ACETITE ADHESIVES in LCD Applications

Toshiharu Noguchi
Technical Manager Asec Co., Ltd.

November 30, 2003

Types Of Adhesives in LCD Application

   

 

Mother Glass Bonding : UV (Temporary) Main Sealing : Heat-cure Epoxy UV End Sealing : UV/Visible Light Cure Terminal Sealing (Reinforcement)  TAB : Silicone UV  Clip Pin : UV  FPC : UV Terminal Bonding (ACP): Heat-cure Epoxy UV COG/ITO Coating : Silicone UV

dhesi es in
Main al

licati n

End( rc I i d t (IT )

att rn)

Major Advantages of UV or UV/Visible Light Curable Adhesives:

Fast Cure Reduction of Assembly Time  Solvent Free Environmental friendly  One Component Production Efficiency


Total Cost Saving

MOTHER GLASS BONDING - 1

Processes: 1) Apply Main-Sealing Adhesive 2) Apply Mother Glass Bonding Adhesive 3) Align and mate Glasses 4) UV Light Exposure 5) Pressing and Heat curing
400~1,000mm

Main Sealing

Glass Bonding
400~1,000mm

MOTHER GLASS BONDING - 2

Requirements for Adhesive:
  

Non-Flow Viscosity Easy Spread in Small Gap Hot Strength (No movement during Heating)

AS-6954 (20,000mPa-s, Thixo 4)

END SEALING - 1
End Sealing Processes
1) Suck LC into Cell 2) Wipe excess LC around the Charging Port 3) Apply and Suck-In Adhesive

(by Cooling Method or Press Method)

4) UV Light Exposure

END SEALING - 2
Sealing Process Details
COOLING Method
STEP 1: Filling LC into Cell STEP 2: WIPING OFF Excess LC STEP 3: Applying UV Adhesive STEP 4: Cooling Cell down to 10-15deg.C STEP 5: Curing by UV Radiation

PRESS Method
STEP 1: Filling LC into Cell STEP 2: Stacking 20-60 Cells STEP 3: Pressing STEP 4: WIPING OFF Excess LC STEP 5: Applying UV Adhesive STEP 6: Releasing Press slightly STEP 7: Curing by UV Radiation

END SEALING - 3
Main Problems In End Seal:
2) 4)
1) LC Disordering: Color difference / Contrast

3) 2) Occurrence of Irregular

1) LC

shapes (HIKE) at Neck Region: Poor Appearance & LC Leakage

3) Gaps between End Seal & Main Seal: LC Leakage 4) Debonding of End Seal: LC Leakage

END SEALING - 4
Requirements of End Sealant


 

  

Good Compatibility with LC (Low Extractive Ionic Compounds) Good Adhesion to substrates (LC wetted) Low UV Energy Curability (500~1,000mJ/cm2) (High CTV Visible Light Curability) Resistance to Washing agent Durability Appropriate Viscosity
AS-1202 (6,000mPa-s) AS-1010 (10,000mPa-s) AS-1203 (20,000mPa-s)

TERMINAL SEALING - 1
Application
 

Clip Pin: TN (Segment Type) FPC, TAB: STN, TFT

UV Adhesive

ACF

TAB

Process

UV Adhesive

FPC

1) Dispensing Process: One-sided or Two-sided a) Roller Method b) Syringe Method 2) UV Light Curing Process
ACF

Terminal Sealing - 2
Requirements of Terminal Sealant
Good Adhesion to Glass, ITO, Sn, PI Flexibility (Low Stress) Moisture Resistance Durability to withstand Thermal Shock & Thermal Aging High Temp. resistance (Pin Clip) Cure Depth > 1.0mm (Pin Clip) Appropriate Viscosity
AS-2002 (5,000mPa-s) AS-1057 (9,000mPa-s) AS-1204 (20,000mPas)

TERMINAL BONDING - 1
Application


FPC to Glass (ITO, Conductive)

Process
1) Apply ACP on ITO Terminal Pattern 2) Put FPC on the ITO Terminals 3) UV Light Exposure with Pressing
Au coated sphere Cu Pattern FPC ACP

ITO Pattern

Glass

TERMINAL BONDING - 2
ACP  UV Adhesive + Conductive Particles  Particles
 

Au coated Sphere Resin Diameter: 3 ~ 5 m

Requirements of UV Adhesive  Good Adhesion to Glass, ITO, FPC  Appropriate Flexibility  Appropriate Cure Shrinkage (Pressing Force)  Moisture Resistance and Durability  Appropriate Viscosity

AS-2002 (5,000mPa-s)

COG/ITO OVERCOATING - 1
Processes:
1) Mount IC Chip on Glass (ITO Circuit) 2) Heat-Pressing 3) FPC Bonding with ACF or ACP 4) Apply COG Overcoat Resin over IC and ITO Pattern 5) UV Light Exposure
Overcoat Resin IC Chip

ACF or ACP

FPC

COG/ITO OVERCOATING - 2
CURRENT PROCESS Bottle Neck 1) Insufficient Moisture Protection capability with RTV Silicone 2) Low Productivity due to Long Curing Time with RTV Silicone

UV Curing Adhesives

COG/ITO OVERCOATING - 3
Requirements of COG OVERCOATING RESIN
       

Low Water Permeability Not Corrosive Low Stress (Low Shrinkage or High Flexibility) Toughness Good Wettability (Glass, ITO, PI, Si) Adequate Low Viscosity (< 1,000mPa-s) Fast Cure (< 1,000mJ/cm2) Durability (Thermal Shock, Heat Aging)
AS-2008 (600mPa-s)

Appendix

LIGHT SHIELD RESIN - 1

Application
1) Protect IC of COG from Malfunction by Light 2) Apply the opposite side of Glass IC mounted 3) Current Process: Al or Black Adhesive Tape
Overcoat Resin IC Chip

ACF or ACP

FPC Light Shield Tape or Resin

LIGHT SHIELD RESIN - 2

Requirements of LIGHT SHIELD RESIN
     

UV/Visible Light Opaque (Black, White or Silver) Screen Printable (High Productivity) Good Adhesion to Glass Adequate Low Viscosity (< 1,000mPa-s) Fast Cure (< 1,000mJ/cm2) Durability
EX03-133 (6,000mPa-s)

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