Test method:

1. Take the sample and rinse with 5 % sulphuric acid for 10 s.

2. Take out the sample after 10 s and rinse with DI water.
3. Dip the sample into the Anti Tarnish chemical solution, with
concentration of 150 mL/L.
4. The dipping time is 5 s, 10 s and 15 s for each sample.
5. After dipping, rinse the sample with water and dry the sample.
6. Ensure the sample is fully dry then put the sample onto the hot plate
with 200 0C for 1 hour.
7. Take out the sample from hot plate after 1 hour and let the sample to
cool down.
8. Tape the sample copper surface with 3M 810 Tape and pull out the tape
away from the sample.
9. Stick the tape onto a white paper to see any copper colors on the tape.

Cu Peel Of Test
Dipping Time
(s)

Hot Plate
Temperature for 1
hours

Result

200

No Cu peel of

10

200

No Cu peel of

15

200

No Cu peel of

Cu Peel Of Test
Dipping Time
(s)

Hot Plate
Temperature for 1
hours

Result

300

Cu peel of

10

300

Cu peel of

15

300

Cu peel of

Solderability Test (Wetting)

Dipping
Time (s)

Solder Pot
Temperature

Result

245

More than 95% solder

coverage

245

More than 95% solder

Coverage

245

More than 95% solder

coverage

Solderability Test (De-Wetting)

Dipping
Time (s)

Solder Pot
Temperature

Result

10

280

More than 95% solder

coverage

10

280

More than 95% solder

Coverage

10

280

More than 95% solder

coverage

Summary
The test perform on Anti Tarnish chemical is
based on the following parameter:
Concentration: 150 ml/L
Bath Temperature: 25 0C
Anti Tarnish Dipping time: 5 15 s
Cu peeling test showed that 1 hour baking time
with 200 0C temperature passed the test but not
for 300 0C temperature.
The solderability for samples after Anti Tarnish
chemical coating is consider acceptable as more
than 95% solder coverage on the Cu surface.