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  • MultilayerPCB Nano

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    hghamkhar
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    This document discusses multilayer printed circuit boards and their manufacturing process. It describes technologies used in multilayer PCBs such as mixed dielectric materials, blind and buried vias, metal backing, and embedded components. It also outlines the lamination, inner layer processing, and testing capabilities available for producing these types of circuit boards.

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    This document discusses multilayer printed circuit boards and their manufacturing process. It describes technologies used in multilayer PCBs such as mixed dielectric materials, blind and buried vias, metal backing, and embedded components. It also outlines the lamination, inner layer processing, and testing capabilities available for producing these types of circuit boards.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    10 views5 pages

    MultilayerPCB Nano

    Uploaded by

    hghamkhar
    This document discusses multilayer printed circuit boards and their manufacturing process. It describes technologies used in multilayer PCBs such as mixed dielectric materials, blind and buried vias, metal backing, and embedded components. It also outlines the lamination, inner layer processing, and testing capabilities available for producing these types of circuit boards.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    of 5

    Multilayer PCB's

    Multilayer
    Mixed dielectric technology & pure PTFE Blind and buried vias Metal backing and Metal core In-house lamination Vacuum assisted Dedicated inner layer processing (DES) facility Embedded resistors, capacitors, connector assembly and Microwave test Post etch punch system Fusion bonding process

    Mixed Dielectric Multilayer With Metal Core


    Feedline Aligned To Pocket MMIC POcket Metal Core Blind Ground Via Multifunctional Epoxy Pre-Preg

    PTFE Laminate Blind Ground Via PTFE Bond Film Silica Filler Material Pth (Isolated from Metal Core)

    Embedded Resistors & Connector Launches

    RF Foam RF Bond Film Ground PTH Embedded Resistor Connector

    Multilayer PCB's With Blind & Buried Vias


    Blind Laser Via (Blind Plated) PTFE Bond Film Multifunctional Epoxy Pre-Preg Mechanical Blind Via (Sequentially Drill & Plate)

    PTFE Laminate

    Buried Via

    Plated Through Hole

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