NXP Semiconductors TECHNICAL COMPLAINT REPORT NXP Reference Number: C0712054

CUSTOMER INFORMATION
Company Customer Customer Ref. No. Customer Part No Quantity Returned Quantity Failing Location of Failure Customer Contact : BOSCH : Bosch, Ansbach : 200000117355 : 8 905 708 064 :4 :4 : Line Reject : J. Pfahler

NXP INFORMATION
NXP Part No. Diffusion Process Package Type NXP 12NC NO. Registration Date RSO Contact Local Reference no. Samples Received : BUK7L06-34ARC : NTrench Generation 2 : SOT78C : 934057493127 : 18-Dec-2007 : E. Edes : S07_103 : Jan. 09, 2008

0 SYMPTOMS
Short circuit.

1
Name

TEAM
Job Title Process Engineer Equipment Engineer QA Supervisor Sr. QA Supervisor / 8D Coordinator Mold Process Technician

Jenny Zimara Cris Pejer Che Tablada Lott Buizon Alvin Daroy

2 VERIFICATION AND PROBLEM DESCRIPTION

Sample Numbers 1-4 Reject Confirmed Yes Verification Result

( NXP FAILURE ANALYSIS RESULT ) :

Four-line rejects sample of BUK7L06-34ARC were received and described the problem as Short circuit. The complaint sample was visually inspected using naked eye and low power microscope. Complaint sample nos. 2-3 was attached on board upon received while complaint sample nos. 1 and 4 were taped on board. Burrs were observed in the edge of heatsink tab of complaint sample nos. 2 and 4 (see figs. 1-12 and Table 1). Dent and bulges were also noted on the complaint samples. The customer also provided photos of the complained areas (see attachment).

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NXP Semiconductors

Fig.1: Photo of board 1 upon receipt.

Fig.2: Closer photo of complaint sample1 taped on board.

2 of 14

Fig.3: Closer photo of complaint sample1 after removal from board.

Fig.4: Closer back photo of complaint sample1 after removal from board.

Fig.5: Higher magnification photo of the bulge on the heat sink.

Fig.6: Closer top photo of dent on the heat sink.

Fig.7: Higher magnification photo of the dent on the heat sink.

Fig.8: Photo of complaint sample 2 attached on board..

D 1

Fig.9: Closer photo of complaint sample2 attached on board.

Fig.10: Front photo of complaint sample2 after removal from board.

Burr

Burr

A1

56um

54u m

Fig.11: Left side view photo of complaint sample2.

Fig.12: Right side view photo of complaint sample2.

Table 1: Dimensional Measurement using Smartscope: E Sample nos. 10 - 10.40mm 1 2 3 4 Pass Failed Pass Failed 10.32 10.43 10.36 10.38 6.22 6.47 6.36 6.26 6.34 6.29 1.21 - 1.33mm 1.32 1.40 1.32 1.32 1.21 - 1.33mm 1.32 1.34 1.32 1.37 D1 A1 (Left Side) A1 (Right Side) Burr measurement on heat sink sides Left 56um 58um Right 54um 68um 82um Top 10um -

Note: A1 actual dimensions include the burr dimension. PSI FAILURE ANALYSIS : The complaint units with device BUK7L06-34ARC were received last January 09, 2008 already detached on the board. The units were visually inspected using naked eye and low power microscope. Burrs was observed on unit # 2 located at the edge of heat sink tab while dent and bulges were also noted on units # 1, 3 and 4. See below Failure Analysis result

FAR # Dev. Date Code

: CC08-002 : BUKL06-34ARC : 0745 and 0736

Fig. 1 Actual marked of unit with data code Pev0745 D1

Fig. 2 Actual marked of unit with data code Pev0736 D7

PHOTO OF THE RETURNED UNITS :

Unit 1

Unit 2

Unit 3

Unit 4

EXTERNAL VISUAL INSPECTION :

Back of the heatsink

Focused view

Unit # 1 :

Top of heat sink

Focused view

Unit # 1 showed dent / tool mark on top of the heat sink

0.54 mm

1.28 mm 0.13 mm Fig 3 : Closer view of dent and measurement

Unit # 2 showed burr at the side of the heat sink

Side view of the heatsink

Back of the heatsink

3.0 mils

Focused view at the back of the heat sink Fig 4 : Focused view at the back of the heatsink

Unit # 3 showed dent at the back of the heat sink

10.00 8.00 mils mils

Fig 5. : Back of the heatsink

Unit # 4 showed dent , toolmark at the back of heat sink and damaged mounting hole

Back of heatsink

16 mils 50 mils 75 mils 4.4 mils

10 mils 28 mils

Focused view at the back of heatsink Unit # 4 showed dent , toolmark at the back of heat sink and damaged mounting hole, based with the actual measurement, these are all within the criteria

D 1

Table 11: Dimensional Measurement using Profile Projector : E Sample nos. 1 2 3 4 Pass Pass Pass Pass 10 10.40 mm 10.196 mm 10.214 mm 10.210 mm 10.220 mm D 6.22 6.37 6.256 mm 6.231 mm 6.298 mm 6.292 mm HS Thickness 1.219 1.321 mm 1.280 mm 1.282 mm 1.287 mm 1.283 mm

See FA dimensional results :

10.196 mm

6.256 mm

6.231 mm 10.214 mm

UNIT 1

UNIT 2

6.298 mm 10.210 mm 10.220 mm 6.292 mm

UNIT 3 Sample Numbers 1, 3 2 4 Sample Size 2 1 1 Date Codes PEv0745 D1 PEv0745 D2 PEv0736 D7 Batch Code 0746000 / 0747000 / 0748000 0747000 / 0748000 0739010 / 0738080

UNIT 4

3 CONTAINMENT ACTIONS
Implementation Date Jan 5, 2008 Description Deployment of customer complaint received to all concerned operators, QA Inspectors, Supervisors and Engineers. Responsible: C.Tablada Status : Done Verify existing inventories to check the existence of the problem Responsible: C.Tablada Status : Conduct visual inspection with sample size of 200 units per lot Station OQA / Lot com EVI Test Singulation Trim # of lots inspected 2 lots 3 lots 2 lots 3 lots 2 lots Defect /Sample size 0 / 400 units 0 / 600 units 0 / 400 units 0 / 600 units 0 / 400 units Result No same defect found No same defect found No same defect found No same defect found No same defect found

Jan 5, 2008

Jan 5, 2008

Verify Mold & TFS machine to check for any abnormalities Responsible: C. Tablada Status : Done, see below result 3.3.1 MOLD MACHINE PART Tool Remarks Mold Tool No worn out part Loading Frame No worn out pin 3.3.2 TFS MACHINE PART

Tool Heatsink die Heatsink punch Locator pin

Remarks No abnormalities found on heatsink die No abnormalities found on heatsink punch No abnormalities found on all locator pin at Trim and Singulation

Jan 5, 2008

3.4 Check machine downtime history Responsible: C.Tablada Status : Done, see below result 3.4.1 Mold History No encountered machine downtime related to complaint during lot processing of the affected lots. TFS History No encountered machine downtime related to complaint during lot processing of the affected lots. Test History No encountered machine downtime related to complaint during lot processing

3.4.2

3.4.3

of the affected lots.

Jan 5, 2008 3.5 Backtracked processing history of the affected lots with datecode 0736 D7 and 0745 D1 , D2 Responsible : C. Tablada Result : See below result Based on the lot processing history, a total of 42 lots was processed from mold to test station (See attached file for details)
"lot traceability.xls"

3.5.1

3.6 Jan 5, 2008 to Feb 5, 2008

Increase sample size on QA visual monitoring at singulation From To 50 units/ 2x /shift / machine 100 units / 2x / shift / machine Responsible : C. Tablada Status : On-going implementation

4 FAILURE ANALYSIS AND ROOT CAUSE

Sample Number(s) Failure Classification Failure Origin Failure Identification Root Cause 1-4 Assembly related defect To be determined Dent and Burr Defect See below : 4.1 DENT ON HEATSINK TAB : Based on the actual dimension of the complaint units using Profile Projector, the dent on the Upper portion of the Heat sink tab still within the acceptable limit with an actual readings of 0.67 mm ( width) and 1.28 mm ( length ) versus 3.0 mm requirement. Please refer to Fig. 3 Actual heat sink tab width and length dimensions were found also still within acceptable limit . It complies Package Outline drawing requirements of 10 mm minimum and 10.40 max. Actual reading obtained was 10.196 mm and 10.220 maximum.

4.2

BURRS AT THE BACK OF HEATSINK TAB : 4.2.1 Comparison between complaint sample unit and good unit after singulation process

GOOD UNIT

COMPLAINT UNIT

Good unit has a smooth surface on the cutting area after singulation

It was noted that there is a presence of solder remains on the cutting area of the complaint unit

4.2.2 Mold

Cavity divider is located in between package side

5 PERMANENT CORRECTIVE ACTIONS

To be determined

VERIFY EFFECTIVENESS OF CORRECTIVE ACTIONS

To be determined

7 ACTIONS TO PREVENT RECURRENCE

To be determined

8 REPORTED BY / APPROVED BY
Reported By: Approved By: J Dones / L. Tiongson NXP Failure Analysis Group Z Erillo Subcon Product Quality Engineer J. Policar Subcon Quality Manager L Mrs Partington Hzg Product Quality Engineer Date: Date: Date: Date: 27-Dec-2007 27-Dec-2007 27-Dec-2007 27-Dec-2007

DISTRIBUTION LIST
Name J. Pfahler J Estalilla H OKeefe ZE Erillo JD Dones L Mrs Partington E. Edes Cabuyao, Power BL24 Product Line Quality Eng Cabuyao, Power Cabuyao, Power BL24 Product Line Quality Eng GSO-E Quality Product Quality Engineer BL24 Product Line Automotive Power Product Quality Engineer Product Quality Engineer BL24 Product Line Automotive Power SO Hungary - Budapest Group Sub Site

ATTACHMENT