 4 wavelengths of DWDM optical signals. These 4 wavelengths

are among C-band 40 wavelengths.
OADC can multiplex/demultiplex 4 wavelengths of CWDM optical signals and 1

channel
of
1310nm
optical
signal.
These
4
wavelengths
are
1471/1491/1511/1531nm or 1551/1571/1591/1611nm.
OADD/OADC can be upgraded. With board cascading, it can multiplex/demultiplex

8 wavelengths of optical signals.
OAD board may process the control commands from NM to make the online
upgrade of board software.
Performance of OADD and OADC are show in Table 32 ,Table 33 .
38
Table 32
Performance of OADD
Item
Unit
Frequency Range
Min
Max
THz
192.1
196.0
Wavelength Range
nm
1529.55
1560.61
Channel Spacing
GHz
100
0.5 dB Passband
nm
0.11
20dB Passband
nm
1.20
In-drop
dB
2.5
3.3
Add-out
dB
2.5
3.3
In-out
dB
2.4
dB
1.0
Insertion Loss
Insertion Loss Uniformity
Table 33
Performance of OADC
Item
Unit
Channel Number
Parameter
6
Central wavelength
nm
1471/1491/1511/
1531
1471/1491/15
11/1531
1551/1571/15
91/1611
Passband @ 0.5dB
nm
6.5
6.5
6.5
Wavelength range of
upgrade port
nm
1544.5~1621
1544.5~1621
dB
0.5
0.5
0.5
@ 1310
Port
dB
0.7
Passband @ 1310 Port
nm
1260~1360
LnCWDM
dB
2.3
2.0
UPGCWDM
dB
1.7
Ln
UPG
dB
2.3
2.0
Ln 1310nm
dB
1.2
Ripple
Insertion
Loss
(Including
connectors)
5.10
Parameter
Performance of OBA
Performacen of OBA is show in Table 34 .
39
Table 34
Performance of OBA Module
Performance
Unit
OBA12
OBA14
OBA17
Operating wavelength
nm
1530~1565
1530~1565
1530~1565
Input power
dBm
-12~4
-12~4
-6~4
Output power(maximum)
dBm
12
14
17
Dynamic range of
output power (dB)
dB
Gain
dB
5~24
7~26
10~23
Small Signal Gain
dB
>25
>25
>25
Noise Index
dB
Input return loss
dB
45
45
45
output return loss
dB
45
45
45
Output pump leakage
dBm
-30
-30
-30
Input pump leakage
dBm
-30
-30
-30
PDG
dB
0.5
0.5
0.5
PMD
ps
Power(full temperature
range)
<25
<25
<25
-15~65
-15~65
-15~65
Operating temperature
Operating humidity
5~95
5~95
5~95
Storage temperature
-40~75
-40~75
-40~75
Optical Connector
LC/PC
LC/PC
LC/PC
Note:OBA19 Only operating at 155M and 622M bit rate.
5.11
Performance of OPA
Performance of OPA is show in Table 35 .
Table 35
40
Performance of OPA Module
Performance
unit
OPA38
OPA32
Operating wavelength
nm
1550.12
1550.12
Filter-3dB bandwidth
nm
0.45
0.45
Filter -20dB bandwidth
nm
1.2
1.2
Input power
dBm
-38~20
-32~15
Output power(maximum)
dBm
-9
-6
Dynamic range of output power (dB)
dB
Gain
dB
26~32
25~31
Small Signal Gain
dB
30
30
Noise Index
dB
4.5
4.5
Performance
unit
OPA38
OPA32
Input return loss
dB
45
45
output return loss
dB
45
45
Output pump leakage
dBm
-30
-30
Input pump leakage
dBm
-50
-50
Forward ASE level
dBm
-30
-30
Backward ASE power level
dBm
-30
-30
Pump wavelength
nm
980
980
PDG
dB
0.2
0.2
PMD
ps
Power
15
15
Power supply
-4810%
-4810%
Operating temperature
-15~65
-15~65
5~95
5~95
Storage temperature
-40~75
-40~75
Optical Connector
LC/PC
LC/PC
Operating humidity
5.12
Performance of DCM
The Dispersion Compensating Modules compensates the dispersion of conventional
single mode fiber (G.652/G.655) Performance of the DCM is show in Table 36 .
Table 36
Performance of the DCM
Type
DCM-20
DCM-40
DCM-60
DCM-80
DCM-100
Dispersion
compensated
range(ps/nm)
-32915
-68021
102031
-136041
-164041
Insert loss(dB)
4.1
5.1
7.0
8.9
12.1
-11.5
typical value
-3.2
-4.4
-6
-7.7
PMD(2-step)
0.5
1.0
1.2
1.3
PMD(Typical)(ps)
-0.4
-0.4
-0.5
-0.6
0.1
0.1
0.1
PMD cost(dB)
Note:
Each DCM needs a 1U-high DCM-Box.;

Generally Only 10G system need to consider dispersion problem;
DCM80 can only be located in front of OBA and cannot be located after OPA
41
5.13
Error Performance
For each circuit direction and for bi-directional section and path, the error performance is
monitored separately, the SDH performance of ZXMP complies with ITU-T G.784, G.828
and G.826. The SDH performance includes performance items such as BBE, ES, SES,
FBBE, FEES, FESES, PSC, PJC+, PJC-, UAS, etc.
The long term and short-term error performances of ZXMP S385 are complied with ITUT G.828 and M.2101 recommendation. According to ITU-T G.821 and G.826, in 420km
HRDP (Hypothetical Reference Digital Path), SDH system error performance of ZTEs
transmission product is as follows, these figures are tested in field and test duration is
not less than 24 hour. SDH system error performance is show in Table 37 .
Table 37
SDH system error performance
Bit
rate(kbit/s)
2048
ESR
1.84810
SESR
9.2410
BBER
44736
-6
-8
-9
9.2410
155520
-6
3.46610
-8
9.2410
-9
9.2410
622080
-6
7.39210
-8
9.2410
-9
9.2410
2488320
-5
1.84810
-5
3.710
-8
9.2410
-9
9.2410
9.2410
9.2410
-8
-9
The performance is better than ITU-T recommendation.
5.14
Jitter index at interfaces

For ZXMP S385, the jitter and wander tolerance for G.703 PDH and SDH interface
conform to ITU-T G.823, G.824 (45Mbps) and G.825 respectively.
5.14.1
Jitter and wander tolerance of PDH input interface

The jitter and wander tolerance at ZXMP S385 PDH input interface meets the
requirements shown in Figure 10, Figure 11 and Table 38 ,Table 39 .
42
Figure 10 The jitter and wander tolerance at E1 PDH input interface
Peak-peak jitter and wander

(logarithm)
A0
A3
Slope: -20dB/10 octave
A1
A2
f0
f10 f9
f8
f1
f2
f3
f4
Jitter frequency
(logarithm)
Figure 11 The jitter and wander tolerance at T1 PDH input interface
Table 38
The input jitter and wander tolerance of PDH interface
Interfa
ce rate
UIp-p
(kbit/s)
A0
A1
A2
1544
18
5.0
UI
0.
1U
I
2048
36.
9
18
0.
2
18
4.881
0-3
0.0
1
34368
618
.6
1.5
0.
15
ffs
ffs
ffs
44736
18
5.0
UI
0.
1U
I
Pseudo
random
Frequency (Hz)
A
3
f10(T1
/T3 is
f0)
f9
f8
f1
f2
f3
f4
signal
10
12
0
6k
40
K
220 1
1.6
67
20
2.4
k
18
k
10
0k
215-1
ffs
10
0
1k
10
k
80
0k
223-1
10
60
0
30
k
40
0k
220 1
1.210
5
1.2
105
Jitter and wander tolerance of PDH output interface
43
Table 39
The output jitter and wander tolerance of the PDH interface
Parameter
value
Digit rate
(kbit/s)
Network limit
Measurement filter bandwidth
B1 unit
interval
B2 unit
interval
Band-pass filter having a lower cutoff
peak-to-peak
peak-topeak
frequency f1 or f3 and an upper cutoff

frequency f4
f1
f3
f4
8kHz
40KHz
1 544
0.1
10Hz
2 048
1.5
0.2
20 Hz
34 368
1.5
0.15
100 Hz
10 kHz
800 kHz
44736
0.1
10Hz
30kHz
400kHz
18 kHz
(700 Hz)
100 kHz
Note:
For the co directional interface only.
The frequency values shown in parenthesis only apply to certain national interfaces.
UI Unit Interval: for 2048 Kbit/s 1 UI = 488 ns; for 34 368 Kbit/s 1 UI = 29.1 ns
5.14.2
Jitter and wander tolerance of SDH input interface

The capability of STM-N input interface to stand jitter and wander is specified and tested
with the digital test signal of sine modulated phase.
The input jitter and wander tolerance of ZXMP S385 SDH terminal multiplexer satisfies
the requirements in Figure 12, Table 40 and Table 41 .
The input jitter and wander tolerance of ZXMP S385 SDH regenerator satisfies the
requirements shown in Figure 13 and Table 42 .
44
Figure 12 The jitter tolerance of STM-N terminal multiplexer input interface
Peak-peak jitter and wander (logarithm)

A0
A1

A2
A3
A4
f12
f0
Table 40
f11
f10
f9
f8
f1
f2
f3
f4
Frequency
Input jitter and wander tolerance (UIP-P) of SDH
STM
interface
A0 (18s)
A1 (2 s)
A2 (0.25 s)
A3
A4
STM-1
2800
311
39
1.5
0.15
STM-4
11200
1244
156
1.5
0.15
STM-16
44790
4977
622
1.5
0.15
Table 41
Input jitter and wander tolerance of the SDH
STM
interface
f0
f12
f11
f10
f9
f8
f1
f2
f3
f4
STM-1
1.2
10-5
1.78
10-4
1.6
10-3
1.56
10-2
0.125
19.3
500
6.5k
65k
1.3M
STM-4
1.2
10-5
1.78
10-4
1.6
10-3
1.56
10-2
0.125
9.65
1000
25k
250k
5M
STM-16
1.2
10-5
1.78
10-4
1.6
10-3
1.56
10-2
0.125
12.1
5000
100k
1M
20M
45
Figure 13 The input jitter tolerance of STM-N SDH regenerator
Input jitter amplitude
UI
P-P
A2
A1
Table 42
f1
Frequency
Input jitter tolerances of STM-N regenerators
STM interface
STM-1
STM-4
STM-16
5.14.3
f2
f1 (kHz)
f2 (kHz)
A1 (UIP-P)
A2 (UIP-P)
65
6.5
0.15
1.5
12
1.2
0.15
1.5
250
25
0.15
1.5
12
1.2
0.15
1.5
1000
100
0.15
1.5
12
1.2
0.15
1.5
Inherent output jitter of STM-N interface

For the ADM, TM and DXC equipment of ZXMP S385, the STM-N output jittering
indexes meet the requirements in Table 43 and Table 44 .
Because of the randomness of jitter, the test value might exceed, and it is acceptable
when over 99% test values satisfy the indexes during the test (for 1 to 2 minutes).
Table 43
STM-N interface inherent output jitter indexes of SDH
STM interface
STM-1
STM-4
STM-16
46
Test filter
Peak value of jitter
500Hz~1.3MHz
0.50 UI
65kHz~1.3MHz
0.10 UI
1000Hz~5MHz
0.50 UI
250kHz~5MHz
0.10 UI
5000Hz~20MHz
0.50 UI
1MHz~20MHz
0.10 UI
Table 44
STM-N network interface output jitter indexes of SDH
STM interface
f1 (Hz)
f3 (kHz)
f4 (MHz)
B1 (UIp-p)
B2 (UIp-p)
STM-1 optical
interface
500
65
1.3
1.5
0.15
STM-1 electrical
interface
500
65
1.3
1.5
0.075
STM-4 optical
interface
1000
250
1.5
0.15
STM-16 optical
interface
5000
1M
20
1.5
0.15
For the REG equipment, when the test filter adopts 12 kHz high-pass filter, its root mean
square value (RMS) created from jitter should not be greater than 0.01UIrms.
5.14.4
Mapping jitter of PDH tributary

The mapping jitter at the ZXMP S385 PDH tributary can satisfy the requirements listed in
Table 45 .
Table 45
Mapping jitter specifications
G.703
interface
Tolerance
(ppm)
(kbit/s)
5.14.5
High-pass filter 20dB/10

multiplication
Maximum peak value

of mapping jitter
f1 (Hz)
f3 (Hz)
f4 (Hz)
f1~f4
f3~f4
2048
50
20
18k
100k
Undetermined
0.08
34368
20
100
10k
800k
Undetermined
0.08
44736
20
100
10k
800k
Undetermined
0.08
Combined Jitter
In the SDH system, generally, there are both mapping jitter and pointer adjusting jitter.
The combined jitter of both is called the combined jitter. Under various test sequences,
the value detected by ZXMP S385 should meet the ones listed in Table 46 .
Table 46
Combined jitter
PDH
inter
face
Bit
rate
toler
ance
High pass filter

20dB/10 octave
(kbit/
s)
(ppm
)
f1
(Hz)
f3
(Hz)
f4
(Hz)
f1~f4 (UIp-p)
f3~f4 (UIp-p)
2048
50
20
18k
100
k
0.4
0.4
0.4
0.0
75
0.0
75
0.0
75
3436
8
30
100
10k
800
k
0.4
0.4
0.4
0.0
75
0.0
75
0.0
75
Maximum peak-peak value combined

jitter UIP-P
0.
75
47
0.0
75
PDH
inter
face
Bit
rate
toler
ance
High pass filter

20dB/10 octave
4473
6
30
100
10k
Maximum peak-peak value combined

jitter UIP-P
800
k
Test sequence
5.14.6
0.4
0.4
0.4
0.
75
0.0
75
0.0
75
0.0
75
0.0
75
Jitter transfer function of the regeneration relay

The jitter transfer function of the regeneration relay is defined the ratio of output STM-N
signal jitter to the input STM-N signal jitter versus frequency.
The jitter transmission characteristic of ZXMP S385 SDH regeneration relay is shown in
Figure 14.
Figure 14 The jitter transfer characteristics of a regeneration relay
Input jitter amplitude
(UI P-P )
A2
A1
f2
f1
Frequency
The jitter transmission parameters of regeneration relay are shown in Table 47 .

Table 47
Jitter transmission parameters of a regeneration relay
STM-N
A
STM-1
STM-4
STM-16
5.15
fc (kHz)
P (dB)
130
0.1
30
0.1
500
0.1
30
0.1
2000
0.1
30
0.1
Clock timing and synchronous characteristics
48
The SEC Index list is show in Table 48 .
Table 48
The SEC Index list
Vendor
ISOTEMP
Type
OCXO
Standard Central Frequency
77.76MHz
Day aging rate
110-8
Year aging rate
510-7
Central frequency precision
110-7(0V)
Short time stability
110-10/s
Temperature characteristic
510-8(0~50C)
Output jitter
When there is no input jitter, the inhered jitter of ZXMP S385 2M clock output
interface should not be over 0.05 UIP-P. The test is conducted at an interval of
every 60 seconds with a single-pole band-pass filter in 20Hz and 100kHz turnover
frequencies.
Permitted input/output attenuation and others

For ZXMP S385 the bit rate tolerance of clock output signal is 4.6ppm.
Long-term phase variation in clock locking mode

The long-term phase variation in the clock locking mode refers to the phase noise
generated at the SEC output terminal when there is an ideal input reference signal.
Usually, they are expressed by the Maximum Time Interval Error (MTIE) and time
deviation error (MTIE). ZXMP S385 can satisfy the requirements shown in Table 49
Table 50 and Table 51 .
Table 49
The wander limit value under constant temperature (MTIE)
MTIE limits
Observation interval
40 ns
0.1s 1s
40 0.1 ns
1s 100s
25.25 0.2 ns
100s 1000s
Table 50
The wander limit value under temperature impact (MTIE)
Additional MTIE permitted value
0.5ns
0.1s
50ns
118s
Table 51
100s
The wander limit value under constant temperature (TDEV)
MTIE limits
3.2 ns
0.1s
25s
49
MTIE limits
0.64
6.4 ns
0.5 ns
25s
100s
100s
1000s
Clock accuracy in the hold mode

Once all the timing references are lost, SEC will enter the hold mode after
instantaneous phase variation. Now, SEC will use the last frequency information
saved before the timing reference signal loss as its timing reference. Meanwhile, the
oscillation frequency of the oscillator will slowly wander, but can still ensure that
SEC frequency only has very small frequency deviation from the reference
frequency in a long time base; therefore, the sliding loss will be within the allowed
index requirement. This mode can be used to deal with an external clock failure
lasting several days.
When SEC loses its reference source and enters the hold mode, the phase error T
of the SEC output signal to the input signal should not be over the following limits
when observation time S is greater than 15s from the moment that the reference
source loses.
T (S) = [(a1+a2)S+0.5bS2+c] ns
a1= 50ns/s corresponds to the initial frequency deviation of 510-8.
a2=2000ns/s refers to the frequency deviation caused by the temperature change
after the clock enters the hold mode. If there is no temperature change in 2 10-6,
there will be no a2S in the phase error.
b = 1.1610-4ns/s. It is caused by aging, corresponding to 110-8/day frequency
wander.
c = 120ns, includes any additional phase deviation that might be generated after
entering the transition stage of hold mode.
ZXMP S385 meets the above requirements.
Frequency Accuracy of Internal Oscillator in the Free-run Mode

When the internal oscillator of SEC works in the free-run mode if SEC loses all of
the clock references, and their memories or SEC has no hold mode at all, it is
required that its output frequency accuracy be within a certain range.
For a reference that can follow the G.811 clock, the SEC output frequency accuracy in
the free-run mode should not be greater than 4.6ppm for SDH terminal equipment and
20ppm for REG equipment. ZXMP S385 can satisfy the above requirements.
50
Environment Adaptability
6.1
Power supply requirements

Working voltage and current:
6.2
Rated working voltage: -48V
Rated working current: 16A
Nominal voltage: -48VDC
Range: -57VDC~-40VDC
Grounding requirements
If separate grounding is adopted in the equipment room, the grounding resistance
should meet the following requirements:
The grounding resistance in case of 48V DC is less than or equal to 4.
The grounding resistance for the system working ground is less than or equal to 4.
The grounding resistance for the lightning protection ground is less than or equal to
4.
If the combined grounding is adopted in the user equipment room, the grounding
resistance should be less than or equal to 1.
The voltage difference among lightning protection ground, system working ground and 48V GND should be less than 1V.
The tandem requirements between all groundings are as follows:
The -48V ground of the board is isolated from the -48V GND.
The board shielding plate is connected to the cabinet via the front panel, and there
is an electrical connection with the co-module filter capacitor inside a board.
The lightening protection GND only connects to the protection component, and
converges with the system working GND at the grounding terminal on the bus bar of the
rack. The -48V GND can converge with the PGND, or the combined GND on the bus bar
of the rack, or be grounded outside.
51
6.3
Environment requirements
6.3.1
Operation Environment
1
Climate
Climate requirement is show in Table 52 .
Table 52
Climate requirement
Item
Range
Altitude
4000m
Air pressure
70 ~ 106kPa
Temperature (Long-term Operating)
+5 ~+40
Temperature (Short-term Operating)
0 ~+45
Temperature change rate
0.5
Relative humidity (Short-term Operating)
20%~80%
Relative humidity (Long-term Operating)
10%~90%
Heat radiation
300W/s
/min
In the normal working environment, the measuring point of the temperature and
humidity refers to data obtained at the place 1.5 meters above the floor and 0.4m
meters in front of the equipment. The short-term working refers to working
continuously for no more than 48 hours and no more than accumulated 15 days in a
year.
2
Biological environment
Avoid multiplication of microbe, such as eumycete and mycete.
Avoid the rodent, e.g., mice.
Air cleanliness
Density requirements for chemical active substances is show in Table 53
Table 53
Density requirements for chemical active substances
Chemical active substance
52
Content
mean (mg/m)
Max( mg/m)
SO2
0.3
H2S
0.1
0.5
NH3
Cl2
0.1
0.3
HCl
0.1
0.5
HF
0.01
0.03
Content
Chemical active substance
mean (mg/m)
Max( mg/m)
O3
0.05
0.1
NO2
0.5
Density requirements for mechanical active substances is show in Table 54 .

Table 54
Density requirements for mechanical active substances
Mechanical active substance
Content
Perceivable dust
= 15 mg/mh
Mechanical stress
Requirements for mechanical stress is show in Table 55 .
Table 55
Requirements for mechanical stress
Item
Unit
Value
Acceleration
m/S2
0.1
Frequency range
Hz
5~100, 100~5
direction
X,Y,Z
duration
Min
90
Condition of earthquake
According with:NEBS GR-63
IEC721-2-6 Environmental conditions appearing in nature-Earthquake vibration
IEC68-3-3 Environmental testing - Part 3: Background information - Subpart 3:
Guidance. Seismic test methods for equipment
6.3.2
Environment for Storage

The following Table 56 ,Table 57 international standards are taken as the reference for
framing the environment requirements:
IEC721-3-1 Classes 1K4/1Z2/1Z3/1Z5/1B2/1C2/1S3/1M2
1
Climate
Table 56
Climate requirement
Item
Range
Altitude
4000m
Air pressure
70 ~ 106kPa
53
Item
Range
Temperature
-40 ~ +70
Temperature change rate
0.5C/min
Relative humidity
10% ~ 100%
Solar radiation
600W/s
Air speed
30m/s
Mechanical stress
Table 57
Requirements for mechanical stress
Item
unit
value
Acceleration
m/S2
0.1
Frequency range
Hz
5~100, 100~5
direction
X,Y,Z
duration
Min
90
The earthquake-proof performance of the whole equipment complies with Earthquakeproof Performance Detection for SDH Optical Communications Equipment (Provisional)
and Earthquake-proof Performance Detection for SDH Optical Communications
Equipment (Provisional). The earthquake-proof performance detection reaches the
eight-level intensity.
6.3.3
Cleanness requirements
Cleanness involves dust and harmful gases in the air. The equipment should be
operated in the equipment room that meets the cleanness requirements described below:
6.3.4
In the transmission equipment room, there is no explosive, electrically conductive,

magnetically conductive or corrosive dust.
The density of dust particles with the diameter greater than 5m should be no more
than 3104 particles/m3.
No corrosive metal or gases that are detrimental to the insulation exist in the
equipment room, such as SO2 and NH3.
The equipment room should be always kept clean, with doors and windows being
closed.
Bearing Requirements of the Equipment Room

The bearing capability of the equipment room should be over 450kg/m2 to hold ZXMP
S385 equipment.
Electromagnetic Compatibility (EMC) requirements
54
Before introducing the EMC requirements, firstly specifies 3 criteria for test results:
6.3.5
Performance A: Continuous phenomenon. Neither error nor alarm is allowed. After

the electromagnetic interference, the number of errors shall not exceed the
maximum of the normal requirement.
Performance B: Transient phenomenon. During the electromagnetic interference,

the degradation of function is allowed, the equipment can work as expected without
the operators interference, the loss of frame and synchronization is not allowed,
and neither pattern out-of-sync, nor AIS alarm is generated. The equipment shall
work normally after the electromagnetic interference.
Performance R: Resistive phenomenon. The fuse or other special devices can be

replaced or restarted.
Electronic Static Discharge (ESD)

1
Anti-interference for static discharging

The static discharge anti-interference index of ZXMP S385 equipment is shown in
Table 58 . During the operation in the interface area, be sure to wear an antistatic
wrist strap.
Table 58
Static discharge anti-interference
Contact discharge
Air discharge
Criterion for test results
6kV
8kV
Performance B
8kV
15kV
Performance R
RF electromagnetic radiated susceptibility

The RF electromagnetic radiated susceptibility of ZXMP S385 equipment is shown
in Table 59 .
Table 59
RF electromagnetic radiated susceptibility
Test frequency (80MHz~1000MHz)

Electric field intensity
Amplitude modulation
10V/m
80%AM (1kHz)
Performance A
Electrical fast transient burst susceptibility

The electrical fast transient burst susceptibility of ZXMP S385 equipment is shown
in Table 60 and Table 61 .
55
Table 60
Electrical fast transient burst susceptibility at the DC power port
Generator waveform 5/50ns

Test voltage
Repeated frequency
1kV
5kHz
Performance B
Table 61
Electrical fast transient burst susceptibilities at the signal cable and control cable ports
Generator waveform 5/50ns

Test voltage
Repeated frequency
1kV
5kHz
Performance B
Surge susceptibility
The surge susceptibility of ZXMP S385 equipment is shown in Table 62 , Table 63
and Table 64 .
Table 62
Surge susceptibility of DC power
The waveform of generators 1.2/50us (8/20s), internal resistance 12

Test mode
Test voltage
Line to ground
1kV
Performance B
Line to ground
2kV
Performance R
Table 63
Surge susceptibility of the outdoor signal cable
The waveform of generators 10/700s, internal resistance 40

Test mode
Line to line
Line to ground
Line to line
Line to ground
Table 64
Test voltage
2kV
Performance B
4kV
Performance R
Surge susceptibility of the indoor signal cable
Generator waveform 1.2/50s (8/20s), internal resistance 42

Test mode
Test voltage
Line to ground
1kV
Performance B
Line to ground
2kV
Performance R
Conductivity susceptibility of RF field

The conductivity susceptibility of RF field of ZXMP S385 equipment is shown in
Table 65 .
56
Table 65
Conductivity susceptibility of RF field
Test frequency 0.15MHz ~ 80MHz

Test intensity
Amplitude modulation
3V
80%AM (1kHz)
Performance A
Electromagnetic Interference (EMI)

6
Conductive emission electromagnetic interference

The conductive emission electromagnetic interference of ZXMP S385 equipment is
shown in Table 66 .
Table 66
Conductive emission electromagnetic interference at the direct current port
Limits (dBuV)
Testing frequency (MHz)
Quasi-peak
Mean value
0.02~0.15
79
--
0.15~0.5
79
66
0.5~30
73
60
Radioactive emission electromagnetic interference

The radioactive emission electromagnetic interference of the ZXMP S385
equipment is shown in Table 67 .
Table 67
Radioactive emission electromagnetic interference
Testing frequency (MHz)
6.4
Quasi-peak demodulating limit (dBV/m)

10m
3m
30~230
40
50
230~1000
47
57
230~1000
47
57
Safety requirements
This product adopts the technical requirements specified in the following standard:
IEC/EN 60950:2000 Safety of information technology equipment
Working voltage and current

Rated working voltage: -48V
Max. working voltage: -57V
Min. working voltage: -40V
57
Rated working current: 16A
Insulation classification of the equipment

The power supply of the equipment provides the SELV circuit with safe and
excessively low voltage, without self-generating dangerous voltage. It belongs to the
equipment of the class III insulation (Class III equipment).
Optical interface
The optical module of the maximum power belongs to (Class 3A). All the optical
modules shall be under strict control and certified by authorities (such as UL, TUV
and NEMKO), and comply with EN60825.
Fuse
All the fuses and power modules, including recoverable fuses, shall be certified by
authorities such as CE, UL and TUV.
Safety mark
On the package of the equipment, there are striking labels about antistatic, fragile,
waterproof, and damp-proof.
The maximum optical power satisfies the 3A safety standard. An obvious label
warning against the laser shall be pasted at the optical interface.
Cables of different colors shall be used for the power input, shielding GND and
lightening protection GND to avoid incorrect connection. Different power connectors
shall use coding keys. There shall be a power label at the power inlet.
Both the equipment and each board shall have an antistatic label.
Grounding symbol
indicates switch-on, and
indicates switch-off.
Mechanical structure
In installation, four bolts are designed at the rack bottom (may also be used to
adjust balance) to fix the rack to the ground. At the rack top, the corresponding
screws are designed to fix the rack to the cabling rack. When installed in the
equipment room, the rack shall be fixed both at the top and bottom to ensure the
stability and safety of the equipment.
The corners of both the rack and sub-rack are processed to avoid hurting people.
Fire protection
The materials of the circuit boards in the equipment use the fireproof materials of
the V-2 level to prevent the circuits from burning in case of failure.
The structural parts use unburnable materials with a good fireproof performance,
including surface processing materials.
58
With the effective heat dissipation design, it ensures that the temperature does not
exceed 70C to prevent heat aggregation and reduce the possibility of burning.
Safe parts passing the safety authentication (CE, UL, etc.) are used.
High temperature protection

In abnormal conditions, the temperature does not exceed 70C. The plastic parts,
components, wires and cables, and safety labels shall all comply with the
requirements specified in the safety standard-GB4943/EN60950.
Lightening protection
In this system, good grounding and isolation and protection of electrical interfaces
are used to prevent the dangerous voltage of lightening.
59
Glossary
Abbreviations
60
Full Name
ADM
Add-Drop Multiplexer
AFEC
Advanced Forward Error Correction
AIS
Alarm Indication Signal
ANSI
American National Standards Institute
APS
Automatic Protection Switching
ASIC
Application Specific Integrated Circuit
ASON
Automatically Switched Optical Network
ATM
Asynchronous Transfer Mode
AU
Administrative Unit
AUG
Administration Unit Group
AU-n
Administration Unit, level n
AU-PTR
Administration Unit Pointer
BBE
Background Block Error
BBER
Background Block Error Ratio
BER
Bit Error Ratio
BITS
Building Integrated Timing Supply
BML
Business Management Layer
CBR
Constant Bit Rate
CDM
Code Division Multiplexing
CLP
Cell Loss Priority
CMI
Coded Mark Inversion
C-n
Container- n
CORBA
Common Object Request Broker

Architecture
CV
Code Violation
CWDM
Coarse Wavelength Division Multiplexing
DB
Data Base
DBMS
Data Base Management System
DCC
Data Communications Channel
DCE
Data Circuit-terminating Equipment
DCF
Data Communications Function
DCN
Data Communications Network
DDN
Digital Data Network
DLL
Dynamic Link Libraries
DNA
Distributed Network Architecture
DNI
Dual Node Interconnection
Abbreviations
Full Name
DQDB
Distributed Queue Double Bus
DTE
Data Terminal Equipment
DWDM
Dense Wavelength-division Multiplexing
DXC
Digital Cross Connect
ECC
Embedded Control Channel
EDFA
Erbium Doped Fiber Amplifier
EM
Element Management
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
EML
Element Management Layer
EMS
Element Management System
EOS
Ethernet Over SDH
ES
Error Second
ESD
Electronic Static Discharge
ESR
Error Second Ratio
ETS
European Telecommunication Standards
ETSI
European Telecommunication Standards

Institute
FDDI
Fiber Distributed Data Interface
FDM
Frequency Division Multiplexing
FE
Fast Ethernet
FEBBE
Far End Background Block Error
FEC
Forward Error Correction
FEES
Far End Error Second
FESES
Far End Severely Error Second
GUI
Graphical User Interface
HDLC
High Digital Link Control
HPC
Higher order Path Connection
HW
High-Way
IEC
International Electro technical

Commission
IEEE
Institute of Electrical & Electronic

Engineers
IP
Internet Protocol
ITU-T
International Telecommunication UnionTelecommunication Standardization

Sector
L2
Layer 2
LAN
Local Area Network
LAPD
Link Access Procedure On D-channel
61
62
Abbreviations
Full Name
LAPS
Link Access Procedure for SDH
LCD
Loss of ATM Cell Delineation
LCT
Local Craft Terminal
LOF
Loss Of Frame
LOP
Loss Of Pointer
LOS
Loss Of Signal
LPC
Lower order Path Connection
MAC
Medium Access Control
MAN
Metropolitan Area Network
MCF
Message Communication Function
MCU
Micro Control Unit
MD
Mediation Device
MF
Mediation Function
MII
Medium Independent Interface
MM
Multi Mode
MS
Multiplex Section
MS-AIS
Multiplex Sections - Alarm Indication

Signal
MSOH
Multiplex Section OverHead
MSP
Multiplex Section Protection
MS-PSC
Multiplex Sections - Protection Switching

Count
MS-PSD
Multiplex Sections - Protection Switching

Duration
MS-SPRing
Multiplexer Section Shared Protection

Ring
MST
Multiplex Section Terminal
MTIE
Maximum Time Interval Error
NE
Network Element
NEF
Network Element Function
NEL
Network Element Layer
NML
Network Manager Layer
NMS
Network Management System
NRZ
Non-Return-to-Zero
OAM
Operation, Administration and

Maintenance
OFS
Out of Frame Second
OOF
Out of Frame
OS
Operation System
OSF
Operation System Function
Abbreviations
Full Name
OSI
Open System Interconnect
PCB
Printed Circuit Board
PCM
Pulse Code Modulation
PDH
Plesiochronous Digital Hierarchy
PGND
Protection GND
PHY
physical Layer Device
PJE-
Pointer Justification Event -
PJE+
Pointer Justification Event +
POH
Path OverHead
PPP
Point to Point Protocol
PRC
Primary Reference Clock
QA
Q Adaptor
QAF
Q Adaptor Function
QoS
Quality of Service
RAM
Random Access Memory
RDI
Remote Defect Indication
REG
Regenerator
REI
Remote Error Indication
RFI
Remote Failure Indication
RIP
Router Information Protocol
RMII
Reduced Medium Independent Interface
RS
Regenerator Section
RSOH
Regenerator Section OverHead
SAR
Segmentation and Reassembly
SDH
Synchronous Digital Hierarchy
SEC
SDH Equipment Clock
SEMF
Synchronous Equipment Manage

Function
SES
Severely Error Second
SESR
Severely Error Second Ratio
SETS
Synchronous Equipment Timing Source
SM
Single Mode
SMCC
Sub-network management control center
SML
Service Management Layer
SMN
SDH Management Network
SMS
SDH Management Sub-Network
SMT
Surface Mount Technology
SNC
Sub-network Connection
SNCP
Sub-network Connection Protection
63
64
Abbreviations
Full Name
SOH
Section Overhead
SPRING
Shared Protection Ring
SSF
Service Signal Fail
SSM
Synchronization status messaging
SSM
Synchronous State Message
STM-N
Synchronous Transport Module Level-N
TCP
Transport Control Protocol
TDEV
Time Deviation
TDM
Time Division Multiplex
TM
Terminal Multiplexer
TMN
Telecommunications Management
Network
TTL
Transistor-Transistor Logic
TU
Tributary Unit
TUG-m
Tributary Unit Group, level m
TU-m
Tributary Unit, level m
UART
Universal Asynchronous Receiver

Transmitter
UAS
Unavailable Second
UBR
Unspecified Bit Rate
UNI
User-Network Interface
UPC
Usage Parameter Control
VBR
Variable Bit Rate
VC
Virtual Channel
VC
Virtual Container
VCI
Virtual channel Indicator
VC-n
Virtual Container, level n
VDN
Virtual Data Network
VLAN
Virtual Local Area Network
VP
Virtual Path
VPI
Virtual Path Indicator
VPG
VP Group
WAN
Wide Area Network
WDM
Wavelength Division Multiplexing
WS
Work Station
WSF
Work Station Function
ZXMP
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ZXMP S385 V2.50

ZXMP S385 V2.50 Product Description

ZXMP S385 V2.50 Product Description

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2011 ZTE Corporation. All rights reserved.

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2011 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

System Architecture .............................................................................................. 12

Technical Specifications ....................................................................................... 17

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description

Ethernet interface types and followed standard ....................................................... 33

ZTE Confidential Proprietary

2011 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

ZXMP S385 functional block diagram ........................................................................ 12

Optical Interfaces Provided by ZXMP S385 ................................................................. 5

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description

GE interface index ..................................................................................................... 36

ZTE Confidential Proprietary

2011 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

ZTE Confidential Proprietary

2009 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

Flexible networking & dispatching function raises

Superior scalability protects CAPEX and reduces

Leading RPR function supports IP evolution and

Powerful embedded WDM function saves fiber

Flexible design facilitates network planning &

Wide application, mature technology and high

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description

ZTE Confidential Proprietary

2009 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

Cross-connection and extension capabilities

Powerful Service Access Ability

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description

Optical Interfaces Provided by ZXMP S385

Maximum Access Quantity

Electrical Interfaces Provided by ZXMP S385

Maximum Access Quantity

ZTE Confidential Proprietary

2009 ZTE Corporation. All rights reserved.

ZXMP S385 V2.50 Product Description

RSEB board provides 810M/100M+2GE interfaces which employs the bandwidth of

Ethernet services Provided by ZXMP S385

Board Name Interface Type

Integrated WDM Function

Complete Equipment Protection Ability

2011 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary

ZXMP S385 V2.50 Product Description