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  • NASA: 70804main FS-1996-08-03-LaRC

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    The Thermal Bond Inspection System (TBIS) uses heat and infrared imaging to detect flaws in aircraft structures. It applies heat to the outer surface of an aircraft and measures temperature variations to generate images of defects like cracking, disbonds, and corrosion. This non-invasive technique provides quantitative information and can rapidly inspect large areas of different materials. A patent has been issued for the TBIS procedure and NASA is seeking commercial licenses for it.

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    The Thermal Bond Inspection System (TBIS) uses heat and infrared imaging to detect flaws in aircraft structures. It applies heat to the outer surface of an aircraft and measures temperature variations to generate images of defects like cracking, disbonds, and corrosion. This non-invasive technique provides quantitative information and can rapidly inspect large areas of different materials. A patent has been issued for the TBIS procedure and NASA is seeking commercial licenses for it.

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    13 views1 page

    NASA: 70804main FS-1996-08-03-LaRC

    Uploaded by

    NASAdocuments
    The Thermal Bond Inspection System (TBIS) uses heat and infrared imaging to detect flaws in aircraft structures. It applies heat to the outer surface of an aircraft and measures temperature variations to generate images of defects like cracking, disbonds, and corrosion. This non-invasive technique provides quantitative information and can rapidly inspect large areas of different materials. A patent has been issued for the TBIS procedure and NASA is seeking commercial licenses for it.

    Copyright:

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    of 1

    NASA Facts

    National Aeronautics and


    Space Administration
    Langley Research Center
    Hampton, Virginia 23681-0001
    804 864-3293

    September 1996

    New Inspection System Uses Heat to Detect Flaws


    Recent advances in thermal-imaging technology acquisition with the application of heat. The
    have spawned new techniques that provide images that result from this synchronization
    quantitative information about flaws in aircraft technique provide quantitative information.
    structures. The Thermal Bond Inspection System
    (TBIS) detects defects in, and determines the Aircraft Fuselage
    thickness of, metal and composite structures by
    using thermal energy and an infrared imaging Heat Lamps
    system.

    NASA Langley Research Center’s thermal


    imaging inspection technique was developed to Infrared Camera
    detect potential flaws in aircraft structures. The
    technique involves applying a heat to the outer Camera Controller
    surface of an aircraft. Images of fatigue cracking,
    bond integrity and material loss due to corrosion
    Microcomputer And
    are generated from measurements of the surface Image Processing Hardware
    temperature variations.

    Benefits This diagram indicates the setup of the Thermal


    This system is completely non-invasive and non- Bond Imaging Inspection System. The infrared imager
    contacting, responds rapidly, can image a variety of converts the heat response from the surface of the
    different materials, and can be used to examine sample to a video signal.
    large surface areas of varying shapes. The TBIS can
    detect defects in bonded aluminum/composite Options for Commercialization
    structures and in laminated surfaces. A procedure for heat inspection has been
    developed and tested extensively. A patent has
    About the Technology been issued and Langley is seeking licensees.
    The figure shows a block diagram of a typical
    TBIS setup. During an inspection, heat is applied to
    the surface of a structure and the surface
    temperature is measured using an infrared camera
    and image processor. Temperature differentials
    indicate regions with differing heat capacities. In
    disbonded or corroded regions, the heat flow is
    reduced. This reduction is reflected in a temperature
    increase over the corroded region due to reduction
    in thickness relative to the uncorroded regions.

    The infrared imager converts the thermal


    response from the surface of the sample to a video
    signal. A microcomputer synchronizes the data

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